Abstract

A hybrid integrated light source was developed with a configuration in which a laser diode (LD) array was mounted on a silicon optical waveguide platform for interchip optical interconnection. This integrated light source is composed of 13-channel stripes with a pitch of 20 or 30 μm. The output power of each LD in the 400 or 600-μm long LD array was over 40 mW at room temperature without cooling. An output power uniformity was 1.3 dB including an LD array power uniformity. The use of a SiON waveguide with a spot size converter resulted in an optical coupling loss of 1 dB between an LD and SiON waveguide. The integrated light source including 52 output ports demonstrated a reduction in the footprint per channel. We also demonstrated a light source with over 100 output ports in which the number of output ports is increased by using a waveguide splitter and multichip bonding. These integrated light sources are practical candidates for use with photonic integrated circuits for high-density optical interconnection.

© 2014 Chinese Laser Press

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  17. T. Sugimoto, T. Shimizu, Y. Akimoto, M. Noguchi, J. Sone, T. Watanabe, and Y. Urino, “A small and low cost bidirectional transceiver module with polymer waveguide for G-PON/Ge-PON,” in Proceeding of 57th Electronic Components and Technology Conference (IEEE, 2007), pp. 707–711.
  18. J. Ciulik and M. R. Notis, “The Au-Sn phase diagram,” J. Alloys Compd. 191, 71–78 (1993).
    [CrossRef]

2012

2011

2010

I. A. Young, E. Mohammed, J. T. S. Liao, A. M. Kern, S. Palermo, B. A. Block, M. R. Reshotko, and P. L. D. Chang, “Optical I/O technology for tera-scale computing,” IEEE J. Solid-State Circuits 45, 235–248 (2010).
[CrossRef]

N. Fujioka, T. Chu, and M. Ishizaka, “Compact and low power consumption hybrid integrated wavelength tunable laser module using silicon waveguide resonators,” J. Lightw. Technol. 28, 3115–3120 (2010).

2009

T. Takeuchi, M. Takahashi, K. Suzuki, S. Watanabe, and H. Yamazaki, “Wavelength tunable laser with silica-waveguide ring resonators,” IEICE Trans. Electron. E92-C, 198–204 (2009).
[CrossRef]

2007

1993

J. Ciulik and M. R. Notis, “The Au-Sn phase diagram,” J. Alloys Compd. 191, 71–78 (1993).
[CrossRef]

Aguilera, R.-C.

J. Liu, X. Sun, R.-C. Aguilera, Y. Cai, L. C. Kimerling, and J. Michel, “Monolithic Ge-on-Si lasers for integrated photonics,” in Proceedings of IEEE 7th International Conference on Group IV Photonics (IEEE, 2010), pp. 1–3.

Akagawa, T.

Y. Urino, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, H. Takahashi, E. Saito, M. Okano, T. Shimizu, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, D. Shimura, H. Okayama, H. Yaegashi, T. Tsuchizawa, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 12.5-Gbps optical interconnects integrated with lasers, optical splitters, optical modulators and photodetectors on a single silicon substrate,” Opt. Express 20, B256–B263 (2012).
[CrossRef]

Y. Urino, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, M. Noguchi, J. Fujikata, D. Shimura, H. Okayama, T. Tsuchizawa, T. Watanabe, K. Yamada, S. Itabashi, E. Saito, T. Nakamura, and Y. Arakawa, “First demonstration of high density optical interconnects integrated with lasers, optical modulators, and photodetectors on single silicon substrate,” Opt. Express 19, B159–B165 (2011).
[CrossRef]

Y. Urino, S. Akiyama, T. Akagawa, T. Baba, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, H. Takahashi, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, E. Saito, D. Shimura, H. Okayama, Y. Onawa, H. Yaegashi, H. Nishi, H. Fukuda, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 30-Tbps/cm2 bandwidth density by silicon optical interposers fully integrated with optical components,” in 39th European Conference and Exhibition on Optical Communication (IET, 2013), paper Mo.4.B.2.

Akimoto, Y.

T. Shimizu, Y. Akimoto, and K. Kurata, “An opto-electronic hybrid integrated platform with a polymer optical waveguide for high performance and low cost modules,” in Proceeding of 54th Electronic Components and Technology Conference (IEEE, 2004), pp. 1042–1045.

T. Sugimoto, T. Shimizu, Y. Akimoto, M. Noguchi, J. Sone, T. Watanabe, and Y. Urino, “A small and low cost bidirectional transceiver module with polymer waveguide for G-PON/Ge-PON,” in Proceeding of 57th Electronic Components and Technology Conference (IEEE, 2007), pp. 707–711.

Akiyama, S.

Y. Urino, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, H. Takahashi, E. Saito, M. Okano, T. Shimizu, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, D. Shimura, H. Okayama, H. Yaegashi, T. Tsuchizawa, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 12.5-Gbps optical interconnects integrated with lasers, optical splitters, optical modulators and photodetectors on a single silicon substrate,” Opt. Express 20, B256–B263 (2012).
[CrossRef]

Y. Urino, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, M. Noguchi, J. Fujikata, D. Shimura, H. Okayama, T. Tsuchizawa, T. Watanabe, K. Yamada, S. Itabashi, E. Saito, T. Nakamura, and Y. Arakawa, “First demonstration of high density optical interconnects integrated with lasers, optical modulators, and photodetectors on single silicon substrate,” Opt. Express 19, B159–B165 (2011).
[CrossRef]

Y. Urino, S. Akiyama, T. Akagawa, T. Baba, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, H. Takahashi, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, E. Saito, D. Shimura, H. Okayama, Y. Onawa, H. Yaegashi, H. Nishi, H. Fukuda, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 30-Tbps/cm2 bandwidth density by silicon optical interposers fully integrated with optical components,” in 39th European Conference and Exhibition on Optical Communication (IET, 2013), paper Mo.4.B.2.

Ando, H.

N. Kimura, K. Shinozaki, N. Kitamura, Y. Fukutomi, Y. Minota, H. Tanaka, A. Sato, and H. Ando, “Receptacle transceiver module using silica waveguide for bi-directional transmission over single fiber,” in Proceeding of 53th Electronic Components and Technology Conference (IEEE, 2003), pp. 290–295.

Arakawa, Y.

Y. Urino, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, H. Takahashi, E. Saito, M. Okano, T. Shimizu, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, D. Shimura, H. Okayama, H. Yaegashi, T. Tsuchizawa, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 12.5-Gbps optical interconnects integrated with lasers, optical splitters, optical modulators and photodetectors on a single silicon substrate,” Opt. Express 20, B256–B263 (2012).
[CrossRef]

Y. Urino, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, M. Noguchi, J. Fujikata, D. Shimura, H. Okayama, T. Tsuchizawa, T. Watanabe, K. Yamada, S. Itabashi, E. Saito, T. Nakamura, and Y. Arakawa, “First demonstration of high density optical interconnects integrated with lasers, optical modulators, and photodetectors on single silicon substrate,” Opt. Express 19, B159–B165 (2011).
[CrossRef]

T. Shimizu, N. Hatori, M. Okano, M. Ishizaka, Y. Urino, T. Yamamoto, M. Mori, T. Nakamura, and Y. Arakawa, “High density hybridly integrated light source with a laser diode array on a silicon optical waveguide platform,” in Integrated Photonic Research, Silicon and Nano Photonics (OSA, 2012), paper ITu4B.5.

T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, Y. Urino, T. Yamamoto, M. Mori, T. Nakamura, and Y. Arakawa, “Multi-channnel and high density hybrid integrated light source on a silicon optical waveguide platform,” in Asia Communications and Photonics Conference (OSA, 2012), paper AF3B.2.

T. Shimizu, N. Hatori, M. Okano, M. Ishizaka, Y. Urino, T. Yamamoto, M. Mori, T. Nakamura, and Y. Arakawa, “High density hybrid integrated light source with a laser diode array on a silicon optical waveguide platform for inter-chip optical interconnection,” in Proceeding of IEEE 8th International Conference on Group IV Photonics (IEEE, 2011), pp. 181–183.

K. Tanabe, K. Watanabe, S. Faure, and Y. Arakawa, “1.3  μm InAs/GaAs quantum dot lasers on Si substrates with current injection across direct-bonded GaAs/Si heterostructures,” in 37th European Conference and Exhibition on Optical Communication (OSA, 2011), paper Tu.6.LeSaleve.1.

Y. Urino, S. Akiyama, T. Akagawa, T. Baba, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, H. Takahashi, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, E. Saito, D. Shimura, H. Okayama, Y. Onawa, H. Yaegashi, H. Nishi, H. Fukuda, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 30-Tbps/cm2 bandwidth density by silicon optical interposers fully integrated with optical components,” in 39th European Conference and Exhibition on Optical Communication (IET, 2013), paper Mo.4.B.2.

Baba, T.

Y. Urino, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, H. Takahashi, E. Saito, M. Okano, T. Shimizu, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, D. Shimura, H. Okayama, H. Yaegashi, T. Tsuchizawa, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 12.5-Gbps optical interconnects integrated with lasers, optical splitters, optical modulators and photodetectors on a single silicon substrate,” Opt. Express 20, B256–B263 (2012).
[CrossRef]

Y. Urino, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, M. Noguchi, J. Fujikata, D. Shimura, H. Okayama, T. Tsuchizawa, T. Watanabe, K. Yamada, S. Itabashi, E. Saito, T. Nakamura, and Y. Arakawa, “First demonstration of high density optical interconnects integrated with lasers, optical modulators, and photodetectors on single silicon substrate,” Opt. Express 19, B159–B165 (2011).
[CrossRef]

Y. Urino, S. Akiyama, T. Akagawa, T. Baba, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, H. Takahashi, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, E. Saito, D. Shimura, H. Okayama, Y. Onawa, H. Yaegashi, H. Nishi, H. Fukuda, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 30-Tbps/cm2 bandwidth density by silicon optical interposers fully integrated with optical components,” in 39th European Conference and Exhibition on Optical Communication (IET, 2013), paper Mo.4.B.2.

