Abstract

Despite many attractive properties and well-developed micro/nano manufacturing technologies based on silicon (Si) wafers, severe adhesions between Si and glass at high temperature have limited its application as a mold material in precision glass molding. In this Letter, a coating using carbide-bonded graphene is introduced to build nonstick Si molds for glass molding. The coating has extraordinary mechanical properties and can effectively prevent Si-glass adhesion under high temperature. We demonstrated fabrications of a Fresnel lens and glass parts with micrometer pillars using graphene-coated Si molds. This newly developed process enables the use of Si as a mold material to fabricate sophisticated structures with high-precision dimensions that was not previously available. This technology will greatly improve precision glass molding process and allow high-precision low-cost glass optics to be manufactured in large quantity.

© 2013 Optical Society of America

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References

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  1. S. Franssila, Introduction to Microfabrication, 2nd ed. (Wiley, 2010).
  2. S. Möller and S. R. Forrest, J. Appl. Phys. 91, 3324 (2002).
    [CrossRef]
  3. A. Kirakosian, R. Bennewitz, J. N. Crain, T. Fauster, J.-L. Lin, D. Y. Petrovykh, and F. J. Himpsel, Appl. Phys. Lett. 79, 1608 (2001).
    [CrossRef]
  4. P. He, F. Wang, L. Li, K. Georgiadis, O. Dambon, F. Klocke, and A. Y. Yi, J. Opt. 13, 085703 (2011).
    [CrossRef]
  5. O. Dambon, F. Wang, F. Klocke, G. Pongs, B. Bresseler, Y. Chen, and A. Y. Yi, J. Vac. Sci. Technol. B 27, 1445 (2009).
    [CrossRef]
  6. L. Li, P. He, F. Wang, K. Georgiadis, O. Dambon, F. Klocke, and A. Y. Yi, J. Opt. 13, 055407 (2011).
    [CrossRef]
  7. K. Green, J. Burke, and B. Oreb, Opt. Eng. 50, 023401 (2011).
    [CrossRef]
  8. J. Albero, L. Nieradko, C. Gorecki, H. Ottevaere, V. Gomez, and J. Pietarinen, Proc. SPIE 6992, 69920A (2008).
    [CrossRef]
  9. Y. Hirai, K. Kanakugi, T. Yamaguchi, K. Yao, S. Kitagawa, and Y. Tanaka, Microelectron. Eng. 67–68237 (2003).
    [CrossRef]
  10. Y. Chen, L. Li, and A. Y. Yi, J. Micromech. Microeng. 17, 883 (2007).
    [CrossRef]
  11. A. K. Geim and K. S. Novoselov, Nat. Mater. 6, 183 (2007).
    [CrossRef]
  12. W. Huang, Y. Jianfeng, K. J. Kwak, D. Gallego-Perez, W. Liao, H. Yang, X. Ouyang, L. Li, W. Lu, G. Lafyatis, and L. J. Lee, “Carbide-bonded graphene coating,” Adv. Mater (to be published).
  13. M. Takahashi, K. Sugimoto, and R. Maeda, Jpn. J. Appl. Phys. 44, 5600 (2005).
    [CrossRef]
  14. M. Komori, H. Uchiyama, H. Takebe, T. Kusuura, K. Kobayashi, H. Kuwahara, and T. Tsuchiya, J. Micromech. Microeng.18, 065013 (2008).
  15. W. Huang, X. Ouyang, and L. J. Lee, ACS Nano 6, 10178 (2012).
    [CrossRef]
  16. E. Cabrera, S. Ko, J. Castro, and L. J. Lee are preparing a manuscript to be titled “New approach to EMI shielding of plastic parts using in mold coated nanopapers.”

