Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group

Novel On-wafer Technique for Loss Characterization

Not Accessible

Your library or personal account may give you access

Abstract

We report for the first time an on-wafer propagation loss characterization technique that simplifies and speeds up the validation process. The small footprint (1.5 mm2) and high accuracy (±0.23 dB/cm) make this method ideal for PIC mass production.

© 2014 Optical Society of America

PDF Article
More Like This
Collective die-to-wafer bonding enabling low-loss evanescent coupling for optically interconnected System-on-Wafer

Pengfei Xu, Junwen He, Koen Kennes, Anton Dvoretskii, Arnita Podpod, Guy Lepage, Negin Golshani, Rafal Magdziak, Swetanshu Bipul, Dieter Bode, Peter Verheyen, Maumita Chakrabarti, Dimitrios Velenis, Andy Miller, Yoojin Ban, Filippo Ferraro, and Joris Van Campenhout
Tu3A.4 Optical Fiber Communication Conference (OFC) 2024

Towards Low Propagation Losses in Active Photonic Multi-Project Wafer Runs

Lewis G. Carpenter, Matthew van Niekerk, Amir Begović, Vijay S.S. Sundaram, Venkatesh Deenadayalan, Thomas Palone, Michael Fanto, Stefan Preble, Christopher Baiocco, Gerald L. Leake, Nicholas M. Fahrenkopf, and David L. Harame
ITu3A.5 Integrated Photonics Research, Silicon and Nanophotonics (IPR) 2021

Novel optical technique for characterization of biomaterials

Yang Liu, Jian Yang, Young L. Kim, Vladimir Turzhitsky, Guillermo A. Ameer, and Vadim Backman
SF6 Biomedical Topical Meeting (BIOMED) 2004

Select as filters


Select Topics Cancel
© Copyright 2024 | Optica Publishing Group. All rights reserved, including rights for text and data mining and training of artificial technologies or similar technologies.