Abstract

It is a big challenge to weld two materials with large differences in coefficients of thermal expansion and melting points. Here we report that the welding between fused silica (softening point, 1720°C) and SiC wafer (melting point, 3100°C) is achieved with a near infrared femtosecond laser at 800 nm. Elements are observed to have a spatial distribution gradient within the cross section of welding line, revealing that mixing and inter-diffusion of substances have occurred during laser irradiation. This is attributed to the femtosecond laser induced local phase transition and volume expansion. Through optimizing the welding parameters, pulse energy and interval of the welding lines, a shear joining strength as high as 15.1 MPa is achieved. In addition, the influence mechanism of the laser ablation on welding quality of the sample without pre-optical contact is carefully studied by measuring the laser induced interface modification.

© 2017 Optical Society of America

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    [Crossref]
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    [Crossref]
  25. F. Lacroix, D. Hélie, and R. Vallée, “Optical bonding reinforced by femtosecond laser welding,” Proc. SPIE 8126, 812612 (2011).
    [Crossref]
  26. S. Richter, S. Döring, A. Tünnermann, and S. Nolte, “Bonding of glass with femtosecond laser pulses at high repetition rates,” Appl. Phys., A Mater. Sci. Process. 103(2), 257–261 (2011).
    [Crossref]
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    [Crossref]
  28. A. Y. Vorobyev and C. Guo, “Direct femtosecond laser surface nano/microstructuring and its applications,” Laser Photonics Rev. 7(3), 385–407 (2013).
    [Crossref]
  29. P. Lorazo, L. J. Lewis, and M. Meunier, “Short-Pulse Laser Ablation of Solids: from Phase Explosion to Fragmentation,” Phys. Rev. Lett. 91(22), 225502 (2003).
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2016 (1)

M. Malinauskas, A. Zukauskas, S. Hasegawa, Y. Hayasaki, V. Mizeikis, R. Buividas, and S. Juodkazis, “Ultrafast laser processing of materials: from science to industry,” Light Sci. Appl. 5(8), e16133 (2016).
[Crossref]

2015 (4)

2014 (4)

R. M. Carter, J. Chen, J. D. Shephard, R. R. Thomson, and D. P. Hand, “Picosecond laser welding of similar and dissimilar materials,” Appl. Opt. 53(19), 4233–4238 (2014).
[Crossref] [PubMed]

C. Iwamoto, “Microstructure of Aluminum/Glass Joint Bonded by Ultrasonic Wire Welding,” Metall. Mater. Trans., A Phys. Metall. Mater. Sci. 45(3), 1371–1375 (2014).
[Crossref]

I. Miyamoto, K. Cvecek, Y. Okamoto, and M. Schmidt, “Internal modification of glass by ultrashort laser pulse and its application to microwelding,” Appl. Phys., A Mater. Sci. Process. 114(1), 187–208 (2014).
[Crossref]

K. Sugioka and Y. Cheng, “Ultrafast lasers[mdash]reliable tools for advanced materials processing,” Light Sci. Appl. 3(4), e149 (2014).
[Crossref]

2013 (2)

2012 (2)

D. Hélie, M. Bégin, F. Lacroix, and R. Vallée, “Reinforced direct bonding of optical materials by femtosecond laser welding,” Appl. Opt. 51(12), 2098–2106 (2012).
[Crossref] [PubMed]

D. Hélie, F. Lacroix, and R. Vallée, “Bonding of optical materials by femtosecond laser welding for aerospace and high power laser applications,” Proc. SPIE 8412, 841210 (2012).
[Crossref]

2011 (4)

F. Lacroix, D. Hélie, and R. Vallée, “Optical bonding reinforced by femtosecond laser welding,” Proc. SPIE 8126, 812612 (2011).
[Crossref]

S. Richter, S. Döring, A. Tünnermann, and S. Nolte, “Bonding of glass with femtosecond laser pulses at high repetition rates,” Appl. Phys., A Mater. Sci. Process. 103(2), 257–261 (2011).
[Crossref]

B. Chimier, O. Utéza, N. Sanner, M. Sentis, T. Itina, P. Lassonde, F. Légaré, F. Vidal, and J. C. Kieffer, “Damage and ablation thresholds of fused-silica in femtosecond regime,” Phys. Rev. B 84(9), 094104 (2011).
[Crossref]

K. Sugioka, M. Iida, H. Takai, and K. Micorikawa, “Efficient microwelding of glass substrates by ultrafast laser irradiation using a double-pulse train,” Opt. Lett. 36(14), 2734–2736 (2011).
[Crossref] [PubMed]

2008 (2)

Y. Ozeki, T. Inoue, T. Tamaki, H. Yamaguchi, S. Onda, W. Watanabe, T. Sano, S. Nishiuchi, A. Hirose, and K. Itoh, “Direct Welding between Copper and Glass Substrates with Femtosecond Laser Pulses,” Appl. Phys. Express 1, 082601 (2008).
[Crossref]

R. R. Gattass and E. Mazur, “Femtosecond laser micromachining in transparent materials,” Nat. Photonics 2(4), 219–225 (2008).
[Crossref]

2006 (2)

T. Tamaki, W. Watanabe, and K. Itoh, “Laser micro-welding of transparent materials by a localized heat accumulation effect using a femtosecond fiber laser at 1558 nm,” Opt. Express 14(22), 10460–10468 (2006).
[Crossref] [PubMed]

