Abstract

We present the first III-V opto-electronic components transfer printed on and coupled to a silicon photonic integrated circuit. Thin InP-based membranes are transferred to an SOI waveguide circuit, after which a single-spatial-mode broadband light source is fabricated. The process flow to create transfer print-ready coupons is discussed. Aqueous FeCl3 at 5°C was found to be the best release agent in combination with the photoresist anchoring structures that were used. A thin DVS-BCB layer provides a strong bond, accommodating the post-processing of the membranes. The resulting optically pumped LED has a 3 dB bandwidth of 130 nm, comparable to devices realized using a traditional die-to-wafer bonding method.

© 2016 Optical Society of America

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  1. G. Roelkens, A. Abbasi, P. Cardile, U. Dave, A. De Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. Van Gasse, J. Verbist, R. Wang, Z. Wang, J. Van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. Van Thourhout, “III-V-on-silicon photonic devices for optical communication and sensing,” IEEE Photon. J. 2(3), 969–1004 (2015).
  2. G. Roelkens, L. Liu, D. Liang, R. Jones, A. Fang, B. Koch, and J. Bowers, “III-V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photon. Rev. 4, 751–779 (2010).
    [Crossref]
  3. E. Menard, K. Lee, D.-Y. Khang, R. Nuzzo, and J. Rogers, “A printable form of silicon for high performance thin film transistors on plastic substrates,” Appl. Phys. Lett. 84, 5398–5400 (2004).
    [Crossref]
  4. H. Yang, D. Zhao, S. Chuwongin, J.-H. Seo, W. Yang, Y. Shuai, J. Berggren, M. Hammar, Z. Ma, and W. Zhou, “Transfer-printed stacked nanomembrane lasers on silicon,” Nature Photon. 6, 615–620 (2012).
    [Crossref]
  5. A. Trindade, B. Guilhabert, D. Massoubre, D. Zhu, N. Laurand, E. Gu, I. Watson, C. J. Humphreys, and M. Dawson, “Nanoscale-accuracy transfer printing of ultra-thin AlInGaN light-emitting diodes onto mechanically flexible substrates,” Appl. Phys. Lett. 103, 253302 (2013).
    [Crossref]
  6. J. Justice, C. Bower, M. Meitl, M. B. Mooney, M. A. Gubbins, and B. Corbett, “Wafer-scale integration of group III-V lasers on silicon using transfer printing of epitaxial layers,” Nature Photon. 6, 610–614 (2012).
    [Crossref]
  7. M. Meitl, Z. Zhu, V. Kumar, K. Lee, X. Feng, Y. Huang, I. Adesida, R. Nuzzo, and J. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nature Mater. 5(1), 33–38 (2006).
    [Crossref]
  8. A. De Groote, J. Peters, M. Davenport, M. Heck, R. Baets, G. Roelkens, and J. Bowers, “Heterogeneously integrated III-V-on-silicon multibandgap superluminescent light-emitting diode with 290 nm optical bandwidth,” Opt. Lett. 39, 4784–4787 (2014).
    [Crossref] [PubMed]
  9. C. Bower, D. Gomez, K. Lucht, B. Cox, and D. Kneeburg, “Transfer-printed integrated circuits for display back-planes,” in Proceedings of International Display Workshop, (SID, 2010), pp. 1203–1206.
  10. A. De Groote, P. Cardile, A. Subramanian, M. Tassaert, D. Delbeke, R. Baets, and G. Roelkens, “A waveguide coupled LED on SOI by heterogeneous integration of InP-based membranes,” in Proceeding of the 12th International Conference on Group IV Photonics, (IEEE, 2015), pp. 31–32.

2015 (1)

G. Roelkens, A. Abbasi, P. Cardile, U. Dave, A. De Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. Van Gasse, J. Verbist, R. Wang, Z. Wang, J. Van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. Van Thourhout, “III-V-on-silicon photonic devices for optical communication and sensing,” IEEE Photon. J. 2(3), 969–1004 (2015).

2014 (1)

2013 (1)

A. Trindade, B. Guilhabert, D. Massoubre, D. Zhu, N. Laurand, E. Gu, I. Watson, C. J. Humphreys, and M. Dawson, “Nanoscale-accuracy transfer printing of ultra-thin AlInGaN light-emitting diodes onto mechanically flexible substrates,” Appl. Phys. Lett. 103, 253302 (2013).
[Crossref]

2012 (2)

J. Justice, C. Bower, M. Meitl, M. B. Mooney, M. A. Gubbins, and B. Corbett, “Wafer-scale integration of group III-V lasers on silicon using transfer printing of epitaxial layers,” Nature Photon. 6, 610–614 (2012).
[Crossref]

H. Yang, D. Zhao, S. Chuwongin, J.-H. Seo, W. Yang, Y. Shuai, J. Berggren, M. Hammar, Z. Ma, and W. Zhou, “Transfer-printed stacked nanomembrane lasers on silicon,” Nature Photon. 6, 615–620 (2012).
[Crossref]

2010 (1)

G. Roelkens, L. Liu, D. Liang, R. Jones, A. Fang, B. Koch, and J. Bowers, “III-V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photon. Rev. 4, 751–779 (2010).
[Crossref]

2006 (1)

M. Meitl, Z. Zhu, V. Kumar, K. Lee, X. Feng, Y. Huang, I. Adesida, R. Nuzzo, and J. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nature Mater. 5(1), 33–38 (2006).
[Crossref]

2004 (1)

E. Menard, K. Lee, D.-Y. Khang, R. Nuzzo, and J. Rogers, “A printable form of silicon for high performance thin film transistors on plastic substrates,” Appl. Phys. Lett. 84, 5398–5400 (2004).
[Crossref]

Abbasi, A.

