Abstract

A systematic study of glass scribing is presented on the benefits of ultrafast laser burst trains in generating filamentation tracks to guide cleaving of glass substrates. The interplay of Kerr self-focusing, plasma defocusing, and burst-train accumulation effects in filament formation was characterized by time-resolved in-situ microscopic imaging. Various filament-track scribing geometries were compared with and without assistance from burst-train pulse delivery or surface V-groove ablation. The cleaving guidance and reproducibility were examined together with the breaking force, facet morphology and flexural strength of cleaved substrates to assess the overall scribing and cleaving quality. The reported results attest to the benefits and flexibility of burst-mode ultrafast laser interactions to assist cleaving of optically transparent materials along well formed filament arrays.

© 2019 Optical Society of America under the terms of the OSA Open Access Publishing Agreement

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Corrections

20 September 2019: Typographical corrections were made to Table 1 and the funding section.


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References

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    [Crossref]
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    [Crossref]
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    [Crossref]
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    [Crossref]
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    [Crossref]
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    [Crossref]
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    [Crossref]
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    [Crossref]
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    [Crossref]

2018 (1)

2017 (2)

2016 (1)

C. Kerse, H. Kalaycıoğlu, P. Elahi, B. Çetin, D. K. Kesim, Ö. Akçaalan, S. Yavaş, M. D. Aşık, B. Öktem, H. Hoogland, R. Holzwarth, and F. Ö. Ilday, “Ablation-cooled material removal with ultrafast bursts of pulses,” Nature 537(7618), 84–88 (2016).
[Crossref]

2015 (1)

A. R. Collins, D. Milne, C. Prieto, and G. M. O’Connor, “Thin glass processing with various laser sources,” Proc. SPIE 9351, 93511K (2015).
[Crossref]

2014 (2)

M. K. Bhuyan, P. K. Velpula, J. P. Colombier, T. Olivier, N. Faure, and R. Stoian, “Single-shot high aspect ratio bulk nanostructuring of fused silica using chirp controlled ultrafast laser Bessel beams,” Appl. Phys. Lett. 104(2), 021107 (2014).
[Crossref]

S. Butkus, D. Paipulas, R. Sirutkaitis, E. Gaižauskas, and V. Sirutkaitis, “Rapid cutting and drilling of transparent materials via femtosecond laser filamentation,” J. Laser Micro/Nanoeng. 9(3), 213–220 (2014).
[Crossref]

2013 (1)

W.-J. Tsai, C.-J. Gu, C.-W. Cheng, and J.-B. Horng, “Internal modification for cutting transparent glass using femtosecond Bessel beams,” Opt. Eng. 53(5), 051503 (2013).
[Crossref]

2012 (1)

A. Mathis, F. Courvoisier, L. Froehly, L. Furfaro, M. Jacquot, P. A. Lacourt, and J. M. Dudley, “Micromachining along a curve: Femtosecond laser micromachining of curved profiles in diamond and silicon using accelerating beams,” Appl. Phys. Lett. 101(7), 071110 (2012).
[Crossref]

2011 (2)

M. Bernier, S. Gagnon, and R. Vallée, “Role of the 1D optical filamentation process in the writing of first order fiber Bragg gratings with femtosecond pulses at 800 nm,” Opt. Express 1(5), 832–844 (2011).
[Crossref]

D. Esser, S. Rezaei, J. Li, P. Herman, and J. Gottmann, “Time dynamics of burst-train filamentation assisted femtosecond laser machining in glasses,” Opt. Express 19(25), 25632–25642 (2011).
[Crossref]

2010 (1)

M. K. Bhuyan, F. Courvoisier, P. A. Lacourt, M. Jacquot, R. Salut, L. Furfaro, and J. M. Dudley, “High aspect ratio nanochannel machining using single shot femtosecond Bessel beams,” Appl. Phys. Lett. 97(8), 081102 (2010).
[Crossref]

2008 (3)

E. Ohmura, M. Kumagai, M. Nakano, K. Kuno, K. Fukumitsu, and H. Morita, “Analysis of processing mechanism in stealth dicing of ultra thin silicon wafer,” J. Adv. Mech. Des. Sys. Manuf. 2(4), 540–549 (2008).
[Crossref]

K. Venkatakrishnan, N. Sudani, and B. Tan, “A high-repetition-rate femtosecond laser for thin silicon wafer dicing,” J. Micromech. Microeng. 18(7), 075032 (2008).
[Crossref]

F. Ahmed, M. Lee, H. Sekita, T. Sumiyoshi, and M. Kamata, “Display glass cutting by femtosecond laser induced single shot periodic void array,” Appl. Phys. A 93(1), 189–192 (2008).
[Crossref]

2007 (2)

A. Couairon and A. Mysyrowicz, “Femtosecond filamentation in transparent media,” Phys. Rep. 441(2-4), 47–189 (2007).
[Crossref]

M. Kumagai, N. Uchiyama, E. Ohmura, R. Sugiura, K. Atsumi, and K. Fukumitsu, “Advanced dicing technology for semiconductor wafer - stealth dicing,” IEEE Trans. Semicond. Manufact. 20(3), 259–265 (2007).
[Crossref]

2005 (3)

C. Hermanns and J. Middleton, “Laser separation of flat glass in electronic-, optic-, display and bio-industry,” Proc. SPIE 5713, 387–396 (2005).
[Crossref]

E. Toratani, M. Kamata, and M. Obara, “Self-fabrication of void array in fused silica by femtosecond laser processing,” Appl. Phys. Lett. 87(17), 171103 (2005).
[Crossref]

S. M. Eaton, H. Zhang, P. R. Herman, F. Yoshino, L. Shah, J. Bovatsek, and A. Y. Arai, “Heat accumulation effects in femtosecond laser-written waveguides with variable repetition rate,” Opt. Express 13(12), 4708–4716 (2005).
[Crossref]

2003 (1)

C. H. Tsai and C. S. Liou, “Fracture mechanism of laser cutting with controlled fracture,” J. Manuf. Sci. Eng. 125(3), 519–528 (2003).
[Crossref]

2001 (1)

S. Nolte, M. Will, M. Augustin, P. Triebel, K. Zöllner, and A. Tünnermann, “Cutting of optical materials by using femtosecond laser pulses,” Proc. SPIE 4440, 152–160 (2001).
[Crossref]

1999 (2)