W. Watanabe, S. Onda, T. Tamaki, K. Itoh, and J. Nishii, “Space-selective laser joining of dissimilar transparent materials using femtosecond laser pulses,” Appl. Phys. Lett. 89(2), 021106 (2006).
[Crossref]

2005 (2)

A. W. Y. Tan and F. E. H. Tay, “Localized laser assisted eutectic bonding of quartz and silicon by Nd:YAG pulsed-laser,” Sens. Actuators A Phys. 120(2), 550–561 (2005).
[Crossref]

T. Tamaki, W. Watanabe, J. Nishii, and K. Itoh, “Welding of Transparent Materials Using Femtosecond Laser Pulses,” Jpn. J. Appl. Phys. 44(22), L687–L689 (2005).
[Crossref]

2004 (1)

Y. Dong and P. Molian, “Coulomb explosion-induced formation of highly oriented nanoparticles on thin films of 3C–SiC by the femtosecond pulsed laser,” Appl. Phys. Lett. 84(1), 10–12 (2004).
[Crossref]

2003 (1)

P. Lorazo, L. J. Lewis, and M. Meunier, “Short-Pulse Laser Ablation of Solids: from Phase Explosion to Fragmentation,” Phys. Rev. Lett. 91(22), 225502 (2003).
[Crossref] [PubMed]

2002 (1)

S. K. Sundaram and E. Mazur, “Inducing and probing non-thermal transitions in semiconductors using femtosecond laser pulses,” Nat. Mater. 1(4), 217–224 (2002).
[Crossref] [PubMed]

1999 (1)

A.-C. Tien, S. Backus, H. Kapteyn, M. Murnane, and G. Mourou, “Short-Pulse Laser Damage in Transparent Materials as a Function of Pulse Duration,” Phys. Rev. Lett. 82(19), 3883–3886 (1999).
[Crossref]

1998 (1)

K. Sokolowski-Tinten, J. Bialkowski, A. Cavalleri, D. von der Linde, A. Oparin, J. Meyer-ter-Vehn, and S. I. Anisimov, “Transient States of Matter during Short Pulse Laser Ablation,” Phys. Rev. Lett. 81(1), 224–227 (1998).
[Crossref]

1996 (1)

B. C. Stuart, M. D. Feit, S. Herman, A. M. Rubenchik, B. W. Shore, and M. D. Perry, “Nanosecond-to-femtosecond laser-induced breakdown in dielectrics,” Phys. Rev. B Condens. Matter 53(4), 1749–1761 (1996).
[Crossref] [PubMed]

Amberla, T.

Anisimov, S. I.

K. Sokolowski-Tinten, J. Bialkowski, A. Cavalleri, D. von der Linde, A. Oparin, J. Meyer-ter-Vehn, and S. I. Anisimov, “Transient States of Matter during Short Pulse Laser Ablation,” Phys. Rev. Lett. 81(1), 224–227 (1998).
[Crossref]

Backus, S.

A.-C. Tien, S. Backus, H. Kapteyn, M. Murnane, and G. Mourou, “Short-Pulse Laser Damage in Transparent Materials as a Function of Pulse Duration,” Phys. Rev. Lett. 82(19), 3883–3886 (1999).
[Crossref]

Bégin, M.

Bialkowski, J.

K. Sokolowski-Tinten, J. Bialkowski, A. Cavalleri, D. von der Linde, A. Oparin, J. Meyer-ter-Vehn, and S. I. Anisimov, “Transient States of Matter during Short Pulse Laser Ablation,” Phys. Rev. Lett. 81(1), 224–227 (1998).
[Crossref]

Buividas, R.

M. Malinauskas, A. Zukauskas, S. Hasegawa, Y. Hayasaki, V. Mizeikis, R. Buividas, and S. Juodkazis, “Ultrafast laser processing of materials: from science to industry,” Light Sci. Appl. 5(8), e16133 (2016).
[Crossref]

Carter, R. M.

Cavalleri, A.

K. Sokolowski-Tinten, J. Bialkowski, A. Cavalleri, D. von der Linde, A. Oparin, J. Meyer-ter-Vehn, and S. I. Anisimov, “Transient States of Matter during Short Pulse Laser Ablation,” Phys. Rev. Lett. 81(1), 224–227 (1998).
[Crossref]

Chen, J.

Cheng, G.

Cheng, Y.

K. Sugioka and Y. Cheng, “Ultrafast lasers[mdash]reliable tools for advanced materials processing,” Light Sci. Appl. 3(4), e149 (2014).
[Crossref]

Chimier, B.

B. Chimier, O. Utéza, N. Sanner, M. Sentis, T. Itina, P. Lassonde, F. Légaré, F. Vidal, and J. C. Kieffer, “Damage and ablation thresholds of fused-silica in femtosecond regime,” Phys. Rev. B 84(9), 094104 (2011).
[Crossref]

Cvecek, K.

K. Cvecek, R. Odato, S. Dehmel, I. Miyamoto, and M. Schmidt, “Gap bridging in joining of glass using ultra short laser pulses,” Opt. Express 23(5), 5681–5693 (2015).
[Crossref] [PubMed]

I. Miyamoto, K. Cvecek, Y. Okamoto, and M. Schmidt, “Internal modification of glass by ultrashort laser pulse and its application to microwelding,” Appl. Phys., A Mater. Sci. Process. 114(1), 187–208 (2014).
[Crossref]

Dehmel, S.

