Abstract
We present a collective PIC die-to-wafer dielectric bonding process, enabling SiN waveguide-based die-to-wafer evanescent couplers with insertion losses of 0.36 ±0.18dB at 1310nm wavelengths, paving the way to optically interconnected 300mm wafer-scale multi-chip compute systems.
© 2024 The Author(s)
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