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Conferences > OFC > 2024 > Tu2B > Tu2B.3

Foundry compatible, efficient wafer-scale manufacturing of ultra-low loss, high-density Si3N4 photonic integrated circuits

Xinru Ji, Rui Ning Wang, Yang Liu, Johann Riemensberger, Zheru Qiu, and Tobias J. Kippenberg

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Abstract

We demonstrate ultra-low propagation loss, lithographic precision, and wafer-scale manufacturing for high-density Si3N4 photonic integrated circuits using an efficient DUV-based subtractive approach. We show a propagation loss as low as 1.4 dB/m at 1.55 µm.

© 2024 The Author(s)

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