Dong, Y.

Y. Dong and P. Molian, “Coulomb explosion-induced formation of highly oriented nanoparticles on thin films of 3C–SiC by the femtosecond pulsed laser,” Appl. Phys. Lett. 84(1), 10–12 (2004).
[Crossref]

Döring, S.

S. Richter, S. Döring, A. Tünnermann, and S. Nolte, “Bonding of glass with femtosecond laser pulses at high repetition rates,” Appl. Phys., A Mater. Sci. Process. 103(2), 257–261 (2011).
[Crossref]

Feit, M. D.

B. C. Stuart, M. D. Feit, S. Herman, A. M. Rubenchik, B. W. Shore, and M. D. Perry, “Nanosecond-to-femtosecond laser-induced breakdown in dielectrics,” Phys. Rev. B Condens. Matter 53(4), 1749–1761 (1996).
[Crossref] [PubMed]

Gattass, R. R.

R. R. Gattass and E. Mazur, “Femtosecond laser micromachining in transparent materials,” Nat. Photonics 2(4), 219–225 (2008).
[Crossref]

Guo, C.

A. Y. Vorobyev and C. Guo, “Direct femtosecond laser surface nano/microstructuring and its applications,” Laser Photonics Rev. 7(3), 385–407 (2013).
[Crossref]

Hand, D. P.

Hansen, A.

Hasegawa, S.

M. Malinauskas, A. Zukauskas, S. Hasegawa, Y. Hayasaki, V. Mizeikis, R. Buividas, and S. Juodkazis, “Ultrafast laser processing of materials: from science to industry,” Light Sci. Appl. 5(8), e16133 (2016).
[Crossref]

Hayasaki, Y.

M. Malinauskas, A. Zukauskas, S. Hasegawa, Y. Hayasaki, V. Mizeikis, R. Buividas, and S. Juodkazis, “Ultrafast laser processing of materials: from science to industry,” Light Sci. Appl. 5(8), e16133 (2016).
[Crossref]

Hélie, D.

D. Hélie, F. Lacroix, and R. Vallée, “Bonding of optical materials by femtosecond laser welding for aerospace and high power laser applications,” Proc. SPIE 8412, 841210 (2012).
[Crossref]

D. Hélie, M. Bégin, F. Lacroix, and R. Vallée, “Reinforced direct bonding of optical materials by femtosecond laser welding,” Appl. Opt. 51(12), 2098–2106 (2012).
[Crossref] [PubMed]

F. Lacroix, D. Hélie, and R. Vallée, “Optical bonding reinforced by femtosecond laser welding,” Proc. SPIE 8126, 812612 (2011).
[Crossref]

Herman, S.

B. C. Stuart, M. D. Feit, S. Herman, A. M. Rubenchik, B. W. Shore, and M. D. Perry, “Nanosecond-to-femtosecond laser-induced breakdown in dielectrics,” Phys. Rev. B Condens. Matter 53(4), 1749–1761 (1996).
[Crossref] [PubMed]

Hirose, A.

Y. Ozeki, T. Inoue, T. Tamaki, H. Yamaguchi, S. Onda, W. Watanabe, T. Sano, S. Nishiuchi, A. Hirose, and K. Itoh, “Direct Welding between Copper and Glass Substrates with Femtosecond Laser Pulses,” Appl. Phys. Express 1, 082601 (2008).
[Crossref]

Iida, M.

Inoue, T.

Y. Ozeki, T. Inoue, T. Tamaki, H. Yamaguchi, S. Onda, W. Watanabe, T. Sano, S. Nishiuchi, A. Hirose, and K. Itoh, “Direct Welding between Copper and Glass Substrates with Femtosecond Laser Pulses,” Appl. Phys. Express 1, 082601 (2008).
[Crossref]

Itina, T.

B. Chimier, O. Utéza, N. Sanner, M. Sentis, T. Itina, P. Lassonde, F. Légaré, F. Vidal, and J. C. Kieffer, “Damage and ablation thresholds of fused-silica in femtosecond regime,” Phys. Rev. B 84(9), 094104 (2011).
[Crossref]

Itoh, K.

Y. Ozeki, T. Inoue, T. Tamaki, H. Yamaguchi, S. Onda, W. Watanabe, T. Sano, S. Nishiuchi, A. Hirose, and K. Itoh, “Direct Welding between Copper and Glass Substrates with Femtosecond Laser Pulses,” Appl. Phys. Express 1, 082601 (2008).
[Crossref]

W. Watanabe, S. Onda, T. Tamaki, K. Itoh, and J. Nishii, “Space-selective laser joining of dissimilar transparent materials using femtosecond laser pulses,” Appl. Phys. Lett. 89(2), 021106 (2006).
[Crossref]

T. Tamaki, W. Watanabe, and K. Itoh, “Laser micro-welding of transparent materials by a localized heat accumulation effect using a femtosecond fiber laser at 1558 nm,” Opt. Express 14(22), 10460–10468 (2006).
[Crossref] [PubMed]

T. Tamaki, W. Watanabe, J. Nishii, and K. Itoh, “Welding of Transparent Materials Using Femtosecond Laser Pulses,” Jpn. J. Appl. Phys. 44(22), L687–L689 (2005).
[Crossref]

Iwamoto, C.