G. Roelkens, A. Abbasi, P. Cardile, U. Dave, A. De Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. Van Gasse, J. Verbist, R. Wang, Z. Wang, J. Van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. Van Thourhout, “III-V-on-silicon photonic devices for optical communication and sensing,” IEEE Photon. J. 2(3), 969–1004 (2015).

Adesida, I.

M. Meitl, Z. Zhu, V. Kumar, K. Lee, X. Feng, Y. Huang, I. Adesida, R. Nuzzo, and J. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nature Mater. 5(1), 33–38 (2006).
[Crossref]

Baets, R.

G. Roelkens, A. Abbasi, P. Cardile, U. Dave, A. De Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. Van Gasse, J. Verbist, R. Wang, Z. Wang, J. Van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. Van Thourhout, “III-V-on-silicon photonic devices for optical communication and sensing,” IEEE Photon. J. 2(3), 969–1004 (2015).

A. De Groote, J. Peters, M. Davenport, M. Heck, R. Baets, G. Roelkens, and J. Bowers, “Heterogeneously integrated III-V-on-silicon multibandgap superluminescent light-emitting diode with 290 nm optical bandwidth,” Opt. Lett. 39, 4784–4787 (2014).
[Crossref] [PubMed]

A. De Groote, P. Cardile, A. Subramanian, M. Tassaert, D. Delbeke, R. Baets, and G. Roelkens, “A waveguide coupled LED on SOI by heterogeneous integration of InP-based membranes,” in Proceeding of the 12th International Conference on Group IV Photonics, (IEEE, 2015), pp. 31–32.

Bauwelinck, J.

G. Roelkens, A. Abbasi, P. Cardile, U. Dave, A. De Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. Van Gasse, J. Verbist, R. Wang, Z. Wang, J. Van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. Van Thourhout, “III-V-on-silicon photonic devices for optical communication and sensing,” IEEE Photon. J. 2(3), 969–1004 (2015).

Berggren, J.

H. Yang, D. Zhao, S. Chuwongin, J.-H. Seo, W. Yang, Y. Shuai, J. Berggren, M. Hammar, Z. Ma, and W. Zhou, “Transfer-printed stacked nanomembrane lasers on silicon,” Nature Photon. 6, 615–620 (2012).
[Crossref]

Bower, C.

J. Justice, C. Bower, M. Meitl, M. B. Mooney, M. A. Gubbins, and B. Corbett, “Wafer-scale integration of group III-V lasers on silicon using transfer printing of epitaxial layers,” Nature Photon. 6, 610–614 (2012).
[Crossref]

C. Bower, D. Gomez, K. Lucht, B. Cox, and D. Kneeburg, “Transfer-printed integrated circuits for display back-planes,” in Proceedings of International Display Workshop, (SID, 2010), pp. 1203–1206.

Bowers, J.

A. De Groote, J. Peters, M. Davenport, M. Heck, R. Baets, G. Roelkens, and J. Bowers, “Heterogeneously integrated III-V-on-silicon multibandgap superluminescent light-emitting diode with 290 nm optical bandwidth,” Opt. Lett. 39, 4784–4787 (2014).
[Crossref] [PubMed]

G. Roelkens, L. Liu, D. Liang, R. Jones, A. Fang, B. Koch, and J. Bowers, “III-V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photon. Rev. 4, 751–779 (2010).
[Crossref]

Cardile, P.

G. Roelkens, A. Abbasi, P. Cardile, U. Dave, A. De Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. Van Gasse, J. Verbist, R. Wang, Z. Wang, J. Van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. Van Thourhout, “III-V-on-silicon photonic devices for optical communication and sensing,” IEEE Photon. J. 2(3), 969–1004 (2015).

A. De Groote, P. Cardile, A. Subramanian, M. Tassaert, D. Delbeke, R. Baets, and G. Roelkens, “A waveguide coupled LED on SOI by heterogeneous integration of InP-based membranes,” in Proceeding of the 12th International Conference on Group IV Photonics, (IEEE, 2015), pp. 31–32.

Chuwongin, S.

H. Yang, D. Zhao, S. Chuwongin, J.-H. Seo, W. Yang, Y. Shuai, J. Berggren, M. Hammar, Z. Ma, and W. Zhou, “Transfer-printed stacked nanomembrane lasers on silicon,” Nature Photon. 6, 615–620 (2012).
[Crossref]

Corbett, B.