2012 (1)

W. Huang, X. Ouyang, and L. J. Lee, ACS Nano 6, 10178 (2012).
[CrossRef]

2011 (3)

P. He, F. Wang, L. Li, K. Georgiadis, O. Dambon, F. Klocke, and A. Y. Yi, J. Opt. 13, 085703 (2011).
[CrossRef]

L. Li, P. He, F. Wang, K. Georgiadis, O. Dambon, F. Klocke, and A. Y. Yi, J. Opt. 13, 055407 (2011).
[CrossRef]

K. Green, J. Burke, and B. Oreb, Opt. Eng. 50, 023401 (2011).
[CrossRef]

2009 (1)

O. Dambon, F. Wang, F. Klocke, G. Pongs, B. Bresseler, Y. Chen, and A. Y. Yi, J. Vac. Sci. Technol. B 27, 1445 (2009).
[CrossRef]

2008 (1)

J. Albero, L. Nieradko, C. Gorecki, H. Ottevaere, V. Gomez, and J. Pietarinen, Proc. SPIE 6992, 69920A (2008).
[CrossRef]

2007 (2)

Y. Chen, L. Li, and A. Y. Yi, J. Micromech. Microeng. 17, 883 (2007).
[CrossRef]

A. K. Geim and K. S. Novoselov, Nat. Mater. 6, 183 (2007).
[CrossRef]

2005 (1)

M. Takahashi, K. Sugimoto, and R. Maeda, Jpn. J. Appl. Phys. 44, 5600 (2005).
[CrossRef]

2003 (1)

Y. Hirai, K. Kanakugi, T. Yamaguchi, K. Yao, S. Kitagawa, and Y. Tanaka, Microelectron. Eng. 67–68237 (2003).
[CrossRef]

2002 (1)

S. Möller and S. R. Forrest, J. Appl. Phys. 91, 3324 (2002).
[CrossRef]

2001 (1)

A. Kirakosian, R. Bennewitz, J. N. Crain, T. Fauster, J.-L. Lin, D. Y. Petrovykh, and F. J. Himpsel, Appl. Phys. Lett. 79, 1608 (2001).
[CrossRef]

Albero, J.

J. Albero, L. Nieradko, C. Gorecki, H. Ottevaere, V. Gomez, and J. Pietarinen, Proc. SPIE 6992, 69920A (2008).
[CrossRef]

Bennewitz, R.

A. Kirakosian, R. Bennewitz, J. N. Crain, T. Fauster, J.-L. Lin, D. Y. Petrovykh, and F. J. Himpsel, Appl. Phys. Lett. 79, 1608 (2001).
[CrossRef]

Bresseler, B.

O. Dambon, F. Wang, F. Klocke, G. Pongs, B. Bresseler, Y. Chen, and A. Y. Yi, J. Vac. Sci. Technol. B 27, 1445 (2009).
[CrossRef]

Burke, J.

K. Green, J. Burke, and B. Oreb, Opt. Eng. 50, 023401 (2011).
[CrossRef]

Cabrera, E.

E. Cabrera, S. Ko, J. Castro, and L. J. Lee are preparing a manuscript to be titled “New approach to EMI shielding of plastic parts using in mold coated nanopapers.”

Castro, J.

E. Cabrera, S. Ko, J. Castro, and L. J. Lee are preparing a manuscript to be titled “New approach to EMI shielding of plastic parts using in mold coated nanopapers.”

Chen, Y.

O. Dambon, F. Wang, F. Klocke, G. Pongs, B. Bresseler, Y. Chen, and A. Y. Yi, J. Vac. Sci. Technol. B 27, 1445 (2009).
[CrossRef]

Y. Chen, L. Li, and A. Y. Yi, J. Micromech. Microeng. 17, 883 (2007).
[CrossRef]

Crain, J. N.

A. Kirakosian, R. Bennewitz, J. N. Crain, T. Fauster, J.-L. Lin, D. Y. Petrovykh, and F. J. Himpsel, Appl. Phys. Lett. 79, 1608 (2001).
[CrossRef]

Dambon, O.

