Abstract

A simple low-loss fiber coupling structure consisting of a Si inverted-taper waveguide and a 435 nm wide and 290 nm thick SiN waveguide was fabricated with fully complementary metal-oxide semiconductor (CMOS)-compatible processes. The small SiN waveguide can expand to the optical field corresponding to a fiber with a mode-field diameter of 4.1 µm. The fiber-to-chip coupling losses were 0.25 and 0.51 dB/facet for quasi-TE and quasi-TM modes, respectively, at a 1550 nm wavelength. Polarization-dependent losses of the conversion in the Si-to-SiN waveguide transition and the fiber-to-chip coupling were less than 0.3 and 0.5 dB, respectively, in the wavelength range of 1520–1580 nm.

© 2020 Optical Society of America under the terms of the OSA Open Access Publishing Agreement

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  1. F. V. Laere, G. Roelkens, M. Ayre, J. Schrauwen, D. Taillaert, D. V. Thourhout, T. F. Krauss, and R. Baets, J. Lightwave Technol. 25, 151 (2007).
    [Crossref]
  2. A. Mekis, S. Gloeckner, G. Masini, A. Narasimha, T. Pinguet, S. Sahni, and P. D. Dobbelaere, IEEE J. Sel. Top. Quantum Electron. 17, 597 (2011).
    [Crossref]
  3. R. Marchetti, C. Lacava, L. Carroll, K. Grandkowski, and P. Minzioni, Photonics Res. 7, 201 (2019).
    [Crossref]
  4. B. B. Bakir, A. Vazquez de Gyves, R. Orobtchouk, P. Lyan, C. Porzier, A. Roman, and J.-M. Fedeli, IEEE Photonics Technol. Lett. 22, 739 (2010).
    [Crossref]
  5. T. Tsuchizawa, K. Yamada, T. Watanabe, S. Park, H. Nishi, R. Kou, H. Shinojima, and S. Itabashi, IEEE J. Sel. Top. Quantum Electron. 17, 516 (2011).
    [Crossref]
  6. M. Tokushima, H. Kawashima, T. Horikawa, and K. Kurata, J. Lightwave Technol. 36, 4783 (2018).
    [Crossref]
  7. T. Tsuchizawa, K. Yamada, H. Fukuda, T. Watanabe, J. Takahashi, M. Takahashi, T. Shoji, E. Tamechika, S. Itabashi, and H. Morita, IEEE J. Sel. Top. Quantum Electron. 11, 232 (2005).
    [Crossref]
  8. H. Park, S. Kim, J. Park, J. Joo, and G. Kim, Opt. Express 21, 29313 (2013).
    [Crossref]
  9. Y. Maegami, R. Takei, E. Omoda, T. Amano, M. Okano, M. Mori, T. Kamei, and Y. Sakakibara, Opt. Express 23, 21287 (2015).
    [Crossref]
  10. N. Kohli, M. Ménard, and W. N. Ye, OSA Contin. 2, 2428 (2019).
    [Crossref]
  11. Y. Huang, J. Song, X. Luo, T.-Y. Liow, and G.-Q. Lo, Opt. Express 22, 21859 (2014).
    [Crossref]
  12. M.-J. Picard, Y. Painchaud, C. Latrasse, C. Larouche, F. Pelletier, and M. Poulin, European Conference on Optical Communication (ECOC) (2015), paper Mo.4.2.4.
  13. B. Snyder, G. Lepage, S. Balakrishnan, P. D. Heyn, P. Verheyen, P. Absil, and J. V. Campenhout, IEEE CPMT Symposium Japan (ICSJ) (IEEE, 2017), pp. 55–58.
  14. T. Shoji, T. Watanabe, K. Yamada, and H. Morita, Electron. Lett. 38, 1669 (2002).
    [Crossref]
  15. Y. Maegami, M. Okano, G. Cong, M. Ohno, and K. Yamada, Opt. Express 24, 16856 (2016).
    [Crossref]
  16. K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.
  17. T. Horikawa, D. Shimura, H. Okayama, S.-H. Jeong, H. Takahashi, J. Ushida, Y. Sobu, A. Shiina, M. Tokushima, K. Kinoshita, and T. Mogami, IEEE J. Sel. Top. Quantum Electron. 24, 8200415 (2018).
    [Crossref]

2019 (2)