Ban, T.

M. Shishikura, T. Ban, H. Ichikawa, T. Ido, M. Takahashi, K. Nakahara, E. Nomoto, Y. Matsuoka, K. Ishikawa, K. Ito, R. Takeyari, H. Sano, T. Hirose, H. Takahashi, T. Nagara, H. Chiba, and S. Irikura, “10  Gbit/s per channel parallel optical transmitter and receiver modules for high-capacity interconnects,” in Proceeding of 53th Electronic Components and Technology Conference (IEEE, 2003), pp. 1040–1045.

Block, B. A.

I. A. Young, E. Mohammed, J. T. S. Liao, A. M. Kern, S. Palermo, B. A. Block, M. R. Reshotko, and P. L. D. Chang, “Optical I/O technology for tera-scale computing,” IEEE J. Solid-State Circuits 45, 235–248 (2010).
[CrossRef]

Bowers, J. E.

Cai, Y.

J. Liu, X. Sun, R.-C. Aguilera, Y. Cai, L. C. Kimerling, and J. Michel, “Monolithic Ge-on-Si lasers for integrated photonics,” in Proceedings of IEEE 7th International Conference on Group IV Photonics (IEEE, 2010), pp. 1–3.

Chang, P. L. D.

I. A. Young, E. Mohammed, J. T. S. Liao, A. M. Kern, S. Palermo, B. A. Block, M. R. Reshotko, and P. L. D. Chang, “Optical I/O technology for tera-scale computing,” IEEE J. Solid-State Circuits 45, 235–248 (2010).
[CrossRef]

Chiba, H.

M. Shishikura, T. Ban, H. Ichikawa, T. Ido, M. Takahashi, K. Nakahara, E. Nomoto, Y. Matsuoka, K. Ishikawa, K. Ito, R. Takeyari, H. Sano, T. Hirose, H. Takahashi, T. Nagara, H. Chiba, and S. Irikura, “10  Gbit/s per channel parallel optical transmitter and receiver modules for high-capacity interconnects,” in Proceeding of 53th Electronic Components and Technology Conference (IEEE, 2003), pp. 1040–1045.

Chu, T.

N. Fujioka, T. Chu, and M. Ishizaka, “Compact and low power consumption hybrid integrated wavelength tunable laser module using silicon waveguide resonators,” J. Lightw. Technol. 28, 3115–3120 (2010).

Ciulik, J.

J. Ciulik and M. R. Notis, “The Au-Sn phase diagram,” J. Alloys Compd. 191, 71–78 (1993).
[CrossRef]

Cohen, O.

Fang, A. W.

Faure, S.

K. Tanabe, K. Watanabe, S. Faure, and Y. Arakawa, “1.3  μm InAs/GaAs quantum dot lasers on Si substrates with current injection across direct-bonded GaAs/Si heterostructures,” in 37th European Conference and Exhibition on Optical Communication (OSA, 2011), paper Tu.6.LeSaleve.1.

Fujikata, J.

Y. Urino, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, H. Takahashi, E. Saito, M. Okano, T. Shimizu, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, D. Shimura, H. Okayama, H. Yaegashi, T. Tsuchizawa, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 12.5-Gbps optical interconnects integrated with lasers, optical splitters, optical modulators and photodetectors on a single silicon substrate,” Opt. Express 20, B256–B263 (2012).
[CrossRef]

Y. Urino, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, M. Noguchi, J. Fujikata, D. Shimura, H. Okayama, T. Tsuchizawa, T. Watanabe, K. Yamada, S. Itabashi, E. Saito, T. Nakamura, and Y. Arakawa, “First demonstration of high density optical interconnects integrated with lasers, optical modulators, and photodetectors on single silicon substrate,” Opt. Express 19, B159–B165 (2011).
[CrossRef]

Y. Urino, S. Akiyama, T. Akagawa, T. Baba, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, H. Takahashi, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, E. Saito, D. Shimura, H. Okayama, Y. Onawa, H. Yaegashi, H. Nishi, H. Fukuda, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 30-Tbps/cm2 bandwidth density by silicon optical interposers fully integrated with optical components,” in 39th European Conference and Exhibition on Optical Communication (IET, 2013), paper Mo.4.B.2.

Fujioka, N.

N. Fujioka, T. Chu, and M. Ishizaka, “Compact and low power consumption hybrid integrated wavelength tunable laser module using silicon waveguide resonators,” J. Lightw. Technol. 28, 3115–3120 (2010).

Fukuda, H.

Y. Urino, S. Akiyama, T. Akagawa, T. Baba, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, H. Takahashi, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, E. Saito, D. Shimura, H. Okayama, Y. Onawa, H. Yaegashi, H. Nishi, H. Fukuda, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 30-Tbps/cm2 bandwidth density by silicon optical interposers fully integrated with optical components,” in 39th European Conference and Exhibition on Optical Communication (IET, 2013), paper Mo.4.B.2.

Fukutomi, Y.

N. Kimura, K. Shinozaki, N. Kitamura, Y. Fukutomi, Y. Minota, H. Tanaka, A. Sato, and H. Ando, “Receptacle transceiver module using silica waveguide for bi-directional transmission over single fiber,” in Proceeding of 53th Electronic Components and Technology Conference (IEEE, 2003), pp. 290–295.

Hatori, N.

Y. Urino, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, H. Takahashi, E. Saito, M. Okano, T. Shimizu, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, D. Shimura, H. Okayama, H. Yaegashi, T. Tsuchizawa, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 12.5-Gbps optical interconnects integrated with lasers, optical splitters, optical modulators and photodetectors on a single silicon substrate,” Opt. Express 20, B256–B263 (2012).
[CrossRef]

Y. Urino, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, M. Noguchi, J. Fujikata, D. Shimura, H. Okayama, T. Tsuchizawa, T. Watanabe, K. Yamada, S. Itabashi, E. Saito, T. Nakamura, and Y. Arakawa, “First demonstration of high density optical interconnects integrated with lasers, optical modulators, and photodetectors on single silicon substrate,” Opt. Express 19, B159–B165 (2011).
[CrossRef]

T. Shimizu, N. Hatori, M. Okano, M. Ishizaka, Y. Urino, T. Yamamoto, M. Mori, T. Nakamura, and Y. Arakawa, “High density hybridly integrated light source with a laser diode array on a silicon optical waveguide platform,” in Integrated Photonic Research, Silicon and Nano Photonics (OSA, 2012), paper ITu4B.5.

T. Shimizu, N. Hatori, M. Okano, M. Ishizaka, Y. Urino, T. Yamamoto, M. Mori, T. Nakamura, and Y. Arakawa, “High density hybrid integrated light source with a laser diode array on a silicon optical waveguide platform for inter-chip optical interconnection,” in Proceeding of IEEE 8th International Conference on Group IV Photonics (IEEE, 2011), pp. 181–183.

T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, Y. Urino, T. Yamamoto, M. Mori, T. Nakamura, and Y. Arakawa, “Multi-channnel and high density hybrid integrated light source on a silicon optical waveguide platform,” in Asia Communications and Photonics Conference (OSA, 2012), paper AF3B.2.

Y. Urino, S. Akiyama, T. Akagawa, T. Baba, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, H. Takahashi, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, E. Saito, D. Shimura, H. Okayama, Y. Onawa, H. Yaegashi, H. Nishi, H. Fukuda, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 30-Tbps/cm2 bandwidth density by silicon optical interposers fully integrated with optical components,” in 39th European Conference and Exhibition on Optical Communication (IET, 2013), paper Mo.4.B.2.

Hirayama, N.

Y. Urino, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, H. Takahashi, E. Saito, M. Okano, T. Shimizu, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, D. Shimura, H. Okayama, H. Yaegashi, T. Tsuchizawa, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 12.5-Gbps optical interconnects integrated with lasers, optical splitters, optical modulators and photodetectors on a single silicon substrate,” Opt. Express 20, B256–B263 (2012).
[CrossRef]

Y. Urino, S. Akiyama, T. Akagawa, T. Baba, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, H. Takahashi, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, E. Saito, D. Shimura, H. Okayama, Y. Onawa, H. Yaegashi, H. Nishi, H. Fukuda, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 30-Tbps/cm2 bandwidth density by silicon optical interposers fully integrated with optical components,” in 39th European Conference and Exhibition on Optical Communication (IET, 2013), paper Mo.4.B.2.

Hirose, T.

M. Shishikura, T. Ban, H. Ichikawa, T. Ido, M. Takahashi, K. Nakahara, E. Nomoto, Y. Matsuoka, K. Ishikawa, K. Ito, R. Takeyari, H. Sano, T. Hirose, H. Takahashi, T. Nagara, H. Chiba, and S. Irikura, “10  Gbit/s per channel parallel optical transmitter and receiver modules for high-capacity interconnects,” in Proceeding of 53th Electronic Components and Technology Conference (IEEE, 2003), pp. 1040–1045.

Horikawa, T.

