Abstract
This Letter presents a method for the fabrication and integration of a thin substrate with a Si handle wafer. An inverted ridge structure guides a single optical mode in an electro-optic modulator fabricated on a mechanically thinned substrate. To define an optical waveguide, a ridge structure is first patterned on a 500 μm thick X-cut wafer; then a low dielectric constant adhesive layer is used to bond the etched to Si. The is mechanically thinned to 4 μm, and planar electrodes are patterned. Experimental results demonstrating modulation with a of 7.1 V-cm were shown, optical loss was low enough, and film quality high enough, to enable an interaction length of 0.8 cm.
© 2016 Optical Society of America
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