C. Iwamoto, “Microstructure of Aluminum/Glass Joint Bonded by Ultrasonic Wire Welding,” Metall. Mater. Trans., A Phys. Metall. Mater. Sci. 45(3), 1371–1375 (2014).
[Crossref]

Juodkazis, S.

M. Malinauskas, A. Zukauskas, S. Hasegawa, Y. Hayasaki, V. Mizeikis, R. Buividas, and S. Juodkazis, “Ultrafast laser processing of materials: from science to industry,” Light Sci. Appl. 5(8), e16133 (2016).
[Crossref]

Kangastupa, J.

Kapteyn, H.

A.-C. Tien, S. Backus, H. Kapteyn, M. Murnane, and G. Mourou, “Short-Pulse Laser Damage in Transparent Materials as a Function of Pulse Duration,” Phys. Rev. Lett. 82(19), 3883–3886 (1999).
[Crossref]

Kieffer, J. C.

B. Chimier, O. Utéza, N. Sanner, M. Sentis, T. Itina, P. Lassonde, F. Légaré, F. Vidal, and J. C. Kieffer, “Damage and ablation thresholds of fused-silica in femtosecond regime,” Phys. Rev. B 84(9), 094104 (2011).
[Crossref]

Lacroix, F.

D. Hélie, F. Lacroix, and R. Vallée, “Bonding of optical materials by femtosecond laser welding for aerospace and high power laser applications,” Proc. SPIE 8412, 841210 (2012).
[Crossref]

D. Hélie, M. Bégin, F. Lacroix, and R. Vallée, “Reinforced direct bonding of optical materials by femtosecond laser welding,” Appl. Opt. 51(12), 2098–2106 (2012).
[Crossref] [PubMed]

F. Lacroix, D. Hélie, and R. Vallée, “Optical bonding reinforced by femtosecond laser welding,” Proc. SPIE 8126, 812612 (2011).
[Crossref]

Lassonde, P.

B. Chimier, O. Utéza, N. Sanner, M. Sentis, T. Itina, P. Lassonde, F. Légaré, F. Vidal, and J. C. Kieffer, “Damage and ablation thresholds of fused-silica in femtosecond regime,” Phys. Rev. B 84(9), 094104 (2011).
[Crossref]

Légaré, F.

B. Chimier, O. Utéza, N. Sanner, M. Sentis, T. Itina, P. Lassonde, F. Légaré, F. Vidal, and J. C. Kieffer, “Damage and ablation thresholds of fused-silica in femtosecond regime,” Phys. Rev. B 84(9), 094104 (2011).
[Crossref]

Lewis, L. J.

P. Lorazo, L. J. Lewis, and M. Meunier, “Short-Pulse Laser Ablation of Solids: from Phase Explosion to Fragmentation,” Phys. Rev. Lett. 91(22), 225502 (2003).
[Crossref] [PubMed]

Lorazo, P.

P. Lorazo, L. J. Lewis, and M. Meunier, “Short-Pulse Laser Ablation of Solids: from Phase Explosion to Fragmentation,” Phys. Rev. Lett. 91(22), 225502 (2003).
[Crossref] [PubMed]

Makimura, T.

Malinauskas, M.

M. Malinauskas, A. Zukauskas, S. Hasegawa, Y. Hayasaki, V. Mizeikis, R. Buividas, and S. Juodkazis, “Ultrafast laser processing of materials: from science to industry,” Light Sci. Appl. 5(8), e16133 (2016).
[Crossref]

Mazur, E.

R. R. Gattass and E. Mazur, “Femtosecond laser micromachining in transparent materials,” Nat. Photonics 2(4), 219–225 (2008).
[Crossref]

S. K. Sundaram and E. Mazur, “Inducing and probing non-thermal transitions in semiconductors using femtosecond laser pulses,” Nat. Mater. 1(4), 217–224 (2002).
[Crossref] [PubMed]

Meunier, M.

P. Lorazo, L. J. Lewis, and M. Meunier, “Short-Pulse Laser Ablation of Solids: from Phase Explosion to Fragmentation,” Phys. Rev. Lett. 91(22), 225502 (2003).
[Crossref] [PubMed]

Meyer-ter-Vehn, J.

K. Sokolowski-Tinten, J. Bialkowski, A. Cavalleri, D. von der Linde, A. Oparin, J. Meyer-ter-Vehn, and S. I. Anisimov, “Transient States of Matter during Short Pulse Laser Ablation,” Phys. Rev. Lett. 81(1), 224–227 (1998).
[Crossref]

Micorikawa, K.

Midorikawa, K.

Miyamoto, I.

Mizeikis, V.

M. Malinauskas, A. Zukauskas, S. Hasegawa, Y. Hayasaki, V. Mizeikis, R. Buividas, and S. Juodkazis, “Ultrafast laser processing of materials: from science to industry,” Light Sci. Appl. 5(8), e16133 (2016).
[Crossref]

Molian, P.

