Zhiping Zhou, Editor-in-Chief
Jianping Yao, Kun Xu, and José Capmany
Jianping Yao,1,* Kun Xu,2 and José Capmany3
1School of Electrical Engineering, University of
Ottawa, Ottawa, Ontario K1N 6N5, Canada
2Beijing University of Posts and Telecommunications,
3ITEAM Research Institute, Universitat
Politécnica de Valencia, Camino de Vera s/n, 46022 Valencia, Spain
*Corresponding author: email@example.com
No abstract available.
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