Y. Urino, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, H. Takahashi, E. Saito, M. Okano, T. Shimizu, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, D. Shimura, H. Okayama, H. Yaegashi, T. Tsuchizawa, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 12.5-Gbps optical interconnects integrated with lasers, optical splitters, optical modulators and photodetectors on a single silicon substrate,” Opt. Express 20, B256–B263 (2012).
[CrossRef]

Y. Urino, S. Akiyama, T. Akagawa, T. Baba, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, H. Takahashi, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, E. Saito, D. Shimura, H. Okayama, Y. Onawa, H. Yaegashi, H. Nishi, H. Fukuda, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 30-Tbps/cm2 bandwidth density by silicon optical interposers fully integrated with optical components,” in 39th European Conference and Exhibition on Optical Communication (IET, 2013), paper Mo.4.B.2.

Ichikawa, H.

M. Shishikura, T. Ban, H. Ichikawa, T. Ido, M. Takahashi, K. Nakahara, E. Nomoto, Y. Matsuoka, K. Ishikawa, K. Ito, R. Takeyari, H. Sano, T. Hirose, H. Takahashi, T. Nagara, H. Chiba, and S. Irikura, “10  Gbit/s per channel parallel optical transmitter and receiver modules for high-capacity interconnects,” in Proceeding of 53th Electronic Components and Technology Conference (IEEE, 2003), pp. 1040–1045.

Ido, T.

M. Shishikura, T. Ban, H. Ichikawa, T. Ido, M. Takahashi, K. Nakahara, E. Nomoto, Y. Matsuoka, K. Ishikawa, K. Ito, R. Takeyari, H. Sano, T. Hirose, H. Takahashi, T. Nagara, H. Chiba, and S. Irikura, “10  Gbit/s per channel parallel optical transmitter and receiver modules for high-capacity interconnects,” in Proceeding of 53th Electronic Components and Technology Conference (IEEE, 2003), pp. 1040–1045.

Imai, M.

Y. Urino, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, H. Takahashi, E. Saito, M. Okano, T. Shimizu, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, D. Shimura, H. Okayama, H. Yaegashi, T. Tsuchizawa, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 12.5-Gbps optical interconnects integrated with lasers, optical splitters, optical modulators and photodetectors on a single silicon substrate,” Opt. Express 20, B256–B263 (2012).
[CrossRef]

Y. Urino, S. Akiyama, T. Akagawa, T. Baba, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, H. Takahashi, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, E. Saito, D. Shimura, H. Okayama, Y. Onawa, H. Yaegashi, H. Nishi, H. Fukuda, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 30-Tbps/cm2 bandwidth density by silicon optical interposers fully integrated with optical components,” in 39th European Conference and Exhibition on Optical Communication (IET, 2013), paper Mo.4.B.2.

Irikura, S.

M. Shishikura, T. Ban, H. Ichikawa, T. Ido, M. Takahashi, K. Nakahara, E. Nomoto, Y. Matsuoka, K. Ishikawa, K. Ito, R. Takeyari, H. Sano, T. Hirose, H. Takahashi, T. Nagara, H. Chiba, and S. Irikura, “10  Gbit/s per channel parallel optical transmitter and receiver modules for high-capacity interconnects,” in Proceeding of 53th Electronic Components and Technology Conference (IEEE, 2003), pp. 1040–1045.

Ishikawa, K.

M. Shishikura, T. Ban, H. Ichikawa, T. Ido, M. Takahashi, K. Nakahara, E. Nomoto, Y. Matsuoka, K. Ishikawa, K. Ito, R. Takeyari, H. Sano, T. Hirose, H. Takahashi, T. Nagara, H. Chiba, and S. Irikura, “10  Gbit/s per channel parallel optical transmitter and receiver modules for high-capacity interconnects,” in Proceeding of 53th Electronic Components and Technology Conference (IEEE, 2003), pp. 1040–1045.

Ishizaka, M.

Y. Urino, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, H. Takahashi, E. Saito, M. Okano, T. Shimizu, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, D. Shimura, H. Okayama, H. Yaegashi, T. Tsuchizawa, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 12.5-Gbps optical interconnects integrated with lasers, optical splitters, optical modulators and photodetectors on a single silicon substrate,” Opt. Express 20, B256–B263 (2012).
[CrossRef]

Y. Urino, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, M. Noguchi, J. Fujikata, D. Shimura, H. Okayama, T. Tsuchizawa, T. Watanabe, K. Yamada, S. Itabashi, E. Saito, T. Nakamura, and Y. Arakawa, “First demonstration of high density optical interconnects integrated with lasers, optical modulators, and photodetectors on single silicon substrate,” Opt. Express 19, B159–B165 (2011).
[CrossRef]

N. Fujioka, T. Chu, and M. Ishizaka, “Compact and low power consumption hybrid integrated wavelength tunable laser module using silicon waveguide resonators,” J. Lightw. Technol. 28, 3115–3120 (2010).

Y. Urino, S. Akiyama, T. Akagawa, T. Baba, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, H. Takahashi, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, E. Saito, D. Shimura, H. Okayama, Y. Onawa, H. Yaegashi, H. Nishi, H. Fukuda, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 30-Tbps/cm2 bandwidth density by silicon optical interposers fully integrated with optical components,” in 39th European Conference and Exhibition on Optical Communication (IET, 2013), paper Mo.4.B.2.

T. Shimizu, N. Hatori, M. Okano, M. Ishizaka, Y. Urino, T. Yamamoto, M. Mori, T. Nakamura, and Y. Arakawa, “High density hybridly integrated light source with a laser diode array on a silicon optical waveguide platform,” in Integrated Photonic Research, Silicon and Nano Photonics (OSA, 2012), paper ITu4B.5.

T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, Y. Urino, T. Yamamoto, M. Mori, T. Nakamura, and Y. Arakawa, “Multi-channnel and high density hybrid integrated light source on a silicon optical waveguide platform,” in Asia Communications and Photonics Conference (OSA, 2012), paper AF3B.2.

T. Shimizu, N. Hatori, M. Okano, M. Ishizaka, Y. Urino, T. Yamamoto, M. Mori, T. Nakamura, and Y. Arakawa, “High density hybrid integrated light source with a laser diode array on a silicon optical waveguide platform for inter-chip optical interconnection,” in Proceeding of IEEE 8th International Conference on Group IV Photonics (IEEE, 2011), pp. 181–183.

Itabashi, S.

Ito, K.

M. Shishikura, T. Ban, H. Ichikawa, T. Ido, M. Takahashi, K. Nakahara, E. Nomoto, Y. Matsuoka, K. Ishikawa, K. Ito, R. Takeyari, H. Sano, T. Hirose, H. Takahashi, T. Nagara, H. Chiba, and S. Irikura, “10  Gbit/s per channel parallel optical transmitter and receiver modules for high-capacity interconnects,” in Proceeding of 53th Electronic Components and Technology Conference (IEEE, 2003), pp. 1040–1045.

Jones, R.

Kern, A. M.

I. A. Young, E. Mohammed, J. T. S. Liao, A. M. Kern, S. Palermo, B. A. Block, M. R. Reshotko, and P. L. D. Chang, “Optical I/O technology for tera-scale computing,” IEEE J. Solid-State Circuits 45, 235–248 (2010).
[CrossRef]

Kimerling, L. C.

J. Liu, X. Sun, R.-C. Aguilera, Y. Cai, L. C. Kimerling, and J. Michel, “Monolithic Ge-on-Si lasers for integrated photonics,” in Proceedings of IEEE 7th International Conference on Group IV Photonics (IEEE, 2010), pp. 1–3.

Kimura, N.

N. Kimura, K. Shinozaki, N. Kitamura, Y. Fukutomi, Y. Minota, H. Tanaka, A. Sato, and H. Ando, “Receptacle transceiver module using silica waveguide for bi-directional transmission over single fiber,” in Proceeding of 53th Electronic Components and Technology Conference (IEEE, 2003), pp. 290–295.

Kitamura, N.

N. Kimura, K. Shinozaki, N. Kitamura, Y. Fukutomi, Y. Minota, H. Tanaka, A. Sato, and H. Ando, “Receptacle transceiver module using silica waveguide for bi-directional transmission over single fiber,” in Proceeding of 53th Electronic Components and Technology Conference (IEEE, 2003), pp. 290–295.

Kurata, K.

T. Shimizu, Y. Akimoto, and K. Kurata, “An opto-electronic hybrid integrated platform with a polymer optical waveguide for high performance and low cost modules,” in Proceeding of 54th Electronic Components and Technology Conference (IEEE, 2004), pp. 1042–1045.

Liao, J. T. S.

I. A. Young, E. Mohammed, J. T. S. Liao, A. M. Kern, S. Palermo, B. A. Block, M. R. Reshotko, and P. L. D. Chang, “Optical I/O technology for tera-scale computing,” IEEE J. Solid-State Circuits 45, 235–248 (2010).
[CrossRef]

Liu, J.

J. Liu, X. Sun, R.-C. Aguilera, Y. Cai, L. C. Kimerling, and J. Michel, “Monolithic Ge-on-Si lasers for integrated photonics,” in Proceedings of IEEE 7th International Conference on Group IV Photonics (IEEE, 2010), pp. 1–3.

Matsuoka, Y.

M. Shishikura, T. Ban, H. Ichikawa, T. Ido, M. Takahashi, K. Nakahara, E. Nomoto, Y. Matsuoka, K. Ishikawa, K. Ito, R. Takeyari, H. Sano, T. Hirose, H. Takahashi, T. Nagara, H. Chiba, and S. Irikura, “10  Gbit/s per channel parallel optical transmitter and receiver modules for high-capacity interconnects,” in Proceeding of 53th Electronic Components and Technology Conference (IEEE, 2003), pp. 1040–1045.

Michel, J.

J. Liu, X. Sun, R.-C. Aguilera, Y. Cai, L. C. Kimerling, and J. Michel, “Monolithic Ge-on-Si lasers for integrated photonics,” in Proceedings of IEEE 7th International Conference on Group IV Photonics (IEEE, 2010), pp. 1–3.