J. Wang, H. Niino, and A. Yabe, “One-step microfabrication of fused silica by laser ablation of an organic solution,” Appl. Phys. A 68(1), 111–113 (1999); J. Wang, H. Niino, and A. Yabe, “Micromachining of transparent materials with super-heated liquid generated by multiphotonic absorption of organic molecule,” Appl. Surf. Sci. 154-155, 571-576 (2000).
[Crossref]

P. Herman, A. Oettl, K. Chen, and R. Marjoribanks, “Laser micromachining of transparent fused silica with 1-ps pulses and pulse trains,” Proc. SPIE 3616, 148–155 (1999).
[Crossref]

1998 (1)

D. Ashkenasi, H. Varel, A. Rosenfeld, S. Henz, J. Herrmann, and E. E. B. Cambell, “Application of self-focusing of ps laser pulses for three-dimensional microstructuring of transparent materials,” Appl. Phys. Lett. 72(12), 1442–1444 (1998).
[Crossref]

1975 (1)

J. H. Marburger, “Self-focusing: Theory,” Prog. Quantum Electron. 4, 35–110 (1975).
[Crossref]

1964 (1)

M. Hercher, “Laser-induced damage in transparent media,” J. Opt. Soc. Am. 54(4), 563 (1964).

Ahmed, F.

F. Ahmed, M. Lee, H. Sekita, T. Sumiyoshi, and M. Kamata, “Display glass cutting by femtosecond laser induced single shot periodic void array,” Appl. Phys. A 93(1), 189–192 (2008).
[Crossref]

Akçaalan, Ö.

C. Kerse, H. Kalaycıoğlu, P. Elahi, B. Çetin, D. K. Kesim, Ö. Akçaalan, S. Yavaş, M. D. Aşık, B. Öktem, H. Hoogland, R. Holzwarth, and F. Ö. Ilday, “Ablation-cooled material removal with ultrafast bursts of pulses,” Nature 537(7618), 84–88 (2016).
[Crossref]

Alimohammadian, E.

E. Alimohammadian (submitted).

Arai, A. Y.

Ashkenasi, D.

D. Ashkenasi, H. Varel, A. Rosenfeld, S. Henz, J. Herrmann, and E. E. B. Cambell, “Application of self-focusing of ps laser pulses for three-dimensional microstructuring of transparent materials,” Appl. Phys. Lett. 72(12), 1442–1444 (1998).
[Crossref]

Asik, M. D.

C. Kerse, H. Kalaycıoğlu, P. Elahi, B. Çetin, D. K. Kesim, Ö. Akçaalan, S. Yavaş, M. D. Aşık, B. Öktem, H. Hoogland, R. Holzwarth, and F. Ö. Ilday, “Ablation-cooled material removal with ultrafast bursts of pulses,” Nature 537(7618), 84–88 (2016).
[Crossref]

Atsumi, K.

M. Kumagai, N. Uchiyama, E. Ohmura, R. Sugiura, K. Atsumi, and K. Fukumitsu, “Advanced dicing technology for semiconductor wafer - stealth dicing,” IEEE Trans. Semicond. Manufact. 20(3), 259–265 (2007).
[Crossref]

Augustin, M.

S. Nolte, M. Will, M. Augustin, P. Triebel, K. Zöllner, and A. Tünnermann, “Cutting of optical materials by using femtosecond laser pulses,” Proc. SPIE 4440, 152–160 (2001).
[Crossref]

Bergner, K.

M. Kumkar, M. Kaiser, J. Kleiner, D. Grossmann, D. Flamm, K. Bergner, and S. Nolte, “Cutting of transparent materials by tailored absorption,” in Advanced Solid State Lasers, OSA Technical Digest (online) (Optical Society of America, 2014), paper ATh1A.2.

Bernier, M.

M. Bernier, S. Gagnon, and R. Vallée, “Role of the 1D optical filamentation process in the writing of first order fiber Bragg gratings with femtosecond pulses at 800 nm,” Opt. Express 1(5), 832–844 (2011).
[Crossref]

Beuton, R.

Bhuyan, M. K.

M. K. Bhuyan, P. K. Velpula, J. P. Colombier, T. Olivier, N. Faure, and R. Stoian, “Single-shot high aspect ratio bulk nanostructuring of fused silica using chirp controlled ultrafast laser Bessel beams,” Appl. Phys. Lett. 104(2), 021107 (2014).
[Crossref]

M. K. Bhuyan, F. Courvoisier, P. A. Lacourt, M. Jacquot, R. Salut, L. Furfaro, and J. M. Dudley, “High aspect ratio nanochannel machining using single shot femtosecond Bessel beams,” Appl. Phys. Lett. 97(8), 081102 (2010).
[Crossref]

Bovatsek, J.

Butkus, S.

S. Butkus, D. Paipulas, R. Sirutkaitis, E. Gaižauskas, and V. Sirutkaitis, “Rapid cutting and drilling of transparent materials via femtosecond laser filamentation,” J. Laser Micro/Nanoeng. 9(3), 213–220 (2014).
[Crossref]

Cambell, E. E. B.

D. Ashkenasi, H. Varel, A. Rosenfeld, S. Henz, J. Herrmann, and E. E. B. Cambell, “Application of self-focusing of ps laser pulses for three-dimensional microstructuring of transparent materials,” Appl. Phys. Lett. 72(12), 1442–1444 (1998).
[Crossref]

Çetin, B.

C. Kerse, H. Kalaycıoğlu, P. Elahi, B. Çetin, D. K. Kesim, Ö. Akçaalan, S. Yavaş, M. D. Aşık, B. Öktem, H. Hoogland, R. Holzwarth, and F. Ö. Ilday, “Ablation-cooled material removal with ultrafast bursts of pulses,” Nature 537(7618), 84–88 (2016).
[Crossref]

Chassagne, B.

Chen, K.

P. Herman, A. Oettl, K. Chen, and R. Marjoribanks, “Laser micromachining of transparent fused silica with 1-ps pulses and pulse trains,” Proc. SPIE 3616, 148–155 (1999).
[Crossref]

Cheng, C.-W.

W.-J. Tsai, C.-J. Gu, C.-W. Cheng, and J.-B. Horng, “Internal modification for cutting transparent glass using femtosecond Bessel beams,” Opt. Eng. 53(5), 051503 (2013).
[Crossref]

Chimier, B.

Chin, S. L.

S. L. Chin, Femtosecond Laser Filamentation (Springer, New York, 2010).

Collins, A. R.