L. Li, P. He, F. Wang, K. Georgiadis, O. Dambon, F. Klocke, and A. Y. Yi, J. Opt. 13, 055407 (2011).
[CrossRef]

P. He, F. Wang, L. Li, K. Georgiadis, O. Dambon, F. Klocke, and A. Y. Yi, J. Opt. 13, 085703 (2011).
[CrossRef]

O. Dambon, F. Wang, F. Klocke, G. Pongs, B. Bresseler, Y. Chen, and A. Y. Yi, J. Vac. Sci. Technol. B 27, 1445 (2009).
[CrossRef]

Fauster, T.

A. Kirakosian, R. Bennewitz, J. N. Crain, T. Fauster, J.-L. Lin, D. Y. Petrovykh, and F. J. Himpsel, Appl. Phys. Lett. 79, 1608 (2001).
[CrossRef]

Forrest, S. R.

S. Möller and S. R. Forrest, J. Appl. Phys. 91, 3324 (2002).
[CrossRef]

Franssila, S.

S. Franssila, Introduction to Microfabrication, 2nd ed. (Wiley, 2010).

Gallego-Perez, D.

W. Huang, Y. Jianfeng, K. J. Kwak, D. Gallego-Perez, W. Liao, H. Yang, X. Ouyang, L. Li, W. Lu, G. Lafyatis, and L. J. Lee, “Carbide-bonded graphene coating,” Adv. Mater (to be published).

Geim, A. K.

A. K. Geim and K. S. Novoselov, Nat. Mater. 6, 183 (2007).
[CrossRef]

Georgiadis, K.

P. He, F. Wang, L. Li, K. Georgiadis, O. Dambon, F. Klocke, and A. Y. Yi, J. Opt. 13, 085703 (2011).
[CrossRef]

L. Li, P. He, F. Wang, K. Georgiadis, O. Dambon, F. Klocke, and A. Y. Yi, J. Opt. 13, 055407 (2011).
[CrossRef]

Gomez, V.

J. Albero, L. Nieradko, C. Gorecki, H. Ottevaere, V. Gomez, and J. Pietarinen, Proc. SPIE 6992, 69920A (2008).
[CrossRef]

Gorecki, C.

J. Albero, L. Nieradko, C. Gorecki, H. Ottevaere, V. Gomez, and J. Pietarinen, Proc. SPIE 6992, 69920A (2008).
[CrossRef]

Green, K.

K. Green, J. Burke, and B. Oreb, Opt. Eng. 50, 023401 (2011).
[CrossRef]

He, P.

L. Li, P. He, F. Wang, K. Georgiadis, O. Dambon, F. Klocke, and A. Y. Yi, J. Opt. 13, 055407 (2011).
[CrossRef]

P. He, F. Wang, L. Li, K. Georgiadis, O. Dambon, F. Klocke, and A. Y. Yi, J. Opt. 13, 085703 (2011).
[CrossRef]

Himpsel, F. J.

A. Kirakosian, R. Bennewitz, J. N. Crain, T. Fauster, J.-L. Lin, D. Y. Petrovykh, and F. J. Himpsel, Appl. Phys. Lett. 79, 1608 (2001).
[CrossRef]

Hirai, Y.

Y. Hirai, K. Kanakugi, T. Yamaguchi, K. Yao, S. Kitagawa, and Y. Tanaka, Microelectron. Eng. 67–68237 (2003).
[CrossRef]

Huang, W.

W. Huang, X. Ouyang, and L. J. Lee, ACS Nano 6, 10178 (2012).
[CrossRef]

W. Huang, Y. Jianfeng, K. J. Kwak, D. Gallego-Perez, W. Liao, H. Yang, X. Ouyang, L. Li, W. Lu, G. Lafyatis, and L. J. Lee, “Carbide-bonded graphene coating,” Adv. Mater (to be published).

Jianfeng, Y.

W. Huang, Y. Jianfeng, K. J. Kwak, D. Gallego-Perez, W. Liao, H. Yang, X. Ouyang, L. Li, W. Lu, G. Lafyatis, and L. J. Lee, “Carbide-bonded graphene coating,” Adv. Mater (to be published).

