Abstract

The mass production and commercialization of integrated photonics have been slowed down by the high cost of packaging its optical interfaces. We show a plug-and-play connector between a fiber and a nanophotonic waveguide consisting of a 3D polymer structure with a fiber entrance port that simultaneously achieves mechanical and optical passive alignment with tolerance beyond ±10 μm to the fiber input position. We take advantage of a mechanical and optical co-design, analogous to commercial fiber-to-fiber connectors. We fabricate the plug-and-play couplers using 3D nanoprinting directly on foundry fabricated diffraction grating couplers. We measure an average of only 0.05 dB excess coupling loss between a single mode fiber and a high confinement silicon waveguide in addition to the inherent grating coupler loss. Our coupling platform offers a passive plug-and-play solution for scalable integrated photonics fiber-chip packaging.

© 2019 Optical Society of America under the terms of the OSA Open Access Publishing Agreement

Full Article  |  PDF Article
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References

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    [Crossref]
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2018 (1)

T. Barwicz, T. W. Lichoulas, Y. Taira, Y. Martin, S. Takenobu, A. Janta-Polczynski, H. Numata, E. L. Kimbrell, J.-W. Nah, B. Peng, D. Childers, R. Leidy, M. Khater, S. Kamlapurkar, E. Cyr, S. Engelmann, P. Fortier, and N. Boyer, “Automated, high-throughput photonic packaging,” Opt. Fiber Technol. 44, 24–35 (2018).
[Crossref]

2017 (1)

C. Scarcella, K. Gradkowski, L. Carroll, J. Lee, M. Duperron, D. Fowler, and P. O’Brien, “Pluggable single-mode fiber-array-to-PIC coupling using micro-lenses,” IEEE Photonic Tech. L. 29, 1943–1946 (2017).
[Crossref]

2016 (2)

D. Thomson, A. Zilkie, J. E. Bowers, T. Komljenovic, G. T. Reed, L. Vivien, D. Marris-Morini, E. Cassan, L. Virot, J.-M. Fedeli, J.-M. Hartmann, J. H. Schmid, D.-X. Xu, F. Boeuf, P. O’Brien, G. Z. Mashanovich, and M. Nedeljkovic, “Roadmap on silicon photonics,” J. Opt. 18, 073003 (2016).
[Crossref]

T. Barwicz, Y. Taira, T. W. Lichoulas, N. Boyer, Y. Martin, H. Numata, J. Nah, S. Takenobu, A. Janta-Polczynski, E. L. Kimbrell, R. Leidy, M. H. Khater, S. Kamlapurkar, S. Engelmann, Y. A. Vlasov, and P. Fortier, “A novel approach to photonic packaging leveraging existing high-throughput microelectronic facilities,” IEEE J. Sel. Top. Quant. 22, 455–466 (2016).
[Crossref]

2015 (1)

N. Pavarelli, J. S. Lee, M. Rensing, C. Scarcella, S. Zhou, P. Ossieur, and P. A. O’Brien, “Optical and electronic packaging processes for silicon photonic systems,” J. Light. Technol. 33, 991–997 (2015).
[Crossref]

2014 (4)

C. Li, K. S. Chee, J. Tao, H. Zhang, M. Yu, and G. Q. Lo, “Silicon photonics packaging with lateral fiber coupling to apodized grating coupler embedded circuit,” Opt. Express 22, 24235 (2014).
[Crossref] [PubMed]

J. E. Hoffman, S. Ravets, J. A. Grover, P. Solano, P. R. Kordell, J. D. Wong-Campos, L. A. Orozco, and S. L. Rolston, “Ultrahigh transmission optical nanofibers,” AIP Adv. 4, 067124 (2014).
[Crossref]

J. M. Ward, A. Maimaiti, V. H. Le, and S. N. Chormaic, “Contributed review: Optical micro- and nanofiber pulling rig,” Rev. Sci. Instrum. 85, 111501 (2014).
[Crossref] [PubMed]

T. Barwicz and Y. Taira, “Low-cost interfacing of fibers to nanophotonic waveguides: design for fabrication and assembly tolerances,” IEEE Photonics J. 6, 1–18 (2014).
[Crossref]

2013 (1)

B. Snyder and P. O’Brien, “Packaging process for grating-coupled silicon photonic waveguides using angle-polished fibers,” IEEE T. Comp. Pack. Man. 3, 954–959 (2013).

Barwicz, T.

T. Barwicz, T. W. Lichoulas, Y. Taira, Y. Martin, S. Takenobu, A. Janta-Polczynski, H. Numata, E. L. Kimbrell, J.-W. Nah, B. Peng, D. Childers, R. Leidy, M. Khater, S. Kamlapurkar, E. Cyr, S. Engelmann, P. Fortier, and N. Boyer, “Automated, high-throughput photonic packaging,” Opt. Fiber Technol. 44, 24–35 (2018).
[Crossref]

T. Barwicz, Y. Taira, T. W. Lichoulas, N. Boyer, Y. Martin, H. Numata, J. Nah, S. Takenobu, A. Janta-Polczynski, E. L. Kimbrell, R. Leidy, M. H. Khater, S. Kamlapurkar, S. Engelmann, Y. A. Vlasov, and P. Fortier, “A novel approach to photonic packaging leveraging existing high-throughput microelectronic facilities,” IEEE J. Sel. Top. Quant. 22, 455–466 (2016).
[Crossref]

T. Barwicz and Y. Taira, “Low-cost interfacing of fibers to nanophotonic waveguides: design for fabrication and assembly tolerances,” IEEE Photonics J. 6, 1–18 (2014).
[Crossref]

T. Barwicz, Y. Taira, H. Numata, N. Boyer, S. Harel, S. Kamlapurkar, S. Takenobu, S. Laflamme, S. Engelmann, Y. Vlasov, and P. Fortier, “Assembly of mechanically compliant interfaces between optical fibers and nanophotonic chips,” in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), (2014), pp. 179–185.
[Crossref]

Bauditsch, N.

D. Karnick, N. Bauditsch, L. Eisenblätter, T. Kühner, M. Schneider, and M. Weber, “Efficient, easy-to-use, planar fiber-to-chip coupling process with angle-polished fibers,” in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), (2017), pp. 1627–1632.
[Crossref]

Boeuf, F.