R. Marchetti, C. Lacava, L. Carroll, K. Grandkowski, and P. Minzioni, Photonics Res. 7, 201 (2019).
[Crossref]

N. Kohli, M. Ménard, and W. N. Ye, OSA Contin. 2, 2428 (2019).
[Crossref]

2018 (2)

T. Horikawa, D. Shimura, H. Okayama, S.-H. Jeong, H. Takahashi, J. Ushida, Y. Sobu, A. Shiina, M. Tokushima, K. Kinoshita, and T. Mogami, IEEE J. Sel. Top. Quantum Electron. 24, 8200415 (2018).
[Crossref]

M. Tokushima, H. Kawashima, T. Horikawa, and K. Kurata, J. Lightwave Technol. 36, 4783 (2018).
[Crossref]

2016 (1)

2015 (1)

2014 (1)

2013 (1)

2011 (2)

T. Tsuchizawa, K. Yamada, T. Watanabe, S. Park, H. Nishi, R. Kou, H. Shinojima, and S. Itabashi, IEEE J. Sel. Top. Quantum Electron. 17, 516 (2011).
[Crossref]

A. Mekis, S. Gloeckner, G. Masini, A. Narasimha, T. Pinguet, S. Sahni, and P. D. Dobbelaere, IEEE J. Sel. Top. Quantum Electron. 17, 597 (2011).
[Crossref]

2010 (1)

B. B. Bakir, A. Vazquez de Gyves, R. Orobtchouk, P. Lyan, C. Porzier, A. Roman, and J.-M. Fedeli, IEEE Photonics Technol. Lett. 22, 739 (2010).
[Crossref]

2007 (1)

2005 (1)

T. Tsuchizawa, K. Yamada, H. Fukuda, T. Watanabe, J. Takahashi, M. Takahashi, T. Shoji, E. Tamechika, S. Itabashi, and H. Morita, IEEE J. Sel. Top. Quantum Electron. 11, 232 (2005).
[Crossref]

2002 (1)

T. Shoji, T. Watanabe, K. Yamada, and H. Morita, Electron. Lett. 38, 1669 (2002).
[Crossref]

Absil, P.

B. Snyder, G. Lepage, S. Balakrishnan, P. D. Heyn, P. Verheyen, P. Absil, and J. V. Campenhout, IEEE CPMT Symposium Japan (ICSJ) (IEEE, 2017), pp. 55–58.

Agostinelli, M.

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

Allen, C.

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

Amano, T.

Ayre, M.

Baets, R.

Bahr, D.

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

Bakir, B. B.

B. B. Bakir, A. Vazquez de Gyves, R. Orobtchouk, P. Lyan, C. Porzier, A. Roman, and J.-M. Fedeli, IEEE Photonics Technol. Lett. 22, 739 (2010).
[Crossref]

Balakrishnan, S.

B. Snyder, G. Lepage, S. Balakrishnan, P. D. Heyn, P. Verheyen, P. Absil, and J. V. Campenhout, IEEE CPMT Symposium Japan (ICSJ) (IEEE, 2017), pp. 55–58.

Bost, M.

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

Campenhout, J. V.

B. Snyder, G. Lepage, S. Balakrishnan, P. D. Heyn, P. Verheyen, P. Absil, and J. V. Campenhout, IEEE CPMT Symposium Japan (ICSJ) (IEEE, 2017), pp. 55–58.

Carroll, L.

R. Marchetti, C. Lacava, L. Carroll, K. Grandkowski, and P. Minzioni, Photonics Res. 7, 201 (2019).
[Crossref]

Charvat, P.

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

Chikarmane, V.

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

Cong, G.

Dobbelaere, P. D.

A. Mekis, S. Gloeckner, G. Masini, A. Narasimha, T. Pinguet, S. Sahni, and P. D. Dobbelaere, IEEE J. Sel. Top. Quantum Electron. 17, 597 (2011).
[Crossref]

Fedeli, J.-M.

B. B. Bakir, A. Vazquez de Gyves, R. Orobtchouk, P. Lyan, C. Porzier, A. Roman, and J.-M. Fedeli, IEEE Photonics Technol. Lett. 22, 739 (2010).
[Crossref]

Fischer, K.

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

Fu, Q.

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

Fukuda, H.

T. Tsuchizawa, K. Yamada, H. Fukuda, T. Watanabe, J. Takahashi, M. Takahashi, T. Shoji, E. Tamechika, S. Itabashi, and H. Morita, IEEE J. Sel. Top. Quantum Electron. 11, 232 (2005).
[Crossref]

Ganpule, C.