A. R. Collins, D. Milne, C. Prieto, and G. M. O’Connor, “Thin glass processing with various laser sources,” Proc. SPIE 9351, 93511K (2015).
[Crossref]

Colombier, J. P.

M. K. Bhuyan, P. K. Velpula, J. P. Colombier, T. Olivier, N. Faure, and R. Stoian, “Single-shot high aspect ratio bulk nanostructuring of fused silica using chirp controlled ultrafast laser Bessel beams,” Appl. Phys. Lett. 104(2), 021107 (2014).
[Crossref]

Couairon, A.

A. Couairon and A. Mysyrowicz, “Femtosecond filamentation in transparent media,” Phys. Rep. 441(2-4), 47–189 (2007).
[Crossref]

Courvoisier, F.

A. Mathis, F. Courvoisier, L. Froehly, L. Furfaro, M. Jacquot, P. A. Lacourt, and J. M. Dudley, “Micromachining along a curve: Femtosecond laser micromachining of curved profiles in diamond and silicon using accelerating beams,” Appl. Phys. Lett. 101(7), 071110 (2012).
[Crossref]

M. K. Bhuyan, F. Courvoisier, P. A. Lacourt, M. Jacquot, R. Salut, L. Furfaro, and J. M. Dudley, “High aspect ratio nanochannel machining using single shot femtosecond Bessel beams,” Appl. Phys. Lett. 97(8), 081102 (2010).
[Crossref]

Dematteo Caulier, O.

Duchateau, G.

Dudley, J. M.

A. Mathis, F. Courvoisier, L. Froehly, L. Furfaro, M. Jacquot, P. A. Lacourt, and J. M. Dudley, “Micromachining along a curve: Femtosecond laser micromachining of curved profiles in diamond and silicon using accelerating beams,” Appl. Phys. Lett. 101(7), 071110 (2012).
[Crossref]

M. K. Bhuyan, F. Courvoisier, P. A. Lacourt, M. Jacquot, R. Salut, L. Furfaro, and J. M. Dudley, “High aspect ratio nanochannel machining using single shot femtosecond Bessel beams,” Appl. Phys. Lett. 97(8), 081102 (2010).
[Crossref]

Eaton, S. M.

S. M. Eaton, H. Zhang, P. R. Herman, F. Yoshino, L. Shah, J. Bovatsek, and A. Y. Arai, “Heat accumulation effects in femtosecond laser-written waveguides with variable repetition rate,” Opt. Express 13(12), 4708–4716 (2005).
[Crossref]

J. Li, P. R. Herman, S. M. Eaton, H. Zhang, A. H. Nejadmalayeri, and S. A. Hosseini, “Combining 5-D Microscopy with 3-D Femtosecond Laser Nanoprocessing,” Conference on Lasers and Electro-Optics/Quantum Electronics and Laser Science Conference and Photonic Applications Systems Technologies, OSA Technical Digest Series (CD) (Optical Society of America, 2007), paper CFR4.

Elahi, P.

C. Kerse, H. Kalaycıoğlu, P. Elahi, B. Çetin, D. K. Kesim, Ö. Akçaalan, S. Yavaş, M. D. Aşık, B. Öktem, H. Hoogland, R. Holzwarth, and F. Ö. Ilday, “Ablation-cooled material removal with ultrafast bursts of pulses,” Nature 537(7618), 84–88 (2016).
[Crossref]

Ertorer, E.

Esser, D.

Faure, N.

M. K. Bhuyan, P. K. Velpula, J. P. Colombier, T. Olivier, N. Faure, and R. Stoian, “Single-shot high aspect ratio bulk nanostructuring of fused silica using chirp controlled ultrafast laser Bessel beams,” Appl. Phys. Lett. 104(2), 021107 (2014).
[Crossref]

Flamm, D.

M. Kumkar, M. Kaiser, J. Kleiner, D. Grossmann, D. Flamm, K. Bergner, and S. Nolte, “Cutting of transparent materials by tailored absorption,” in Advanced Solid State Lasers, OSA Technical Digest (online) (Optical Society of America, 2014), paper ATh1A.2.

Froehly, L.

A. Mathis, F. Courvoisier, L. Froehly, L. Furfaro, M. Jacquot, P. A. Lacourt, and J. M. Dudley, “Micromachining along a curve: Femtosecond laser micromachining of curved profiles in diamond and silicon using accelerating beams,” Appl. Phys. Lett. 101(7), 071110 (2012).
[Crossref]

Fukumitsu, K.

E. Ohmura, M. Kumagai, M. Nakano, K. Kuno, K. Fukumitsu, and H. Morita, “Analysis of processing mechanism in stealth dicing of ultra thin silicon wafer,” J. Adv. Mech. Des. Sys. Manuf. 2(4), 540–549 (2008).
[Crossref]

M. Kumagai, N. Uchiyama, E. Ohmura, R. Sugiura, K. Atsumi, and K. Fukumitsu, “Advanced dicing technology for semiconductor wafer - stealth dicing,” IEEE Trans. Semicond. Manufact. 20(3), 259–265 (2007).
[Crossref]

Furfaro, L.

A. Mathis, F. Courvoisier, L. Froehly, L. Furfaro, M. Jacquot, P. A. Lacourt, and J. M. Dudley, “Micromachining along a curve: Femtosecond laser micromachining of curved profiles in diamond and silicon using accelerating beams,” Appl. Phys. Lett. 101(7), 071110 (2012).
[Crossref]

M. K. Bhuyan, F. Courvoisier, P. A. Lacourt, M. Jacquot, R. Salut, L. Furfaro, and J. M. Dudley, “High aspect ratio nanochannel machining using single shot femtosecond Bessel beams,” Appl. Phys. Lett. 97(8), 081102 (2010).
[Crossref]

Gagnon, S.

M. Bernier, S. Gagnon, and R. Vallée, “Role of the 1D optical filamentation process in the writing of first order fiber Bragg gratings with femtosecond pulses at 800 nm,” Opt. Express 1(5), 832–844 (2011).
[Crossref]

Gaižauskas, E.

S. Butkus, D. Paipulas, R. Sirutkaitis, E. Gaižauskas, and V. Sirutkaitis, “Rapid cutting and drilling of transparent materials via femtosecond laser filamentation,” J. Laser Micro/Nanoeng. 9(3), 213–220 (2014).
[Crossref]

Gottmann, J.

Grossmann, D.

M. Kumkar, M. Kaiser, J. Kleiner, D. Grossmann, D. Flamm, K. Bergner, and S. Nolte, “Cutting of transparent materials by tailored absorption,” in Advanced Solid State Lasers, OSA Technical Digest (online) (Optical Society of America, 2014), paper ATh1A.2.

