Abstract

A simple and practical method for preparing phosphor glass is proposed. Phosphor distribution and element analysis are investigated by optical microscope and field emission scanning electron microscope (FE-SEM). The phosphor particles dispersed in the matrix are vividly observed, and their distributions are uniform. Spectrum distribution and color coordinates dependent on the thickness of the screen-printed phosphor layer coupled with a blue light emitting diode (LED) chip are studied. The luminous efficacy of the 75 μm printed phosphor-layer phosphor glass packaged white LED is 81.24lm/W at 350 mA. This study opens up many possibilities for applications using the phosphor glass on a selected chip in which emission is well absorbed by all phosphors. The screen-printing technique also offers possibilities for the design and engineering of complex phosphor layers on glass substrates. Phosphor screen-printing technology allows the realization of high stability and thermal conductivity for the phosphor layer. This phosphor glass method provides many possibilities for LED packing, including thin-film flip chip and remote phosphor technology.

© 2013 Optical Society of America

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    [CrossRef]
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    [CrossRef]
  3. H. Zhao, G. Liu, J. Zhang, J. D. Poplawsky, V. Dierolf, and N. Tansu, Opt. Express 19, A991 (2011).
    [CrossRef]
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    [CrossRef]
  5. C. K. Tan, J. Zhang, X. H. Li, G. Y. Liu, B. O. Tayo, and N. Tansu, J. Display Technology 9, 272 (2013).
    [CrossRef]
  6. H. C. Kuo, C. W. Hung, H. C. Chen, K. J. Chen, C. H. Wang, C. W. Sher, C. C. Yeh, C. C. Lin, C. H. Chen, and Y. J. Cheng, Opt. Express 19, A930 (2011).
    [CrossRef]
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    [CrossRef]
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    [CrossRef]
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    [CrossRef]
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    [CrossRef]
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    [CrossRef]
  15. S. Nishiura, S. Tanabe, K. Fujioka, and Y. Fujimoto, Opt. Mater. 33, 688 (2011).
    [CrossRef]
  16. S. Fujita, S. Yoshihara, A. Sakamoto, S. Yamamoto, and S. Tanabe, Proc. SPIE 5941, 186 (2005).
    [CrossRef]
  17. C. Lucat, P. Ginet, and F. Ménil, J. Microelectron. Electron. Packag. 4, 86 (2007).
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    [CrossRef]
  19. N. Narendran and Y. Gu, J. Display Technology 1, 167 (2005).
    [CrossRef]
  20. M. R. Haskard and R. Malcolm, Thick Film Technology and Applications (Port Erin, Electrochemical Publications, 1997).
    [CrossRef]
  21. T. Nakanishi and S. Tanabe, IEEE J. Sel. Top. Quantum Electron. 15, 1171 (2009).
    [CrossRef]
  22. C. C. Tsai, J. S. Liou, W. C. Cheng, C. H. Chung, M. H. Chen, J. Wang, and W. H. Cheng, in Electronic Components and Technology Conference (IEEE, 2011), pp. 1626–1630.

2013 (5)

G. Y. Liu, J. Zhang, C. K. Tan, and N. Tansu, IEEE Photon. J. 5, 2201011 (2013).
[CrossRef]

C. K. Tan, J. Zhang, X. H. Li, G. Y. Liu, B. O. Tayo, and N. Tansu, J. Display Technology 9, 272 (2013).
[CrossRef]

C. C. Tsai, W. C. Cheng, J. K. Chang, L. Y. Chen, J. H. Chen, Y. C. Hsu, and W. H. Cheng, J. Display Technology 9, 427 (2013).
[CrossRef]

L. Y. Chen, J. K. Chang, Y. R. Wu, W. C. Cheng, J. H. Chen, C. C. Tsai, and W. H. Cheng, J. Display Technology 9, 441 (2013).
[CrossRef]

D. F. Feezell, J. S. Speck, S. P. DenBaars, and S. Nakamura, J. Disp. Technol. 9, 190 (2013).
[CrossRef]

2012 (2)