J. Justice, C. Bower, M. Meitl, M. B. Mooney, M. A. Gubbins, and B. Corbett, “Wafer-scale integration of group III-V lasers on silicon using transfer printing of epitaxial layers,” Nature Photon. 6, 610–614 (2012).
[Crossref]

Cox, B.

C. Bower, D. Gomez, K. Lucht, B. Cox, and D. Kneeburg, “Transfer-printed integrated circuits for display back-planes,” in Proceedings of International Display Workshop, (SID, 2010), pp. 1203–1206.

Dave, U.

G. Roelkens, A. Abbasi, P. Cardile, U. Dave, A. De Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. Van Gasse, J. Verbist, R. Wang, Z. Wang, J. Van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. Van Thourhout, “III-V-on-silicon photonic devices for optical communication and sensing,” IEEE Photon. J. 2(3), 969–1004 (2015).

Davenport, M.

Dawson, M.

A. Trindade, B. Guilhabert, D. Massoubre, D. Zhu, N. Laurand, E. Gu, I. Watson, C. J. Humphreys, and M. Dawson, “Nanoscale-accuracy transfer printing of ultra-thin AlInGaN light-emitting diodes onto mechanically flexible substrates,” Appl. Phys. Lett. 103, 253302 (2013).
[Crossref]

De Groote, A.

G. Roelkens, A. Abbasi, P. Cardile, U. Dave, A. De Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. Van Gasse, J. Verbist, R. Wang, Z. Wang, J. Van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. Van Thourhout, “III-V-on-silicon photonic devices for optical communication and sensing,” IEEE Photon. J. 2(3), 969–1004 (2015).

A. De Groote, J. Peters, M. Davenport, M. Heck, R. Baets, G. Roelkens, and J. Bowers, “Heterogeneously integrated III-V-on-silicon multibandgap superluminescent light-emitting diode with 290 nm optical bandwidth,” Opt. Lett. 39, 4784–4787 (2014).
[Crossref] [PubMed]

A. De Groote, P. Cardile, A. Subramanian, M. Tassaert, D. Delbeke, R. Baets, and G. Roelkens, “A waveguide coupled LED on SOI by heterogeneous integration of InP-based membranes,” in Proceeding of the 12th International Conference on Group IV Photonics, (IEEE, 2015), pp. 31–32.

de Koninck, Y.

G. Roelkens, A. Abbasi, P. Cardile, U. Dave, A. De Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. Van Gasse, J. Verbist, R. Wang, Z. Wang, J. Van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. Van Thourhout, “III-V-on-silicon photonic devices for optical communication and sensing,” IEEE Photon. J. 2(3), 969–1004 (2015).

Delbeke, D.

A. De Groote, P. Cardile, A. Subramanian, M. Tassaert, D. Delbeke, R. Baets, and G. Roelkens, “A waveguide coupled LED on SOI by heterogeneous integration of InP-based membranes,” in Proceeding of the 12th International Conference on Group IV Photonics, (IEEE, 2015), pp. 31–32.

Dhoore, S.

G. Roelkens, A. Abbasi, P. Cardile, U. Dave, A. De Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. Van Gasse, J. Verbist, R. Wang, Z. Wang, J. Van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. Van Thourhout, “III-V-on-silicon photonic devices for optical communication and sensing,” IEEE Photon. J. 2(3), 969–1004 (2015).

Fang, A.

G. Roelkens, L. Liu, D. Liang, R. Jones, A. Fang, B. Koch, and J. Bowers, “III-V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photon. Rev. 4, 751–779 (2010).
[Crossref]

Feng, X.

M. Meitl, Z. Zhu, V. Kumar, K. Lee, X. Feng, Y. Huang, I. Adesida, R. Nuzzo, and J. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nature Mater. 5(1), 33–38 (2006).
[Crossref]

Fu, X.

G. Roelkens, A. Abbasi, P. Cardile, U. Dave, A. De Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. Van Gasse, J. Verbist, R. Wang, Z. Wang, J. Van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. Van Thourhout, “III-V-on-silicon photonic devices for optical communication and sensing,” IEEE Photon. J. 2(3), 969–1004 (2015).

Gassenq, A.

G. Roelkens, A. Abbasi, P. Cardile, U. Dave, A. De Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. Van Gasse, J. Verbist, R. Wang, Z. Wang, J. Van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. Van Thourhout, “III-V-on-silicon photonic devices for optical communication and sensing,” IEEE Photon. J. 2(3), 969–1004 (2015).

Gomez, D.

C. Bower, D. Gomez, K. Lucht, B. Cox, and D. Kneeburg, “Transfer-printed integrated circuits for display back-planes,” in Proceedings of International Display Workshop, (SID, 2010), pp. 1203–1206.

Gu, E.

A. Trindade, B. Guilhabert, D. Massoubre, D. Zhu, N. Laurand, E. Gu, I. Watson, C. J. Humphreys, and M. Dawson, “Nanoscale-accuracy transfer printing of ultra-thin AlInGaN light-emitting diodes onto mechanically flexible substrates,” Appl. Phys. Lett. 103, 253302 (2013).
[Crossref]

Gubbins, M. A.