Kanakugi, K.

Y. Hirai, K. Kanakugi, T. Yamaguchi, K. Yao, S. Kitagawa, and Y. Tanaka, Microelectron. Eng. 67–68237 (2003).
[CrossRef]

Kirakosian, A.

A. Kirakosian, R. Bennewitz, J. N. Crain, T. Fauster, J.-L. Lin, D. Y. Petrovykh, and F. J. Himpsel, Appl. Phys. Lett. 79, 1608 (2001).
[CrossRef]

Kitagawa, S.

Y. Hirai, K. Kanakugi, T. Yamaguchi, K. Yao, S. Kitagawa, and Y. Tanaka, Microelectron. Eng. 67–68237 (2003).
[CrossRef]

Klocke, F.

L. Li, P. He, F. Wang, K. Georgiadis, O. Dambon, F. Klocke, and A. Y. Yi, J. Opt. 13, 055407 (2011).
[CrossRef]

P. He, F. Wang, L. Li, K. Georgiadis, O. Dambon, F. Klocke, and A. Y. Yi, J. Opt. 13, 085703 (2011).
[CrossRef]

O. Dambon, F. Wang, F. Klocke, G. Pongs, B. Bresseler, Y. Chen, and A. Y. Yi, J. Vac. Sci. Technol. B 27, 1445 (2009).
[CrossRef]

Ko, S.

E. Cabrera, S. Ko, J. Castro, and L. J. Lee are preparing a manuscript to be titled “New approach to EMI shielding of plastic parts using in mold coated nanopapers.”

Kobayashi, K.

M. Komori, H. Uchiyama, H. Takebe, T. Kusuura, K. Kobayashi, H. Kuwahara, and T. Tsuchiya, J. Micromech. Microeng.18, 065013 (2008).

Komori, M.

M. Komori, H. Uchiyama, H. Takebe, T. Kusuura, K. Kobayashi, H. Kuwahara, and T. Tsuchiya, J. Micromech. Microeng.18, 065013 (2008).

Kusuura, T.

M. Komori, H. Uchiyama, H. Takebe, T. Kusuura, K. Kobayashi, H. Kuwahara, and T. Tsuchiya, J. Micromech. Microeng.18, 065013 (2008).

Kuwahara, H.

M. Komori, H. Uchiyama, H. Takebe, T. Kusuura, K. Kobayashi, H. Kuwahara, and T. Tsuchiya, J. Micromech. Microeng.18, 065013 (2008).

Kwak, K. J.

W. Huang, Y. Jianfeng, K. J. Kwak, D. Gallego-Perez, W. Liao, H. Yang, X. Ouyang, L. Li, W. Lu, G. Lafyatis, and L. J. Lee, “Carbide-bonded graphene coating,” Adv. Mater (to be published).

Lafyatis, G.

W. Huang, Y. Jianfeng, K. J. Kwak, D. Gallego-Perez, W. Liao, H. Yang, X. Ouyang, L. Li, W. Lu, G. Lafyatis, and L. J. Lee, “Carbide-bonded graphene coating,” Adv. Mater (to be published).

Lee, L. J.

W. Huang, X. Ouyang, and L. J. Lee, ACS Nano 6, 10178 (2012).
[CrossRef]

W. Huang, Y. Jianfeng, K. J. Kwak, D. Gallego-Perez, W. Liao, H. Yang, X. Ouyang, L. Li, W. Lu, G. Lafyatis, and L. J. Lee, “Carbide-bonded graphene coating,” Adv. Mater (to be published).

E. Cabrera, S. Ko, J. Castro, and L. J. Lee are preparing a manuscript to be titled “New approach to EMI shielding of plastic parts using in mold coated nanopapers.”

Li, L.