Gu, C.-J.

W.-J. Tsai, C.-J. Gu, C.-W. Cheng, and J.-B. Horng, “Internal modification for cutting transparent glass using femtosecond Bessel beams,” Opt. Eng. 53(5), 051503 (2013).
[Crossref]

Hannon, M.

J. P. Sercel, M. Mendes, M. Hannon, and M. von Dadelszen, “Laser scribing with extended depth affectation into a workplace,” US Patent (US20120234807A1).

Haque, M.

Henz, S.

D. Ashkenasi, H. Varel, A. Rosenfeld, S. Henz, J. Herrmann, and E. E. B. Cambell, “Application of self-focusing of ps laser pulses for three-dimensional microstructuring of transparent materials,” Appl. Phys. Lett. 72(12), 1442–1444 (1998).
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M. Hercher, “Laser-induced damage in transparent media,” J. Opt. Soc. Am. 54(4), 563 (1964).

Herman, P.

E. Ertorer, M. Haque, J. Li, and P. Herman, “Femtosecond laser filaments for rapid and flexible writing of fiber Bragg grating,” Opt. Express 26(7), 9323–9331 (2018).
[Crossref]

D. Esser, S. Rezaei, J. Li, P. Herman, and J. Gottmann, “Time dynamics of burst-train filamentation assisted femtosecond laser machining in glasses,” Opt. Express 19(25), 25632–25642 (2011).
[Crossref]

P. Herman, A. Oettl, K. Chen, and R. Marjoribanks, “Laser micromachining of transparent fused silica with 1-ps pulses and pulse trains,” Proc. SPIE 3616, 148–155 (1999).
[Crossref]

S. Hosseini and P. Herman, “Method of material processing by laser filamentation,” US Patent (US20130126573A1).

Herman, P. R.

S. M. Eaton, H. Zhang, P. R. Herman, F. Yoshino, L. Shah, J. Bovatsek, and A. Y. Arai, “Heat accumulation effects in femtosecond laser-written waveguides with variable repetition rate,” Opt. Express 13(12), 4708–4716 (2005).
[Crossref]

J. Li, P. R. Herman, S. M. Eaton, H. Zhang, A. H. Nejadmalayeri, and S. A. Hosseini, “Combining 5-D Microscopy with 3-D Femtosecond Laser Nanoprocessing,” Conference on Lasers and Electro-Optics/Quantum Electronics and Laser Science Conference and Photonic Applications Systems Technologies, OSA Technical Digest Series (CD) (Optical Society of America, 2007), paper CFR4.

Hermanns, C.

C. Hermanns and J. Middleton, “Laser separation of flat glass in electronic-, optic-, display and bio-industry,” Proc. SPIE 5713, 387–396 (2005).
[Crossref]

Herrmann, J.

D. Ashkenasi, H. Varel, A. Rosenfeld, S. Henz, J. Herrmann, and E. E. B. Cambell, “Application of self-focusing of ps laser pulses for three-dimensional microstructuring of transparent materials,” Appl. Phys. Lett. 72(12), 1442–1444 (1998).
[Crossref]

Holzwarth, R.

C. Kerse, H. Kalaycıoğlu, P. Elahi, B. Çetin, D. K. Kesim, Ö. Akçaalan, S. Yavaş, M. D. Aşık, B. Öktem, H. Hoogland, R. Holzwarth, and F. Ö. Ilday, “Ablation-cooled material removal with ultrafast bursts of pulses,” Nature 537(7618), 84–88 (2016).
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Hönninger, C.

Hoogland, H.

C. Kerse, H. Kalaycıoğlu, P. Elahi, B. Çetin, D. K. Kesim, Ö. Akçaalan, S. Yavaş, M. D. Aşık, B. Öktem, H. Hoogland, R. Holzwarth, and F. Ö. Ilday, “Ablation-cooled material removal with ultrafast bursts of pulses,” Nature 537(7618), 84–88 (2016).
[Crossref]

Horng, J.-B.

W.-J. Tsai, C.-J. Gu, C.-W. Cheng, and J.-B. Horng, “Internal modification for cutting transparent glass using femtosecond Bessel beams,” Opt. Eng. 53(5), 051503 (2013).
[Crossref]

Hosseini, S.

S. Hosseini and P. Herman, “Method of material processing by laser filamentation,” US Patent (US20130126573A1).

Hosseini, S. A.

J. Li, P. R. Herman, S. M. Eaton, H. Zhang, A. H. Nejadmalayeri, and S. A. Hosseini, “Combining 5-D Microscopy with 3-D Femtosecond Laser Nanoprocessing,” Conference on Lasers and Electro-Optics/Quantum Electronics and Laser Science Conference and Photonic Applications Systems Technologies, OSA Technical Digest Series (CD) (Optical Society of America, 2007), paper CFR4.

Ilday, F. Ö.

C. Kerse, H. Kalaycıoğlu, P. Elahi, B. Çetin, D. K. Kesim, Ö. Akçaalan, S. Yavaş, M. D. Aşık, B. Öktem, H. Hoogland, R. Holzwarth, and F. Ö. Ilday, “Ablation-cooled material removal with ultrafast bursts of pulses,” Nature 537(7618), 84–88 (2016).
[Crossref]

Itoh, K.

W. Watanabe, T. Tamaki, Y. Ozeki, and K. Itoh, “Filamentation in ultrafast laser material processing,” in Progress in Ultrafast Intense Laser Science VI, K. Yamanouchi, G. Gerber, and A. D. Bandrauk, eds. (Springer-Verlag, 2010).

Jacquot, M.

A. Mathis, F. Courvoisier, L. Froehly, L. Furfaro, M. Jacquot, P. A. Lacourt, and J. M. Dudley, “Micromachining along a curve: Femtosecond laser micromachining of curved profiles in diamond and silicon using accelerating beams,” Appl. Phys. Lett. 101(7), 071110 (2012).
[Crossref]

M. K. Bhuyan, F. Courvoisier, P. A. Lacourt, M. Jacquot, R. Salut, L. Furfaro, and J. M. Dudley, “High aspect ratio nanochannel machining using single shot femtosecond Bessel beams,” Appl. Phys. Lett. 97(8), 081102 (2010).
[Crossref]

Kaiser, M.