Y. Dong and P. Molian, “Coulomb explosion-induced formation of highly oriented nanoparticles on thin films of 3C–SiC by the femtosecond pulsed laser,” Appl. Phys. Lett. 84(1), 10–12 (2004).
[Crossref]

Mourou, G.

A.-C. Tien, S. Backus, H. Kapteyn, M. Murnane, and G. Mourou, “Short-Pulse Laser Damage in Transparent Materials as a Function of Pulse Duration,” Phys. Rev. Lett. 82(19), 3883–3886 (1999).
[Crossref]

Murnane, M.

A.-C. Tien, S. Backus, H. Kapteyn, M. Murnane, and G. Mourou, “Short-Pulse Laser Damage in Transparent Materials as a Function of Pulse Duration,” Phys. Rev. Lett. 82(19), 3883–3886 (1999).
[Crossref]

Nishii, J.

W. Watanabe, S. Onda, T. Tamaki, K. Itoh, and J. Nishii, “Space-selective laser joining of dissimilar transparent materials using femtosecond laser pulses,” Appl. Phys. Lett. 89(2), 021106 (2006).
[Crossref]

T. Tamaki, W. Watanabe, J. Nishii, and K. Itoh, “Welding of Transparent Materials Using Femtosecond Laser Pulses,” Jpn. J. Appl. Phys. 44(22), L687–L689 (2005).
[Crossref]

Nishiuchi, S.

Y. Ozeki, T. Inoue, T. Tamaki, H. Yamaguchi, S. Onda, W. Watanabe, T. Sano, S. Nishiuchi, A. Hirose, and K. Itoh, “Direct Welding between Copper and Glass Substrates with Femtosecond Laser Pulses,” Appl. Phys. Express 1, 082601 (2008).
[Crossref]

Nolte, S.

S. Richter, S. Döring, A. Tünnermann, and S. Nolte, “Bonding of glass with femtosecond laser pulses at high repetition rates,” Appl. Phys., A Mater. Sci. Process. 103(2), 257–261 (2011).
[Crossref]

Odato, R.

Okamoto, Y.

I. Miyamoto, Y. Okamoto, A. Hansen, J. Vihinen, T. Amberla, and J. Kangastupa, “High speed, high strength microwelding of Si/glass using ps-laser pulses,” Opt. Express 23(3), 3427–3439 (2015).
[Crossref] [PubMed]

I. Miyamoto, K. Cvecek, Y. Okamoto, and M. Schmidt, “Internal modification of glass by ultrashort laser pulse and its application to microwelding,” Appl. Phys., A Mater. Sci. Process. 114(1), 187–208 (2014).
[Crossref]

Onda, S.

Y. Ozeki, T. Inoue, T. Tamaki, H. Yamaguchi, S. Onda, W. Watanabe, T. Sano, S. Nishiuchi, A. Hirose, and K. Itoh, “Direct Welding between Copper and Glass Substrates with Femtosecond Laser Pulses,” Appl. Phys. Express 1, 082601 (2008).
[Crossref]

W. Watanabe, S. Onda, T. Tamaki, K. Itoh, and J. Nishii, “Space-selective laser joining of dissimilar transparent materials using femtosecond laser pulses,” Appl. Phys. Lett. 89(2), 021106 (2006).
[Crossref]

Oparin, A.

K. Sokolowski-Tinten, J. Bialkowski, A. Cavalleri, D. von der Linde, A. Oparin, J. Meyer-ter-Vehn, and S. I. Anisimov, “Transient States of Matter during Short Pulse Laser Ablation,” Phys. Rev. Lett. 81(1), 224–227 (1998).
[Crossref]

Ozeki, Y.

Y. Ozeki, T. Inoue, T. Tamaki, H. Yamaguchi, S. Onda, W. Watanabe, T. Sano, S. Nishiuchi, A. Hirose, and K. Itoh, “Direct Welding between Copper and Glass Substrates with Femtosecond Laser Pulses,” Appl. Phys. Express 1, 082601 (2008).
[Crossref]

Perry, M. D.

B. C. Stuart, M. D. Feit, S. Herman, A. M. Rubenchik, B. W. Shore, and M. D. Perry, “Nanosecond-to-femtosecond laser-induced breakdown in dielectrics,” Phys. Rev. B Condens. Matter 53(4), 1749–1761 (1996).
[Crossref] [PubMed]

Richter, S.

S. Richter, S. Döring, A. Tünnermann, and S. Nolte, “Bonding of glass with femtosecond laser pulses at high repetition rates,” Appl. Phys., A Mater. Sci. Process. 103(2), 257–261 (2011).
[Crossref]

Rubenchik, A. M.

B. C. Stuart, M. D. Feit, S. Herman, A. M. Rubenchik, B. W. Shore, and M. D. Perry, “Nanosecond-to-femtosecond laser-induced breakdown in dielectrics,” Phys. Rev. B Condens. Matter 53(4), 1749–1761 (1996).
[Crossref] [PubMed]

Sanner, N.

B. Chimier, O. Utéza, N. Sanner, M. Sentis, T. Itina, P. Lassonde, F. Légaré, F. Vidal, and J. C. Kieffer, “Damage and ablation thresholds of fused-silica in femtosecond regime,” Phys. Rev. B 84(9), 094104 (2011).
[Crossref]

Sano, T.