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

Gloeckner, S.

A. Mekis, S. Gloeckner, G. Masini, A. Narasimha, T. Pinguet, S. Sahni, and P. D. Dobbelaere, IEEE J. Sel. Top. Quantum Electron. 17, 597 (2011).
[Crossref]

Grandkowski, K.

R. Marchetti, C. Lacava, L. Carroll, K. Grandkowski, and P. Minzioni, Photonics Res. 7, 201 (2019).
[Crossref]

Haran, M.

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

Heckscher, M.

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

Heyn, P. D.

B. Snyder, G. Lepage, S. Balakrishnan, P. D. Heyn, P. Verheyen, P. Absil, and J. V. Campenhout, IEEE CPMT Symposium Japan (ICSJ) (IEEE, 2017), pp. 55–58.

Hiramatsu, H.

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

Horikawa, T.

T. Horikawa, D. Shimura, H. Okayama, S.-H. Jeong, H. Takahashi, J. Ushida, Y. Sobu, A. Shiina, M. Tokushima, K. Kinoshita, and T. Mogami, IEEE J. Sel. Top. Quantum Electron. 24, 8200415 (2018).
[Crossref]

M. Tokushima, H. Kawashima, T. Horikawa, and K. Kurata, J. Lightwave Technol. 36, 4783 (2018).
[Crossref]

Huang, Y.

Hwang, E.

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

Itabashi, S.

T. Tsuchizawa, K. Yamada, T. Watanabe, S. Park, H. Nishi, R. Kou, H. Shinojima, and S. Itabashi, IEEE J. Sel. Top. Quantum Electron. 17, 516 (2011).
[Crossref]

T. Tsuchizawa, K. Yamada, H. Fukuda, T. Watanabe, J. Takahashi, M. Takahashi, T. Shoji, E. Tamechika, S. Itabashi, and H. Morita, IEEE J. Sel. Top. Quantum Electron. 11, 232 (2005).
[Crossref]

Jain, P.

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

Jeong, S.-H.

T. Horikawa, D. Shimura, H. Okayama, S.-H. Jeong, H. Takahashi, J. Ushida, Y. Sobu, A. Shiina, M. Tokushima, K. Kinoshita, and T. Mogami, IEEE J. Sel. Top. Quantum Electron. 24, 8200415 (2018).
[Crossref]

Jin, I.

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

Joo, J.

Kamei, T.

Kasim, R.

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

Kawashima, H.

Kim, G.

Kim, S.

Kinoshita, K.

T. Horikawa, D. Shimura, H. Okayama, S.-H. Jeong, H. Takahashi, J. Ushida, Y. Sobu, A. Shiina, M. Tokushima, K. Kinoshita, and T. Mogami, IEEE J. Sel. Top. Quantum Electron. 24, 8200415 (2018).
[Crossref]

Kohli, N.

N. Kohli, M. Ménard, and W. N. Ye, OSA Contin. 2, 2428 (2019).
[Crossref]

Kosaraju, S.

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

Kou, R.

T. Tsuchizawa, K. Yamada, T. Watanabe, S. Park, H. Nishi, R. Kou, H. Shinojima, and S. Itabashi, IEEE J. Sel. Top. Quantum Electron. 17, 516 (2011).
[Crossref]

Krauss, T. F.

Kurata, K.

Lacava, C.

R. Marchetti, C. Lacava, L. Carroll, K. Grandkowski, and P. Minzioni, Photonics Res. 7, 201 (2019).
[Crossref]

Laere, F. V.

Larouche, C.

M.-J. Picard, Y. Painchaud, C. Latrasse, C. Larouche, F. Pelletier, and M. Poulin, European Conference on Optical Communication (ECOC) (2015), paper Mo.4.2.4.

Latrasse, C.

M.-J. Picard, Y. Painchaud, C. Latrasse, C. Larouche, F. Pelletier, and M. Poulin, European Conference on Optical Communication (ECOC) (2015), paper Mo.4.2.4.

Lee, K. S.

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

Lepage, G.

B. Snyder, G. Lepage, S. Balakrishnan, P. D. Heyn, P. Verheyen, P. Absil, and J. V. Campenhout, IEEE CPMT Symposium Japan (ICSJ) (IEEE, 2017), pp. 55–58.