J. Justice, C. Bower, M. Meitl, M. B. Mooney, M. A. Gubbins, and B. Corbett, “Wafer-scale integration of group III-V lasers on silicon using transfer printing of epitaxial layers,” Nature Photon. 6, 610–614 (2012).
[Crossref]

Guilhabert, B.

A. Trindade, B. Guilhabert, D. Massoubre, D. Zhu, N. Laurand, E. Gu, I. Watson, C. J. Humphreys, and M. Dawson, “Nanoscale-accuracy transfer printing of ultra-thin AlInGaN light-emitting diodes onto mechanically flexible substrates,” Appl. Phys. Lett. 103, 253302 (2013).
[Crossref]

Hammar, M.

H. Yang, D. Zhao, S. Chuwongin, J.-H. Seo, W. Yang, Y. Shuai, J. Berggren, M. Hammar, Z. Ma, and W. Zhou, “Transfer-printed stacked nanomembrane lasers on silicon,” Nature Photon. 6, 615–620 (2012).
[Crossref]

Hattasan, N.

G. Roelkens, A. Abbasi, P. Cardile, U. Dave, A. De Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. Van Gasse, J. Verbist, R. Wang, Z. Wang, J. Van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. Van Thourhout, “III-V-on-silicon photonic devices for optical communication and sensing,” IEEE Photon. J. 2(3), 969–1004 (2015).

Heck, M.

Huang, Q.

G. Roelkens, A. Abbasi, P. Cardile, U. Dave, A. De Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. Van Gasse, J. Verbist, R. Wang, Z. Wang, J. Van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. Van Thourhout, “III-V-on-silicon photonic devices for optical communication and sensing,” IEEE Photon. J. 2(3), 969–1004 (2015).

Huang, Y.

M. Meitl, Z. Zhu, V. Kumar, K. Lee, X. Feng, Y. Huang, I. Adesida, R. Nuzzo, and J. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nature Mater. 5(1), 33–38 (2006).
[Crossref]

Humphreys, C. J.

A. Trindade, B. Guilhabert, D. Massoubre, D. Zhu, N. Laurand, E. Gu, I. Watson, C. J. Humphreys, and M. Dawson, “Nanoscale-accuracy transfer printing of ultra-thin AlInGaN light-emitting diodes onto mechanically flexible substrates,” Appl. Phys. Lett. 103, 253302 (2013).
[Crossref]

Jones, R.

G. Roelkens, L. Liu, D. Liang, R. Jones, A. Fang, B. Koch, and J. Bowers, “III-V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photon. Rev. 4, 751–779 (2010).
[Crossref]

Justice, J.

J. Justice, C. Bower, M. Meitl, M. B. Mooney, M. A. Gubbins, and B. Corbett, “Wafer-scale integration of group III-V lasers on silicon using transfer printing of epitaxial layers,” Nature Photon. 6, 610–614 (2012).
[Crossref]

Keyvaninia, S.

G. Roelkens, A. Abbasi, P. Cardile, U. Dave, A. De Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. Van Gasse, J. Verbist, R. Wang, Z. Wang, J. Van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. Van Thourhout, “III-V-on-silicon photonic devices for optical communication and sensing,” IEEE Photon. J. 2(3), 969–1004 (2015).

Khang, D.-Y.

E. Menard, K. Lee, D.-Y. Khang, R. Nuzzo, and J. Rogers, “A printable form of silicon for high performance thin film transistors on plastic substrates,” Appl. Phys. Lett. 84, 5398–5400 (2004).
[Crossref]

Kneeburg, D.

C. Bower, D. Gomez, K. Lucht, B. Cox, and D. Kneeburg, “Transfer-printed integrated circuits for display back-planes,” in Proceedings of International Display Workshop, (SID, 2010), pp. 1203–1206.

Koch, B.

G. Roelkens, L. Liu, D. Liang, R. Jones, A. Fang, B. Koch, and J. Bowers, “III-V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photon. Rev. 4, 751–779 (2010).
[Crossref]

Kumar, V.

M. Meitl, Z. Zhu, V. Kumar, K. Lee, X. Feng, Y. Huang, I. Adesida, R. Nuzzo, and J. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nature Mater. 5(1), 33–38 (2006).
[Crossref]

Kumari, S.

G. Roelkens, A. Abbasi, P. Cardile, U. Dave, A. De Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. Van Gasse, J. Verbist, R. Wang, Z. Wang, J. Van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. Van Thourhout, “III-V-on-silicon photonic devices for optical communication and sensing,” IEEE Photon. J. 2(3), 969–1004 (2015).

Kuyken, B.

G. Roelkens, A. Abbasi, P. Cardile, U. Dave, A. De Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. Van Gasse, J. Verbist, R. Wang, Z. Wang, J. Van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. Van Thourhout, “III-V-on-silicon photonic devices for optical communication and sensing,” IEEE Photon. J. 2(3), 969–1004 (2015).

Laurand, N.

A. Trindade, B. Guilhabert, D. Massoubre, D. Zhu, N. Laurand, E. Gu, I. Watson, C. J. Humphreys, and M. Dawson, “Nanoscale-accuracy transfer printing of ultra-thin AlInGaN light-emitting diodes onto mechanically flexible substrates,” Appl. Phys. Lett. 103, 253302 (2013).
[Crossref]

Lee, K.