D. Thomson, A. Zilkie, J. E. Bowers, T. Komljenovic, G. T. Reed, L. Vivien, D. Marris-Morini, E. Cassan, L. Virot, J.-M. Fedeli, J.-M. Hartmann, J. H. Schmid, D.-X. Xu, F. Boeuf, P. O’Brien, G. Z. Mashanovich, and M. Nedeljkovic, “Roadmap on silicon photonics,” J. Opt. 18, 073003 (2016).
[Crossref]

Bowers, J. E.

D. Thomson, A. Zilkie, J. E. Bowers, T. Komljenovic, G. T. Reed, L. Vivien, D. Marris-Morini, E. Cassan, L. Virot, J.-M. Fedeli, J.-M. Hartmann, J. H. Schmid, D.-X. Xu, F. Boeuf, P. O’Brien, G. Z. Mashanovich, and M. Nedeljkovic, “Roadmap on silicon photonics,” J. Opt. 18, 073003 (2016).
[Crossref]

Boyer, N.

T. Barwicz, T. W. Lichoulas, Y. Taira, Y. Martin, S. Takenobu, A. Janta-Polczynski, H. Numata, E. L. Kimbrell, J.-W. Nah, B. Peng, D. Childers, R. Leidy, M. Khater, S. Kamlapurkar, E. Cyr, S. Engelmann, P. Fortier, and N. Boyer, “Automated, high-throughput photonic packaging,” Opt. Fiber Technol. 44, 24–35 (2018).
[Crossref]

T. Barwicz, Y. Taira, T. W. Lichoulas, N. Boyer, Y. Martin, H. Numata, J. Nah, S. Takenobu, A. Janta-Polczynski, E. L. Kimbrell, R. Leidy, M. H. Khater, S. Kamlapurkar, S. Engelmann, Y. A. Vlasov, and P. Fortier, “A novel approach to photonic packaging leveraging existing high-throughput microelectronic facilities,” IEEE J. Sel. Top. Quant. 22, 455–466 (2016).
[Crossref]

T. Barwicz, Y. Taira, H. Numata, N. Boyer, S. Harel, S. Kamlapurkar, S. Takenobu, S. Laflamme, S. Engelmann, Y. Vlasov, and P. Fortier, “Assembly of mechanically compliant interfaces between optical fibers and nanophotonic chips,” in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), (2014), pp. 179–185.
[Crossref]

Carroll, L.

C. Scarcella, K. Gradkowski, L. Carroll, J. Lee, M. Duperron, D. Fowler, and P. O’Brien, “Pluggable single-mode fiber-array-to-PIC coupling using micro-lenses,” IEEE Photonic Tech. L. 29, 1943–1946 (2017).
[Crossref]

Cassan, E.

D. Thomson, A. Zilkie, J. E. Bowers, T. Komljenovic, G. T. Reed, L. Vivien, D. Marris-Morini, E. Cassan, L. Virot, J.-M. Fedeli, J.-M. Hartmann, J. H. Schmid, D.-X. Xu, F. Boeuf, P. O’Brien, G. Z. Mashanovich, and M. Nedeljkovic, “Roadmap on silicon photonics,” J. Opt. 18, 073003 (2016).
[Crossref]

Chee, K. S.

Childers, D.

T. Barwicz, T. W. Lichoulas, Y. Taira, Y. Martin, S. Takenobu, A. Janta-Polczynski, H. Numata, E. L. Kimbrell, J.-W. Nah, B. Peng, D. Childers, R. Leidy, M. Khater, S. Kamlapurkar, E. Cyr, S. Engelmann, P. Fortier, and N. Boyer, “Automated, high-throughput photonic packaging,” Opt. Fiber Technol. 44, 24–35 (2018).
[Crossref]

Chormaic, S. N.

J. M. Ward, A. Maimaiti, V. H. Le, and S. N. Chormaic, “Contributed review: Optical micro- and nanofiber pulling rig,” Rev. Sci. Instrum. 85, 111501 (2014).
[Crossref] [PubMed]

Cyr, E.

T. Barwicz, T. W. Lichoulas, Y. Taira, Y. Martin, S. Takenobu, A. Janta-Polczynski, H. Numata, E. L. Kimbrell, J.-W. Nah, B. Peng, D. Childers, R. Leidy, M. Khater, S. Kamlapurkar, E. Cyr, S. Engelmann, P. Fortier, and N. Boyer, “Automated, high-throughput photonic packaging,” Opt. Fiber Technol. 44, 24–35 (2018).
[Crossref]

Duperron, M.

C. Scarcella, K. Gradkowski, L. Carroll, J. Lee, M. Duperron, D. Fowler, and P. O’Brien, “Pluggable single-mode fiber-array-to-PIC coupling using micro-lenses,” IEEE Photonic Tech. L. 29, 1943–1946 (2017).
[Crossref]

Eisenblätter, L.

D. Karnick, N. Bauditsch, L. Eisenblätter, T. Kühner, M. Schneider, and M. Weber, “Efficient, easy-to-use, planar fiber-to-chip coupling process with angle-polished fibers,” in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), (2017), pp. 1627–1632.
[Crossref]

Engelmann, S.

T. Barwicz, T. W. Lichoulas, Y. Taira, Y. Martin, S. Takenobu, A. Janta-Polczynski, H. Numata, E. L. Kimbrell, J.-W. Nah, B. Peng, D. Childers, R. Leidy, M. Khater, S. Kamlapurkar, E. Cyr, S. Engelmann, P. Fortier, and N. Boyer, “Automated, high-throughput photonic packaging,” Opt. Fiber Technol. 44, 24–35 (2018).
[Crossref]

T. Barwicz, Y. Taira, T. W. Lichoulas, N. Boyer, Y. Martin, H. Numata, J. Nah, S. Takenobu, A. Janta-Polczynski, E. L. Kimbrell, R. Leidy, M. H. Khater, S. Kamlapurkar, S. Engelmann, Y. A. Vlasov, and P. Fortier, “A novel approach to photonic packaging leveraging existing high-throughput microelectronic facilities,” IEEE J. Sel. Top. Quant. 22, 455–466 (2016).
[Crossref]

T. Barwicz, Y. Taira, H. Numata, N. Boyer, S. Harel, S. Kamlapurkar, S. Takenobu, S. Laflamme, S. Engelmann, Y. Vlasov, and P. Fortier, “Assembly of mechanically compliant interfaces between optical fibers and nanophotonic chips,” in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), (2014), pp. 179–185.
[Crossref]

Fedeli, J.-M.

