Abstract

Photonic wire bonding (PWB) was used to achieve flexible chip-scale optical interconnection as a kind of 3D-freeform polymer waveguide based on the two-photon polymerization of SU-8. First, the fabrication conditions of PWB were determined for the two-photon absorption process, and the coupling structure between PWB and III-V optical components was numerically simulated in order to obtain high coupling efficiency. Then, using PWB, chip-to-chip optical transmission was realized between laser and detector chips located on a common Si substrate. We fabricated a 2.5-μm-wide PWB with 1:3 aspect ratio between two optical chips of 140-μm gap and achieved a connection loss of approximately 10 dB.

© 2015 Optical Society of America

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References

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2015 (2)

Z. Gu, T. Amemiya, A. Ishikawa, J. Kang, T. Hiratani, Y. Hayashi, J. Suzuki, N. Nishiyama, T. Tanaka, and S. Arai, “Investigation of optical interconnection by using photonic wire bonding,” J. Laser Micro/Nanoeng. 10(2), 148–153 (2015).
[Crossref]

H. Duprez, A. Descos, T. Ferrotti, C. Sciancalepore, C. Jany, K. Hassan, C. Seassal, S. Menezo, and B. Ben Bakir, “1310 nm hybrid InP/InGaAsP on silicon distributed feedback laser with high side-mode suppression ratio,” Opt. Express 23(7), 8489–8497 (2015).
[Crossref] [PubMed]

2014 (4)

C. Zhang, S. Srinivasan, Y. Tang, M. J. R. Heck, M. L. Davenport, and J. E. Bowers, “Low threshold and high speed short cavity distributed feedback hybrid silicon lasers,” Opt. Express 22(9), 10202–10209 (2014).
[Crossref] [PubMed]

S. Srinivasan, A. Arrighi, M. J. R. Heck, J. Hutchinson, E. Norberg, G. Fish, and J. E. Bowers, “Harmonically mode-locked hybrid silicon laser with intra-cavity filter to suppress supermode noise,” IEEE J. Sel. Top. Quantum Electron. 20(4), 1100208 (2014).
[Crossref]

D. Inoue, J. Lee, K. Doi, T. Hiratani, Y. Atsuji, T. Amemiya, N. Nishiyama, and S. Arai, “Room-temperature continuous-wave operation of GaInAsP/InP lateral-current-injection membrane laser bonded on Si substrate,” Appl. Phys. Express 7(7), 072701 (2014).
[Crossref]

K. Doi, T. Shindo, J. Lee, T. Amemiya, N. Nishiyama, and S. Arai, “Thermal analysis of lateral current injection membrane distributed feedback laser,” IEEE J. Quantum Electron. 50(5), 321–326 (2014).
[Crossref]

2013 (6)

M. J. R. Heck, J. F. Bauters, M. L. Davenport, J. K. Doylend, S. Jain, G. Kurczveil, S. Srinivasan, Y. Tang, and J. E. Bowers, “Hybrid silicon photonic integrated circuit technology,” IEEE J. Sel. Top. Quantum Electron. 19(4), 6100117 (2013).
[Crossref]

C. Koos, J. Leuthold, W. Freude, N. Lindenmann, S. Koeber, G. Balthasar, J. Hoffmann, T. Hoose, P. Huebner, D. Hillerkuss, and R. Schmogrow, “Photonic wire bonding: connecting nanophotonic circuits across chip boundaries,” Proc. SPIE 8613, 86130W (2013).
[Crossref]

T. Shindo, M. Futami, K. Doi, T. Amemiya, N. Nishiyama, and S. Arai, “Design of lateral current injection type membrane distributed-feedback lasers for on-chip optical interconnections,” IEEE J. Sel. Top. Quantum Electron. 19(4), 1502009 (2013).
[Crossref]

T. Shindo, T. Koguchi, M. Futami, K. Doi, Y. Yamahara, J. Lee, T. Amemiya, N. Nishiyama, and S. Arai, “10 Gbps operation of top air-clad lateral junction waveguide-type photodiodes,” Jpn. J. Appl. Phys. 52(11R), 118002 (2013).
[Crossref]

