Abstract

We propose an optical thin-film characterization technique, differential optical sectioning interference microscopy (DOSIM), for simultaneously measuring the refractive indices and thicknesses of transparent thin films with submicrometer lateral resolution. DOSIM obtains the depth and optical phase information of a thin film by using a dual-scan concept in differential optical sectioning microscopy combined with the Fabry–Perot interferometric effect and allows the solution of refractive index and thickness without the 2π phase-wrapping ambiguity. Because DOSIM uses a microscope objective as the probe, its lateral resolution achieves the diffraction limit. As a demonstration, we measure the refractive indices and thicknesses of SiO2 thin films grown on Si substrate and indium-tin-oxide thin films grown on a glass substrate. We also compare the measurement results of DOSIM with those of a conventional ellipsometer and an atomic force microscope.

© 2007 Optical Society of America

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