Minota, Y.

N. Kimura, K. Shinozaki, N. Kitamura, Y. Fukutomi, Y. Minota, H. Tanaka, A. Sato, and H. Ando, “Receptacle transceiver module using silica waveguide for bi-directional transmission over single fiber,” in Proceeding of 53th Electronic Components and Technology Conference (IEEE, 2003), pp. 290–295.

Miura, M.

Y. Urino, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, H. Takahashi, E. Saito, M. Okano, T. Shimizu, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, D. Shimura, H. Okayama, H. Yaegashi, T. Tsuchizawa, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 12.5-Gbps optical interconnects integrated with lasers, optical splitters, optical modulators and photodetectors on a single silicon substrate,” Opt. Express 20, B256–B263 (2012).
[CrossRef]

Y. Urino, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, M. Noguchi, J. Fujikata, D. Shimura, H. Okayama, T. Tsuchizawa, T. Watanabe, K. Yamada, S. Itabashi, E. Saito, T. Nakamura, and Y. Arakawa, “First demonstration of high density optical interconnects integrated with lasers, optical modulators, and photodetectors on single silicon substrate,” Opt. Express 19, B159–B165 (2011).
[CrossRef]

Y. Urino, S. Akiyama, T. Akagawa, T. Baba, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, H. Takahashi, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, E. Saito, D. Shimura, H. Okayama, Y. Onawa, H. Yaegashi, H. Nishi, H. Fukuda, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 30-Tbps/cm2 bandwidth density by silicon optical interposers fully integrated with optical components,” in 39th European Conference and Exhibition on Optical Communication (IET, 2013), paper Mo.4.B.2.

Mohammed, E.

I. A. Young, E. Mohammed, J. T. S. Liao, A. M. Kern, S. Palermo, B. A. Block, M. R. Reshotko, and P. L. D. Chang, “Optical I/O technology for tera-scale computing,” IEEE J. Solid-State Circuits 45, 235–248 (2010).
[CrossRef]

Mori, M.

Y. Urino, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, H. Takahashi, E. Saito, M. Okano, T. Shimizu, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, D. Shimura, H. Okayama, H. Yaegashi, T. Tsuchizawa, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 12.5-Gbps optical interconnects integrated with lasers, optical splitters, optical modulators and photodetectors on a single silicon substrate,” Opt. Express 20, B256–B263 (2012).
[CrossRef]

Y. Urino, S. Akiyama, T. Akagawa, T. Baba, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, H. Takahashi, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, E. Saito, D. Shimura, H. Okayama, Y. Onawa, H. Yaegashi, H. Nishi, H. Fukuda, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 30-Tbps/cm2 bandwidth density by silicon optical interposers fully integrated with optical components,” in 39th European Conference and Exhibition on Optical Communication (IET, 2013), paper Mo.4.B.2.

T. Shimizu, N. Hatori, M. Okano, M. Ishizaka, Y. Urino, T. Yamamoto, M. Mori, T. Nakamura, and Y. Arakawa, “High density hybridly integrated light source with a laser diode array on a silicon optical waveguide platform,” in Integrated Photonic Research, Silicon and Nano Photonics (OSA, 2012), paper ITu4B.5.

T. Shimizu, N. Hatori, M. Okano, M. Ishizaka, Y. Urino, T. Yamamoto, M. Mori, T. Nakamura, and Y. Arakawa, “High density hybrid integrated light source with a laser diode array on a silicon optical waveguide platform for inter-chip optical interconnection,” in Proceeding of IEEE 8th International Conference on Group IV Photonics (IEEE, 2011), pp. 181–183.

T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, Y. Urino, T. Yamamoto, M. Mori, T. Nakamura, and Y. Arakawa, “Multi-channnel and high density hybrid integrated light source on a silicon optical waveguide platform,” in Asia Communications and Photonics Conference (OSA, 2012), paper AF3B.2.

Nagara, T.

M. Shishikura, T. Ban, H. Ichikawa, T. Ido, M. Takahashi, K. Nakahara, E. Nomoto, Y. Matsuoka, K. Ishikawa, K. Ito, R. Takeyari, H. Sano, T. Hirose, H. Takahashi, T. Nagara, H. Chiba, and S. Irikura, “10  Gbit/s per channel parallel optical transmitter and receiver modules for high-capacity interconnects,” in Proceeding of 53th Electronic Components and Technology Conference (IEEE, 2003), pp. 1040–1045.

Nakahara, K.

M. Shishikura, T. Ban, H. Ichikawa, T. Ido, M. Takahashi, K. Nakahara, E. Nomoto, Y. Matsuoka, K. Ishikawa, K. Ito, R. Takeyari, H. Sano, T. Hirose, H. Takahashi, T. Nagara, H. Chiba, and S. Irikura, “10  Gbit/s per channel parallel optical transmitter and receiver modules for high-capacity interconnects,” in Proceeding of 53th Electronic Components and Technology Conference (IEEE, 2003), pp. 1040–1045.

Nakamura, T.

Y. Urino, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, H. Takahashi, E. Saito, M. Okano, T. Shimizu, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, D. Shimura, H. Okayama, H. Yaegashi, T. Tsuchizawa, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 12.5-Gbps optical interconnects integrated with lasers, optical splitters, optical modulators and photodetectors on a single silicon substrate,” Opt. Express 20, B256–B263 (2012).
[CrossRef]

Y. Urino, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, M. Noguchi, J. Fujikata, D. Shimura, H. Okayama, T. Tsuchizawa, T. Watanabe, K. Yamada, S. Itabashi, E. Saito, T. Nakamura, and Y. Arakawa, “First demonstration of high density optical interconnects integrated with lasers, optical modulators, and photodetectors on single silicon substrate,” Opt. Express 19, B159–B165 (2011).
[CrossRef]

T. Shimizu, N. Hatori, M. Okano, M. Ishizaka, Y. Urino, T. Yamamoto, M. Mori, T. Nakamura, and Y. Arakawa, “High density hybridly integrated light source with a laser diode array on a silicon optical waveguide platform,” in Integrated Photonic Research, Silicon and Nano Photonics (OSA, 2012), paper ITu4B.5.

T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, Y. Urino, T. Yamamoto, M. Mori, T. Nakamura, and Y. Arakawa, “Multi-channnel and high density hybrid integrated light source on a silicon optical waveguide platform,” in Asia Communications and Photonics Conference (OSA, 2012), paper AF3B.2.

T. Shimizu, N. Hatori, M. Okano, M. Ishizaka, Y. Urino, T. Yamamoto, M. Mori, T. Nakamura, and Y. Arakawa, “High density hybrid integrated light source with a laser diode array on a silicon optical waveguide platform for inter-chip optical interconnection,” in Proceeding of IEEE 8th International Conference on Group IV Photonics (IEEE, 2011), pp. 181–183.

Y. Urino, S. Akiyama, T. Akagawa, T. Baba, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, H. Takahashi, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, E. Saito, D. Shimura, H. Okayama, Y. Onawa, H. Yaegashi, H. Nishi, H. Fukuda, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 30-Tbps/cm2 bandwidth density by silicon optical interposers fully integrated with optical components,” in 39th European Conference and Exhibition on Optical Communication (IET, 2013), paper Mo.4.B.2.

Nishi, H.

Y. Urino, S. Akiyama, T. Akagawa, T. Baba, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, H. Takahashi, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, E. Saito, D. Shimura, H. Okayama, Y. Onawa, H. Yaegashi, H. Nishi, H. Fukuda, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 30-Tbps/cm2 bandwidth density by silicon optical interposers fully integrated with optical components,” in 39th European Conference and Exhibition on Optical Communication (IET, 2013), paper Mo.4.B.2.

Noguchi, M.

Y. Urino, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, H. Takahashi, E. Saito, M. Okano, T. Shimizu, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, D. Shimura, H. Okayama, H. Yaegashi, T. Tsuchizawa, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 12.5-Gbps optical interconnects integrated with lasers, optical splitters, optical modulators and photodetectors on a single silicon substrate,” Opt. Express 20, B256–B263 (2012).
[CrossRef]

Y. Urino, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, M. Noguchi, J. Fujikata, D. Shimura, H. Okayama, T. Tsuchizawa, T. Watanabe, K. Yamada, S. Itabashi, E. Saito, T. Nakamura, and Y. Arakawa, “First demonstration of high density optical interconnects integrated with lasers, optical modulators, and photodetectors on single silicon substrate,” Opt. Express 19, B159–B165 (2011).
[CrossRef]

T. Sugimoto, T. Shimizu, Y. Akimoto, M. Noguchi, J. Sone, T. Watanabe, and Y. Urino, “A small and low cost bidirectional transceiver module with polymer waveguide for G-PON/Ge-PON,” in Proceeding of 57th Electronic Components and Technology Conference (IEEE, 2007), pp. 707–711.

Y. Urino, S. Akiyama, T. Akagawa, T. Baba, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, H. Takahashi, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, E. Saito, D. Shimura, H. Okayama, Y. Onawa, H. Yaegashi, H. Nishi, H. Fukuda, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 30-Tbps/cm2 bandwidth density by silicon optical interposers fully integrated with optical components,” in 39th European Conference and Exhibition on Optical Communication (IET, 2013), paper Mo.4.B.2.

Noguchi, Y.

