Abstract

We report on high-quality high-throughput laser milling of silicon with a sub-ps laser delivering more than 1 kW of average laser power on the workpiece. In order to avoid heat accumulation effects, the processing strategy for high-quality laser milling was adapted to the available average power by using five-pulse bursts, a large beam diameter of 372 µm to limit the peak fluence per pulse to approximately ${0.7}\;{{{\rm J}/{\rm cm}}^2}$, and a high feed rate of 24 m/s. As a result, smooth surfaces with a low roughness of ${{ S }_a}\le 0.6\;{\unicode{x00B5}{\rm m}}$ were achieved up to the investigated milling depth of 313 µm while maintaining a high material removal rate of ${230}\;{{\rm mm}^3}/{\min}$.

© 2021 Optical Society of America

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