Liow, T.-Y.

Liu, H.

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

Lo, G.-Q.

Luo, X.

Lyan, P.

B. B. Bakir, A. Vazquez de Gyves, R. Orobtchouk, P. Lyan, C. Porzier, A. Roman, and J.-M. Fedeli, IEEE Photonics Technol. Lett. 22, 739 (2010).
[Crossref]

Maegami, Y.

Marchetti, R.

R. Marchetti, C. Lacava, L. Carroll, K. Grandkowski, and P. Minzioni, Photonics Res. 7, 201 (2019).
[Crossref]

Masini, G.

A. Mekis, S. Gloeckner, G. Masini, A. Narasimha, T. Pinguet, S. Sahni, and P. D. Dobbelaere, IEEE J. Sel. Top. Quantum Electron. 17, 597 (2011).
[Crossref]

McFadden, R.

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

Mekis, A.

A. Mekis, S. Gloeckner, G. Masini, A. Narasimha, T. Pinguet, S. Sahni, and P. D. Dobbelaere, IEEE J. Sel. Top. Quantum Electron. 17, 597 (2011).
[Crossref]

Ménard, M.

N. Kohli, M. Ménard, and W. N. Ye, OSA Contin. 2, 2428 (2019).
[Crossref]

Minzioni, P.

R. Marchetti, C. Lacava, L. Carroll, K. Grandkowski, and P. Minzioni, Photonics Res. 7, 201 (2019).
[Crossref]

Mogami, T.

T. Horikawa, D. Shimura, H. Okayama, S.-H. Jeong, H. Takahashi, J. Ushida, Y. Sobu, A. Shiina, M. Tokushima, K. Kinoshita, and T. Mogami, IEEE J. Sel. Top. Quantum Electron. 24, 8200415 (2018).
[Crossref]

Mori, M.

Morita, H.

T. Tsuchizawa, K. Yamada, H. Fukuda, T. Watanabe, J. Takahashi, M. Takahashi, T. Shoji, E. Tamechika, S. Itabashi, and H. Morita, IEEE J. Sel. Top. Quantum Electron. 11, 232 (2005).
[Crossref]

T. Shoji, T. Watanabe, K. Yamada, and H. Morita, Electron. Lett. 38, 1669 (2002).
[Crossref]

Narasimha, A.

A. Mekis, S. Gloeckner, G. Masini, A. Narasimha, T. Pinguet, S. Sahni, and P. D. Dobbelaere, IEEE J. Sel. Top. Quantum Electron. 17, 597 (2011).
[Crossref]

Natarajan, S.

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

Nigam, S.

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

Nishi, H.

T. Tsuchizawa, K. Yamada, T. Watanabe, S. Park, H. Nishi, R. Kou, H. Shinojima, and S. Itabashi, IEEE J. Sel. Top. Quantum Electron. 17, 516 (2011).
[Crossref]

Ohno, M.

Okano, M.

Okayama, H.

T. Horikawa, D. Shimura, H. Okayama, S.-H. Jeong, H. Takahashi, J. Ushida, Y. Sobu, A. Shiina, M. Tokushima, K. Kinoshita, and T. Mogami, IEEE J. Sel. Top. Quantum Electron. 24, 8200415 (2018).
[Crossref]

Omoda, E.

Orobtchouk, R.

B. B. Bakir, A. Vazquez de Gyves, R. Orobtchouk, P. Lyan, C. Porzier, A. Roman, and J.-M. Fedeli, IEEE Photonics Technol. Lett. 22, 739 (2010).
[Crossref]

Painchaud, Y.

M.-J. Picard, Y. Painchaud, C. Latrasse, C. Larouche, F. Pelletier, and M. Poulin, European Conference on Optical Communication (ECOC) (2015), paper Mo.4.2.4.

Park, H.

Park, J.

Park, S.

T. Tsuchizawa, K. Yamada, T. Watanabe, S. Park, H. Nishi, R. Kou, H. Shinojima, and S. Itabashi, IEEE J. Sel. Top. Quantum Electron. 17, 516 (2011).
[Crossref]

Patel, R.

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

Pelletier, F.

M.-J. Picard, Y. Painchaud, C. Latrasse, C. Larouche, F. Pelletier, and M. Poulin, European Conference on Optical Communication (ECOC) (2015), paper Mo.4.2.4.