L. Li, P. He, F. Wang, K. Georgiadis, O. Dambon, F. Klocke, and A. Y. Yi, J. Opt. 13, 055407 (2011).
[CrossRef]

P. He, F. Wang, L. Li, K. Georgiadis, O. Dambon, F. Klocke, and A. Y. Yi, J. Opt. 13, 085703 (2011).
[CrossRef]

Y. Chen, L. Li, and A. Y. Yi, J. Micromech. Microeng. 17, 883 (2007).
[CrossRef]

W. Huang, Y. Jianfeng, K. J. Kwak, D. Gallego-Perez, W. Liao, H. Yang, X. Ouyang, L. Li, W. Lu, G. Lafyatis, and L. J. Lee, “Carbide-bonded graphene coating,” Adv. Mater (to be published).

Liao, W.

W. Huang, Y. Jianfeng, K. J. Kwak, D. Gallego-Perez, W. Liao, H. Yang, X. Ouyang, L. Li, W. Lu, G. Lafyatis, and L. J. Lee, “Carbide-bonded graphene coating,” Adv. Mater (to be published).

Lin, J.-L.

A. Kirakosian, R. Bennewitz, J. N. Crain, T. Fauster, J.-L. Lin, D. Y. Petrovykh, and F. J. Himpsel, Appl. Phys. Lett. 79, 1608 (2001).
[CrossRef]

Lu, W.

W. Huang, Y. Jianfeng, K. J. Kwak, D. Gallego-Perez, W. Liao, H. Yang, X. Ouyang, L. Li, W. Lu, G. Lafyatis, and L. J. Lee, “Carbide-bonded graphene coating,” Adv. Mater (to be published).

Maeda, R.

M. Takahashi, K. Sugimoto, and R. Maeda, Jpn. J. Appl. Phys. 44, 5600 (2005).
[CrossRef]

Möller, S.

S. Möller and S. R. Forrest, J. Appl. Phys. 91, 3324 (2002).
[CrossRef]

Nieradko, L.

J. Albero, L. Nieradko, C. Gorecki, H. Ottevaere, V. Gomez, and J. Pietarinen, Proc. SPIE 6992, 69920A (2008).
[CrossRef]

Novoselov, K. S.

A. K. Geim and K. S. Novoselov, Nat. Mater. 6, 183 (2007).
[CrossRef]

Oreb, B.

K. Green, J. Burke, and B. Oreb, Opt. Eng. 50, 023401 (2011).
[CrossRef]

Ottevaere, H.

J. Albero, L. Nieradko, C. Gorecki, H. Ottevaere, V. Gomez, and J. Pietarinen, Proc. SPIE 6992, 69920A (2008).
[CrossRef]

Ouyang, X.

W. Huang, X. Ouyang, and L. J. Lee, ACS Nano 6, 10178 (2012).
[CrossRef]

W. Huang, Y. Jianfeng, K. J. Kwak, D. Gallego-Perez, W. Liao, H. Yang, X. Ouyang, L. Li, W. Lu, G. Lafyatis, and L. J. Lee, “Carbide-bonded graphene coating,” Adv. Mater (to be published).

Petrovykh, D. Y.

A. Kirakosian, R. Bennewitz, J. N. Crain, T. Fauster, J.-L. Lin, D. Y. Petrovykh, and F. J. Himpsel, Appl. Phys. Lett. 79, 1608 (2001).
[CrossRef]

Pietarinen, J.

J. Albero, L. Nieradko, C. Gorecki, H. Ottevaere, V. Gomez, and J. Pietarinen, Proc. SPIE 6992, 69920A (2008).
[CrossRef]

Pongs, G.

O. Dambon, F. Wang, F. Klocke, G. Pongs, B. Bresseler, Y. Chen, and A. Y. Yi, J. Vac. Sci. Technol. B 27, 1445 (2009).
[CrossRef]

Sugimoto, K.

M. Takahashi, K. Sugimoto, and R. Maeda, Jpn. J. Appl. Phys. 44, 5600 (2005).
[CrossRef]

Takahashi, M.

