Abstract

The thickness of optical thin films, such as dielectrics, can be determined by the use of a profilometer or by a spectrophotometer. Both of these standard methods have coated area size limitations. Converting a digital camera to a spectrophotometer eliminates these size limitations. This work reviews a simple method for determining the physical thickness of a dielectric film on a silicon wafer using two images from a digital camera.

© 2017 Optical Society of America

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