M. Kumkar, M. Kaiser, J. Kleiner, D. Grossmann, D. Flamm, K. Bergner, and S. Nolte, “Cutting of transparent materials by tailored absorption,” in Advanced Solid State Lasers, OSA Technical Digest (online) (Optical Society of America, 2014), paper ATh1A.2.

Kalaycioglu, H.

C. Kerse, H. Kalaycıoğlu, P. Elahi, B. Çetin, D. K. Kesim, Ö. Akçaalan, S. Yavaş, M. D. Aşık, B. Öktem, H. Hoogland, R. Holzwarth, and F. Ö. Ilday, “Ablation-cooled material removal with ultrafast bursts of pulses,” Nature 537(7618), 84–88 (2016).
[Crossref]

Kamata, M.

F. Ahmed, M. Lee, H. Sekita, T. Sumiyoshi, and M. Kamata, “Display glass cutting by femtosecond laser induced single shot periodic void array,” Appl. Phys. A 93(1), 189–192 (2008).
[Crossref]

E. Toratani, M. Kamata, and M. Obara, “Self-fabrication of void array in fused silica by femtosecond laser processing,” Appl. Phys. Lett. 87(17), 171103 (2005).
[Crossref]

Kerse, C.

C. Kerse, H. Kalaycıoğlu, P. Elahi, B. Çetin, D. K. Kesim, Ö. Akçaalan, S. Yavaş, M. D. Aşık, B. Öktem, H. Hoogland, R. Holzwarth, and F. Ö. Ilday, “Ablation-cooled material removal with ultrafast bursts of pulses,” Nature 537(7618), 84–88 (2016).
[Crossref]

Kesim, D. K.

C. Kerse, H. Kalaycıoğlu, P. Elahi, B. Çetin, D. K. Kesim, Ö. Akçaalan, S. Yavaş, M. D. Aşık, B. Öktem, H. Hoogland, R. Holzwarth, and F. Ö. Ilday, “Ablation-cooled material removal with ultrafast bursts of pulses,” Nature 537(7618), 84–88 (2016).
[Crossref]

Kleiner, J.

M. Kumkar, M. Kaiser, J. Kleiner, D. Grossmann, D. Flamm, K. Bergner, and S. Nolte, “Cutting of transparent materials by tailored absorption,” in Advanced Solid State Lasers, OSA Technical Digest (online) (Optical Society of America, 2014), paper ATh1A.2.

Kling, R.

Kumagai, M.

E. Ohmura, M. Kumagai, M. Nakano, K. Kuno, K. Fukumitsu, and H. Morita, “Analysis of processing mechanism in stealth dicing of ultra thin silicon wafer,” J. Adv. Mech. Des. Sys. Manuf. 2(4), 540–549 (2008).
[Crossref]

M. Kumagai, N. Uchiyama, E. Ohmura, R. Sugiura, K. Atsumi, and K. Fukumitsu, “Advanced dicing technology for semiconductor wafer - stealth dicing,” IEEE Trans. Semicond. Manufact. 20(3), 259–265 (2007).
[Crossref]

Kumkar, M.

M. Kumkar, M. Kaiser, J. Kleiner, D. Grossmann, D. Flamm, K. Bergner, and S. Nolte, “Cutting of transparent materials by tailored absorption,” in Advanced Solid State Lasers, OSA Technical Digest (online) (Optical Society of America, 2014), paper ATh1A.2.

Kuno, K.

E. Ohmura, M. Kumagai, M. Nakano, K. Kuno, K. Fukumitsu, and H. Morita, “Analysis of processing mechanism in stealth dicing of ultra thin silicon wafer,” J. Adv. Mech. Des. Sys. Manuf. 2(4), 540–549 (2008).
[Crossref]

Lacourt, P. A.

A. Mathis, F. Courvoisier, L. Froehly, L. Furfaro, M. Jacquot, P. A. Lacourt, and J. M. Dudley, “Micromachining along a curve: Femtosecond laser micromachining of curved profiles in diamond and silicon using accelerating beams,” Appl. Phys. Lett. 101(7), 071110 (2012).
[Crossref]

M. K. Bhuyan, F. Courvoisier, P. A. Lacourt, M. Jacquot, R. Salut, L. Furfaro, and J. M. Dudley, “High aspect ratio nanochannel machining using single shot femtosecond Bessel beams,” Appl. Phys. Lett. 97(8), 081102 (2010).
[Crossref]

Lee, M.

F. Ahmed, M. Lee, H. Sekita, T. Sumiyoshi, and M. Kamata, “Display glass cutting by femtosecond laser induced single shot periodic void array,” Appl. Phys. A 93(1), 189–192 (2008).
[Crossref]

Li, J.

E. Ertorer, M. Haque, J. Li, and P. Herman, “Femtosecond laser filaments for rapid and flexible writing of fiber Bragg grating,” Opt. Express 26(7), 9323–9331 (2018).
[Crossref]

D. Esser, S. Rezaei, J. Li, P. Herman, and J. Gottmann, “Time dynamics of burst-train filamentation assisted femtosecond laser machining in glasses,” Opt. Express 19(25), 25632–25642 (2011).
[Crossref]

J. Li, P. R. Herman, S. M. Eaton, H. Zhang, A. H. Nejadmalayeri, and S. A. Hosseini, “Combining 5-D Microscopy with 3-D Femtosecond Laser Nanoprocessing,” Conference on Lasers and Electro-Optics/Quantum Electronics and Laser Science Conference and Photonic Applications Systems Technologies, OSA Technical Digest Series (CD) (Optical Society of America, 2007), paper CFR4.

Liou, C. S.

C. H. Tsai and C. S. Liou, “Fracture mechanism of laser cutting with controlled fracture,” J. Manuf. Sci. Eng. 125(3), 519–528 (2003).
[Crossref]

Lopez, J.

Marburger, J. H.

J. H. Marburger, “Self-focusing: Theory,” Prog. Quantum Electron. 4, 35–110 (1975).
[Crossref]

Marjoribanks, R.

P. Herman, A. Oettl, K. Chen, and R. Marjoribanks, “Laser micromachining of transparent fused silica with 1-ps pulses and pulse trains,” Proc. SPIE 3616, 148–155 (1999).
[Crossref]

Mathis, A.

A. Mathis, F. Courvoisier, L. Froehly, L. Furfaro, M. Jacquot, P. A. Lacourt, and J. M. Dudley, “Micromachining along a curve: Femtosecond laser micromachining of curved profiles in diamond and silicon using accelerating beams,” Appl. Phys. Lett. 101(7), 071110 (2012).
[Crossref]

Mayerhofer, R.

