Abstract

We analyzed the feasibility of using a UV imprinting process to integrate a microlens array onto an image sensor. A simulated wafer-scale image sensor chip array was fabricated for the implementation. A microlens array with a side length of 4.63μm, a sag height of 1.416μm, and a residual-layer thickness of 1.15μm was integrated onto the simulated image sensor. The standard deviations of the sag height and the residual-layer thickness were less than 0.038μm and less than 0.164μm, respectively, in whole-wafer-scale samples. The measured beam spot size (FWHM) at the imaging plane was 1.19μm, with a uniform intensity distribution and pitch in the array.

© 2006 Optical Society of America

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