R. M. Farrell, E. C. Young, F. Wu, S. P. DenBaars, and J. S. Speck, Semicond. Sci. Technol. 27, 024001 (2012).
[CrossRef]

M. H. Chang, D. Das, P. V. Varde, and M. Pecht, Microelectron. Reliab. 52, 762 (2012).
[CrossRef]

2011 (5)

P. F. Smet, A. B. Parmentier, and D. Poelman, J. Electrochem. Soc. 158, R37 (2011).
[CrossRef]

H. C. Kuo, C. W. Hung, H. C. Chen, K. J. Chen, C. H. Wang, C. W. Sher, C. C. Yeh, C. C. Lin, C. H. Chen, and Y. J. Cheng, Opt. Express 19, A930 (2011).
[CrossRef]

S. E. Brinkley, N. Pfaff, K. A. Denault, Z. J. Zhang, H. T. Hintzen, R. Seshadri, S. Nakamura, and S. P. DenBaars, Appl. Phys. Lett. 99, 241106 (2011).
[CrossRef]

H. Zhao, G. Liu, J. Zhang, J. D. Poplawsky, V. Dierolf, and N. Tansu, Opt. Express 19, A991 (2011).
[CrossRef]

S. Nishiura, S. Tanabe, K. Fujioka, and Y. Fujimoto, Opt. Mater. 33, 688 (2011).
[CrossRef]

2009 (1)

T. Nakanishi and S. Tanabe, IEEE J. Sel. Top. Quantum Electron. 15, 1171 (2009).
[CrossRef]

2008 (1)

S. Fujita, A. Sakamoto, and S. Tanabe, IEEE J. Sel. Top. Quantum Electron. 14, 1387 (2008).
[CrossRef]

2007 (1)

C. Lucat, P. Ginet, and F. Ménil, J. Microelectron. Electron. Packag. 4, 86 (2007).

2005 (3)

H. Luo, J. K. Kim, E. F. Schubert, J. Cho, C. Sone, and Y. Park, Appl. Phys. Lett. 86, 213505 (2005).
[CrossRef]

N. Narendran and Y. Gu, J. Display Technology 1, 167 (2005).
[CrossRef]

S. Fujita, S. Yoshihara, A. Sakamoto, S. Yamamoto, and S. Tanabe, Proc. SPIE 5941, 186 (2005).
[CrossRef]

Brinkley, S. E.

S. E. Brinkley, N. Pfaff, K. A. Denault, Z. J. Zhang, H. T. Hintzen, R. Seshadri, S. Nakamura, and S. P. DenBaars, Appl. Phys. Lett. 99, 241106 (2011).
[CrossRef]

Chang, J. K.

C. C. Tsai, W. C. Cheng, J. K. Chang, L. Y. Chen, J. H. Chen, Y. C. Hsu, and W. H. Cheng, J. Display Technology 9, 427 (2013).
[CrossRef]

L. Y. Chen, J. K. Chang, Y. R. Wu, W. C. Cheng, J. H. Chen, C. C. Tsai, and W. H. Cheng, J. Display Technology 9, 441 (2013).
[CrossRef]

Chang, M. H.

M. H. Chang, D. Das, P. V. Varde, and M. Pecht, Microelectron. Reliab. 52, 762 (2012).
[CrossRef]

Chen, C. H.

Chen, H. C.

Chen, J. H.

L. Y. Chen, J. K. Chang, Y. R. Wu, W. C. Cheng, J. H. Chen, C. C. Tsai, and W. H. Cheng, J. Display Technology 9, 441 (2013).
[CrossRef]

C. C. Tsai, W. C. Cheng, J. K. Chang, L. Y. Chen, J. H. Chen, Y. C. Hsu, and W. H. Cheng, J. Display Technology 9, 427 (2013).
[CrossRef]

Chen, K. J.

Chen, L. Y.