R. Mayerhofer, “Ultrashort-pulsed laser material processing with high repetition rate burst pulses,” Proc. SPIE 10091, 100910Z (2017).
[Crossref]

Mendes, M.

J. P. Sercel, M. Mendes, M. Hannon, and M. von Dadelszen, “Laser scribing with extended depth affectation into a workplace,” US Patent (US20120234807A1).

Middleton, J.

C. Hermanns and J. Middleton, “Laser separation of flat glass in electronic-, optic-, display and bio-industry,” Proc. SPIE 5713, 387–396 (2005).
[Crossref]

Milne, D.

A. R. Collins, D. Milne, C. Prieto, and G. M. O’Connor, “Thin glass processing with various laser sources,” Proc. SPIE 9351, 93511K (2015).
[Crossref]

Mishchik, K.

Morita, H.

E. Ohmura, M. Kumagai, M. Nakano, K. Kuno, K. Fukumitsu, and H. Morita, “Analysis of processing mechanism in stealth dicing of ultra thin silicon wafer,” J. Adv. Mech. Des. Sys. Manuf. 2(4), 540–549 (2008).
[Crossref]

Mottay, E.

Mysyrowicz, A.

A. Couairon and A. Mysyrowicz, “Femtosecond filamentation in transparent media,” Phys. Rep. 441(2-4), 47–189 (2007).
[Crossref]

Nakano, M.

E. Ohmura, M. Kumagai, M. Nakano, K. Kuno, K. Fukumitsu, and H. Morita, “Analysis of processing mechanism in stealth dicing of ultra thin silicon wafer,” J. Adv. Mech. Des. Sys. Manuf. 2(4), 540–549 (2008).
[Crossref]

Nejadmalayeri, A. H.

J. Li, P. R. Herman, S. M. Eaton, H. Zhang, A. H. Nejadmalayeri, and S. A. Hosseini, “Combining 5-D Microscopy with 3-D Femtosecond Laser Nanoprocessing,” Conference on Lasers and Electro-Optics/Quantum Electronics and Laser Science Conference and Photonic Applications Systems Technologies, OSA Technical Digest Series (CD) (Optical Society of America, 2007), paper CFR4.

Niino, H.

J. Wang, H. Niino, and A. Yabe, “One-step microfabrication of fused silica by laser ablation of an organic solution,” Appl. Phys. A 68(1), 111–113 (1999); J. Wang, H. Niino, and A. Yabe, “Micromachining of transparent materials with super-heated liquid generated by multiphotonic absorption of organic molecule,” Appl. Surf. Sci. 154-155, 571-576 (2000).
[Crossref]

Nolte, S.

S. Nolte, M. Will, M. Augustin, P. Triebel, K. Zöllner, and A. Tünnermann, “Cutting of optical materials by using femtosecond laser pulses,” Proc. SPIE 4440, 152–160 (2001).
[Crossref]

M. Kumkar, M. Kaiser, J. Kleiner, D. Grossmann, D. Flamm, K. Bergner, and S. Nolte, “Cutting of transparent materials by tailored absorption,” in Advanced Solid State Lasers, OSA Technical Digest (online) (Optical Society of America, 2014), paper ATh1A.2.

O’Connor, G. M.

A. R. Collins, D. Milne, C. Prieto, and G. M. O’Connor, “Thin glass processing with various laser sources,” Proc. SPIE 9351, 93511K (2015).
[Crossref]

Obara, M.

E. Toratani, M. Kamata, and M. Obara, “Self-fabrication of void array in fused silica by femtosecond laser processing,” Appl. Phys. Lett. 87(17), 171103 (2005).
[Crossref]

Oettl, A.

P. Herman, A. Oettl, K. Chen, and R. Marjoribanks, “Laser micromachining of transparent fused silica with 1-ps pulses and pulse trains,” Proc. SPIE 3616, 148–155 (1999).
[Crossref]

Ohmura, E.

E. Ohmura, M. Kumagai, M. Nakano, K. Kuno, K. Fukumitsu, and H. Morita, “Analysis of processing mechanism in stealth dicing of ultra thin silicon wafer,” J. Adv. Mech. Des. Sys. Manuf. 2(4), 540–549 (2008).
[Crossref]

M. Kumagai, N. Uchiyama, E. Ohmura, R. Sugiura, K. Atsumi, and K. Fukumitsu, “Advanced dicing technology for semiconductor wafer - stealth dicing,” IEEE Trans. Semicond. Manufact. 20(3), 259–265 (2007).
[Crossref]

Öktem, B.

C. Kerse, H. Kalaycıoğlu, P. Elahi, B. Çetin, D. K. Kesim, Ö. Akçaalan, S. Yavaş, M. D. Aşık, B. Öktem, H. Hoogland, R. Holzwarth, and F. Ö. Ilday, “Ablation-cooled material removal with ultrafast bursts of pulses,” Nature 537(7618), 84–88 (2016).
[Crossref]

Olivier, T.

M. K. Bhuyan, P. K. Velpula, J. P. Colombier, T. Olivier, N. Faure, and R. Stoian, “Single-shot high aspect ratio bulk nanostructuring of fused silica using chirp controlled ultrafast laser Bessel beams,” Appl. Phys. Lett. 104(2), 021107 (2014).
[Crossref]

Ozeki, Y.

W. Watanabe, T. Tamaki, Y. Ozeki, and K. Itoh, “Filamentation in ultrafast laser material processing,” in Progress in Ultrafast Intense Laser Science VI, K. Yamanouchi, G. Gerber, and A. D. Bandrauk, eds. (Springer-Verlag, 2010).

Paipulas, D.

S. Butkus, D. Paipulas, R. Sirutkaitis, E. Gaižauskas, and V. Sirutkaitis, “Rapid cutting and drilling of transparent materials via femtosecond laser filamentation,” J. Laser Micro/Nanoeng. 9(3), 213–220 (2014).
[Crossref]

Patel, R.

J. Bovatsek and R. Patel, “Method and apparatus for laser cutting transparent and semitransparent substrates,” US Patent (US20150367442A1).

Prieto, C.

A. R. Collins, D. Milne, C. Prieto, and G. M. O’Connor, “Thin glass processing with various laser sources,” Proc. SPIE 9351, 93511K (2015).
[Crossref]

Rezaei, S.

Rosenfeld, A.