M. Meitl, Z. Zhu, V. Kumar, K. Lee, X. Feng, Y. Huang, I. Adesida, R. Nuzzo, and J. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nature Mater. 5(1), 33–38 (2006).
[Crossref]

E. Menard, K. Lee, D.-Y. Khang, R. Nuzzo, and J. Rogers, “A printable form of silicon for high performance thin film transistors on plastic substrates,” Appl. Phys. Lett. 84, 5398–5400 (2004).
[Crossref]

Li, L.

G. Roelkens, A. Abbasi, P. Cardile, U. Dave, A. De Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. Van Gasse, J. Verbist, R. Wang, Z. Wang, J. Van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. Van Thourhout, “III-V-on-silicon photonic devices for optical communication and sensing,” IEEE Photon. J. 2(3), 969–1004 (2015).

Liang, D.

G. Roelkens, L. Liu, D. Liang, R. Jones, A. Fang, B. Koch, and J. Bowers, “III-V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photon. Rev. 4, 751–779 (2010).
[Crossref]

Liu, L.

G. Roelkens, L. Liu, D. Liang, R. Jones, A. Fang, B. Koch, and J. Bowers, “III-V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photon. Rev. 4, 751–779 (2010).
[Crossref]

Lucht, K.

C. Bower, D. Gomez, K. Lucht, B. Cox, and D. Kneeburg, “Transfer-printed integrated circuits for display back-planes,” in Proceedings of International Display Workshop, (SID, 2010), pp. 1203–1206.

Ma, Z.

H. Yang, D. Zhao, S. Chuwongin, J.-H. Seo, W. Yang, Y. Shuai, J. Berggren, M. Hammar, Z. Ma, and W. Zhou, “Transfer-printed stacked nanomembrane lasers on silicon,” Nature Photon. 6, 615–620 (2012).
[Crossref]

Massoubre, D.

A. Trindade, B. Guilhabert, D. Massoubre, D. Zhu, N. Laurand, E. Gu, I. Watson, C. J. Humphreys, and M. Dawson, “Nanoscale-accuracy transfer printing of ultra-thin AlInGaN light-emitting diodes onto mechanically flexible substrates,” Appl. Phys. Lett. 103, 253302 (2013).
[Crossref]

Mechet, P.

G. Roelkens, A. Abbasi, P. Cardile, U. Dave, A. De Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. Van Gasse, J. Verbist, R. Wang, Z. Wang, J. Van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. Van Thourhout, “III-V-on-silicon photonic devices for optical communication and sensing,” IEEE Photon. J. 2(3), 969–1004 (2015).

Meitl, M.

J. Justice, C. Bower, M. Meitl, M. B. Mooney, M. A. Gubbins, and B. Corbett, “Wafer-scale integration of group III-V lasers on silicon using transfer printing of epitaxial layers,” Nature Photon. 6, 610–614 (2012).
[Crossref]

M. Meitl, Z. Zhu, V. Kumar, K. Lee, X. Feng, Y. Huang, I. Adesida, R. Nuzzo, and J. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nature Mater. 5(1), 33–38 (2006).
[Crossref]

Menard, E.

E. Menard, K. Lee, D.-Y. Khang, R. Nuzzo, and J. Rogers, “A printable form of silicon for high performance thin film transistors on plastic substrates,” Appl. Phys. Lett. 84, 5398–5400 (2004).
[Crossref]

Mooney, M. B.

J. Justice, C. Bower, M. Meitl, M. B. Mooney, M. A. Gubbins, and B. Corbett, “Wafer-scale integration of group III-V lasers on silicon using transfer printing of epitaxial layers,” Nature Photon. 6, 610–614 (2012).
[Crossref]

Morthier, G.

G. Roelkens, A. Abbasi, P. Cardile, U. Dave, A. De Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. Van Gasse, J. Verbist, R. Wang, Z. Wang, J. Van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. Van Thourhout, “III-V-on-silicon photonic devices for optical communication and sensing,” IEEE Photon. J. 2(3), 969–1004 (2015).

Muneeb, M.

G. Roelkens, A. Abbasi, P. Cardile, U. Dave, A. De Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. Van Gasse, J. Verbist, R. Wang, Z. Wang, J. Van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. Van Thourhout, “III-V-on-silicon photonic devices for optical communication and sensing,” IEEE Photon. J. 2(3), 969–1004 (2015).

Nuzzo, R.

M. Meitl, Z. Zhu, V. Kumar, K. Lee, X. Feng, Y. Huang, I. Adesida, R. Nuzzo, and J. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nature Mater. 5(1), 33–38 (2006).
[Crossref]

E. Menard, K. Lee, D.-Y. Khang, R. Nuzzo, and J. Rogers, “A printable form of silicon for high performance thin film transistors on plastic substrates,” Appl. Phys. Lett. 84, 5398–5400 (2004).
[Crossref]

Peters, J.

Roelkens, G.

