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OSA Publishing

Optical Materials Express Feature Issue

Flexible and wearable: Exploring a New Domain of Photonics and Optoelectronics

Submissions open: 1 February 2022
Submissions close: 1 March 2022

The role of wearable optical technologies is rapidly expanding, fueled by the development of new scalable fabrication methods and engineering of organic materials and metamaterials that can provide flexibility without compromising optical performance. This feature issue will highlight recent advances in wearable optical and photonic technologies and applications with a focus on flexible materials, fibers and textiles with embedded photonic functionalities, including optical communication, sensing, thermoregulation, biomedical imaging and monitoring, and color engineering. We welcome submissions on emerging topics such as passive radiative cooling, solar energy harvesting, flexible photonic display technologies, and noninvasive, wearable photonic healthcare devices for personalized medicine.

Topics to be covered include but are not limited to:

  • Polymer optical fibers
  • Structural color engineering
  • Optical-stimuli-responsive fibers and textiles
  • Color-changing flexible materials
  • Radiatively-cooling textiles and wearables
  • Solar energy harvesting with flexible and textile-based materials and devices
  • Wearable flexible optical sensors
  • Wearable photonic devices for biomedical imaging and monitoring
  • Fabrication of flexible and wearable materials with photonic functionalities
  • Textile-embedded antennas
  • Electromagnetic textiles for radiation shielding and thermal signature control

Manuscripts must be prepared according to the usual guidelines for submission to Optical Materials Express and must be submitted online through OSA's electronic submission system. When submitting, authors should specify that the manuscript is for the "Flexible and wearable: exploring a new domain of Photonics and Optoelectronics" feature issue (choose from the drop-down menu).

Feature Issue Guest Editors
Svetlana V. Boriskina, Massachusetts Inst. of Technology, USA (Lead Editor)
Po-Chun Hsu, Duke University, USA
Maksim Skorobogatiy, École Polytechnique de Montréal, Canada
Cunjiang Yu, University of Houston, USA
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