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OSA Publishing

Optical Materials Express Feature Announcement

Advanced Computational Nanophotonics: From Materials to Devices

Submission Opens: 1 August 2018
Submission Deadline: 1 October 2018

The rapid-publication, open-access, electronic OSA journal, Optical Materials Express (OMEx), is planning a feature issue on advanced computational nanophotonics. Papers will cover recent advances in the area of advanced computational nanophotonics and computational optical materials science.

The primary focus of the feature issue is design and optimization methods for new optical metamaterials (MMs) and metasurfaces (MSs) with unusual properties. To guide and support experimental and theoretical research on MMs and MSs at all stages of discovery, design optimization, development, manufacture, and validation, it's imperative to have a reliable, fast, accurate, and user-friendly (easy-to-use and easy-to-access) simulation toolset. A successful multiscale approach should couple several scientific areas: optical materials science and engineering, advanced numerical methods in electromagnetics, high-performance computing (HPC), and software packaging.

Topics to be covered include but are not limited to:

  • Computational characterization of optical materials
  • Design of advanced artificial nanostructured meta-devices
  • Nonlinearity, nonlocal and quantum effects
  • New 2D materials and other exotic material platforms
  • Multiscale and multiphysics design and optimization of dynamically controlled nanophotonic elements

Manuscripts must be prepared according to the usual guidelines for submission to Optical Materials Express and must be submitted online through OSA's online submission system. When submitting, authors must specify that the manuscript is for the "Advanced Computational Nanophotonics" feature issue (choose from the drop-down menu). The standard OMEx publication charges will apply to all published articles.

Feature Editors

Alexander V. Kildishev, Purdue University, USA (Lead Editor)
Juejun Hu, Massachusetts Institute of Technology, USA
Olivier Martin, Ecole Polytechnique Federale de Lausanne, Switzerland
Doug Werner, Pennsylvania State University, USA

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