G. Roelkens, A. Abbasi, P. Cardile, U. Dave, A. De Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. Van Gasse, J. Verbist, R. Wang, Z. Wang, J. Van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. Van Thourhout, “III-V-on-silicon photonic devices for optical communication and sensing,” IEEE Photon. J. 2(3), 969–1004 (2015).

A. De Groote, J. Peters, M. Davenport, M. Heck, R. Baets, G. Roelkens, and J. Bowers, “Heterogeneously integrated III-V-on-silicon multibandgap superluminescent light-emitting diode with 290 nm optical bandwidth,” Opt. Lett. 39, 4784–4787 (2014).
[Crossref] [PubMed]

G. Roelkens, L. Liu, D. Liang, R. Jones, A. Fang, B. Koch, and J. Bowers, “III-V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photon. Rev. 4, 751–779 (2010).
[Crossref]

A. De Groote, P. Cardile, A. Subramanian, M. Tassaert, D. Delbeke, R. Baets, and G. Roelkens, “A waveguide coupled LED on SOI by heterogeneous integration of InP-based membranes,” in Proceeding of the 12th International Conference on Group IV Photonics, (IEEE, 2015), pp. 31–32.

Rogers, J.

M. Meitl, Z. Zhu, V. Kumar, K. Lee, X. Feng, Y. Huang, I. Adesida, R. Nuzzo, and J. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nature Mater. 5(1), 33–38 (2006).
[Crossref]

E. Menard, K. Lee, D.-Y. Khang, R. Nuzzo, and J. Rogers, “A printable form of silicon for high performance thin film transistors on plastic substrates,” Appl. Phys. Lett. 84, 5398–5400 (2004).
[Crossref]

Sanchez, D.

G. Roelkens, A. Abbasi, P. Cardile, U. Dave, A. De Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. Van Gasse, J. Verbist, R. Wang, Z. Wang, J. Van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. Van Thourhout, “III-V-on-silicon photonic devices for optical communication and sensing,” IEEE Photon. J. 2(3), 969–1004 (2015).

Seo, J.-H.

H. Yang, D. Zhao, S. Chuwongin, J.-H. Seo, W. Yang, Y. Shuai, J. Berggren, M. Hammar, Z. Ma, and W. Zhou, “Transfer-printed stacked nanomembrane lasers on silicon,” Nature Photon. 6, 615–620 (2012).
[Crossref]

Shao, H.

G. Roelkens, A. Abbasi, P. Cardile, U. Dave, A. De Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. Van Gasse, J. Verbist, R. Wang, Z. Wang, J. Van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. Van Thourhout, “III-V-on-silicon photonic devices for optical communication and sensing,” IEEE Photon. J. 2(3), 969–1004 (2015).

Shuai, Y.

H. Yang, D. Zhao, S. Chuwongin, J.-H. Seo, W. Yang, Y. Shuai, J. Berggren, M. Hammar, Z. Ma, and W. Zhou, “Transfer-printed stacked nanomembrane lasers on silicon,” Nature Photon. 6, 615–620 (2012).
[Crossref]

Spuesens, T.

G. Roelkens, A. Abbasi, P. Cardile, U. Dave, A. De Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. Van Gasse, J. Verbist, R. Wang, Z. Wang, J. Van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. Van Thourhout, “III-V-on-silicon photonic devices for optical communication and sensing,” IEEE Photon. J. 2(3), 969–1004 (2015).

Subramanian, A.

G. Roelkens, A. Abbasi, P. Cardile, U. Dave, A. De Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. Van Gasse, J. Verbist, R. Wang, Z. Wang, J. Van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. Van Thourhout, “III-V-on-silicon photonic devices for optical communication and sensing,” IEEE Photon. J. 2(3), 969–1004 (2015).

A. De Groote, P. Cardile, A. Subramanian, M. Tassaert, D. Delbeke, R. Baets, and G. Roelkens, “A waveguide coupled LED on SOI by heterogeneous integration of InP-based membranes,” in Proceeding of the 12th International Conference on Group IV Photonics, (IEEE, 2015), pp. 31–32.

Tassaert, M.

G. Roelkens, A. Abbasi, P. Cardile, U. Dave, A. De Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. Van Gasse, J. Verbist, R. Wang, Z. Wang, J. Van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. Van Thourhout, “III-V-on-silicon photonic devices for optical communication and sensing,” IEEE Photon. J. 2(3), 969–1004 (2015).

A. De Groote, P. Cardile, A. Subramanian, M. Tassaert, D. Delbeke, R. Baets, and G. Roelkens, “A waveguide coupled LED on SOI by heterogeneous integration of InP-based membranes,” in Proceeding of the 12th International Conference on Group IV Photonics, (IEEE, 2015), pp. 31–32.

Trindade, A.

A. Trindade, B. Guilhabert, D. Massoubre, D. Zhu, N. Laurand, E. Gu, I. Watson, C. J. Humphreys, and M. Dawson, “Nanoscale-accuracy transfer printing of ultra-thin AlInGaN light-emitting diodes onto mechanically flexible substrates,” Appl. Phys. Lett. 103, 253302 (2013).
[Crossref]

Uvin, S.