D. Ashkenasi, H. Varel, A. Rosenfeld, S. Henz, J. Herrmann, and E. E. B. Cambell, “Application of self-focusing of ps laser pulses for three-dimensional microstructuring of transparent materials,” Appl. Phys. Lett. 72(12), 1442–1444 (1998).
[Crossref]

Salut, R.

M. K. Bhuyan, F. Courvoisier, P. A. Lacourt, M. Jacquot, R. Salut, L. Furfaro, and J. M. Dudley, “High aspect ratio nanochannel machining using single shot femtosecond Bessel beams,” Appl. Phys. Lett. 97(8), 081102 (2010).
[Crossref]

Sekita, H.

F. Ahmed, M. Lee, H. Sekita, T. Sumiyoshi, and M. Kamata, “Display glass cutting by femtosecond laser induced single shot periodic void array,” Appl. Phys. A 93(1), 189–192 (2008).
[Crossref]

Sercel, J. P.

J. P. Sercel, M. Mendes, M. Hannon, and M. von Dadelszen, “Laser scribing with extended depth affectation into a workplace,” US Patent (US20120234807A1).

Shah, L.

Sirutkaitis, R.

S. Butkus, D. Paipulas, R. Sirutkaitis, E. Gaižauskas, and V. Sirutkaitis, “Rapid cutting and drilling of transparent materials via femtosecond laser filamentation,” J. Laser Micro/Nanoeng. 9(3), 213–220 (2014).
[Crossref]

Sirutkaitis, V.

S. Butkus, D. Paipulas, R. Sirutkaitis, E. Gaižauskas, and V. Sirutkaitis, “Rapid cutting and drilling of transparent materials via femtosecond laser filamentation,” J. Laser Micro/Nanoeng. 9(3), 213–220 (2014).
[Crossref]

Skupin, S.

Stoian, R.

M. K. Bhuyan, P. K. Velpula, J. P. Colombier, T. Olivier, N. Faure, and R. Stoian, “Single-shot high aspect ratio bulk nanostructuring of fused silica using chirp controlled ultrafast laser Bessel beams,” Appl. Phys. Lett. 104(2), 021107 (2014).
[Crossref]

Sudani, N.

K. Venkatakrishnan, N. Sudani, and B. Tan, “A high-repetition-rate femtosecond laser for thin silicon wafer dicing,” J. Micromech. Microeng. 18(7), 075032 (2008).
[Crossref]

Sugiura, R.

M. Kumagai, N. Uchiyama, E. Ohmura, R. Sugiura, K. Atsumi, and K. Fukumitsu, “Advanced dicing technology for semiconductor wafer - stealth dicing,” IEEE Trans. Semicond. Manufact. 20(3), 259–265 (2007).
[Crossref]

Sumiyoshi, T.

F. Ahmed, M. Lee, H. Sekita, T. Sumiyoshi, and M. Kamata, “Display glass cutting by femtosecond laser induced single shot periodic void array,” Appl. Phys. A 93(1), 189–192 (2008).
[Crossref]

Tamaki, T.

W. Watanabe, T. Tamaki, Y. Ozeki, and K. Itoh, “Filamentation in ultrafast laser material processing,” in Progress in Ultrafast Intense Laser Science VI, K. Yamanouchi, G. Gerber, and A. D. Bandrauk, eds. (Springer-Verlag, 2010).

Tan, B.

K. Venkatakrishnan, N. Sudani, and B. Tan, “A high-repetition-rate femtosecond laser for thin silicon wafer dicing,” J. Micromech. Microeng. 18(7), 075032 (2008).
[Crossref]

Toratani, E.

E. Toratani, M. Kamata, and M. Obara, “Self-fabrication of void array in fused silica by femtosecond laser processing,” Appl. Phys. Lett. 87(17), 171103 (2005).
[Crossref]

Triebel, P.

S. Nolte, M. Will, M. Augustin, P. Triebel, K. Zöllner, and A. Tünnermann, “Cutting of optical materials by using femtosecond laser pulses,” Proc. SPIE 4440, 152–160 (2001).
[Crossref]

Tsai, C. H.

C. H. Tsai and C. S. Liou, “Fracture mechanism of laser cutting with controlled fracture,” J. Manuf. Sci. Eng. 125(3), 519–528 (2003).
[Crossref]

Tsai, W.-J.

W.-J. Tsai, C.-J. Gu, C.-W. Cheng, and J.-B. Horng, “Internal modification for cutting transparent glass using femtosecond Bessel beams,” Opt. Eng. 53(5), 051503 (2013).
[Crossref]

Tünnermann, A.

S. Nolte, M. Will, M. Augustin, P. Triebel, K. Zöllner, and A. Tünnermann, “Cutting of optical materials by using femtosecond laser pulses,” Proc. SPIE 4440, 152–160 (2001).
[Crossref]

Uchiyama, N.

M. Kumagai, N. Uchiyama, E. Ohmura, R. Sugiura, K. Atsumi, and K. Fukumitsu, “Advanced dicing technology for semiconductor wafer - stealth dicing,” IEEE Trans. Semicond. Manufact. 20(3), 259–265 (2007).
[Crossref]

Vallée, R.

M. Bernier, S. Gagnon, and R. Vallée, “Role of the 1D optical filamentation process in the writing of first order fiber Bragg gratings with femtosecond pulses at 800 nm,” Opt. Express 1(5), 832–844 (2011).
[Crossref]

Varel, H.

D. Ashkenasi, H. Varel, A. Rosenfeld, S. Henz, J. Herrmann, and E. E. B. Cambell, “Application of self-focusing of ps laser pulses for three-dimensional microstructuring of transparent materials,” Appl. Phys. Lett. 72(12), 1442–1444 (1998).
[Crossref]

Velpula, P. K.

M. K. Bhuyan, P. K. Velpula, J. P. Colombier, T. Olivier, N. Faure, and R. Stoian, “Single-shot high aspect ratio bulk nanostructuring of fused silica using chirp controlled ultrafast laser Bessel beams,” Appl. Phys. Lett. 104(2), 021107 (2014).
[Crossref]

Venkatakrishnan, K.

K. Venkatakrishnan, N. Sudani, and B. Tan, “A high-repetition-rate femtosecond laser for thin silicon wafer dicing,” J. Micromech. Microeng. 18(7), 075032 (2008).
[Crossref]

von Dadelszen, M.

J. P. Sercel, M. Mendes, M. Hannon, and M. von Dadelszen, “Laser scribing with extended depth affectation into a workplace,” US Patent (US20120234807A1).