Pelto, C.

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

Picard, M.-J.

M.-J. Picard, Y. Painchaud, C. Latrasse, C. Larouche, F. Pelletier, and M. Poulin, European Conference on Optical Communication (ECOC) (2015), paper Mo.4.2.4.

Pinguet, T.

A. Mekis, S. Gloeckner, G. Masini, A. Narasimha, T. Pinguet, S. Sahni, and P. D. Dobbelaere, IEEE J. Sel. Top. Quantum Electron. 17, 597 (2011).
[Crossref]

Plekhanov, P.

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

Porzier, C.

B. B. Bakir, A. Vazquez de Gyves, R. Orobtchouk, P. Lyan, C. Porzier, A. Roman, and J.-M. Fedeli, IEEE Photonics Technol. Lett. 22, 739 (2010).
[Crossref]

Poulin, M.

M.-J. Picard, Y. Painchaud, C. Latrasse, C. Larouche, F. Pelletier, and M. Poulin, European Conference on Optical Communication (ECOC) (2015), paper Mo.4.2.4.

Prince, M.

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

Puls, C.

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

Rajamani, S.

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

Rao, D.

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

Reese, P.

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

Roelkens, G.

Roman, A.

B. B. Bakir, A. Vazquez de Gyves, R. Orobtchouk, P. Lyan, C. Porzier, A. Roman, and J.-M. Fedeli, IEEE Photonics Technol. Lett. 22, 739 (2010).
[Crossref]

Rosenbaum, A.

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

Sahni, S.

A. Mekis, S. Gloeckner, G. Masini, A. Narasimha, T. Pinguet, S. Sahni, and P. D. Dobbelaere, IEEE J. Sel. Top. Quantum Electron. 17, 597 (2011).
[Crossref]

Sakakibara, Y.

Schrauwen, J.

Shiina, A.

T. Horikawa, D. Shimura, H. Okayama, S.-H. Jeong, H. Takahashi, J. Ushida, Y. Sobu, A. Shiina, M. Tokushima, K. Kinoshita, and T. Mogami, IEEE J. Sel. Top. Quantum Electron. 24, 8200415 (2018).
[Crossref]

Shimura, D.

T. Horikawa, D. Shimura, H. Okayama, S.-H. Jeong, H. Takahashi, J. Ushida, Y. Sobu, A. Shiina, M. Tokushima, K. Kinoshita, and T. Mogami, IEEE J. Sel. Top. Quantum Electron. 24, 8200415 (2018).
[Crossref]

Shinojima, H.

T. Tsuchizawa, K. Yamada, T. Watanabe, S. Park, H. Nishi, R. Kou, H. Shinojima, and S. Itabashi, IEEE J. Sel. Top. Quantum Electron. 17, 516 (2011).
[Crossref]

Shoji, T.

T. Tsuchizawa, K. Yamada, H. Fukuda, T. Watanabe, J. Takahashi, M. Takahashi, T. Shoji, E. Tamechika, S. Itabashi, and H. Morita, IEEE J. Sel. Top. Quantum Electron. 11, 232 (2005).
[Crossref]

T. Shoji, T. Watanabe, K. Yamada, and H. Morita, Electron. Lett. 38, 1669 (2002).
[Crossref]

Sivakumar, S.

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

Snyder, B.

B. Snyder, G. Lepage, S. Balakrishnan, P. D. Heyn, P. Verheyen, P. Absil, and J. V. Campenhout, IEEE CPMT Symposium Japan (ICSJ) (IEEE, 2017), pp. 55–58.

Sobu, Y.

T. Horikawa, D. Shimura, H. Okayama, S.-H. Jeong, H. Takahashi, J. Ushida, Y. Sobu, A. Shiina, M. Tokushima, K. Kinoshita, and T. Mogami, IEEE J. Sel. Top. Quantum Electron. 24, 8200415 (2018).
[Crossref]

Song, B.

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

Song, J.

Taillaert, D.

Takahashi, H.

T. Horikawa, D. Shimura, H. Okayama, S.-H. Jeong, H. Takahashi, J. Ushida, Y. Sobu, A. Shiina, M. Tokushima, K. Kinoshita, and T. Mogami, IEEE J. Sel. Top. Quantum Electron. 24, 8200415 (2018).
[Crossref]

Takahashi, J.