L. Y. Chen, J. K. Chang, Y. R. Wu, W. C. Cheng, J. H. Chen, C. C. Tsai, and W. H. Cheng, J. Display Technology 9, 441 (2013).
[CrossRef]

C. C. Tsai, W. C. Cheng, J. K. Chang, L. Y. Chen, J. H. Chen, Y. C. Hsu, and W. H. Cheng, J. Display Technology 9, 427 (2013).
[CrossRef]

Chen, M. H.

C. C. Tsai, J. S. Liou, W. C. Cheng, C. H. Chung, M. H. Chen, J. Wang, and W. H. Cheng, in Electronic Components and Technology Conference (IEEE, 2011), pp. 1626–1630.

Chen, M. X.

L. Yang, Z. C. Lv, M. X. Chen, and S. Liu, in 5th International Conference on Electronic Packaging Technology and High Density Packaging (IEEE, 2012), pp. 1463–1466.

Cheng, W. C.

L. Y. Chen, J. K. Chang, Y. R. Wu, W. C. Cheng, J. H. Chen, C. C. Tsai, and W. H. Cheng, J. Display Technology 9, 441 (2013).
[CrossRef]

C. C. Tsai, W. C. Cheng, J. K. Chang, L. Y. Chen, J. H. Chen, Y. C. Hsu, and W. H. Cheng, J. Display Technology 9, 427 (2013).
[CrossRef]

C. C. Tsai, J. S. Liou, W. C. Cheng, C. H. Chung, M. H. Chen, J. Wang, and W. H. Cheng, in Electronic Components and Technology Conference (IEEE, 2011), pp. 1626–1630.

Cheng, W. H.

C. C. Tsai, W. C. Cheng, J. K. Chang, L. Y. Chen, J. H. Chen, Y. C. Hsu, and W. H. Cheng, J. Display Technology 9, 427 (2013).
[CrossRef]

L. Y. Chen, J. K. Chang, Y. R. Wu, W. C. Cheng, J. H. Chen, C. C. Tsai, and W. H. Cheng, J. Display Technology 9, 441 (2013).
[CrossRef]

C. C. Tsai, J. S. Liou, W. C. Cheng, C. H. Chung, M. H. Chen, J. Wang, and W. H. Cheng, in Electronic Components and Technology Conference (IEEE, 2011), pp. 1626–1630.

Cheng, Y. J.

Cho, J.

H. Luo, J. K. Kim, E. F. Schubert, J. Cho, C. Sone, and Y. Park, Appl. Phys. Lett. 86, 213505 (2005).
[CrossRef]

Chung, C. H.

C. C. Tsai, J. S. Liou, W. C. Cheng, C. H. Chung, M. H. Chen, J. Wang, and W. H. Cheng, in Electronic Components and Technology Conference (IEEE, 2011), pp. 1626–1630.

Das, D.

M. H. Chang, D. Das, P. V. Varde, and M. Pecht, Microelectron. Reliab. 52, 762 (2012).
[CrossRef]

Denault, K. A.

S. E. Brinkley, N. Pfaff, K. A. Denault, Z. J. Zhang, H. T. Hintzen, R. Seshadri, S. Nakamura, and S. P. DenBaars, Appl. Phys. Lett. 99, 241106 (2011).
[CrossRef]

DenBaars, S. P.

D. F. Feezell, J. S. Speck, S. P. DenBaars, and S. Nakamura, J. Disp. Technol. 9, 190 (2013).
[CrossRef]

R. M. Farrell, E. C. Young, F. Wu, S. P. DenBaars, and J. S. Speck, Semicond. Sci. Technol. 27, 024001 (2012).
[CrossRef]

S. E. Brinkley, N. Pfaff, K. A. Denault, Z. J. Zhang, H. T. Hintzen, R. Seshadri, S. Nakamura, and S. P. DenBaars, Appl. Phys. Lett. 99, 241106 (2011).
[CrossRef]

Dierolf, V.

Farrell, R. M.