Y. Urino, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, H. Takahashi, E. Saito, M. Okano, T. Shimizu, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, D. Shimura, H. Okayama, H. Yaegashi, T. Tsuchizawa, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 12.5-Gbps optical interconnects integrated with lasers, optical splitters, optical modulators and photodetectors on a single silicon substrate,” Opt. Express 20, B256–B263 (2012).
[CrossRef]

Y. Urino, S. Akiyama, T. Akagawa, T. Baba, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, H. Takahashi, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, E. Saito, D. Shimura, H. Okayama, Y. Onawa, H. Yaegashi, H. Nishi, H. Fukuda, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 30-Tbps/cm2 bandwidth density by silicon optical interposers fully integrated with optical components,” in 39th European Conference and Exhibition on Optical Communication (IET, 2013), paper Mo.4.B.2.

Nomoto, E.

M. Shishikura, T. Ban, H. Ichikawa, T. Ido, M. Takahashi, K. Nakahara, E. Nomoto, Y. Matsuoka, K. Ishikawa, K. Ito, R. Takeyari, H. Sano, T. Hirose, H. Takahashi, T. Nagara, H. Chiba, and S. Irikura, “10  Gbit/s per channel parallel optical transmitter and receiver modules for high-capacity interconnects,” in Proceeding of 53th Electronic Components and Technology Conference (IEEE, 2003), pp. 1040–1045.

Notis, M. R.

J. Ciulik and M. R. Notis, “The Au-Sn phase diagram,” J. Alloys Compd. 191, 71–78 (1993).
[CrossRef]

Okamoto, D.

Y. Urino, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, H. Takahashi, E. Saito, M. Okano, T. Shimizu, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, D. Shimura, H. Okayama, H. Yaegashi, T. Tsuchizawa, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 12.5-Gbps optical interconnects integrated with lasers, optical splitters, optical modulators and photodetectors on a single silicon substrate,” Opt. Express 20, B256–B263 (2012).
[CrossRef]

Y. Urino, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, M. Noguchi, J. Fujikata, D. Shimura, H. Okayama, T. Tsuchizawa, T. Watanabe, K. Yamada, S. Itabashi, E. Saito, T. Nakamura, and Y. Arakawa, “First demonstration of high density optical interconnects integrated with lasers, optical modulators, and photodetectors on single silicon substrate,” Opt. Express 19, B159–B165 (2011).
[CrossRef]

Y. Urino, S. Akiyama, T. Akagawa, T. Baba, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, H. Takahashi, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, E. Saito, D. Shimura, H. Okayama, Y. Onawa, H. Yaegashi, H. Nishi, H. Fukuda, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 30-Tbps/cm2 bandwidth density by silicon optical interposers fully integrated with optical components,” in 39th European Conference and Exhibition on Optical Communication (IET, 2013), paper Mo.4.B.2.

Okano, M.

Y. Urino, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, H. Takahashi, E. Saito, M. Okano, T. Shimizu, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, D. Shimura, H. Okayama, H. Yaegashi, T. Tsuchizawa, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 12.5-Gbps optical interconnects integrated with lasers, optical splitters, optical modulators and photodetectors on a single silicon substrate,” Opt. Express 20, B256–B263 (2012).
[CrossRef]

Y. Urino, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, M. Noguchi, J. Fujikata, D. Shimura, H. Okayama, T. Tsuchizawa, T. Watanabe, K. Yamada, S. Itabashi, E. Saito, T. Nakamura, and Y. Arakawa, “First demonstration of high density optical interconnects integrated with lasers, optical modulators, and photodetectors on single silicon substrate,” Opt. Express 19, B159–B165 (2011).
[CrossRef]

T. Shimizu, N. Hatori, M. Okano, M. Ishizaka, Y. Urino, T. Yamamoto, M. Mori, T. Nakamura, and Y. Arakawa, “High density hybridly integrated light source with a laser diode array on a silicon optical waveguide platform,” in Integrated Photonic Research, Silicon and Nano Photonics (OSA, 2012), paper ITu4B.5.

T. Shimizu, N. Hatori, M. Okano, M. Ishizaka, Y. Urino, T. Yamamoto, M. Mori, T. Nakamura, and Y. Arakawa, “High density hybrid integrated light source with a laser diode array on a silicon optical waveguide platform for inter-chip optical interconnection,” in Proceeding of IEEE 8th International Conference on Group IV Photonics (IEEE, 2011), pp. 181–183.

T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, Y. Urino, T. Yamamoto, M. Mori, T. Nakamura, and Y. Arakawa, “Multi-channnel and high density hybrid integrated light source on a silicon optical waveguide platform,” in Asia Communications and Photonics Conference (OSA, 2012), paper AF3B.2.

Y. Urino, S. Akiyama, T. Akagawa, T. Baba, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, H. Takahashi, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, E. Saito, D. Shimura, H. Okayama, Y. Onawa, H. Yaegashi, H. Nishi, H. Fukuda, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 30-Tbps/cm2 bandwidth density by silicon optical interposers fully integrated with optical components,” in 39th European Conference and Exhibition on Optical Communication (IET, 2013), paper Mo.4.B.2.

Okayama, H.

Y. Urino, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, H. Takahashi, E. Saito, M. Okano, T. Shimizu, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, D. Shimura, H. Okayama, H. Yaegashi, T. Tsuchizawa, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 12.5-Gbps optical interconnects integrated with lasers, optical splitters, optical modulators and photodetectors on a single silicon substrate,” Opt. Express 20, B256–B263 (2012).
[CrossRef]

Y. Urino, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, M. Noguchi, J. Fujikata, D. Shimura, H. Okayama, T. Tsuchizawa, T. Watanabe, K. Yamada, S. Itabashi, E. Saito, T. Nakamura, and Y. Arakawa, “First demonstration of high density optical interconnects integrated with lasers, optical modulators, and photodetectors on single silicon substrate,” Opt. Express 19, B159–B165 (2011).
[CrossRef]

Y. Urino, S. Akiyama, T. Akagawa, T. Baba, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, H. Takahashi, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, E. Saito, D. Shimura, H. Okayama, Y. Onawa, H. Yaegashi, H. Nishi, H. Fukuda, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 30-Tbps/cm2 bandwidth density by silicon optical interposers fully integrated with optical components,” in 39th European Conference and Exhibition on Optical Communication (IET, 2013), paper Mo.4.B.2.

Onawa, Y.

Y. Urino, S. Akiyama, T. Akagawa, T. Baba, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, H. Takahashi, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, E. Saito, D. Shimura, H. Okayama, Y. Onawa, H. Yaegashi, H. Nishi, H. Fukuda, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 30-Tbps/cm2 bandwidth density by silicon optical interposers fully integrated with optical components,” in 39th European Conference and Exhibition on Optical Communication (IET, 2013), paper Mo.4.B.2.

Palermo, S.

I. A. Young, E. Mohammed, J. T. S. Liao, A. M. Kern, S. Palermo, B. A. Block, M. R. Reshotko, and P. L. D. Chang, “Optical I/O technology for tera-scale computing,” IEEE J. Solid-State Circuits 45, 235–248 (2010).
[CrossRef]

Paniccia, M.

Park, H.

Raday, O.

Reshotko, M. R.

I. A. Young, E. Mohammed, J. T. S. Liao, A. M. Kern, S. Palermo, B. A. Block, M. R. Reshotko, and P. L. D. Chang, “Optical I/O technology for tera-scale computing,” IEEE J. Solid-State Circuits 45, 235–248 (2010).
[CrossRef]

Saito, E.

Y. Urino, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, H. Takahashi, E. Saito, M. Okano, T. Shimizu, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, D. Shimura, H. Okayama, H. Yaegashi, T. Tsuchizawa, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 12.5-Gbps optical interconnects integrated with lasers, optical splitters, optical modulators and photodetectors on a single silicon substrate,” Opt. Express 20, B256–B263 (2012).
[CrossRef]

Y. Urino, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, M. Noguchi, J. Fujikata, D. Shimura, H. Okayama, T. Tsuchizawa, T. Watanabe, K. Yamada, S. Itabashi, E. Saito, T. Nakamura, and Y. Arakawa, “First demonstration of high density optical interconnects integrated with lasers, optical modulators, and photodetectors on single silicon substrate,” Opt. Express 19, B159–B165 (2011).
[CrossRef]

Y. Urino, S. Akiyama, T. Akagawa, T. Baba, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, H. Takahashi, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, E. Saito, D. Shimura, H. Okayama, Y. Onawa, H. Yaegashi, H. Nishi, H. Fukuda, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 30-Tbps/cm2 bandwidth density by silicon optical interposers fully integrated with optical components,” in 39th European Conference and Exhibition on Optical Communication (IET, 2013), paper Mo.4.B.2.

Saito, S.

S. Saito, “Silicon and germanium quantum well light-emitting diode,” in Proceeding of IEEE 8th International Conference on Group IV Photonics (IEEE, 2011), pp. 166–168.

Saitou, S.

Y. Urino, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, H. Takahashi, E. Saito, M. Okano, T. Shimizu, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, D. Shimura, H. Okayama, H. Yaegashi, T. Tsuchizawa, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 12.5-Gbps optical interconnects integrated with lasers, optical splitters, optical modulators and photodetectors on a single silicon substrate,” Opt. Express 20, B256–B263 (2012).
[CrossRef]

Y. Urino, S. Akiyama, T. Akagawa, T. Baba, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, H. Takahashi, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, E. Saito, D. Shimura, H. Okayama, Y. Onawa, H. Yaegashi, H. Nishi, H. Fukuda, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 30-Tbps/cm2 bandwidth density by silicon optical interposers fully integrated with optical components,” in 39th European Conference and Exhibition on Optical Communication (IET, 2013), paper Mo.4.B.2.

Sano, H.