M. Takahashi, K. Sugimoto, and R. Maeda, Jpn. J. Appl. Phys. 44, 5600 (2005).
[CrossRef]

Takebe, H.

M. Komori, H. Uchiyama, H. Takebe, T. Kusuura, K. Kobayashi, H. Kuwahara, and T. Tsuchiya, J. Micromech. Microeng.18, 065013 (2008).

Tanaka, Y.

Y. Hirai, K. Kanakugi, T. Yamaguchi, K. Yao, S. Kitagawa, and Y. Tanaka, Microelectron. Eng. 67–68237 (2003).
[CrossRef]

Tsuchiya, T.

M. Komori, H. Uchiyama, H. Takebe, T. Kusuura, K. Kobayashi, H. Kuwahara, and T. Tsuchiya, J. Micromech. Microeng.18, 065013 (2008).

Uchiyama, H.

M. Komori, H. Uchiyama, H. Takebe, T. Kusuura, K. Kobayashi, H. Kuwahara, and T. Tsuchiya, J. Micromech. Microeng.18, 065013 (2008).

Wang, F.

L. Li, P. He, F. Wang, K. Georgiadis, O. Dambon, F. Klocke, and A. Y. Yi, J. Opt. 13, 055407 (2011).
[CrossRef]

P. He, F. Wang, L. Li, K. Georgiadis, O. Dambon, F. Klocke, and A. Y. Yi, J. Opt. 13, 085703 (2011).
[CrossRef]

O. Dambon, F. Wang, F. Klocke, G. Pongs, B. Bresseler, Y. Chen, and A. Y. Yi, J. Vac. Sci. Technol. B 27, 1445 (2009).
[CrossRef]

Yamaguchi, T.

Y. Hirai, K. Kanakugi, T. Yamaguchi, K. Yao, S. Kitagawa, and Y. Tanaka, Microelectron. Eng. 67–68237 (2003).
[CrossRef]

Yang, H.

W. Huang, Y. Jianfeng, K. J. Kwak, D. Gallego-Perez, W. Liao, H. Yang, X. Ouyang, L. Li, W. Lu, G. Lafyatis, and L. J. Lee, “Carbide-bonded graphene coating,” Adv. Mater (to be published).

Yao, K.

Y. Hirai, K. Kanakugi, T. Yamaguchi, K. Yao, S. Kitagawa, and Y. Tanaka, Microelectron. Eng. 67–68237 (2003).
[CrossRef]

Yi, A. Y.

L. Li, P. He, F. Wang, K. Georgiadis, O. Dambon, F. Klocke, and A. Y. Yi, J. Opt. 13, 055407 (2011).
[CrossRef]

P. He, F. Wang, L. Li, K. Georgiadis, O. Dambon, F. Klocke, and A. Y. Yi, J. Opt. 13, 085703 (2011).
[CrossRef]

O. Dambon, F. Wang, F. Klocke, G. Pongs, B. Bresseler, Y. Chen, and A. Y. Yi, J. Vac. Sci. Technol. B 27, 1445 (2009).
[CrossRef]

Y. Chen, L. Li, and A. Y. Yi, J. Micromech. Microeng. 17, 883 (2007).
[CrossRef]

ACS Nano (1)

W. Huang, X. Ouyang, and L. J. Lee, ACS Nano 6, 10178 (2012).
[CrossRef]

Appl. Phys. Lett. (1)

A. Kirakosian, R. Bennewitz, J. N. Crain, T. Fauster, J.-L. Lin, D. Y. Petrovykh, and F. J. Himpsel, Appl. Phys. Lett. 79, 1608 (2001).
[CrossRef]