R. M. Farrell, E. C. Young, F. Wu, S. P. DenBaars, and J. S. Speck, Semicond. Sci. Technol. 27, 024001 (2012).
[CrossRef]

Feezell, D. F.

D. F. Feezell, J. S. Speck, S. P. DenBaars, and S. Nakamura, J. Disp. Technol. 9, 190 (2013).
[CrossRef]

Fujimoto, Y.

S. Nishiura, S. Tanabe, K. Fujioka, and Y. Fujimoto, Opt. Mater. 33, 688 (2011).
[CrossRef]

Fujioka, K.

S. Nishiura, S. Tanabe, K. Fujioka, and Y. Fujimoto, Opt. Mater. 33, 688 (2011).
[CrossRef]

Fujita, S.

S. Fujita, A. Sakamoto, and S. Tanabe, IEEE J. Sel. Top. Quantum Electron. 14, 1387 (2008).
[CrossRef]

S. Fujita, S. Yoshihara, A. Sakamoto, S. Yamamoto, and S. Tanabe, Proc. SPIE 5941, 186 (2005).
[CrossRef]

Ginet, P.

C. Lucat, P. Ginet, and F. Ménil, J. Microelectron. Electron. Packag. 4, 86 (2007).

Gu, Y.

N. Narendran and Y. Gu, J. Display Technology 1, 167 (2005).
[CrossRef]

Haskard, M. R.

M. R. Haskard and R. Malcolm, Thick Film Technology and Applications (Port Erin, Electrochemical Publications, 1997).
[CrossRef]

Hintzen, H. T.

S. E. Brinkley, N. Pfaff, K. A. Denault, Z. J. Zhang, H. T. Hintzen, R. Seshadri, S. Nakamura, and S. P. DenBaars, Appl. Phys. Lett. 99, 241106 (2011).
[CrossRef]

Hsu, Y. C.

C. C. Tsai, W. C. Cheng, J. K. Chang, L. Y. Chen, J. H. Chen, Y. C. Hsu, and W. H. Cheng, J. Display Technology 9, 427 (2013).
[CrossRef]

Hung, C. W.

Kim, J. K.

H. Luo, J. K. Kim, E. F. Schubert, J. Cho, C. Sone, and Y. Park, Appl. Phys. Lett. 86, 213505 (2005).
[CrossRef]

Kuo, H. C.

Li, X. H.

C. K. Tan, J. Zhang, X. H. Li, G. Y. Liu, B. O. Tayo, and N. Tansu, J. Display Technology 9, 272 (2013).
[CrossRef]

Lin, C. C.

Liou, J. S.

C. C. Tsai, J. S. Liou, W. C. Cheng, C. H. Chung, M. H. Chen, J. Wang, and W. H. Cheng, in Electronic Components and Technology Conference (IEEE, 2011), pp. 1626–1630.

Liu, G.

Liu, G. Y.

G. Y. Liu, J. Zhang, C. K. Tan, and N. Tansu, IEEE Photon. J. 5, 2201011 (2013).
[CrossRef]

C. K. Tan, J. Zhang, X. H. Li, G. Y. Liu, B. O. Tayo, and N. Tansu, J. Display Technology 9, 272 (2013).
[CrossRef]

Liu, S.

L. Yang, Z. C. Lv, M. X. Chen, and S. Liu, in 5th International Conference on Electronic Packaging Technology and High Density Packaging (IEEE, 2012), pp. 1463–1466.

S. Liu and X. B. Luo, LED Packaging for Lighting Applications: Design, Manufacturing and Testing (Wiley and Chemical Industry, 2011).

Lucat, C.

C. Lucat, P. Ginet, and F. Ménil, J. Microelectron. Electron. Packag. 4, 86 (2007).

Luo, H.

H. Luo, J. K. Kim, E. F. Schubert, J. Cho, C. Sone, and Y. Park, Appl. Phys. Lett. 86, 213505 (2005).
[CrossRef]

Luo, X. B.

