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OSA Publishing

Photonics Research Feature Announcement

Quantum Photonics

Submission Open: 15 October 2018
Submission Deadline: 1 December 2018

Quantum photonics is an increasingly important emerging field because of the rising demand for experimental demonstration of quantum communication, quantum computing, and quantum simulation, and photonic chips possess prominent advantages as a potential analog for digital quantum computers and a versatile tool for probing fundamental quantum physics.

Using the photonic structure to form a large state-space not only may be fundamentally interesting but also may provide a powerful platform for quantum simulation and quantum computing. This Feature Issue will explore the use of photonic platforms to investigate quantum advantage/supremacy in various quantum computing protocols, such as Boson sampling, quantum walk, fast hitting, and even universal quantum computing protocols.

Topics to be covered include, but are not limited to:

  • Demonstration of analog quantum computing protocols in photonic chips
  • Quantum simulation of other physics systems using photonic lattices with strong Hamiltonian engineering capabilities
  • Photonic devices for quantum communications
  • Quantum sensing and metrology using integrated photonic chips
  • Quantum coherence and entanglement and their applications using multi-photon sources
  • Probing fundamental quantum physics with photons

Manuscripts should be prepared according to the usual standards for submission to Photonics Research; see the OSA Style Guide. Manuscripts must also be uploaded through OSA's electronic submission system. Please specify that the manuscript is for the Quantum Photonics feature issue (choose from the feature issue drop-down menu). Manuscripts will undergo the same peer review as other papers submitted to the Journal. The standard Photonics Research article processing charges will apply.

Feature Editors
Xianmin Jin, Shanghai Jiao Tong University, China (Lead Editor)
M.S. Kim, Imperial College London, UK
Brian J. Smith, University of Oregon, USA
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