T. Tsuchizawa, K. Yamada, H. Fukuda, T. Watanabe, J. Takahashi, M. Takahashi, T. Shoji, E. Tamechika, S. Itabashi, and H. Morita, IEEE J. Sel. Top. Quantum Electron. 11, 232 (2005).
[Crossref]

Takahashi, M.

T. Tsuchizawa, K. Yamada, H. Fukuda, T. Watanabe, J. Takahashi, M. Takahashi, T. Shoji, E. Tamechika, S. Itabashi, and H. Morita, IEEE J. Sel. Top. Quantum Electron. 11, 232 (2005).
[Crossref]

Takei, R.

Tamechika, E.

T. Tsuchizawa, K. Yamada, H. Fukuda, T. Watanabe, J. Takahashi, M. Takahashi, T. Shoji, E. Tamechika, S. Itabashi, and H. Morita, IEEE J. Sel. Top. Quantum Electron. 11, 232 (2005).
[Crossref]

Thourhout, D. V.

Tokushima, M.

M. Tokushima, H. Kawashima, T. Horikawa, and K. Kurata, J. Lightwave Technol. 36, 4783 (2018).
[Crossref]

T. Horikawa, D. Shimura, H. Okayama, S.-H. Jeong, H. Takahashi, J. Ushida, Y. Sobu, A. Shiina, M. Tokushima, K. Kinoshita, and T. Mogami, IEEE J. Sel. Top. Quantum Electron. 24, 8200415 (2018).
[Crossref]

Tsuchizawa, T.

T. Tsuchizawa, K. Yamada, T. Watanabe, S. Park, H. Nishi, R. Kou, H. Shinojima, and S. Itabashi, IEEE J. Sel. Top. Quantum Electron. 17, 516 (2011).
[Crossref]

T. Tsuchizawa, K. Yamada, H. Fukuda, T. Watanabe, J. Takahashi, M. Takahashi, T. Shoji, E. Tamechika, S. Itabashi, and H. Morita, IEEE J. Sel. Top. Quantum Electron. 11, 232 (2005).
[Crossref]

Uncuer, M.

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

Ushida, J.

T. Horikawa, D. Shimura, H. Okayama, S.-H. Jeong, H. Takahashi, J. Ushida, Y. Sobu, A. Shiina, M. Tokushima, K. Kinoshita, and T. Mogami, IEEE J. Sel. Top. Quantum Electron. 24, 8200415 (2018).
[Crossref]

Vazquez de Gyves, A.

B. B. Bakir, A. Vazquez de Gyves, R. Orobtchouk, P. Lyan, C. Porzier, A. Roman, and J.-M. Fedeli, IEEE Photonics Technol. Lett. 22, 739 (2010).
[Crossref]

Verheyen, P.

B. Snyder, G. Lepage, S. Balakrishnan, P. D. Heyn, P. Verheyen, P. Absil, and J. V. Campenhout, IEEE CPMT Symposium Japan (ICSJ) (IEEE, 2017), pp. 55–58.

Watanabe, T.

T. Tsuchizawa, K. Yamada, T. Watanabe, S. Park, H. Nishi, R. Kou, H. Shinojima, and S. Itabashi, IEEE J. Sel. Top. Quantum Electron. 17, 516 (2011).
[Crossref]

T. Tsuchizawa, K. Yamada, H. Fukuda, T. Watanabe, J. Takahashi, M. Takahashi, T. Shoji, E. Tamechika, S. Itabashi, and H. Morita, IEEE J. Sel. Top. Quantum Electron. 11, 232 (2005).
[Crossref]

T. Shoji, T. Watanabe, K. Yamada, and H. Morita, Electron. Lett. 38, 1669 (2002).
[Crossref]

Williams, S.

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

Yamada, K.

Y. Maegami, M. Okano, G. Cong, M. Ohno, and K. Yamada, Opt. Express 24, 16856 (2016).
[Crossref]

T. Tsuchizawa, K. Yamada, T. Watanabe, S. Park, H. Nishi, R. Kou, H. Shinojima, and S. Itabashi, IEEE J. Sel. Top. Quantum Electron. 17, 516 (2011).
[Crossref]

T. Tsuchizawa, K. Yamada, H. Fukuda, T. Watanabe, J. Takahashi, M. Takahashi, T. Shoji, E. Tamechika, S. Itabashi, and H. Morita, IEEE J. Sel. Top. Quantum Electron. 11, 232 (2005).
[Crossref]

T. Shoji, T. Watanabe, K. Yamada, and H. Morita, Electron. Lett. 38, 1669 (2002).
[Crossref]

Yang, M.