S. Liu and X. B. Luo, LED Packaging for Lighting Applications: Design, Manufacturing and Testing (Wiley and Chemical Industry, 2011).

Lv, Z. C.

L. Yang, Z. C. Lv, M. X. Chen, and S. Liu, in 5th International Conference on Electronic Packaging Technology and High Density Packaging (IEEE, 2012), pp. 1463–1466.

Malcolm, R.

M. R. Haskard and R. Malcolm, Thick Film Technology and Applications (Port Erin, Electrochemical Publications, 1997).
[CrossRef]

Ménil, F.

C. Lucat, P. Ginet, and F. Ménil, J. Microelectron. Electron. Packag. 4, 86 (2007).

Nakamura, S.

D. F. Feezell, J. S. Speck, S. P. DenBaars, and S. Nakamura, J. Disp. Technol. 9, 190 (2013).
[CrossRef]

S. E. Brinkley, N. Pfaff, K. A. Denault, Z. J. Zhang, H. T. Hintzen, R. Seshadri, S. Nakamura, and S. P. DenBaars, Appl. Phys. Lett. 99, 241106 (2011).
[CrossRef]

Nakanishi, T.

T. Nakanishi and S. Tanabe, IEEE J. Sel. Top. Quantum Electron. 15, 1171 (2009).
[CrossRef]

Narendran, N.

N. Narendran and Y. Gu, J. Display Technology 1, 167 (2005).
[CrossRef]

Nishiura, S.

S. Nishiura, S. Tanabe, K. Fujioka, and Y. Fujimoto, Opt. Mater. 33, 688 (2011).
[CrossRef]

Park, Y.

H. Luo, J. K. Kim, E. F. Schubert, J. Cho, C. Sone, and Y. Park, Appl. Phys. Lett. 86, 213505 (2005).
[CrossRef]

Parmentier, A. B.

P. F. Smet, A. B. Parmentier, and D. Poelman, J. Electrochem. Soc. 158, R37 (2011).
[CrossRef]

Pecht, M.

M. H. Chang, D. Das, P. V. Varde, and M. Pecht, Microelectron. Reliab. 52, 762 (2012).
[CrossRef]

Pfaff, N.

S. E. Brinkley, N. Pfaff, K. A. Denault, Z. J. Zhang, H. T. Hintzen, R. Seshadri, S. Nakamura, and S. P. DenBaars, Appl. Phys. Lett. 99, 241106 (2011).
[CrossRef]

Poelman, D.

P. F. Smet, A. B. Parmentier, and D. Poelman, J. Electrochem. Soc. 158, R37 (2011).
[CrossRef]

Poplawsky, J. D.

Sakamoto, A.

S. Fujita, A. Sakamoto, and S. Tanabe, IEEE J. Sel. Top. Quantum Electron. 14, 1387 (2008).
[CrossRef]

S. Fujita, S. Yoshihara, A. Sakamoto, S. Yamamoto, and S. Tanabe, Proc. SPIE 5941, 186 (2005).
[CrossRef]

Schubert, E. F.

H. Luo, J. K. Kim, E. F. Schubert, J. Cho, C. Sone, and Y. Park, Appl. Phys. Lett. 86, 213505 (2005).
[CrossRef]

Seshadri, R.

S. E. Brinkley, N. Pfaff, K. A. Denault, Z. J. Zhang, H. T. Hintzen, R. Seshadri, S. Nakamura, and S. P. DenBaars, Appl. Phys. Lett. 99, 241106 (2011).
[CrossRef]

Sher, C. W.

Smet, P. F.

P. F. Smet, A. B. Parmentier, and D. Poelman, J. Electrochem. Soc. 158, R37 (2011).
[CrossRef]

Sone, C.

H. Luo, J. K. Kim, E. F. Schubert, J. Cho, C. Sone, and Y. Park, Appl. Phys. Lett. 86, 213505 (2005).
[CrossRef]

Speck, J. S.