X. Lin, A. Hosseini, X. Dou, H. Subbaraman, and R. T. Chen, “Low-cost board-to-board optical interconnects using molded polymer waveguide with 45 degree mirrors and inkjet-printed micro-lenses as proximity vertical coupler,” Opt. Express 21(1), 60–69 (2013).
[Crossref] [PubMed]

S. Keyvaninia, G. Roelkens, D. Van Thourhout, C. Jany, M. Lamponi, A. Le Liepvre, F. Lelarge, D. Make, G. H. Duan, D. Bordel, and J. M. Fedeli, “Demonstration of a heterogeneously integrated III-V/SOI single wavelength tunable laser,” Opt. Express 21(3), 3784–3792 (2013).
[Crossref] [PubMed]

2012 (1)

2011 (2)

T T. Shindo, T. Okumura, H. Ito, T. Koguchi, D. Takahashi, Y. Atsumi, J. Kang, R. Osabe, T. Amemiya, N. Nishiyama, and S. Arai, “Lateral-current-injection distributed feedback laser with surface grating structure,” IEEE J. Sel. Top. Quantum Electron. 17(5), 1175–1182 (2011).
[Crossref]

S. Stankovic, R. Jones, M. N. Sysak, J. M. Heck, G. Roelkens, and D. Van Thourhout, “1310 nm hybrid III-V/Si Fabry-Perot laser based on adhesive bonding,” IEEE Photonics Technol. Lett. 23(23), 1781–1783 (2011).
[Crossref]

2010 (3)

J. E. Bowers, D. Liang, A. Fang, H. Park, R. Jones, and M. Paniccia, “Hybrid silicon lasers: the final frontier to integrated computing,” Opt. Photonics News 21(5), 28–33 (2010).
[Crossref]

G. Roelkens, L. Liu, D. Liang, R. Jones, A. Fang, B. Koch, and J. Bowers, “III-V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photonics Rev. 4(6), 751–779 (2010).
[Crossref]

Y. Liu, D. D. Nolte, and L. J. Pyrak-Nolte, “Large-format fabrication by two-photon polymerization of SU-8,” Appl. Phys., A Mater. Sci. Process. 100(1), 181–191 (2010).
[Crossref]

2008 (2)

A. W. Fang, E. Lively, Y.-H. Kuo, D. Liang, and J. E. Bowers, “A distributed feedback silicon evanescent laser,” Opt. Express 16(7), 4413–4419 (2008).
[Crossref] [PubMed]

A. Fazzi, R. Canegallo, L. Ciccarelli, L. Magagni, F. Natali, E. Jung, P. Rolandi, and R. Guerrieri, “3-D capacitive interconnections with mono-and bi-directional capabilities,” IEEE J. Solid-State Circuits 43(1), 275–284 (2008).
[Crossref]

2005 (1)

H. Shinohara, “Broadband access in Japan: rapidly growing FTTH market,” IEEE Commun. Mag. 43(9), 72–78 (2005).
[Crossref]

2001 (1)

Amemiya, T.

Z. Gu, T. Amemiya, A. Ishikawa, J. Kang, T. Hiratani, Y. Hayashi, J. Suzuki, N. Nishiyama, T. Tanaka, and S. Arai, “Investigation of optical interconnection by using photonic wire bonding,” J. Laser Micro/Nanoeng. 10(2), 148–153 (2015).
[Crossref]

D. Inoue, J. Lee, K. Doi, T. Hiratani, Y. Atsuji, T. Amemiya, N. Nishiyama, and S. Arai, “Room-temperature continuous-wave operation of GaInAsP/InP lateral-current-injection membrane laser bonded on Si substrate,” Appl. Phys. Express 7(7), 072701 (2014).
[Crossref]

K. Doi, T. Shindo, J. Lee, T. Amemiya, N. Nishiyama, and S. Arai, “Thermal analysis of lateral current injection membrane distributed feedback laser,” IEEE J. Quantum Electron. 50(5), 321–326 (2014).
[Crossref]