D. Thomson, A. Zilkie, J. E. Bowers, T. Komljenovic, G. T. Reed, L. Vivien, D. Marris-Morini, E. Cassan, L. Virot, J.-M. Fedeli, J.-M. Hartmann, J. H. Schmid, D.-X. Xu, F. Boeuf, P. O’Brien, G. Z. Mashanovich, and M. Nedeljkovic, “Roadmap on silicon photonics,” J. Opt. 18, 073003 (2016).
[Crossref]

Fortier, P.

T. Barwicz, T. W. Lichoulas, Y. Taira, Y. Martin, S. Takenobu, A. Janta-Polczynski, H. Numata, E. L. Kimbrell, J.-W. Nah, B. Peng, D. Childers, R. Leidy, M. Khater, S. Kamlapurkar, E. Cyr, S. Engelmann, P. Fortier, and N. Boyer, “Automated, high-throughput photonic packaging,” Opt. Fiber Technol. 44, 24–35 (2018).
[Crossref]

T. Barwicz, Y. Taira, T. W. Lichoulas, N. Boyer, Y. Martin, H. Numata, J. Nah, S. Takenobu, A. Janta-Polczynski, E. L. Kimbrell, R. Leidy, M. H. Khater, S. Kamlapurkar, S. Engelmann, Y. A. Vlasov, and P. Fortier, “A novel approach to photonic packaging leveraging existing high-throughput microelectronic facilities,” IEEE J. Sel. Top. Quant. 22, 455–466 (2016).
[Crossref]

T. Barwicz, Y. Taira, H. Numata, N. Boyer, S. Harel, S. Kamlapurkar, S. Takenobu, S. Laflamme, S. Engelmann, Y. Vlasov, and P. Fortier, “Assembly of mechanically compliant interfaces between optical fibers and nanophotonic chips,” in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), (2014), pp. 179–185.
[Crossref]

Fowler, D.

C. Scarcella, K. Gradkowski, L. Carroll, J. Lee, M. Duperron, D. Fowler, and P. O’Brien, “Pluggable single-mode fiber-array-to-PIC coupling using micro-lenses,” IEEE Photonic Tech. L. 29, 1943–1946 (2017).
[Crossref]

Gradkowski, K.

C. Scarcella, K. Gradkowski, L. Carroll, J. Lee, M. Duperron, D. Fowler, and P. O’Brien, “Pluggable single-mode fiber-array-to-PIC coupling using micro-lenses,” IEEE Photonic Tech. L. 29, 1943–1946 (2017).
[Crossref]

Grover, J. A.

J. E. Hoffman, S. Ravets, J. A. Grover, P. Solano, P. R. Kordell, J. D. Wong-Campos, L. A. Orozco, and S. L. Rolston, “Ultrahigh transmission optical nanofibers,” AIP Adv. 4, 067124 (2014).
[Crossref]

Harel, S.

T. Barwicz, Y. Taira, H. Numata, N. Boyer, S. Harel, S. Kamlapurkar, S. Takenobu, S. Laflamme, S. Engelmann, Y. Vlasov, and P. Fortier, “Assembly of mechanically compliant interfaces between optical fibers and nanophotonic chips,” in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), (2014), pp. 179–185.
[Crossref]

Hartmann, J.-M.

D. Thomson, A. Zilkie, J. E. Bowers, T. Komljenovic, G. T. Reed, L. Vivien, D. Marris-Morini, E. Cassan, L. Virot, J.-M. Fedeli, J.-M. Hartmann, J. H. Schmid, D.-X. Xu, F. Boeuf, P. O’Brien, G. Z. Mashanovich, and M. Nedeljkovic, “Roadmap on silicon photonics,” J. Opt. 18, 073003 (2016).
[Crossref]

Hoffman, J. E.

J. E. Hoffman, S. Ravets, J. A. Grover, P. Solano, P. R. Kordell, J. D. Wong-Campos, L. A. Orozco, and S. L. Rolston, “Ultrahigh transmission optical nanofibers,” AIP Adv. 4, 067124 (2014).
[Crossref]

Janta-Polczynski, A.

T. Barwicz, T. W. Lichoulas, Y. Taira, Y. Martin, S. Takenobu, A. Janta-Polczynski, H. Numata, E. L. Kimbrell, J.-W. Nah, B. Peng, D. Childers, R. Leidy, M. Khater, S. Kamlapurkar, E. Cyr, S. Engelmann, P. Fortier, and N. Boyer, “Automated, high-throughput photonic packaging,” Opt. Fiber Technol. 44, 24–35 (2018).
[Crossref]

T. Barwicz, Y. Taira, T. W. Lichoulas, N. Boyer, Y. Martin, H. Numata, J. Nah, S. Takenobu, A. Janta-Polczynski, E. L. Kimbrell, R. Leidy, M. H. Khater, S. Kamlapurkar, S. Engelmann, Y. A. Vlasov, and P. Fortier, “A novel approach to photonic packaging leveraging existing high-throughput microelectronic facilities,” IEEE J. Sel. Top. Quant. 22, 455–466 (2016).
[Crossref]

Kamlapurkar, S.

T. Barwicz, T. W. Lichoulas, Y. Taira, Y. Martin, S. Takenobu, A. Janta-Polczynski, H. Numata, E. L. Kimbrell, J.-W. Nah, B. Peng, D. Childers, R. Leidy, M. Khater, S. Kamlapurkar, E. Cyr, S. Engelmann, P. Fortier, and N. Boyer, “Automated, high-throughput photonic packaging,” Opt. Fiber Technol. 44, 24–35 (2018).
[Crossref]

T. Barwicz, Y. Taira, T. W. Lichoulas, N. Boyer, Y. Martin, H. Numata, J. Nah, S. Takenobu, A. Janta-Polczynski, E. L. Kimbrell, R. Leidy, M. H. Khater, S. Kamlapurkar, S. Engelmann, Y. A. Vlasov, and P. Fortier, “A novel approach to photonic packaging leveraging existing high-throughput microelectronic facilities,” IEEE J. Sel. Top. Quant. 22, 455–466 (2016).
[Crossref]

T. Barwicz, Y. Taira, H. Numata, N. Boyer, S. Harel, S. Kamlapurkar, S. Takenobu, S. Laflamme, S. Engelmann, Y. Vlasov, and P. Fortier, “Assembly of mechanically compliant interfaces between optical fibers and nanophotonic chips,” in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), (2014), pp. 179–185.
[Crossref]

Karnick, D.