Y. Ozeki, T. Inoue, T. Tamaki, H. Yamaguchi, S. Onda, W. Watanabe, T. Sano, S. Nishiuchi, A. Hirose, and K. Itoh, “Direct Welding between Copper and Glass Substrates with Femtosecond Laser Pulses,” Appl. Phys. Express 1, 082601 (2008).
[Crossref]

Schmidt, M.

K. Cvecek, R. Odato, S. Dehmel, I. Miyamoto, and M. Schmidt, “Gap bridging in joining of glass using ultra short laser pulses,” Opt. Express 23(5), 5681–5693 (2015).
[Crossref] [PubMed]

I. Miyamoto, K. Cvecek, Y. Okamoto, and M. Schmidt, “Internal modification of glass by ultrashort laser pulse and its application to microwelding,” Appl. Phys., A Mater. Sci. Process. 114(1), 187–208 (2014).
[Crossref]

Sentis, M.

B. Chimier, O. Utéza, N. Sanner, M. Sentis, T. Itina, P. Lassonde, F. Légaré, F. Vidal, and J. C. Kieffer, “Damage and ablation thresholds of fused-silica in femtosecond regime,” Phys. Rev. B 84(9), 094104 (2011).
[Crossref]

Shephard, J. D.

Shore, B. W.

B. C. Stuart, M. D. Feit, S. Herman, A. M. Rubenchik, B. W. Shore, and M. D. Perry, “Nanosecond-to-femtosecond laser-induced breakdown in dielectrics,” Phys. Rev. B Condens. Matter 53(4), 1749–1761 (1996).
[Crossref] [PubMed]

Sokolowski-Tinten, K.

K. Sokolowski-Tinten, J. Bialkowski, A. Cavalleri, D. von der Linde, A. Oparin, J. Meyer-ter-Vehn, and S. I. Anisimov, “Transient States of Matter during Short Pulse Laser Ablation,” Phys. Rev. Lett. 81(1), 224–227 (1998).
[Crossref]

Stuart, B. C.

B. C. Stuart, M. D. Feit, S. Herman, A. M. Rubenchik, B. W. Shore, and M. D. Perry, “Nanosecond-to-femtosecond laser-induced breakdown in dielectrics,” Phys. Rev. B Condens. Matter 53(4), 1749–1761 (1996).
[Crossref] [PubMed]

Sugioka, K.

Sundaram, S. K.

S. K. Sundaram and E. Mazur, “Inducing and probing non-thermal transitions in semiconductors using femtosecond laser pulses,” Nat. Mater. 1(4), 217–224 (2002).
[Crossref] [PubMed]

Takai, H.

Tamaki, T.

Y. Ozeki, T. Inoue, T. Tamaki, H. Yamaguchi, S. Onda, W. Watanabe, T. Sano, S. Nishiuchi, A. Hirose, and K. Itoh, “Direct Welding between Copper and Glass Substrates with Femtosecond Laser Pulses,” Appl. Phys. Express 1, 082601 (2008).
[Crossref]

T. Tamaki, W. Watanabe, and K. Itoh, “Laser micro-welding of transparent materials by a localized heat accumulation effect using a femtosecond fiber laser at 1558 nm,” Opt. Express 14(22), 10460–10468 (2006).
[Crossref] [PubMed]

W. Watanabe, S. Onda, T. Tamaki, K. Itoh, and J. Nishii, “Space-selective laser joining of dissimilar transparent materials using femtosecond laser pulses,” Appl. Phys. Lett. 89(2), 021106 (2006).
[Crossref]

T. Tamaki, W. Watanabe, J. Nishii, and K. Itoh, “Welding of Transparent Materials Using Femtosecond Laser Pulses,” Jpn. J. Appl. Phys. 44(22), L687–L689 (2005).
[Crossref]

Tan, A. W. Y.

A. W. Y. Tan and F. E. H. Tay, “Localized laser assisted eutectic bonding of quartz and silicon by Nd:YAG pulsed-laser,” Sens. Actuators A Phys. 120(2), 550–561 (2005).
[Crossref]

Tay, F. E. H.

A. W. Y. Tan and F. E. H. Tay, “Localized laser assisted eutectic bonding of quartz and silicon by Nd:YAG pulsed-laser,” Sens. Actuators A Phys. 120(2), 550–561 (2005).
[Crossref]

Thomson, R. R.

Tien, A.-C.

A.-C. Tien, S. Backus, H. Kapteyn, M. Murnane, and G. Mourou, “Short-Pulse Laser Damage in Transparent Materials as a Function of Pulse Duration,” Phys. Rev. Lett. 82(19), 3883–3886 (1999).
[Crossref]

Tünnermann, A.

S. Richter, S. Döring, A. Tünnermann, and S. Nolte, “Bonding of glass with femtosecond laser pulses at high repetition rates,” Appl. Phys., A Mater. Sci. Process. 103(2), 257–261 (2011).
[Crossref]

Utéza, O.

B. Chimier, O. Utéza, N. Sanner, M. Sentis, T. Itina, P. Lassonde, F. Légaré, F. Vidal, and J. C. Kieffer, “Damage and ablation thresholds of fused-silica in femtosecond regime,” Phys. Rev. B 84(9), 094104 (2011).
[Crossref]

Vallée, R.

