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OSA Publishing

Optical Materials Express Feature Issue

Hybrid Integrated Photonic Platforms

Submissions opens: 1 May 2021
Submissions close: 1 June 2021

Hybrid photonic integration and interfaces allow the combination of different ingredients on a single functional unit and enhance our ability to manipulate light, thereby enabling photonic technologies with extraordinary performance, new functionalities, and scalability. This feature issue will provide perspectives on all aspects of hybrid integrated photonic platforms and will address critical challenges and requirements across a broad range of photonic technologies such as communication, computing, sensing, quantum photonics, reconfigurable photonics, flexible photonics, and bio-photonics. We welcome contributions on hybrid and heterogeneous photonic integration and interfacing approaches, as well as emerging solutions spanning the entire optical frequency range.

Topics to be covered include but are not limited to:

  • Hybrid integrated photonic materials
    • Hybrid integrated photonic platforms: e.g. Si, SiO2, III-Vs, SiNx photonics
    • Hybrid photonic materials: LiNbO3, SiGe, SiC, chalcogenide compounds, magneto-optic materials, phase-change materials, nonlinear optical materials, ferroelectrics, electro-optic materials, etc.
    • Low dimensional materials: 2D materials, quantum dots, quantum wires, and quantum wells, etc.
    • Soft matter: polymers, liquid crystals, etc.
  • Hybrid integrated photonic and nanophotonic devices and systems
  • Heterogeneous photonic integration: heteroepitaxy, deposition, bonding, transfer printing, additive manufacturing
  • Photonic packaging and assembly, coupling, optical interposers, photonics-to-electronics integration, co-packaging
  • Applications and emerging functions of hybrid integrated photonics: chip-level optical interconnects, sensing, computing, Lidar, quantum photonics, tunable and reconfigurable photonics, flexible photonics

All papers need to present original, previously unpublished work, and will be subject to the normal criteria and peer-review process of the Journal. The standard OMEx publication charges will apply to all published articles.

Manuscripts must be prepared according to the usual guidelines for submission to Optical Materials Express and must be submitted online through OSA's electronic submission system. When submitting, authors should specify that the manuscript is for the "Hybrid Integrated Photonic Platforms" feature issue (choose from the drop-down menu).

Feature Issue Guest Editors
Tian Gu, Massachusetts Institute of Technology, USA (Lead Editor)
Hyun Jung Kim, National Institute of Aerospace, USA
Hongtao Lin, Zhejiang University, China
Sebastian Lourdudoss, KTH Royal Institute of Technology, Sweden
Weidong Zhou, University of Texas at Arlington, USA
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