D. Karnick, N. Bauditsch, L. Eisenblätter, T. Kühner, M. Schneider, and M. Weber, “Efficient, easy-to-use, planar fiber-to-chip coupling process with angle-polished fibers,” in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), (2017), pp. 1627–1632.
[Crossref]

Khater, M.

T. Barwicz, T. W. Lichoulas, Y. Taira, Y. Martin, S. Takenobu, A. Janta-Polczynski, H. Numata, E. L. Kimbrell, J.-W. Nah, B. Peng, D. Childers, R. Leidy, M. Khater, S. Kamlapurkar, E. Cyr, S. Engelmann, P. Fortier, and N. Boyer, “Automated, high-throughput photonic packaging,” Opt. Fiber Technol. 44, 24–35 (2018).
[Crossref]

Khater, M. H.

T. Barwicz, Y. Taira, T. W. Lichoulas, N. Boyer, Y. Martin, H. Numata, J. Nah, S. Takenobu, A. Janta-Polczynski, E. L. Kimbrell, R. Leidy, M. H. Khater, S. Kamlapurkar, S. Engelmann, Y. A. Vlasov, and P. Fortier, “A novel approach to photonic packaging leveraging existing high-throughput microelectronic facilities,” IEEE J. Sel. Top. Quant. 22, 455–466 (2016).
[Crossref]

Kimbrell, E. L.

T. Barwicz, T. W. Lichoulas, Y. Taira, Y. Martin, S. Takenobu, A. Janta-Polczynski, H. Numata, E. L. Kimbrell, J.-W. Nah, B. Peng, D. Childers, R. Leidy, M. Khater, S. Kamlapurkar, E. Cyr, S. Engelmann, P. Fortier, and N. Boyer, “Automated, high-throughput photonic packaging,” Opt. Fiber Technol. 44, 24–35 (2018).
[Crossref]

T. Barwicz, Y. Taira, T. W. Lichoulas, N. Boyer, Y. Martin, H. Numata, J. Nah, S. Takenobu, A. Janta-Polczynski, E. L. Kimbrell, R. Leidy, M. H. Khater, S. Kamlapurkar, S. Engelmann, Y. A. Vlasov, and P. Fortier, “A novel approach to photonic packaging leveraging existing high-throughput microelectronic facilities,” IEEE J. Sel. Top. Quant. 22, 455–466 (2016).
[Crossref]

Komljenovic, T.

D. Thomson, A. Zilkie, J. E. Bowers, T. Komljenovic, G. T. Reed, L. Vivien, D. Marris-Morini, E. Cassan, L. Virot, J.-M. Fedeli, J.-M. Hartmann, J. H. Schmid, D.-X. Xu, F. Boeuf, P. O’Brien, G. Z. Mashanovich, and M. Nedeljkovic, “Roadmap on silicon photonics,” J. Opt. 18, 073003 (2016).
[Crossref]

Kordell, P. R.

J. E. Hoffman, S. Ravets, J. A. Grover, P. Solano, P. R. Kordell, J. D. Wong-Campos, L. A. Orozco, and S. L. Rolston, “Ultrahigh transmission optical nanofibers,” AIP Adv. 4, 067124 (2014).
[Crossref]

Kühner, T.

D. Karnick, N. Bauditsch, L. Eisenblätter, T. Kühner, M. Schneider, and M. Weber, “Efficient, easy-to-use, planar fiber-to-chip coupling process with angle-polished fibers,” in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), (2017), pp. 1627–1632.
[Crossref]

Laflamme, S.

T. Barwicz, Y. Taira, H. Numata, N. Boyer, S. Harel, S. Kamlapurkar, S. Takenobu, S. Laflamme, S. Engelmann, Y. Vlasov, and P. Fortier, “Assembly of mechanically compliant interfaces between optical fibers and nanophotonic chips,” in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), (2014), pp. 179–185.
[Crossref]

Le, V. H.

J. M. Ward, A. Maimaiti, V. H. Le, and S. N. Chormaic, “Contributed review: Optical micro- and nanofiber pulling rig,” Rev. Sci. Instrum. 85, 111501 (2014).
[Crossref] [PubMed]

Lee, J.

C. Scarcella, K. Gradkowski, L. Carroll, J. Lee, M. Duperron, D. Fowler, and P. O’Brien, “Pluggable single-mode fiber-array-to-PIC coupling using micro-lenses,” IEEE Photonic Tech. L. 29, 1943–1946 (2017).
[Crossref]

Lee, J. S.

N. Pavarelli, J. S. Lee, M. Rensing, C. Scarcella, S. Zhou, P. Ossieur, and P. A. O’Brien, “Optical and electronic packaging processes for silicon photonic systems,” J. Light. Technol. 33, 991–997 (2015).
[Crossref]

Leidy, R.

T. Barwicz, T. W. Lichoulas, Y. Taira, Y. Martin, S. Takenobu, A. Janta-Polczynski, H. Numata, E. L. Kimbrell, J.-W. Nah, B. Peng, D. Childers, R. Leidy, M. Khater, S. Kamlapurkar, E. Cyr, S. Engelmann, P. Fortier, and N. Boyer, “Automated, high-throughput photonic packaging,” Opt. Fiber Technol. 44, 24–35 (2018).
[Crossref]

T. Barwicz, Y. Taira, T. W. Lichoulas, N. Boyer, Y. Martin, H. Numata, J. Nah, S. Takenobu, A. Janta-Polczynski, E. L. Kimbrell, R. Leidy, M. H. Khater, S. Kamlapurkar, S. Engelmann, Y. A. Vlasov, and P. Fortier, “A novel approach to photonic packaging leveraging existing high-throughput microelectronic facilities,” IEEE J. Sel. Top. Quant. 22, 455–466 (2016).
[Crossref]

Li, C.

Lichoulas, T. W.