D. F. Feezell, J. S. Speck, S. P. DenBaars, and S. Nakamura, J. Disp. Technol. 9, 190 (2013).
[CrossRef]

R. M. Farrell, E. C. Young, F. Wu, S. P. DenBaars, and J. S. Speck, Semicond. Sci. Technol. 27, 024001 (2012).
[CrossRef]

Tan, C. K.

G. Y. Liu, J. Zhang, C. K. Tan, and N. Tansu, IEEE Photon. J. 5, 2201011 (2013).
[CrossRef]

C. K. Tan, J. Zhang, X. H. Li, G. Y. Liu, B. O. Tayo, and N. Tansu, J. Display Technology 9, 272 (2013).
[CrossRef]

Tanabe, S.

S. Nishiura, S. Tanabe, K. Fujioka, and Y. Fujimoto, Opt. Mater. 33, 688 (2011).
[CrossRef]

T. Nakanishi and S. Tanabe, IEEE J. Sel. Top. Quantum Electron. 15, 1171 (2009).
[CrossRef]

S. Fujita, A. Sakamoto, and S. Tanabe, IEEE J. Sel. Top. Quantum Electron. 14, 1387 (2008).
[CrossRef]

S. Fujita, S. Yoshihara, A. Sakamoto, S. Yamamoto, and S. Tanabe, Proc. SPIE 5941, 186 (2005).
[CrossRef]

Tansu, N.

G. Y. Liu, J. Zhang, C. K. Tan, and N. Tansu, IEEE Photon. J. 5, 2201011 (2013).
[CrossRef]

C. K. Tan, J. Zhang, X. H. Li, G. Y. Liu, B. O. Tayo, and N. Tansu, J. Display Technology 9, 272 (2013).
[CrossRef]

H. Zhao, G. Liu, J. Zhang, J. D. Poplawsky, V. Dierolf, and N. Tansu, Opt. Express 19, A991 (2011).
[CrossRef]

Tayo, B. O.

C. K. Tan, J. Zhang, X. H. Li, G. Y. Liu, B. O. Tayo, and N. Tansu, J. Display Technology 9, 272 (2013).
[CrossRef]

Tsai, C. C.

L. Y. Chen, J. K. Chang, Y. R. Wu, W. C. Cheng, J. H. Chen, C. C. Tsai, and W. H. Cheng, J. Display Technology 9, 441 (2013).
[CrossRef]

C. C. Tsai, W. C. Cheng, J. K. Chang, L. Y. Chen, J. H. Chen, Y. C. Hsu, and W. H. Cheng, J. Display Technology 9, 427 (2013).
[CrossRef]

C. C. Tsai, J. S. Liou, W. C. Cheng, C. H. Chung, M. H. Chen, J. Wang, and W. H. Cheng, in Electronic Components and Technology Conference (IEEE, 2011), pp. 1626–1630.

Varde, P. V.

M. H. Chang, D. Das, P. V. Varde, and M. Pecht, Microelectron. Reliab. 52, 762 (2012).
[CrossRef]

Wang, C. H.

Wang, J.

C. C. Tsai, J. S. Liou, W. C. Cheng, C. H. Chung, M. H. Chen, J. Wang, and W. H. Cheng, in Electronic Components and Technology Conference (IEEE, 2011), pp. 1626–1630.

Wu, F.

R. M. Farrell, E. C. Young, F. Wu, S. P. DenBaars, and J. S. Speck, Semicond. Sci. Technol. 27, 024001 (2012).
[CrossRef]

Wu, Y. R.

L. Y. Chen, J. K. Chang, Y. R. Wu, W. C. Cheng, J. H. Chen, C. C. Tsai, and W. H. Cheng, J. Display Technology 9, 441 (2013).
[CrossRef]

Yamamoto, S.

S. Fujita, S. Yoshihara, A. Sakamoto, S. Yamamoto, and S. Tanabe, Proc. SPIE 5941, 186 (2005).
[CrossRef]

Yang, L.