Wang, J.

J. Wang, H. Niino, and A. Yabe, “One-step microfabrication of fused silica by laser ablation of an organic solution,” Appl. Phys. A 68(1), 111–113 (1999); J. Wang, H. Niino, and A. Yabe, “Micromachining of transparent materials with super-heated liquid generated by multiphotonic absorption of organic molecule,” Appl. Surf. Sci. 154-155, 571-576 (2000).
[Crossref]

Watanabe, W.

W. Watanabe, T. Tamaki, Y. Ozeki, and K. Itoh, “Filamentation in ultrafast laser material processing,” in Progress in Ultrafast Intense Laser Science VI, K. Yamanouchi, G. Gerber, and A. D. Bandrauk, eds. (Springer-Verlag, 2010).

Will, M.

S. Nolte, M. Will, M. Augustin, P. Triebel, K. Zöllner, and A. Tünnermann, “Cutting of optical materials by using femtosecond laser pulses,” Proc. SPIE 4440, 152–160 (2001).
[Crossref]

Yabe, A.

J. Wang, H. Niino, and A. Yabe, “One-step microfabrication of fused silica by laser ablation of an organic solution,” Appl. Phys. A 68(1), 111–113 (1999); J. Wang, H. Niino, and A. Yabe, “Micromachining of transparent materials with super-heated liquid generated by multiphotonic absorption of organic molecule,” Appl. Surf. Sci. 154-155, 571-576 (2000).
[Crossref]

Yavas, S.

C. Kerse, H. Kalaycıoğlu, P. Elahi, B. Çetin, D. K. Kesim, Ö. Akçaalan, S. Yavaş, M. D. Aşık, B. Öktem, H. Hoogland, R. Holzwarth, and F. Ö. Ilday, “Ablation-cooled material removal with ultrafast bursts of pulses,” Nature 537(7618), 84–88 (2016).
[Crossref]

Yoshino, F.

Zhang, H.

S. M. Eaton, H. Zhang, P. R. Herman, F. Yoshino, L. Shah, J. Bovatsek, and A. Y. Arai, “Heat accumulation effects in femtosecond laser-written waveguides with variable repetition rate,” Opt. Express 13(12), 4708–4716 (2005).
[Crossref]

J. Li, P. R. Herman, S. M. Eaton, H. Zhang, A. H. Nejadmalayeri, and S. A. Hosseini, “Combining 5-D Microscopy with 3-D Femtosecond Laser Nanoprocessing,” Conference on Lasers and Electro-Optics/Quantum Electronics and Laser Science Conference and Photonic Applications Systems Technologies, OSA Technical Digest Series (CD) (Optical Society of America, 2007), paper CFR4.

Zöllner, K.

S. Nolte, M. Will, M. Augustin, P. Triebel, K. Zöllner, and A. Tünnermann, “Cutting of optical materials by using femtosecond laser pulses,” Proc. SPIE 4440, 152–160 (2001).
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Appl. Phys. A (2)

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Figures (6)

Fig. 1.
Fig. 1. Schematic arrangement (a) for ultrafast laser filament formation and in-situ photoluminescence characterization, driven by single-pulse (b) and burst train (4 pulses/burst as an example) (c) exposure, under various combinations of V-channel and/or filament array scribing structures (VB-nF, VT-nF, VB-F, VT-F, and I-F, see text for definitions). ICCD: intensified CCD detector; tgate: ICCD gate width; tdelay: ICCD gate delay time; t1: time period (20 ns) between laser pulses in a laser burst; t2: time period between single laser pulses or burst trains.
Fig. 2.
Fig. 2. Photoluminescence images (a)-(g) of laser filament tracks recorded in soda-lime glass with 5 ns ICCD gate width at varying laser focal positions illustrated by the green dashed lines except for (a) where the focal plane is 335 µm below the bottom surface. Photoluminescence images (h)-(l) of laser filaments recorded with 5 ns ICCD gate width, at fixed focal position (green dashed lines) with varying laser pulse energy: 34 µJ (h), 50 µJ (i), 74 µJ (j), 104 µJ (k), and 153 µJ (l). TS: glass top surface; BS: glass bottom surface.
Fig. 3.
Fig. 3. Photoluminescence images of laser filament tracks recorded in soda-lime glass with 5 ns ICCD gate width for single pulse (a) and burst train (b) exposure. The gate delay time is as labeled and focal positions are illustrated by green dashed lines. The total filament areal photoluminescence intensity is plotted as a function of gate delay for single pulse (c) and burst train (d) exposure, with the laser coincidence time depicted by the vertical red dashed lines. TS: glass top surface; BS: glass bottom surface.
Fig. 4.
Fig. 4. Optical microscope images in end ((a), (g)), top ((b), (h)), and bottom ((c), (i)) surface views of filament arrays formed in soda-lime glass and connected with a simultaneously formed bottom surface V-channel (VB-F), comparing morphology of single pulse ((a)-(c)) and burst train ((g)-(i)) exposures prior to cleaving, and optical microscope ((e), (j)), camera ((d), (k)), and AFM images ((f), (l)) of the resulted cleavage facets, comparing facet quality under single pulse ((d), (e), (f)) and burst train ((j), (k), (l)) exposures. TS: glass top surface; BS: glass bottom surface.
Fig. 5.
Fig. 5. Optical microscope images in end ((a), (f)), top ((b), (g)), and bottom ((c), (h)) surface views of filament arrays formed in soda-lime glass under burst train exposure prior to cleaving, and optical microscope ((d), (i)) and camera ((e), (l)) images of the resulted cleavage facets, as well as optical microscope images of the top ((j)) and bottom ((k)) surfaces showing the sharp and smooth corners of the cleavage facet. Filament arrays were formed simultaneously with (VT-F; (a)-(e)) or without (I-F; (f)-(l)) ablation of a top surface V-channel. TS: glass top surface; BS: glass bottom surface.
Fig. 6.
Fig. 6. Comparison of breaking force (red circles) of non-scribed glass (Ref) and glass samples scribed by the following laser structures: filament array with bottom V-groove under single pulse (VB-F(nB)) and burst train (VB-F) exposure, and burst-train exposure of filament arrays with (VT-F) and without (I-F) a top surface V-groove. Flexural strengths of the pristine and cleaved glass samples are shown by black circles. Error bars are standard deviation over ∼5 samples.

Tables (1)

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Table 1. Comparison of ultrashort-pulsed laser glass scribing methods

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