T. Barwicz, T. W. Lichoulas, Y. Taira, Y. Martin, S. Takenobu, A. Janta-Polczynski, H. Numata, E. L. Kimbrell, J.-W. Nah, B. Peng, D. Childers, R. Leidy, M. Khater, S. Kamlapurkar, E. Cyr, S. Engelmann, P. Fortier, and N. Boyer, “Automated, high-throughput photonic packaging,” Opt. Fiber Technol. 44, 24–35 (2018).
[Crossref]

T. Barwicz, Y. Taira, T. W. Lichoulas, N. Boyer, Y. Martin, H. Numata, J. Nah, S. Takenobu, A. Janta-Polczynski, E. L. Kimbrell, R. Leidy, M. H. Khater, S. Kamlapurkar, S. Engelmann, Y. A. Vlasov, and P. Fortier, “A novel approach to photonic packaging leveraging existing high-throughput microelectronic facilities,” IEEE J. Sel. Top. Quant. 22, 455–466 (2016).
[Crossref]

Lo, G. Q.

Maimaiti, A.

J. M. Ward, A. Maimaiti, V. H. Le, and S. N. Chormaic, “Contributed review: Optical micro- and nanofiber pulling rig,” Rev. Sci. Instrum. 85, 111501 (2014).
[Crossref] [PubMed]

Marris-Morini, D.

D. Thomson, A. Zilkie, J. E. Bowers, T. Komljenovic, G. T. Reed, L. Vivien, D. Marris-Morini, E. Cassan, L. Virot, J.-M. Fedeli, J.-M. Hartmann, J. H. Schmid, D.-X. Xu, F. Boeuf, P. O’Brien, G. Z. Mashanovich, and M. Nedeljkovic, “Roadmap on silicon photonics,” J. Opt. 18, 073003 (2016).
[Crossref]

Martin, Y.

T. Barwicz, T. W. Lichoulas, Y. Taira, Y. Martin, S. Takenobu, A. Janta-Polczynski, H. Numata, E. L. Kimbrell, J.-W. Nah, B. Peng, D. Childers, R. Leidy, M. Khater, S. Kamlapurkar, E. Cyr, S. Engelmann, P. Fortier, and N. Boyer, “Automated, high-throughput photonic packaging,” Opt. Fiber Technol. 44, 24–35 (2018).
[Crossref]

T. Barwicz, Y. Taira, T. W. Lichoulas, N. Boyer, Y. Martin, H. Numata, J. Nah, S. Takenobu, A. Janta-Polczynski, E. L. Kimbrell, R. Leidy, M. H. Khater, S. Kamlapurkar, S. Engelmann, Y. A. Vlasov, and P. Fortier, “A novel approach to photonic packaging leveraging existing high-throughput microelectronic facilities,” IEEE J. Sel. Top. Quant. 22, 455–466 (2016).
[Crossref]

Mashanovich, G. Z.

D. Thomson, A. Zilkie, J. E. Bowers, T. Komljenovic, G. T. Reed, L. Vivien, D. Marris-Morini, E. Cassan, L. Virot, J.-M. Fedeli, J.-M. Hartmann, J. H. Schmid, D.-X. Xu, F. Boeuf, P. O’Brien, G. Z. Mashanovich, and M. Nedeljkovic, “Roadmap on silicon photonics,” J. Opt. 18, 073003 (2016).
[Crossref]

Nah, J.

T. Barwicz, Y. Taira, T. W. Lichoulas, N. Boyer, Y. Martin, H. Numata, J. Nah, S. Takenobu, A. Janta-Polczynski, E. L. Kimbrell, R. Leidy, M. H. Khater, S. Kamlapurkar, S. Engelmann, Y. A. Vlasov, and P. Fortier, “A novel approach to photonic packaging leveraging existing high-throughput microelectronic facilities,” IEEE J. Sel. Top. Quant. 22, 455–466 (2016).
[Crossref]

Nah, J.-W.

T. Barwicz, T. W. Lichoulas, Y. Taira, Y. Martin, S. Takenobu, A. Janta-Polczynski, H. Numata, E. L. Kimbrell, J.-W. Nah, B. Peng, D. Childers, R. Leidy, M. Khater, S. Kamlapurkar, E. Cyr, S. Engelmann, P. Fortier, and N. Boyer, “Automated, high-throughput photonic packaging,” Opt. Fiber Technol. 44, 24–35 (2018).
[Crossref]

Nedeljkovic, M.

D. Thomson, A. Zilkie, J. E. Bowers, T. Komljenovic, G. T. Reed, L. Vivien, D. Marris-Morini, E. Cassan, L. Virot, J.-M. Fedeli, J.-M. Hartmann, J. H. Schmid, D.-X. Xu, F. Boeuf, P. O’Brien, G. Z. Mashanovich, and M. Nedeljkovic, “Roadmap on silicon photonics,” J. Opt. 18, 073003 (2016).
[Crossref]

Numata, H.

T. Barwicz, T. W. Lichoulas, Y. Taira, Y. Martin, S. Takenobu, A. Janta-Polczynski, H. Numata, E. L. Kimbrell, J.-W. Nah, B. Peng, D. Childers, R. Leidy, M. Khater, S. Kamlapurkar, E. Cyr, S. Engelmann, P. Fortier, and N. Boyer, “Automated, high-throughput photonic packaging,” Opt. Fiber Technol. 44, 24–35 (2018).
[Crossref]

T. Barwicz, Y. Taira, T. W. Lichoulas, N. Boyer, Y. Martin, H. Numata, J. Nah, S. Takenobu, A. Janta-Polczynski, E. L. Kimbrell, R. Leidy, M. H. Khater, S. Kamlapurkar, S. Engelmann, Y. A. Vlasov, and P. Fortier, “A novel approach to photonic packaging leveraging existing high-throughput microelectronic facilities,” IEEE J. Sel. Top. Quant. 22, 455–466 (2016).
[Crossref]

T. Barwicz, Y. Taira, H. Numata, N. Boyer, S. Harel, S. Kamlapurkar, S. Takenobu, S. Laflamme, S. Engelmann, Y. Vlasov, and P. Fortier, “Assembly of mechanically compliant interfaces between optical fibers and nanophotonic chips,” in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), (2014), pp. 179–185.
[Crossref]

O’Brien, P.