M. Shishikura, T. Ban, H. Ichikawa, T. Ido, M. Takahashi, K. Nakahara, E. Nomoto, Y. Matsuoka, K. Ishikawa, K. Ito, R. Takeyari, H. Sano, T. Hirose, H. Takahashi, T. Nagara, H. Chiba, and S. Irikura, “10  Gbit/s per channel parallel optical transmitter and receiver modules for high-capacity interconnects,” in Proceeding of 53th Electronic Components and Technology Conference (IEEE, 2003), pp. 1040–1045.

Sato, A.

N. Kimura, K. Shinozaki, N. Kitamura, Y. Fukutomi, Y. Minota, H. Tanaka, A. Sato, and H. Ando, “Receptacle transceiver module using silica waveguide for bi-directional transmission over single fiber,” in Proceeding of 53th Electronic Components and Technology Conference (IEEE, 2003), pp. 290–295.

Shimizu, T.

Y. Urino, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, H. Takahashi, E. Saito, M. Okano, T. Shimizu, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, D. Shimura, H. Okayama, H. Yaegashi, T. Tsuchizawa, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 12.5-Gbps optical interconnects integrated with lasers, optical splitters, optical modulators and photodetectors on a single silicon substrate,” Opt. Express 20, B256–B263 (2012).
[CrossRef]

Y. Urino, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, M. Noguchi, J. Fujikata, D. Shimura, H. Okayama, T. Tsuchizawa, T. Watanabe, K. Yamada, S. Itabashi, E. Saito, T. Nakamura, and Y. Arakawa, “First demonstration of high density optical interconnects integrated with lasers, optical modulators, and photodetectors on single silicon substrate,” Opt. Express 19, B159–B165 (2011).
[CrossRef]

T. Shimizu, N. Hatori, M. Okano, M. Ishizaka, Y. Urino, T. Yamamoto, M. Mori, T. Nakamura, and Y. Arakawa, “High density hybridly integrated light source with a laser diode array on a silicon optical waveguide platform,” in Integrated Photonic Research, Silicon and Nano Photonics (OSA, 2012), paper ITu4B.5.

T. Shimizu, Y. Akimoto, and K. Kurata, “An opto-electronic hybrid integrated platform with a polymer optical waveguide for high performance and low cost modules,” in Proceeding of 54th Electronic Components and Technology Conference (IEEE, 2004), pp. 1042–1045.

T. Sugimoto, T. Shimizu, Y. Akimoto, M. Noguchi, J. Sone, T. Watanabe, and Y. Urino, “A small and low cost bidirectional transceiver module with polymer waveguide for G-PON/Ge-PON,” in Proceeding of 57th Electronic Components and Technology Conference (IEEE, 2007), pp. 707–711.

T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, Y. Urino, T. Yamamoto, M. Mori, T. Nakamura, and Y. Arakawa, “Multi-channnel and high density hybrid integrated light source on a silicon optical waveguide platform,” in Asia Communications and Photonics Conference (OSA, 2012), paper AF3B.2.

T. Shimizu, N. Hatori, M. Okano, M. Ishizaka, Y. Urino, T. Yamamoto, M. Mori, T. Nakamura, and Y. Arakawa, “High density hybrid integrated light source with a laser diode array on a silicon optical waveguide platform for inter-chip optical interconnection,” in Proceeding of IEEE 8th International Conference on Group IV Photonics (IEEE, 2011), pp. 181–183.

Y. Urino, S. Akiyama, T. Akagawa, T. Baba, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, H. Takahashi, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, E. Saito, D. Shimura, H. Okayama, Y. Onawa, H. Yaegashi, H. Nishi, H. Fukuda, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 30-Tbps/cm2 bandwidth density by silicon optical interposers fully integrated with optical components,” in 39th European Conference and Exhibition on Optical Communication (IET, 2013), paper Mo.4.B.2.

Shimura, D.

Y. Urino, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, H. Takahashi, E. Saito, M. Okano, T. Shimizu, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, D. Shimura, H. Okayama, H. Yaegashi, T. Tsuchizawa, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 12.5-Gbps optical interconnects integrated with lasers, optical splitters, optical modulators and photodetectors on a single silicon substrate,” Opt. Express 20, B256–B263 (2012).
[CrossRef]

Y. Urino, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, M. Noguchi, J. Fujikata, D. Shimura, H. Okayama, T. Tsuchizawa, T. Watanabe, K. Yamada, S. Itabashi, E. Saito, T. Nakamura, and Y. Arakawa, “First demonstration of high density optical interconnects integrated with lasers, optical modulators, and photodetectors on single silicon substrate,” Opt. Express 19, B159–B165 (2011).
[CrossRef]

Y. Urino, S. Akiyama, T. Akagawa, T. Baba, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, H. Takahashi, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, E. Saito, D. Shimura, H. Okayama, Y. Onawa, H. Yaegashi, H. Nishi, H. Fukuda, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 30-Tbps/cm2 bandwidth density by silicon optical interposers fully integrated with optical components,” in 39th European Conference and Exhibition on Optical Communication (IET, 2013), paper Mo.4.B.2.

Shinozaki, K.

N. Kimura, K. Shinozaki, N. Kitamura, Y. Fukutomi, Y. Minota, H. Tanaka, A. Sato, and H. Ando, “Receptacle transceiver module using silica waveguide for bi-directional transmission over single fiber,” in Proceeding of 53th Electronic Components and Technology Conference (IEEE, 2003), pp. 290–295.

Shishikura, M.

M. Shishikura, T. Ban, H. Ichikawa, T. Ido, M. Takahashi, K. Nakahara, E. Nomoto, Y. Matsuoka, K. Ishikawa, K. Ito, R. Takeyari, H. Sano, T. Hirose, H. Takahashi, T. Nagara, H. Chiba, and S. Irikura, “10  Gbit/s per channel parallel optical transmitter and receiver modules for high-capacity interconnects,” in Proceeding of 53th Electronic Components and Technology Conference (IEEE, 2003), pp. 1040–1045.

Sone, J.

T. Sugimoto, T. Shimizu, Y. Akimoto, M. Noguchi, J. Sone, T. Watanabe, and Y. Urino, “A small and low cost bidirectional transceiver module with polymer waveguide for G-PON/Ge-PON,” in Proceeding of 57th Electronic Components and Technology Conference (IEEE, 2007), pp. 707–711.

Sugimoto, T.

T. Sugimoto, T. Shimizu, Y. Akimoto, M. Noguchi, J. Sone, T. Watanabe, and Y. Urino, “A small and low cost bidirectional transceiver module with polymer waveguide for G-PON/Ge-PON,” in Proceeding of 57th Electronic Components and Technology Conference (IEEE, 2007), pp. 707–711.

Sun, X.

J. Liu, X. Sun, R.-C. Aguilera, Y. Cai, L. C. Kimerling, and J. Michel, “Monolithic Ge-on-Si lasers for integrated photonics,” in Proceedings of IEEE 7th International Conference on Group IV Photonics (IEEE, 2010), pp. 1–3.

Suzuki, K.

T. Takeuchi, M. Takahashi, K. Suzuki, S. Watanabe, and H. Yamazaki, “Wavelength tunable laser with silica-waveguide ring resonators,” IEICE Trans. Electron. E92-C, 198–204 (2009).
[CrossRef]

Sysak, M. N.

Takahashi, H.

Y. Urino, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, H. Takahashi, E. Saito, M. Okano, T. Shimizu, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, D. Shimura, H. Okayama, H. Yaegashi, T. Tsuchizawa, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 12.5-Gbps optical interconnects integrated with lasers, optical splitters, optical modulators and photodetectors on a single silicon substrate,” Opt. Express 20, B256–B263 (2012).
[CrossRef]

M. Shishikura, T. Ban, H. Ichikawa, T. Ido, M. Takahashi, K. Nakahara, E. Nomoto, Y. Matsuoka, K. Ishikawa, K. Ito, R. Takeyari, H. Sano, T. Hirose, H. Takahashi, T. Nagara, H. Chiba, and S. Irikura, “10  Gbit/s per channel parallel optical transmitter and receiver modules for high-capacity interconnects,” in Proceeding of 53th Electronic Components and Technology Conference (IEEE, 2003), pp. 1040–1045.

Y. Urino, S. Akiyama, T. Akagawa, T. Baba, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, H. Takahashi, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, E. Saito, D. Shimura, H. Okayama, Y. Onawa, H. Yaegashi, H. Nishi, H. Fukuda, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 30-Tbps/cm2 bandwidth density by silicon optical interposers fully integrated with optical components,” in 39th European Conference and Exhibition on Optical Communication (IET, 2013), paper Mo.4.B.2.

Takahashi, M.

Y. Urino, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, H. Takahashi, E. Saito, M. Okano, T. Shimizu, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, D. Shimura, H. Okayama, H. Yaegashi, T. Tsuchizawa, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 12.5-Gbps optical interconnects integrated with lasers, optical splitters, optical modulators and photodetectors on a single silicon substrate,” Opt. Express 20, B256–B263 (2012).
[CrossRef]

T. Takeuchi, M. Takahashi, K. Suzuki, S. Watanabe, and H. Yamazaki, “Wavelength tunable laser with silica-waveguide ring resonators,” IEICE Trans. Electron. E92-C, 198–204 (2009).
[CrossRef]

M. Shishikura, T. Ban, H. Ichikawa, T. Ido, M. Takahashi, K. Nakahara, E. Nomoto, Y. Matsuoka, K. Ishikawa, K. Ito, R. Takeyari, H. Sano, T. Hirose, H. Takahashi, T. Nagara, H. Chiba, and S. Irikura, “10  Gbit/s per channel parallel optical transmitter and receiver modules for high-capacity interconnects,” in Proceeding of 53th Electronic Components and Technology Conference (IEEE, 2003), pp. 1040–1045.