G. Roelkens, A. Abbasi, P. Cardile, U. Dave, A. De Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. Van Gasse, J. Verbist, R. Wang, Z. Wang, J. Van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. Van Thourhout, “III-V-on-silicon photonic devices for optical communication and sensing,” IEEE Photon. J. 2(3), 969–1004 (2015).

Van Campenhout, J.

G. Roelkens, A. Abbasi, P. Cardile, U. Dave, A. De Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. Van Gasse, J. Verbist, R. Wang, Z. Wang, J. Van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. Van Thourhout, “III-V-on-silicon photonic devices for optical communication and sensing,” IEEE Photon. J. 2(3), 969–1004 (2015).

Van Gasse, K.

G. Roelkens, A. Abbasi, P. Cardile, U. Dave, A. De Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. Van Gasse, J. Verbist, R. Wang, Z. Wang, J. Van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. Van Thourhout, “III-V-on-silicon photonic devices for optical communication and sensing,” IEEE Photon. J. 2(3), 969–1004 (2015).

Van Thourhout, D.

G. Roelkens, A. Abbasi, P. Cardile, U. Dave, A. De Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. Van Gasse, J. Verbist, R. Wang, Z. Wang, J. Van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. Van Thourhout, “III-V-on-silicon photonic devices for optical communication and sensing,” IEEE Photon. J. 2(3), 969–1004 (2015).

Verbist, J.

G. Roelkens, A. Abbasi, P. Cardile, U. Dave, A. De Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. Van Gasse, J. Verbist, R. Wang, Z. Wang, J. Van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. Van Thourhout, “III-V-on-silicon photonic devices for optical communication and sensing,” IEEE Photon. J. 2(3), 969–1004 (2015).

Wang, R.

G. Roelkens, A. Abbasi, P. Cardile, U. Dave, A. De Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. Van Gasse, J. Verbist, R. Wang, Z. Wang, J. Van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. Van Thourhout, “III-V-on-silicon photonic devices for optical communication and sensing,” IEEE Photon. J. 2(3), 969–1004 (2015).

Wang, Z.

G. Roelkens, A. Abbasi, P. Cardile, U. Dave, A. De Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. Van Gasse, J. Verbist, R. Wang, Z. Wang, J. Van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. Van Thourhout, “III-V-on-silicon photonic devices for optical communication and sensing,” IEEE Photon. J. 2(3), 969–1004 (2015).

Watson, I.

A. Trindade, B. Guilhabert, D. Massoubre, D. Zhu, N. Laurand, E. Gu, I. Watson, C. J. Humphreys, and M. Dawson, “Nanoscale-accuracy transfer printing of ultra-thin AlInGaN light-emitting diodes onto mechanically flexible substrates,” Appl. Phys. Lett. 103, 253302 (2013).
[Crossref]

Yang, H.

H. Yang, D. Zhao, S. Chuwongin, J.-H. Seo, W. Yang, Y. Shuai, J. Berggren, M. Hammar, Z. Ma, and W. Zhou, “Transfer-printed stacked nanomembrane lasers on silicon,” Nature Photon. 6, 615–620 (2012).
[Crossref]

Yang, W.

H. Yang, D. Zhao, S. Chuwongin, J.-H. Seo, W. Yang, Y. Shuai, J. Berggren, M. Hammar, Z. Ma, and W. Zhou, “Transfer-printed stacked nanomembrane lasers on silicon,” Nature Photon. 6, 615–620 (2012).
[Crossref]

Yin, X.

G. Roelkens, A. Abbasi, P. Cardile, U. Dave, A. De Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. Van Gasse, J. Verbist, R. Wang, Z. Wang, J. Van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. Van Thourhout, “III-V-on-silicon photonic devices for optical communication and sensing,” IEEE Photon. J. 2(3), 969–1004 (2015).

Zhao, D.

H. Yang, D. Zhao, S. Chuwongin, J.-H. Seo, W. Yang, Y. Shuai, J. Berggren, M. Hammar, Z. Ma, and W. Zhou, “Transfer-printed stacked nanomembrane lasers on silicon,” Nature Photon. 6, 615–620 (2012).
[Crossref]

Zhou, W.

H. Yang, D. Zhao, S. Chuwongin, J.-H. Seo, W. Yang, Y. Shuai, J. Berggren, M. Hammar, Z. Ma, and W. Zhou, “Transfer-printed stacked nanomembrane lasers on silicon,” Nature Photon. 6, 615–620 (2012).
[Crossref]

Zhu, D.

A. Trindade, B. Guilhabert, D. Massoubre, D. Zhu, N. Laurand, E. Gu, I. Watson, C. J. Humphreys, and M. Dawson, “Nanoscale-accuracy transfer printing of ultra-thin AlInGaN light-emitting diodes onto mechanically flexible substrates,” Appl. Phys. Lett. 103, 253302 (2013).
[Crossref]

Zhu, Z.