C. Scarcella, K. Gradkowski, L. Carroll, J. Lee, M. Duperron, D. Fowler, and P. O’Brien, “Pluggable single-mode fiber-array-to-PIC coupling using micro-lenses,” IEEE Photonic Tech. L. 29, 1943–1946 (2017).
[Crossref]

D. Thomson, A. Zilkie, J. E. Bowers, T. Komljenovic, G. T. Reed, L. Vivien, D. Marris-Morini, E. Cassan, L. Virot, J.-M. Fedeli, J.-M. Hartmann, J. H. Schmid, D.-X. Xu, F. Boeuf, P. O’Brien, G. Z. Mashanovich, and M. Nedeljkovic, “Roadmap on silicon photonics,” J. Opt. 18, 073003 (2016).
[Crossref]

B. Snyder and P. O’Brien, “Packaging process for grating-coupled silicon photonic waveguides using angle-polished fibers,” IEEE T. Comp. Pack. Man. 3, 954–959 (2013).

O’Brien, P. A.

N. Pavarelli, J. S. Lee, M. Rensing, C. Scarcella, S. Zhou, P. Ossieur, and P. A. O’Brien, “Optical and electronic packaging processes for silicon photonic systems,” J. Light. Technol. 33, 991–997 (2015).
[Crossref]

Orozco, L. A.

J. E. Hoffman, S. Ravets, J. A. Grover, P. Solano, P. R. Kordell, J. D. Wong-Campos, L. A. Orozco, and S. L. Rolston, “Ultrahigh transmission optical nanofibers,” AIP Adv. 4, 067124 (2014).
[Crossref]

Ossieur, P.

N. Pavarelli, J. S. Lee, M. Rensing, C. Scarcella, S. Zhou, P. Ossieur, and P. A. O’Brien, “Optical and electronic packaging processes for silicon photonic systems,” J. Light. Technol. 33, 991–997 (2015).
[Crossref]

Pavarelli, N.

N. Pavarelli, J. S. Lee, M. Rensing, C. Scarcella, S. Zhou, P. Ossieur, and P. A. O’Brien, “Optical and electronic packaging processes for silicon photonic systems,” J. Light. Technol. 33, 991–997 (2015).
[Crossref]

Peng, B.

T. Barwicz, T. W. Lichoulas, Y. Taira, Y. Martin, S. Takenobu, A. Janta-Polczynski, H. Numata, E. L. Kimbrell, J.-W. Nah, B. Peng, D. Childers, R. Leidy, M. Khater, S. Kamlapurkar, E. Cyr, S. Engelmann, P. Fortier, and N. Boyer, “Automated, high-throughput photonic packaging,” Opt. Fiber Technol. 44, 24–35 (2018).
[Crossref]

Preve, G. B.

G. B. Preve, “Silicon photonics packaging automation: problems, challenges, and considerations,” in Silicon Photonics III, (Springer, Berlin, Heidelberg, 2016), Top. Appl. Phys., pp. 237–259.
[Crossref]

Ravets, S.

J. E. Hoffman, S. Ravets, J. A. Grover, P. Solano, P. R. Kordell, J. D. Wong-Campos, L. A. Orozco, and S. L. Rolston, “Ultrahigh transmission optical nanofibers,” AIP Adv. 4, 067124 (2014).
[Crossref]

Reed, G. T.

D. Thomson, A. Zilkie, J. E. Bowers, T. Komljenovic, G. T. Reed, L. Vivien, D. Marris-Morini, E. Cassan, L. Virot, J.-M. Fedeli, J.-M. Hartmann, J. H. Schmid, D.-X. Xu, F. Boeuf, P. O’Brien, G. Z. Mashanovich, and M. Nedeljkovic, “Roadmap on silicon photonics,” J. Opt. 18, 073003 (2016).
[Crossref]

Rensing, M.

N. Pavarelli, J. S. Lee, M. Rensing, C. Scarcella, S. Zhou, P. Ossieur, and P. A. O’Brien, “Optical and electronic packaging processes for silicon photonic systems,” J. Light. Technol. 33, 991–997 (2015).
[Crossref]

Rolston, S. L.

J. E. Hoffman, S. Ravets, J. A. Grover, P. Solano, P. R. Kordell, J. D. Wong-Campos, L. A. Orozco, and S. L. Rolston, “Ultrahigh transmission optical nanofibers,” AIP Adv. 4, 067124 (2014).
[Crossref]

Scarcella, C.

C. Scarcella, K. Gradkowski, L. Carroll, J. Lee, M. Duperron, D. Fowler, and P. O’Brien, “Pluggable single-mode fiber-array-to-PIC coupling using micro-lenses,” IEEE Photonic Tech. L. 29, 1943–1946 (2017).
[Crossref]

N. Pavarelli, J. S. Lee, M. Rensing, C. Scarcella, S. Zhou, P. Ossieur, and P. A. O’Brien, “Optical and electronic packaging processes for silicon photonic systems,” J. Light. Technol. 33, 991–997 (2015).
[Crossref]

Schmid, J. H.

D. Thomson, A. Zilkie, J. E. Bowers, T. Komljenovic, G. T. Reed, L. Vivien, D. Marris-Morini, E. Cassan, L. Virot, J.-M. Fedeli, J.-M. Hartmann, J. H. Schmid, D.-X. Xu, F. Boeuf, P. O’Brien, G. Z. Mashanovich, and M. Nedeljkovic, “Roadmap on silicon photonics,” J. Opt. 18, 073003 (2016).
[Crossref]

Schneider, M.

D. Karnick, N. Bauditsch, L. Eisenblätter, T. Kühner, M. Schneider, and M. Weber, “Efficient, easy-to-use, planar fiber-to-chip coupling process with angle-polished fibers,” in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), (2017), pp. 1627–1632.
[Crossref]

Snyder, B.

B. Snyder and P. O’Brien, “Packaging process for grating-coupled silicon photonic waveguides using angle-polished fibers,” IEEE T. Comp. Pack. Man. 3, 954–959 (2013).

Solano, P.

J. E. Hoffman, S. Ravets, J. A. Grover, P. Solano, P. R. Kordell, J. D. Wong-Campos, L. A. Orozco, and S. L. Rolston, “Ultrahigh transmission optical nanofibers,” AIP Adv. 4, 067124 (2014).
[Crossref]

Taira, Y.