Y. Urino, S. Akiyama, T. Akagawa, T. Baba, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, H. Takahashi, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, E. Saito, D. Shimura, H. Okayama, Y. Onawa, H. Yaegashi, H. Nishi, H. Fukuda, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 30-Tbps/cm2 bandwidth density by silicon optical interposers fully integrated with optical components,” in 39th European Conference and Exhibition on Optical Communication (IET, 2013), paper Mo.4.B.2.

Takeuchi, T.

T. Takeuchi, M. Takahashi, K. Suzuki, S. Watanabe, and H. Yamazaki, “Wavelength tunable laser with silica-waveguide ring resonators,” IEICE Trans. Electron. E92-C, 198–204 (2009).
[CrossRef]

Takeyari, R.

M. Shishikura, T. Ban, H. Ichikawa, T. Ido, M. Takahashi, K. Nakahara, E. Nomoto, Y. Matsuoka, K. Ishikawa, K. Ito, R. Takeyari, H. Sano, T. Hirose, H. Takahashi, T. Nagara, H. Chiba, and S. Irikura, “10  Gbit/s per channel parallel optical transmitter and receiver modules for high-capacity interconnects,” in Proceeding of 53th Electronic Components and Technology Conference (IEEE, 2003), pp. 1040–1045.

Tanabe, K.

K. Tanabe, K. Watanabe, S. Faure, and Y. Arakawa, “1.3  μm InAs/GaAs quantum dot lasers on Si substrates with current injection across direct-bonded GaAs/Si heterostructures,” in 37th European Conference and Exhibition on Optical Communication (OSA, 2011), paper Tu.6.LeSaleve.1.

Tanaka, H.

N. Kimura, K. Shinozaki, N. Kitamura, Y. Fukutomi, Y. Minota, H. Tanaka, A. Sato, and H. Ando, “Receptacle transceiver module using silica waveguide for bi-directional transmission over single fiber,” in Proceeding of 53th Electronic Components and Technology Conference (IEEE, 2003), pp. 290–295.

Tsuchizawa, T.

Urino, Y.

Y. Urino, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, H. Takahashi, E. Saito, M. Okano, T. Shimizu, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, D. Shimura, H. Okayama, H. Yaegashi, T. Tsuchizawa, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 12.5-Gbps optical interconnects integrated with lasers, optical splitters, optical modulators and photodetectors on a single silicon substrate,” Opt. Express 20, B256–B263 (2012).
[CrossRef]

Y. Urino, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, M. Noguchi, J. Fujikata, D. Shimura, H. Okayama, T. Tsuchizawa, T. Watanabe, K. Yamada, S. Itabashi, E. Saito, T. Nakamura, and Y. Arakawa, “First demonstration of high density optical interconnects integrated with lasers, optical modulators, and photodetectors on single silicon substrate,” Opt. Express 19, B159–B165 (2011).
[CrossRef]

T. Shimizu, N. Hatori, M. Okano, M. Ishizaka, Y. Urino, T. Yamamoto, M. Mori, T. Nakamura, and Y. Arakawa, “High density hybridly integrated light source with a laser diode array on a silicon optical waveguide platform,” in Integrated Photonic Research, Silicon and Nano Photonics (OSA, 2012), paper ITu4B.5.

T. Sugimoto, T. Shimizu, Y. Akimoto, M. Noguchi, J. Sone, T. Watanabe, and Y. Urino, “A small and low cost bidirectional transceiver module with polymer waveguide for G-PON/Ge-PON,” in Proceeding of 57th Electronic Components and Technology Conference (IEEE, 2007), pp. 707–711.

T. Shimizu, N. Hatori, M. Okano, M. Ishizaka, Y. Urino, T. Yamamoto, M. Mori, T. Nakamura, and Y. Arakawa, “High density hybrid integrated light source with a laser diode array on a silicon optical waveguide platform for inter-chip optical interconnection,” in Proceeding of IEEE 8th International Conference on Group IV Photonics (IEEE, 2011), pp. 181–183.

T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, Y. Urino, T. Yamamoto, M. Mori, T. Nakamura, and Y. Arakawa, “Multi-channnel and high density hybrid integrated light source on a silicon optical waveguide platform,” in Asia Communications and Photonics Conference (OSA, 2012), paper AF3B.2.

Y. Urino, S. Akiyama, T. Akagawa, T. Baba, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, H. Takahashi, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, E. Saito, D. Shimura, H. Okayama, Y. Onawa, H. Yaegashi, H. Nishi, H. Fukuda, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 30-Tbps/cm2 bandwidth density by silicon optical interposers fully integrated with optical components,” in 39th European Conference and Exhibition on Optical Communication (IET, 2013), paper Mo.4.B.2.

Usuki, T.

Y. Urino, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, H. Takahashi, E. Saito, M. Okano, T. Shimizu, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, D. Shimura, H. Okayama, H. Yaegashi, T. Tsuchizawa, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 12.5-Gbps optical interconnects integrated with lasers, optical splitters, optical modulators and photodetectors on a single silicon substrate,” Opt. Express 20, B256–B263 (2012).
[CrossRef]

Y. Urino, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, M. Noguchi, J. Fujikata, D. Shimura, H. Okayama, T. Tsuchizawa, T. Watanabe, K. Yamada, S. Itabashi, E. Saito, T. Nakamura, and Y. Arakawa, “First demonstration of high density optical interconnects integrated with lasers, optical modulators, and photodetectors on single silicon substrate,” Opt. Express 19, B159–B165 (2011).
[CrossRef]

Y. Urino, S. Akiyama, T. Akagawa, T. Baba, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, H. Takahashi, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, E. Saito, D. Shimura, H. Okayama, Y. Onawa, H. Yaegashi, H. Nishi, H. Fukuda, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 30-Tbps/cm2 bandwidth density by silicon optical interposers fully integrated with optical components,” in 39th European Conference and Exhibition on Optical Communication (IET, 2013), paper Mo.4.B.2.

Watanabe, K.

K. Tanabe, K. Watanabe, S. Faure, and Y. Arakawa, “1.3  μm InAs/GaAs quantum dot lasers on Si substrates with current injection across direct-bonded GaAs/Si heterostructures,” in 37th European Conference and Exhibition on Optical Communication (OSA, 2011), paper Tu.6.LeSaleve.1.

Watanabe, S.

T. Takeuchi, M. Takahashi, K. Suzuki, S. Watanabe, and H. Yamazaki, “Wavelength tunable laser with silica-waveguide ring resonators,” IEICE Trans. Electron. E92-C, 198–204 (2009).
[CrossRef]

Watanabe, T.

Yaegashi, H.

Y. Urino, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, H. Takahashi, E. Saito, M. Okano, T. Shimizu, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, D. Shimura, H. Okayama, H. Yaegashi, T. Tsuchizawa, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 12.5-Gbps optical interconnects integrated with lasers, optical splitters, optical modulators and photodetectors on a single silicon substrate,” Opt. Express 20, B256–B263 (2012).
[CrossRef]

Y. Urino, S. Akiyama, T. Akagawa, T. Baba, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, H. Takahashi, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, E. Saito, D. Shimura, H. Okayama, Y. Onawa, H. Yaegashi, H. Nishi, H. Fukuda, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 30-Tbps/cm2 bandwidth density by silicon optical interposers fully integrated with optical components,” in 39th European Conference and Exhibition on Optical Communication (IET, 2013), paper Mo.4.B.2.

Yamada, K.

Y. Urino, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, H. Takahashi, E. Saito, M. Okano, T. Shimizu, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, D. Shimura, H. Okayama, H. Yaegashi, T. Tsuchizawa, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 12.5-Gbps optical interconnects integrated with lasers, optical splitters, optical modulators and photodetectors on a single silicon substrate,” Opt. Express 20, B256–B263 (2012).
[CrossRef]

Y. Urino, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, M. Noguchi, J. Fujikata, D. Shimura, H. Okayama, T. Tsuchizawa, T. Watanabe, K. Yamada, S. Itabashi, E. Saito, T. Nakamura, and Y. Arakawa, “First demonstration of high density optical interconnects integrated with lasers, optical modulators, and photodetectors on single silicon substrate,” Opt. Express 19, B159–B165 (2011).
[CrossRef]

Y. Urino, S. Akiyama, T. Akagawa, T. Baba, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, H. Takahashi, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, E. Saito, D. Shimura, H. Okayama, Y. Onawa, H. Yaegashi, H. Nishi, H. Fukuda, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 30-Tbps/cm2 bandwidth density by silicon optical interposers fully integrated with optical components,” in 39th European Conference and Exhibition on Optical Communication (IET, 2013), paper Mo.4.B.2.

Yamagishi, M.

Y. Urino, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, H. Takahashi, E. Saito, M. Okano, T. Shimizu, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, D. Shimura, H. Okayama, H. Yaegashi, T. Tsuchizawa, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 12.5-Gbps optical interconnects integrated with lasers, optical splitters, optical modulators and photodetectors on a single silicon substrate,” Opt. Express 20, B256–B263 (2012).
[CrossRef]

Y. Urino, S. Akiyama, T. Akagawa, T. Baba, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, H. Takahashi, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, E. Saito, D. Shimura, H. Okayama, Y. Onawa, H. Yaegashi, H. Nishi, H. Fukuda, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 30-Tbps/cm2 bandwidth density by silicon optical interposers fully integrated with optical components,” in 39th European Conference and Exhibition on Optical Communication (IET, 2013), paper Mo.4.B.2.

Yamamoto, T.