T. Shindo, T. Koguchi, M. Futami, K. Doi, Y. Yamahara, J. Lee, T. Amemiya, N. Nishiyama, and S. Arai, “10 Gbps operation of top air-clad lateral junction waveguide-type photodiodes,” Jpn. J. Appl. Phys. 52(11R), 118002 (2013).
[Crossref]

T. Shindo, M. Futami, K. Doi, T. Amemiya, N. Nishiyama, and S. Arai, “Design of lateral current injection type membrane distributed-feedback lasers for on-chip optical interconnections,” IEEE J. Sel. Top. Quantum Electron. 19(4), 1502009 (2013).
[Crossref]

T T. Shindo, T. Okumura, H. Ito, T. Koguchi, D. Takahashi, Y. Atsumi, J. Kang, R. Osabe, T. Amemiya, N. Nishiyama, and S. Arai, “Lateral-current-injection distributed feedback laser with surface grating structure,” IEEE J. Sel. Top. Quantum Electron. 17(5), 1175–1182 (2011).
[Crossref]

Arai, S.

Z. Gu, T. Amemiya, A. Ishikawa, J. Kang, T. Hiratani, Y. Hayashi, J. Suzuki, N. Nishiyama, T. Tanaka, and S. Arai, “Investigation of optical interconnection by using photonic wire bonding,” J. Laser Micro/Nanoeng. 10(2), 148–153 (2015).
[Crossref]

D. Inoue, J. Lee, K. Doi, T. Hiratani, Y. Atsuji, T. Amemiya, N. Nishiyama, and S. Arai, “Room-temperature continuous-wave operation of GaInAsP/InP lateral-current-injection membrane laser bonded on Si substrate,” Appl. Phys. Express 7(7), 072701 (2014).
[Crossref]

K. Doi, T. Shindo, J. Lee, T. Amemiya, N. Nishiyama, and S. Arai, “Thermal analysis of lateral current injection membrane distributed feedback laser,” IEEE J. Quantum Electron. 50(5), 321–326 (2014).
[Crossref]

T. Shindo, M. Futami, K. Doi, T. Amemiya, N. Nishiyama, and S. Arai, “Design of lateral current injection type membrane distributed-feedback lasers for on-chip optical interconnections,” IEEE J. Sel. Top. Quantum Electron. 19(4), 1502009 (2013).
[Crossref]

T. Shindo, T. Koguchi, M. Futami, K. Doi, Y. Yamahara, J. Lee, T. Amemiya, N. Nishiyama, and S. Arai, “10 Gbps operation of top air-clad lateral junction waveguide-type photodiodes,” Jpn. J. Appl. Phys. 52(11R), 118002 (2013).
[Crossref]

T T. Shindo, T. Okumura, H. Ito, T. Koguchi, D. Takahashi, Y. Atsumi, J. Kang, R. Osabe, T. Amemiya, N. Nishiyama, and S. Arai, “Lateral-current-injection distributed feedback laser with surface grating structure,” IEEE J. Sel. Top. Quantum Electron. 17(5), 1175–1182 (2011).
[Crossref]

Arrighi, A.

S. Srinivasan, A. Arrighi, M. J. R. Heck, J. Hutchinson, E. Norberg, G. Fish, and J. E. Bowers, “Harmonically mode-locked hybrid silicon laser with intra-cavity filter to suppress supermode noise,” IEEE J. Sel. Top. Quantum Electron. 20(4), 1100208 (2014).
[Crossref]

Atsuji, Y.

D. Inoue, J. Lee, K. Doi, T. Hiratani, Y. Atsuji, T. Amemiya, N. Nishiyama, and S. Arai, “Room-temperature continuous-wave operation of GaInAsP/InP lateral-current-injection membrane laser bonded on Si substrate,” Appl. Phys. Express 7(7), 072701 (2014).
[Crossref]

Atsumi, Y.