T. Barwicz, T. W. Lichoulas, Y. Taira, Y. Martin, S. Takenobu, A. Janta-Polczynski, H. Numata, E. L. Kimbrell, J.-W. Nah, B. Peng, D. Childers, R. Leidy, M. Khater, S. Kamlapurkar, E. Cyr, S. Engelmann, P. Fortier, and N. Boyer, “Automated, high-throughput photonic packaging,” Opt. Fiber Technol. 44, 24–35 (2018).
[Crossref]

T. Barwicz, Y. Taira, T. W. Lichoulas, N. Boyer, Y. Martin, H. Numata, J. Nah, S. Takenobu, A. Janta-Polczynski, E. L. Kimbrell, R. Leidy, M. H. Khater, S. Kamlapurkar, S. Engelmann, Y. A. Vlasov, and P. Fortier, “A novel approach to photonic packaging leveraging existing high-throughput microelectronic facilities,” IEEE J. Sel. Top. Quant. 22, 455–466 (2016).
[Crossref]

T. Barwicz and Y. Taira, “Low-cost interfacing of fibers to nanophotonic waveguides: design for fabrication and assembly tolerances,” IEEE Photonics J. 6, 1–18 (2014).
[Crossref]

T. Barwicz, Y. Taira, H. Numata, N. Boyer, S. Harel, S. Kamlapurkar, S. Takenobu, S. Laflamme, S. Engelmann, Y. Vlasov, and P. Fortier, “Assembly of mechanically compliant interfaces between optical fibers and nanophotonic chips,” in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), (2014), pp. 179–185.
[Crossref]

Takenobu, S.

T. Barwicz, T. W. Lichoulas, Y. Taira, Y. Martin, S. Takenobu, A. Janta-Polczynski, H. Numata, E. L. Kimbrell, J.-W. Nah, B. Peng, D. Childers, R. Leidy, M. Khater, S. Kamlapurkar, E. Cyr, S. Engelmann, P. Fortier, and N. Boyer, “Automated, high-throughput photonic packaging,” Opt. Fiber Technol. 44, 24–35 (2018).
[Crossref]

T. Barwicz, Y. Taira, T. W. Lichoulas, N. Boyer, Y. Martin, H. Numata, J. Nah, S. Takenobu, A. Janta-Polczynski, E. L. Kimbrell, R. Leidy, M. H. Khater, S. Kamlapurkar, S. Engelmann, Y. A. Vlasov, and P. Fortier, “A novel approach to photonic packaging leveraging existing high-throughput microelectronic facilities,” IEEE J. Sel. Top. Quant. 22, 455–466 (2016).
[Crossref]

T. Barwicz, Y. Taira, H. Numata, N. Boyer, S. Harel, S. Kamlapurkar, S. Takenobu, S. Laflamme, S. Engelmann, Y. Vlasov, and P. Fortier, “Assembly of mechanically compliant interfaces between optical fibers and nanophotonic chips,” in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), (2014), pp. 179–185.
[Crossref]

Tao, J.

Thomson, D.

D. Thomson, A. Zilkie, J. E. Bowers, T. Komljenovic, G. T. Reed, L. Vivien, D. Marris-Morini, E. Cassan, L. Virot, J.-M. Fedeli, J.-M. Hartmann, J. H. Schmid, D.-X. Xu, F. Boeuf, P. O’Brien, G. Z. Mashanovich, and M. Nedeljkovic, “Roadmap on silicon photonics,” J. Opt. 18, 073003 (2016).
[Crossref]

Virot, L.

D. Thomson, A. Zilkie, J. E. Bowers, T. Komljenovic, G. T. Reed, L. Vivien, D. Marris-Morini, E. Cassan, L. Virot, J.-M. Fedeli, J.-M. Hartmann, J. H. Schmid, D.-X. Xu, F. Boeuf, P. O’Brien, G. Z. Mashanovich, and M. Nedeljkovic, “Roadmap on silicon photonics,” J. Opt. 18, 073003 (2016).
[Crossref]

Vivien, L.

D. Thomson, A. Zilkie, J. E. Bowers, T. Komljenovic, G. T. Reed, L. Vivien, D. Marris-Morini, E. Cassan, L. Virot, J.-M. Fedeli, J.-M. Hartmann, J. H. Schmid, D.-X. Xu, F. Boeuf, P. O’Brien, G. Z. Mashanovich, and M. Nedeljkovic, “Roadmap on silicon photonics,” J. Opt. 18, 073003 (2016).
[Crossref]

Vlasov, Y.

T. Barwicz, Y. Taira, H. Numata, N. Boyer, S. Harel, S. Kamlapurkar, S. Takenobu, S. Laflamme, S. Engelmann, Y. Vlasov, and P. Fortier, “Assembly of mechanically compliant interfaces between optical fibers and nanophotonic chips,” in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), (2014), pp. 179–185.
[Crossref]

Vlasov, Y. A.

T. Barwicz, Y. Taira, T. W. Lichoulas, N. Boyer, Y. Martin, H. Numata, J. Nah, S. Takenobu, A. Janta-Polczynski, E. L. Kimbrell, R. Leidy, M. H. Khater, S. Kamlapurkar, S. Engelmann, Y. A. Vlasov, and P. Fortier, “A novel approach to photonic packaging leveraging existing high-throughput microelectronic facilities,” IEEE J. Sel. Top. Quant. 22, 455–466 (2016).
[Crossref]

Ward, J. M.

J. M. Ward, A. Maimaiti, V. H. Le, and S. N. Chormaic, “Contributed review: Optical micro- and nanofiber pulling rig,” Rev. Sci. Instrum. 85, 111501 (2014).
[Crossref] [PubMed]

Weber, M.

D. Karnick, N. Bauditsch, L. Eisenblätter, T. Kühner, M. Schneider, and M. Weber, “Efficient, easy-to-use, planar fiber-to-chip coupling process with angle-polished fibers,” in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), (2017), pp. 1627–1632.
[Crossref]

Wong-Campos, J. D.

J. E. Hoffman, S. Ravets, J. A. Grover, P. Solano, P. R. Kordell, J. D. Wong-Campos, L. A. Orozco, and S. L. Rolston, “Ultrahigh transmission optical nanofibers,” AIP Adv. 4, 067124 (2014).
[Crossref]

Xu, D.-X.

D. Thomson, A. Zilkie, J. E. Bowers, T. Komljenovic, G. T. Reed, L. Vivien, D. Marris-Morini, E. Cassan, L. Virot, J.-M. Fedeli, J.-M. Hartmann, J. H. Schmid, D.-X. Xu, F. Boeuf, P. O’Brien, G. Z. Mashanovich, and M. Nedeljkovic, “Roadmap on silicon photonics,” J. Opt. 18, 073003 (2016).
[Crossref]

Yu, M.