D. Hélie, M. Bégin, F. Lacroix, and R. Vallée, “Reinforced direct bonding of optical materials by femtosecond laser welding,” Appl. Opt. 51(12), 2098–2106 (2012).
[Crossref] [PubMed]

D. Hélie, F. Lacroix, and R. Vallée, “Bonding of optical materials by femtosecond laser welding for aerospace and high power laser applications,” Proc. SPIE 8412, 841210 (2012).
[Crossref]

F. Lacroix, D. Hélie, and R. Vallée, “Optical bonding reinforced by femtosecond laser welding,” Proc. SPIE 8126, 812612 (2011).
[Crossref]

Vidal, F.

B. Chimier, O. Utéza, N. Sanner, M. Sentis, T. Itina, P. Lassonde, F. Légaré, F. Vidal, and J. C. Kieffer, “Damage and ablation thresholds of fused-silica in femtosecond regime,” Phys. Rev. B 84(9), 094104 (2011).
[Crossref]

Vihinen, J.

von der Linde, D.

K. Sokolowski-Tinten, J. Bialkowski, A. Cavalleri, D. von der Linde, A. Oparin, J. Meyer-ter-Vehn, and S. I. Anisimov, “Transient States of Matter during Short Pulse Laser Ablation,” Phys. Rev. Lett. 81(1), 224–227 (1998).
[Crossref]

Vorobyev, A. Y.

A. Y. Vorobyev and C. Guo, “Direct femtosecond laser surface nano/microstructuring and its applications,” Laser Photonics Rev. 7(3), 385–407 (2013).
[Crossref]

Wang, H.

Watanabe, W.

Y. Ozeki, T. Inoue, T. Tamaki, H. Yamaguchi, S. Onda, W. Watanabe, T. Sano, S. Nishiuchi, A. Hirose, and K. Itoh, “Direct Welding between Copper and Glass Substrates with Femtosecond Laser Pulses,” Appl. Phys. Express 1, 082601 (2008).
[Crossref]

T. Tamaki, W. Watanabe, and K. Itoh, “Laser micro-welding of transparent materials by a localized heat accumulation effect using a femtosecond fiber laser at 1558 nm,” Opt. Express 14(22), 10460–10468 (2006).
[Crossref] [PubMed]

W. Watanabe, S. Onda, T. Tamaki, K. Itoh, and J. Nishii, “Space-selective laser joining of dissimilar transparent materials using femtosecond laser pulses,” Appl. Phys. Lett. 89(2), 021106 (2006).
[Crossref]

T. Tamaki, W. Watanabe, J. Nishii, and K. Itoh, “Welding of Transparent Materials Using Femtosecond Laser Pulses,” Jpn. J. Appl. Phys. 44(22), L687–L689 (2005).
[Crossref]

Wu, D.

Wu, S.

Xu, J.

Yamaguchi, H.

Y. Ozeki, T. Inoue, T. Tamaki, H. Yamaguchi, S. Onda, W. Watanabe, T. Sano, S. Nishiuchi, A. Hirose, and K. Itoh, “Direct Welding between Copper and Glass Substrates with Femtosecond Laser Pulses,” Appl. Phys. Express 1, 082601 (2008).
[Crossref]

Zhang, G.

Zukauskas, A.

M. Malinauskas, A. Zukauskas, S. Hasegawa, Y. Hayasaki, V. Mizeikis, R. Buividas, and S. Juodkazis, “Ultrafast laser processing of materials: from science to industry,” Light Sci. Appl. 5(8), e16133 (2016).
[Crossref]

Appl. Opt. (3)

Appl. Phys. Express (1)

Y. Ozeki, T. Inoue, T. Tamaki, H. Yamaguchi, S. Onda, W. Watanabe, T. Sano, S. Nishiuchi, A. Hirose, and K. Itoh, “Direct Welding between Copper and Glass Substrates with Femtosecond Laser Pulses,” Appl. Phys. Express 1, 082601 (2008).
[Crossref]

Appl. Phys. Lett. (2)

W. Watanabe, S. Onda, T. Tamaki, K. Itoh, and J. Nishii, “Space-selective laser joining of dissimilar transparent materials using femtosecond laser pulses,” Appl. Phys. Lett. 89(2), 021106 (2006).
[Crossref]

Y. Dong and P. Molian, “Coulomb explosion-induced formation of highly oriented nanoparticles on thin films of 3C–SiC by the femtosecond pulsed laser,” Appl. Phys. Lett. 84(1), 10–12 (2004).
[Crossref]

Appl. Phys., A Mater. Sci. Process. (2)

S. Richter, S. Döring, A. Tünnermann, and S. Nolte, “Bonding of glass with femtosecond laser pulses at high repetition rates,” Appl. Phys., A Mater. Sci. Process. 103(2), 257–261 (2011).
[Crossref]

I. Miyamoto, K. Cvecek, Y. Okamoto, and M. Schmidt, “Internal modification of glass by ultrashort laser pulse and its application to microwelding,” Appl. Phys., A Mater. Sci. Process. 114(1), 187–208 (2014).
[Crossref]

Jpn. J. Appl. Phys. (1)

T. Tamaki, W. Watanabe, J. Nishii, and K. Itoh, “Welding of Transparent Materials Using Femtosecond Laser Pulses,” Jpn. J. Appl. Phys. 44(22), L687–L689 (2005).
[Crossref]