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

Yashar, P.

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

Ye, W. N.

N. Kohli, M. Ménard, and W. N. Ye, OSA Contin. 2, 2428 (2019).
[Crossref]

Electron. Lett. (1)

T. Shoji, T. Watanabe, K. Yamada, and H. Morita, Electron. Lett. 38, 1669 (2002).
[Crossref]

IEEE J. Sel. Top. Quantum Electron. (4)

A. Mekis, S. Gloeckner, G. Masini, A. Narasimha, T. Pinguet, S. Sahni, and P. D. Dobbelaere, IEEE J. Sel. Top. Quantum Electron. 17, 597 (2011).
[Crossref]

T. Tsuchizawa, K. Yamada, T. Watanabe, S. Park, H. Nishi, R. Kou, H. Shinojima, and S. Itabashi, IEEE J. Sel. Top. Quantum Electron. 17, 516 (2011).
[Crossref]

T. Tsuchizawa, K. Yamada, H. Fukuda, T. Watanabe, J. Takahashi, M. Takahashi, T. Shoji, E. Tamechika, S. Itabashi, and H. Morita, IEEE J. Sel. Top. Quantum Electron. 11, 232 (2005).
[Crossref]

T. Horikawa, D. Shimura, H. Okayama, S.-H. Jeong, H. Takahashi, J. Ushida, Y. Sobu, A. Shiina, M. Tokushima, K. Kinoshita, and T. Mogami, IEEE J. Sel. Top. Quantum Electron. 24, 8200415 (2018).
[Crossref]

IEEE Photonics Technol. Lett. (1)

B. B. Bakir, A. Vazquez de Gyves, R. Orobtchouk, P. Lyan, C. Porzier, A. Roman, and J.-M. Fedeli, IEEE Photonics Technol. Lett. 22, 739 (2010).
[Crossref]

J. Lightwave Technol. (2)

Opt. Express (4)

OSA Contin. (1)

N. Kohli, M. Ménard, and W. N. Ye, OSA Contin. 2, 2428 (2019).
[Crossref]

Photonics Res. (1)

R. Marchetti, C. Lacava, L. Carroll, K. Grandkowski, and P. Minzioni, Photonics Res. 7, 201 (2019).
[Crossref]

Other (3)

K. Fischer, M. Agostinelli, C. Allen, D. Bahr, M. Bost, P. Charvat, V. Chikarmane, Q. Fu, C. Ganpule, M. Haran, M. Heckscher, H. Hiramatsu, E. Hwang, P. Jain, I. Jin, R. Kasim, S. Kosaraju, K. S. Lee, H. Liu, R. McFadden, S. Nigam, R. Patel, C. Pelto, P. Plekhanov, M. Prince, C. Puls, S. Rajamani, D. Rao, P. Reese, A. Rosenbaum, S. Sivakumar, B. Song, M. Uncuer, S. Williams, M. Yang, P. Yashar, and S. Natarajan, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (IEEE, 2015), pp. 5–8.

M.-J. Picard, Y. Painchaud, C. Latrasse, C. Larouche, F. Pelletier, and M. Poulin, European Conference on Optical Communication (ECOC) (2015), paper Mo.4.2.4.

B. Snyder, G. Lepage, S. Balakrishnan, P. D. Heyn, P. Verheyen, P. Absil, and J. V. Campenhout, IEEE CPMT Symposium Japan (ICSJ) (IEEE, 2017), pp. 55–58.

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Figures (4)

Fig. 1.
Fig. 1. Demonstrated fiber coupling structure: (a) schematic diagram; (b) and (c) cross-sectional STEM images.
Fig. 2.
Fig. 2. (a) Transmittance of the Si waveguide as a function of waveguide length, (b) spectra of transmission per length, and (c) spectra of fiber-to-chip coupling efficiency.
Fig. 3.
Fig. 3. (a) Transmittance of the Si waveguide with a number of waveguide transitions, (b) spectra of conversion efficiency at Si-to-SiN waveguide transition per transition, and (c) spectra of fiber-to-chip coupling efficiency.
Fig. 4.
Fig. 4. Results of alignment tolerance measurement for the (a) TE mode and (b) TM mode.

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