M. Meitl, Z. Zhu, V. Kumar, K. Lee, X. Feng, Y. Huang, I. Adesida, R. Nuzzo, and J. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nature Mater. 5(1), 33–38 (2006).
[Crossref]

Appl. Phys. Lett. (2)

E. Menard, K. Lee, D.-Y. Khang, R. Nuzzo, and J. Rogers, “A printable form of silicon for high performance thin film transistors on plastic substrates,” Appl. Phys. Lett. 84, 5398–5400 (2004).
[Crossref]

A. Trindade, B. Guilhabert, D. Massoubre, D. Zhu, N. Laurand, E. Gu, I. Watson, C. J. Humphreys, and M. Dawson, “Nanoscale-accuracy transfer printing of ultra-thin AlInGaN light-emitting diodes onto mechanically flexible substrates,” Appl. Phys. Lett. 103, 253302 (2013).
[Crossref]

IEEE Photon. J. (1)

G. Roelkens, A. Abbasi, P. Cardile, U. Dave, A. De Groote, Y. de Koninck, S. Dhoore, X. Fu, A. Gassenq, N. Hattasan, Q. Huang, S. Kumari, S. Keyvaninia, B. Kuyken, L. Li, P. Mechet, M. Muneeb, D. Sanchez, H. Shao, T. Spuesens, A. Subramanian, S. Uvin, M. Tassaert, K. Van Gasse, J. Verbist, R. Wang, Z. Wang, J. Van Campenhout, X. Yin, J. Bauwelinck, G. Morthier, R. Baets, and D. Van Thourhout, “III-V-on-silicon photonic devices for optical communication and sensing,” IEEE Photon. J. 2(3), 969–1004 (2015).

Laser Photon. Rev. (1)

G. Roelkens, L. Liu, D. Liang, R. Jones, A. Fang, B. Koch, and J. Bowers, “III-V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photon. Rev. 4, 751–779 (2010).
[Crossref]

Nature Mater. (1)

M. Meitl, Z. Zhu, V. Kumar, K. Lee, X. Feng, Y. Huang, I. Adesida, R. Nuzzo, and J. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nature Mater. 5(1), 33–38 (2006).
[Crossref]

Nature Photon. (2)

J. Justice, C. Bower, M. Meitl, M. B. Mooney, M. A. Gubbins, and B. Corbett, “Wafer-scale integration of group III-V lasers on silicon using transfer printing of epitaxial layers,” Nature Photon. 6, 610–614 (2012).
[Crossref]

H. Yang, D. Zhao, S. Chuwongin, J.-H. Seo, W. Yang, Y. Shuai, J. Berggren, M. Hammar, Z. Ma, and W. Zhou, “Transfer-printed stacked nanomembrane lasers on silicon,” Nature Photon. 6, 615–620 (2012).
[Crossref]

Opt. Lett. (1)

Other (2)

C. Bower, D. Gomez, K. Lucht, B. Cox, and D. Kneeburg, “Transfer-printed integrated circuits for display back-planes,” in Proceedings of International Display Workshop, (SID, 2010), pp. 1203–1206.

A. De Groote, P. Cardile, A. Subramanian, M. Tassaert, D. Delbeke, R. Baets, and G. Roelkens, “A waveguide coupled LED on SOI by heterogeneous integration of InP-based membranes,” in Proceeding of the 12th International Conference on Group IV Photonics, (IEEE, 2015), pp. 31–32.

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Figures (8)

Fig. 1
Fig. 1 Illustration of area magnification in transfer printing III-V coupons from the III-V source substrate to the SOI target substrate. The coupons from the first source wafer are indicated in red. The coupons from the second source wafer are illustrated in yellow. The patterned stamp used for this purpose is also schematically shown. (a) Patterned stamp, (b) Two source substrates with patterned coupons, (c) SOI target substrate with four printed coupons of each source in top left.
Fig. 2
Fig. 2 Process flow of transfer printed, optically pumped LED. (a) InP starting layer stack, (b) Coupon patterning, (c) Encapsulation and tether definition, (d) Top view after encapsulation and tether definition. The cross section of the other figures is indicated, (e) Release etch, (f) Pick-up of the III-V coupon from the InP source substrate, (g) Printing of the III-V coupon to the SOI target substrate, (h) Removal of encapsulation and of sacrificial layers, (i) Definition of LED
Fig. 3
Fig. 3 Height variation along coupon for different etchants
Fig. 4
Fig. 4 Microscope images of the coupons before, during and after transfer printing. (a) Coupons on source wafer, (b) Picked-up coupon on stamp, (c) Printed coupon on target wafer
Fig. 5
Fig. 5 Cross sections of transfer printed coupons on planarized SOI waveguide circuits. (a) Transfer printed coupon on planarized SOI using Van der Waals bonding, (b) Transfer printed coupon on planarized SOI using a DVS-BCB adhesive bonding agent
Fig. 6
Fig. 6 Illustration of the optically pumped LED.
Fig. 7
Fig. 7 Sideview of the taper coupling structure intensity profile. 1550 nm light is coupled adiabatically from III-V to silicon waveguide
Fig. 8
Fig. 8 Measured spectrum of transfer printed, optically pumped LED.

Tables (1)

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Table 1 Chemicals tested for undercutting and the observed etching behavior.

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