Y. Urino, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, H. Takahashi, E. Saito, M. Okano, T. Shimizu, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, D. Shimura, H. Okayama, H. Yaegashi, T. Tsuchizawa, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 12.5-Gbps optical interconnects integrated with lasers, optical splitters, optical modulators and photodetectors on a single silicon substrate,” Opt. Express 20, B256–B263 (2012).
[CrossRef]

Y. Urino, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, M. Noguchi, J. Fujikata, D. Shimura, H. Okayama, T. Tsuchizawa, T. Watanabe, K. Yamada, S. Itabashi, E. Saito, T. Nakamura, and Y. Arakawa, “First demonstration of high density optical interconnects integrated with lasers, optical modulators, and photodetectors on single silicon substrate,” Opt. Express 19, B159–B165 (2011).
[CrossRef]

T. Shimizu, N. Hatori, M. Okano, M. Ishizaka, Y. Urino, T. Yamamoto, M. Mori, T. Nakamura, and Y. Arakawa, “High density hybridly integrated light source with a laser diode array on a silicon optical waveguide platform,” in Integrated Photonic Research, Silicon and Nano Photonics (OSA, 2012), paper ITu4B.5.

T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, Y. Urino, T. Yamamoto, M. Mori, T. Nakamura, and Y. Arakawa, “Multi-channnel and high density hybrid integrated light source on a silicon optical waveguide platform,” in Asia Communications and Photonics Conference (OSA, 2012), paper AF3B.2.

T. Shimizu, N. Hatori, M. Okano, M. Ishizaka, Y. Urino, T. Yamamoto, M. Mori, T. Nakamura, and Y. Arakawa, “High density hybrid integrated light source with a laser diode array on a silicon optical waveguide platform for inter-chip optical interconnection,” in Proceeding of IEEE 8th International Conference on Group IV Photonics (IEEE, 2011), pp. 181–183.

Y. Urino, S. Akiyama, T. Akagawa, T. Baba, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, H. Takahashi, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, E. Saito, D. Shimura, H. Okayama, Y. Onawa, H. Yaegashi, H. Nishi, H. Fukuda, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 30-Tbps/cm2 bandwidth density by silicon optical interposers fully integrated with optical components,” in 39th European Conference and Exhibition on Optical Communication (IET, 2013), paper Mo.4.B.2.

Yamazaki, H.

T. Takeuchi, M. Takahashi, K. Suzuki, S. Watanabe, and H. Yamazaki, “Wavelength tunable laser with silica-waveguide ring resonators,” IEICE Trans. Electron. E92-C, 198–204 (2009).
[CrossRef]

Young, I. A.

I. A. Young, E. Mohammed, J. T. S. Liao, A. M. Kern, S. Palermo, B. A. Block, M. R. Reshotko, and P. L. D. Chang, “Optical I/O technology for tera-scale computing,” IEEE J. Solid-State Circuits 45, 235–248 (2010).
[CrossRef]

IEEE J. Solid-State Circuits

I. A. Young, E. Mohammed, J. T. S. Liao, A. M. Kern, S. Palermo, B. A. Block, M. R. Reshotko, and P. L. D. Chang, “Optical I/O technology for tera-scale computing,” IEEE J. Solid-State Circuits 45, 235–248 (2010).
[CrossRef]

IEICE Trans. Electron.

T. Takeuchi, M. Takahashi, K. Suzuki, S. Watanabe, and H. Yamazaki, “Wavelength tunable laser with silica-waveguide ring resonators,” IEICE Trans. Electron. E92-C, 198–204 (2009).
[CrossRef]

J. Alloys Compd.

J. Ciulik and M. R. Notis, “The Au-Sn phase diagram,” J. Alloys Compd. 191, 71–78 (1993).
[CrossRef]

J. Lightw. Technol.

N. Fujioka, T. Chu, and M. Ishizaka, “Compact and low power consumption hybrid integrated wavelength tunable laser module using silicon waveguide resonators,” J. Lightw. Technol. 28, 3115–3120 (2010).

Opt. Express

Other

Y. Urino, S. Akiyama, T. Akagawa, T. Baba, T. Usuki, D. Okamoto, M. Miura, J. Fujikata, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, H. Takahashi, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, E. Saito, D. Shimura, H. Okayama, Y. Onawa, H. Yaegashi, H. Nishi, H. Fukuda, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, and Y. Arakawa, “Demonstration of 30-Tbps/cm2 bandwidth density by silicon optical interposers fully integrated with optical components,” in 39th European Conference and Exhibition on Optical Communication (IET, 2013), paper Mo.4.B.2.

J. Liu, X. Sun, R.-C. Aguilera, Y. Cai, L. C. Kimerling, and J. Michel, “Monolithic Ge-on-Si lasers for integrated photonics,” in Proceedings of IEEE 7th International Conference on Group IV Photonics (IEEE, 2010), pp. 1–3.

T. Shimizu, Y. Akimoto, and K. Kurata, “An opto-electronic hybrid integrated platform with a polymer optical waveguide for high performance and low cost modules,” in Proceeding of 54th Electronic Components and Technology Conference (IEEE, 2004), pp. 1042–1045.

T. Sugimoto, T. Shimizu, Y. Akimoto, M. Noguchi, J. Sone, T. Watanabe, and Y. Urino, “A small and low cost bidirectional transceiver module with polymer waveguide for G-PON/Ge-PON,” in Proceeding of 57th Electronic Components and Technology Conference (IEEE, 2007), pp. 707–711.

K. Tanabe, K. Watanabe, S. Faure, and Y. Arakawa, “1.3  μm InAs/GaAs quantum dot lasers on Si substrates with current injection across direct-bonded GaAs/Si heterostructures,” in 37th European Conference and Exhibition on Optical Communication (OSA, 2011), paper Tu.6.LeSaleve.1.

S. Saito, “Silicon and germanium quantum well light-emitting diode,” in Proceeding of IEEE 8th International Conference on Group IV Photonics (IEEE, 2011), pp. 166–168.

N. Kimura, K. Shinozaki, N. Kitamura, Y. Fukutomi, Y. Minota, H. Tanaka, A. Sato, and H. Ando, “Receptacle transceiver module using silica waveguide for bi-directional transmission over single fiber,” in Proceeding of 53th Electronic Components and Technology Conference (IEEE, 2003), pp. 290–295.

M. Shishikura, T. Ban, H. Ichikawa, T. Ido, M. Takahashi, K. Nakahara, E. Nomoto, Y. Matsuoka, K. Ishikawa, K. Ito, R. Takeyari, H. Sano, T. Hirose, H. Takahashi, T. Nagara, H. Chiba, and S. Irikura, “10  Gbit/s per channel parallel optical transmitter and receiver modules for high-capacity interconnects,” in Proceeding of 53th Electronic Components and Technology Conference (IEEE, 2003), pp. 1040–1045.

T. Shimizu, N. Hatori, M. Okano, M. Ishizaka, Y. Urino, T. Yamamoto, M. Mori, T. Nakamura, and Y. Arakawa, “High density hybrid integrated light source with a laser diode array on a silicon optical waveguide platform for inter-chip optical interconnection,” in Proceeding of IEEE 8th International Conference on Group IV Photonics (IEEE, 2011), pp. 181–183.

T. Shimizu, N. Hatori, M. Okano, M. Ishizaka, Y. Urino, T. Yamamoto, M. Mori, T. Nakamura, and Y. Arakawa, “High density hybridly integrated light source with a laser diode array on a silicon optical waveguide platform,” in Integrated Photonic Research, Silicon and Nano Photonics (OSA, 2012), paper ITu4B.5.

T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, Y. Urino, T. Yamamoto, M. Mori, T. Nakamura, and Y. Arakawa, “Multi-channnel and high density hybrid integrated light source on a silicon optical waveguide platform,” in Asia Communications and Photonics Conference (OSA, 2012), paper AF3B.2.

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Figures (14)

Fig. 1.
Fig. 1.

Schematic of integrated light source in photonics-electronics convergence system.

Fig. 2.
Fig. 2.

Hybrid integration structure with an LD array on a silicon waveguide platform.

Fig. 3.
Fig. 3.

Photograph of 13-channel LD array. Cavity length is 400 μm, and array pitch is 30 μm.

Fig. 4.
Fig. 4.

Scanning electron microscope image of waveguide facet made by dry etching.

Fig. 5.
Fig. 5.

(a) Schematic of LD mounting structure and (b) LD mounting image focused on alignment marks by transmission infrared light.

Fig. 6.
Fig. 6.

(a) Schematic and (b) photograph of 13-channel hybrid integrated light source.

Fig. 7.
Fig. 7.

Dependence of light output of 13-channel LD array on operating current at room temperature without cooling.

Fig. 8.
Fig. 8.

Optical coupling tolerance between LD and SiON waveguide along horizontal and vertical directions.

Fig. 9.
Fig. 9.

Relative light intensity of 13-channel LD array and waveguide output ports on integrated light source.

Fig. 10.
Fig. 10.

(a) Schematic and (b) photograph of integrated light source with 52 output ports made possible by introducing waveguide splitter.

Fig. 11.
Fig. 11.

Schematic showing multichip bonding technology. (a) Mounting structure and (b) illustration of diffusion of Au on surface of electrodes into AuSn bump at soldering.

Fig. 12.
Fig. 12.

(a) Schematic and (b) photograph of integrated light source with 104 output ports with two LD array chips.

Fig. 13.
Fig. 13.

Near-field pattern of outputs in integrated light source with 104 output ports.

Fig. 14.
Fig. 14.

Histogram of relative intensity of output ports. (a) 1st–52nd channel port and (b) 53rd–104th channel port.

Tables (1)

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Table 1. Requirements of Integrated Light Source for 10Tbit/s Optical Interconnects

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