Laser Photonics Rev. (1)

A. Y. Vorobyev and C. Guo, “Direct femtosecond laser surface nano/microstructuring and its applications,” Laser Photonics Rev. 7(3), 385–407 (2013).
[Crossref]

Light Sci. Appl. (2)

K. Sugioka and Y. Cheng, “Ultrafast lasers[mdash]reliable tools for advanced materials processing,” Light Sci. Appl. 3(4), e149 (2014).
[Crossref]

M. Malinauskas, A. Zukauskas, S. Hasegawa, Y. Hayasaki, V. Mizeikis, R. Buividas, and S. Juodkazis, “Ultrafast laser processing of materials: from science to industry,” Light Sci. Appl. 5(8), e16133 (2016).
[Crossref]

Metall. Mater. Trans., A Phys. Metall. Mater. Sci. (1)

C. Iwamoto, “Microstructure of Aluminum/Glass Joint Bonded by Ultrasonic Wire Welding,” Metall. Mater. Trans., A Phys. Metall. Mater. Sci. 45(3), 1371–1375 (2014).
[Crossref]

Nat. Mater. (1)

S. K. Sundaram and E. Mazur, “Inducing and probing non-thermal transitions in semiconductors using femtosecond laser pulses,” Nat. Mater. 1(4), 217–224 (2002).
[Crossref] [PubMed]

Nat. Photonics (1)

R. R. Gattass and E. Mazur, “Femtosecond laser micromachining in transparent materials,” Nat. Photonics 2(4), 219–225 (2008).
[Crossref]

Opt. Express (5)

Opt. Lett. (1)

Phys. Rev. B (1)

B. Chimier, O. Utéza, N. Sanner, M. Sentis, T. Itina, P. Lassonde, F. Légaré, F. Vidal, and J. C. Kieffer, “Damage and ablation thresholds of fused-silica in femtosecond regime,” Phys. Rev. B 84(9), 094104 (2011).
[Crossref]

Phys. Rev. B Condens. Matter (1)

B. C. Stuart, M. D. Feit, S. Herman, A. M. Rubenchik, B. W. Shore, and M. D. Perry, “Nanosecond-to-femtosecond laser-induced breakdown in dielectrics,” Phys. Rev. B Condens. Matter 53(4), 1749–1761 (1996).
[Crossref] [PubMed]

Phys. Rev. Lett. (3)

A.-C. Tien, S. Backus, H. Kapteyn, M. Murnane, and G. Mourou, “Short-Pulse Laser Damage in Transparent Materials as a Function of Pulse Duration,” Phys. Rev. Lett. 82(19), 3883–3886 (1999).
[Crossref]

P. Lorazo, L. J. Lewis, and M. Meunier, “Short-Pulse Laser Ablation of Solids: from Phase Explosion to Fragmentation,” Phys. Rev. Lett. 91(22), 225502 (2003).
[Crossref] [PubMed]

K. Sokolowski-Tinten, J. Bialkowski, A. Cavalleri, D. von der Linde, A. Oparin, J. Meyer-ter-Vehn, and S. I. Anisimov, “Transient States of Matter during Short Pulse Laser Ablation,” Phys. Rev. Lett. 81(1), 224–227 (1998).
[Crossref]

Proc. SPIE (2)

F. Lacroix, D. Hélie, and R. Vallée, “Optical bonding reinforced by femtosecond laser welding,” Proc. SPIE 8126, 812612 (2011).
[Crossref]

D. Hélie, F. Lacroix, and R. Vallée, “Bonding of optical materials by femtosecond laser welding for aerospace and high power laser applications,” Proc. SPIE 8412, 841210 (2012).
[Crossref]

Sens. Actuators A Phys. (1)

A. W. Y. Tan and F. E. H. Tay, “Localized laser assisted eutectic bonding of quartz and silicon by Nd:YAG pulsed-laser,” Sens. Actuators A Phys. 120(2), 550–561 (2005).
[Crossref]

Other (1)

M. E. Levinshtein, S. L. Rumyantsev, and M. S. Shur, Properties of Advanced Semiconductor Materials: GaN, AIN, InN, BN, SiC, SiGe (John Wiley & Sons, 2001).

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Figures (6)

Fig. 1
Fig. 1

Illustration of the experimental setup for laser welding.

Fig. 2
Fig. 2

(a) Fused silica and SiC with optical contact are directly welded together by 50-kHz, 240-fs, 800-nm laser pulses. (b) Image of the welding lines.

Fig. 3
Fig. 3

Surface morphology of the sample after post-joining separation: (a) SiC surface, (b) large vision of welding line. Energy dispersive spectrometry analysis: (c) chemical composition in region 1, (d) chemical composition in region 2.

Fig. 4
Fig. 4

(a) Morphology and (b) chemical elements analysis of the cross section of welding line irradiated at pulse energy of 1.0 μJ and speed of 0.5 mm/s.

Fig. 5
Fig. 5

Dependence of (a) shear joining strength and (b) welding line width on pulse energy, (c) relationship between interval and shear joining strength.

Fig. 6
Fig. 6

SEM images of the samples after post-joining separation: (a) SiC surface with non-optical contact, (b) larger version of region 1, (c) larger version of region 2, (d) SiC surface with optical contact.

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