L. Yang, Z. C. Lv, M. X. Chen, and S. Liu, in 5th International Conference on Electronic Packaging Technology and High Density Packaging (IEEE, 2012), pp. 1463–1466.

Yeh, C. C.

Yoshihara, S.

S. Fujita, S. Yoshihara, A. Sakamoto, S. Yamamoto, and S. Tanabe, Proc. SPIE 5941, 186 (2005).
[CrossRef]

Young, E. C.

R. M. Farrell, E. C. Young, F. Wu, S. P. DenBaars, and J. S. Speck, Semicond. Sci. Technol. 27, 024001 (2012).
[CrossRef]

Zhang, J.

G. Y. Liu, J. Zhang, C. K. Tan, and N. Tansu, IEEE Photon. J. 5, 2201011 (2013).
[CrossRef]

C. K. Tan, J. Zhang, X. H. Li, G. Y. Liu, B. O. Tayo, and N. Tansu, J. Display Technology 9, 272 (2013).
[CrossRef]

H. Zhao, G. Liu, J. Zhang, J. D. Poplawsky, V. Dierolf, and N. Tansu, Opt. Express 19, A991 (2011).
[CrossRef]

Zhang, Z. J.

S. E. Brinkley, N. Pfaff, K. A. Denault, Z. J. Zhang, H. T. Hintzen, R. Seshadri, S. Nakamura, and S. P. DenBaars, Appl. Phys. Lett. 99, 241106 (2011).
[CrossRef]

Zhao, H.

Appl. Phys. Lett. (2)

S. E. Brinkley, N. Pfaff, K. A. Denault, Z. J. Zhang, H. T. Hintzen, R. Seshadri, S. Nakamura, and S. P. DenBaars, Appl. Phys. Lett. 99, 241106 (2011).
[CrossRef]

H. Luo, J. K. Kim, E. F. Schubert, J. Cho, C. Sone, and Y. Park, Appl. Phys. Lett. 86, 213505 (2005).
[CrossRef]

IEEE J. Sel. Top. Quantum Electron. (2)

S. Fujita, A. Sakamoto, and S. Tanabe, IEEE J. Sel. Top. Quantum Electron. 14, 1387 (2008).
[CrossRef]

T. Nakanishi and S. Tanabe, IEEE J. Sel. Top. Quantum Electron. 15, 1171 (2009).
[CrossRef]

IEEE Photon. J. (1)

G. Y. Liu, J. Zhang, C. K. Tan, and N. Tansu, IEEE Photon. J. 5, 2201011 (2013).
[CrossRef]

J. Disp. Technol. (1)

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Figures (10)

Fig. 1.
Fig. 1.

Fabrication process of phosphor glass.

Fig. 2.
Fig. 2.

Illustration of screen-printing process.

Fig. 3.
Fig. 3.

(a) Appearance of fabricated phosphor glass. (b) Optical image of phosphor particles distribution on glass substrate.

Fig. 4.
Fig. 4.

Cross-sectional image of YAG:Ce screen-printed layers of different thickness. (a) 31 μm, (b) 35 μm, and (c) 75 μm.

Fig. 5.
Fig. 5.

FE-SEM image of the sintered phosphor glass layer with the EDAX results for each phase.

Fig. 6.
Fig. 6.

Excitation and emission spectrum of phosphor glass with different thickness of YAG:Ce screen-printed layers.

Fig. 7.
Fig. 7.

(a) Schematic diagram of the combination of an InGaN LED chip with phosphor glass. (b) White light emission from 75 μm YAG screen-printed layer phosphor glass slice with InGaN blue LED chip.

Fig. 8.
Fig. 8.

Spectrum of different thickness YAG phosphor glass under 465 nm LED excitation.

Fig. 9.
Fig. 9.

Chromaticity color coordinates of different thicknesses of YAG phosphor glass under 465 nm LED excitation.

Fig. 10.
Fig. 10.

Current dependency of luminous efficiency and optical power of the 75 μm thickness phosphor glass under 465 nm LED excitation.

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