J. Appl. Phys. (1)

S. Möller and S. R. Forrest, J. Appl. Phys. 91, 3324 (2002).
[CrossRef]

J. Micromech. Microeng. (1)

Y. Chen, L. Li, and A. Y. Yi, J. Micromech. Microeng. 17, 883 (2007).
[CrossRef]

J. Opt. (2)

L. Li, P. He, F. Wang, K. Georgiadis, O. Dambon, F. Klocke, and A. Y. Yi, J. Opt. 13, 055407 (2011).
[CrossRef]

P. He, F. Wang, L. Li, K. Georgiadis, O. Dambon, F. Klocke, and A. Y. Yi, J. Opt. 13, 085703 (2011).
[CrossRef]

J. Vac. Sci. Technol. B (1)

O. Dambon, F. Wang, F. Klocke, G. Pongs, B. Bresseler, Y. Chen, and A. Y. Yi, J. Vac. Sci. Technol. B 27, 1445 (2009).
[CrossRef]

Jpn. J. Appl. Phys. (1)

M. Takahashi, K. Sugimoto, and R. Maeda, Jpn. J. Appl. Phys. 44, 5600 (2005).
[CrossRef]

Microelectron. Eng. (1)

Y. Hirai, K. Kanakugi, T. Yamaguchi, K. Yao, S. Kitagawa, and Y. Tanaka, Microelectron. Eng. 67–68237 (2003).
[CrossRef]

Nat. Mater. (1)

A. K. Geim and K. S. Novoselov, Nat. Mater. 6, 183 (2007).
[CrossRef]

Opt. Eng. (1)

K. Green, J. Burke, and B. Oreb, Opt. Eng. 50, 023401 (2011).
[CrossRef]

Proc. SPIE (1)

J. Albero, L. Nieradko, C. Gorecki, H. Ottevaere, V. Gomez, and J. Pietarinen, Proc. SPIE 6992, 69920A (2008).
[CrossRef]

Other (4)

W. Huang, Y. Jianfeng, K. J. Kwak, D. Gallego-Perez, W. Liao, H. Yang, X. Ouyang, L. Li, W. Lu, G. Lafyatis, and L. J. Lee, “Carbide-bonded graphene coating,” Adv. Mater (to be published).

S. Franssila, Introduction to Microfabrication, 2nd ed. (Wiley, 2010).

M. Komori, H. Uchiyama, H. Takebe, T. Kusuura, K. Kobayashi, H. Kuwahara, and T. Tsuchiya, J. Micromech. Microeng.18, 065013 (2008).

E. Cabrera, S. Ko, J. Castro, and L. J. Lee are preparing a manuscript to be titled “New approach to EMI shielding of plastic parts using in mold coated nanopapers.”

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Figures (5)

Fig. 1.
Fig. 1.

(a) Schematic of carbide-bonded graphene coating deposition on the Si substrate using nanosheets. (b) Surface scan of an uncoated Si wafer. Surface roughness was 0.53 nm (Ra). (c) Surface scan of a graphene-coated Si wafer, surface roughness was 0.50 nm (Ra).

Fig. 2.
Fig. 2.

(a) Cross section view of the molding experiment setup. (b) Temperature and load history of glass molding. (c) Glass molding using a carbide-bonded graphene-coated Si wafer. (d) Glass molding using a Si wafer without graphene coating.

Fig. 3.
Fig. 3.

(a) Surface profile of a coated Si mold. (b) SEM image of Si mold with microwells after molding. (c) Surface scan of a molded glass with micropillars. The inset is an SEM picture of the molded glass. (d) Comparison of line scans between the Si mold and the molded glass part (the profile of the Si mold was flipped for comparison).

Fig. 4.
Fig. 4.

(a) Surface scan of the molded glass Fresnel lens. (b) Comparison of line scans between the molded glass lens and the Si mold (the profile of the molded glass lens was flipped for comparison).

Fig. 5.
Fig. 5.

(a) Optical setup for testing the imaging quality of molded Fresnel lens. LS, light source; LD, light diffuser; d1=690mm, d2=86mm, d3 is about 127 mm. (b) Image of the target with both Fresnel lens and commercial lens. (c) Image of the target on CCD with commercial lens alone. The molded lens was removed and CCD was placed on the focus plane of the commercial lens in this measurement.

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