Zhang, H.

Zhou, S.

N. Pavarelli, J. S. Lee, M. Rensing, C. Scarcella, S. Zhou, P. Ossieur, and P. A. O’Brien, “Optical and electronic packaging processes for silicon photonic systems,” J. Light. Technol. 33, 991–997 (2015).
[Crossref]

Zilkie, A.

D. Thomson, A. Zilkie, J. E. Bowers, T. Komljenovic, G. T. Reed, L. Vivien, D. Marris-Morini, E. Cassan, L. Virot, J.-M. Fedeli, J.-M. Hartmann, J. H. Schmid, D.-X. Xu, F. Boeuf, P. O’Brien, G. Z. Mashanovich, and M. Nedeljkovic, “Roadmap on silicon photonics,” J. Opt. 18, 073003 (2016).
[Crossref]

AIP Adv. (1)

J. E. Hoffman, S. Ravets, J. A. Grover, P. Solano, P. R. Kordell, J. D. Wong-Campos, L. A. Orozco, and S. L. Rolston, “Ultrahigh transmission optical nanofibers,” AIP Adv. 4, 067124 (2014).
[Crossref]

IEEE J. Sel. Top. Quant. (1)

T. Barwicz, Y. Taira, T. W. Lichoulas, N. Boyer, Y. Martin, H. Numata, J. Nah, S. Takenobu, A. Janta-Polczynski, E. L. Kimbrell, R. Leidy, M. H. Khater, S. Kamlapurkar, S. Engelmann, Y. A. Vlasov, and P. Fortier, “A novel approach to photonic packaging leveraging existing high-throughput microelectronic facilities,” IEEE J. Sel. Top. Quant. 22, 455–466 (2016).
[Crossref]

IEEE Photonic Tech. L. (1)

C. Scarcella, K. Gradkowski, L. Carroll, J. Lee, M. Duperron, D. Fowler, and P. O’Brien, “Pluggable single-mode fiber-array-to-PIC coupling using micro-lenses,” IEEE Photonic Tech. L. 29, 1943–1946 (2017).
[Crossref]

IEEE Photonics J. (1)

T. Barwicz and Y. Taira, “Low-cost interfacing of fibers to nanophotonic waveguides: design for fabrication and assembly tolerances,” IEEE Photonics J. 6, 1–18 (2014).
[Crossref]

IEEE T. Comp. Pack. Man. (1)

B. Snyder and P. O’Brien, “Packaging process for grating-coupled silicon photonic waveguides using angle-polished fibers,” IEEE T. Comp. Pack. Man. 3, 954–959 (2013).

J. Light. Technol. (1)

N. Pavarelli, J. S. Lee, M. Rensing, C. Scarcella, S. Zhou, P. Ossieur, and P. A. O’Brien, “Optical and electronic packaging processes for silicon photonic systems,” J. Light. Technol. 33, 991–997 (2015).
[Crossref]

J. Opt. (1)

D. Thomson, A. Zilkie, J. E. Bowers, T. Komljenovic, G. T. Reed, L. Vivien, D. Marris-Morini, E. Cassan, L. Virot, J.-M. Fedeli, J.-M. Hartmann, J. H. Schmid, D.-X. Xu, F. Boeuf, P. O’Brien, G. Z. Mashanovich, and M. Nedeljkovic, “Roadmap on silicon photonics,” J. Opt. 18, 073003 (2016).
[Crossref]

Opt. Express (1)

Opt. Fiber Technol. (1)

T. Barwicz, T. W. Lichoulas, Y. Taira, Y. Martin, S. Takenobu, A. Janta-Polczynski, H. Numata, E. L. Kimbrell, J.-W. Nah, B. Peng, D. Childers, R. Leidy, M. Khater, S. Kamlapurkar, E. Cyr, S. Engelmann, P. Fortier, and N. Boyer, “Automated, high-throughput photonic packaging,” Opt. Fiber Technol. 44, 24–35 (2018).
[Crossref]

Rev. Sci. Instrum. (1)

J. M. Ward, A. Maimaiti, V. H. Le, and S. N. Chormaic, “Contributed review: Optical micro- and nanofiber pulling rig,” Rev. Sci. Instrum. 85, 111501 (2014).
[Crossref] [PubMed]

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Nanoscribe-GmbH, “Ip photoresists,” https://www.nanoscribe.de/en/products/ip-photoresists/ .

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[Crossref]

D. Karnick, N. Bauditsch, L. Eisenblätter, T. Kühner, M. Schneider, and M. Weber, “Efficient, easy-to-use, planar fiber-to-chip coupling process with angle-polished fibers,” in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), (2017), pp. 1627–1632.
[Crossref]

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Figures (4)

Fig. 1
Fig. 1 (a) Schematic diagram of our 3D funnel coupler defined on top of a grating coupler. The fiber is inserted all the way into the funnel and edge-coupled to the polymer waveguide. (b) FDTD simulation of the funnel lateral cross-section where the light input is from the left. The fiber and polymer waveguide mode cross-sections are shown in the insets; these two modes are spatially matched at the edge-coupling region. We can also observe that there is no light leakage into the funnel walls in direct contact with the fiber. (c) FDTD simulation of the TIR mirror reflecting light between the polymer waveguide and the grating coupler.
Fig. 2
Fig. 2 Scanning Electron Microscopy (SEM) images of fabricated funnel couplers showing perspective and top views.
Fig. 3
Fig. 3 (a) Averaged plug-and-play coupler loss for 18 devices relative to the measured grating coupler loss. The dashed lines represent the standard deviation. (b) Histogram showing the distributions of the loss among the different devices, the dashed line is a guide to the eye that represents a normal distribution. These loss variations are mainly due to the fabrication misalignment between the couplers and the gratings. Values above 0 dB mean that the coupling efficiency between the grating-polymer waveguide-thinned fiber was higher than the measured grating-vertical fiber coupling efficiency. (c) Measured relative loss as a function of temperature at a wavelength of 1544 nm. (d) Simulated excess coupling loss between the polymer waveguide and the fiber with varying fiber’s MFD.
Fig. 4
Fig. 4 Schematic depicting the polymer coupler dimensions.

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