T T. Shindo, T. Okumura, H. Ito, T. Koguchi, D. Takahashi, Y. Atsumi, J. Kang, R. Osabe, T. Amemiya, N. Nishiyama, and S. Arai, “Lateral-current-injection distributed feedback laser with surface grating structure,” IEEE J. Sel. Top. Quantum Electron. 17(5), 1175–1182 (2011).
[Crossref]

Balthasar, G.

C. Koos, J. Leuthold, W. Freude, N. Lindenmann, S. Koeber, G. Balthasar, J. Hoffmann, T. Hoose, P. Huebner, D. Hillerkuss, and R. Schmogrow, “Photonic wire bonding: connecting nanophotonic circuits across chip boundaries,” Proc. SPIE 8613, 86130W (2013).
[Crossref]

N. Lindenmann, G. Balthasar, D. Hillerkuss, R. Schmogrow, M. Jordan, J. Leuthold, W. Freude, and C. Koos, “Photonic wire bonding: a novel concept for chip-scale interconnects,” Opt. Express 20(16), 17667–17677 (2012).
[Crossref] [PubMed]

Bauters, J. F.

M. J. R. Heck, J. F. Bauters, M. L. Davenport, J. K. Doylend, S. Jain, G. Kurczveil, S. Srinivasan, Y. Tang, and J. E. Bowers, “Hybrid silicon photonic integrated circuit technology,” IEEE J. Sel. Top. Quantum Electron. 19(4), 6100117 (2013).
[Crossref]

Ben Bakir, B.

Bordel, D.

Bowers, J.

G. Roelkens, L. Liu, D. Liang, R. Jones, A. Fang, B. Koch, and J. Bowers, “III-V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photonics Rev. 4(6), 751–779 (2010).
[Crossref]

Bowers, J. E.

S. Srinivasan, A. Arrighi, M. J. R. Heck, J. Hutchinson, E. Norberg, G. Fish, and J. E. Bowers, “Harmonically mode-locked hybrid silicon laser with intra-cavity filter to suppress supermode noise,” IEEE J. Sel. Top. Quantum Electron. 20(4), 1100208 (2014).
[Crossref]

C. Zhang, S. Srinivasan, Y. Tang, M. J. R. Heck, M. L. Davenport, and J. E. Bowers, “Low threshold and high speed short cavity distributed feedback hybrid silicon lasers,” Opt. Express 22(9), 10202–10209 (2014).
[Crossref] [PubMed]

M. J. R. Heck, J. F. Bauters, M. L. Davenport, J. K. Doylend, S. Jain, G. Kurczveil, S. Srinivasan, Y. Tang, and J. E. Bowers, “Hybrid silicon photonic integrated circuit technology,” IEEE J. Sel. Top. Quantum Electron. 19(4), 6100117 (2013).
[Crossref]

J. E. Bowers, D. Liang, A. Fang, H. Park, R. Jones, and M. Paniccia, “Hybrid silicon lasers: the final frontier to integrated computing,” Opt. Photonics News 21(5), 28–33 (2010).
[Crossref]

A. W. Fang, E. Lively, Y.-H. Kuo, D. Liang, and J. E. Bowers, “A distributed feedback silicon evanescent laser,” Opt. Express 16(7), 4413–4419 (2008).
[Crossref] [PubMed]

Brodeur, A.

Canegallo, R.

A. Fazzi, R. Canegallo, L. Ciccarelli, L. Magagni, F. Natali, E. Jung, P. Rolandi, and R. Guerrieri, “3-D capacitive interconnections with mono-and bi-directional capabilities,” IEEE J. Solid-State Circuits 43(1), 275–284 (2008).
[Crossref]

Chen, R. T.

Ciccarelli, L.

A. Fazzi, R. Canegallo, L. Ciccarelli, L. Magagni, F. Natali, E. Jung, P. Rolandi, and R. Guerrieri, “3-D capacitive interconnections with mono-and bi-directional capabilities,” IEEE J. Solid-State Circuits 43(1), 275–284 (2008).
[Crossref]

Davenport, M. L.

C. Zhang, S. Srinivasan, Y. Tang, M. J. R. Heck, M. L. Davenport, and J. E. Bowers, “Low threshold and high speed short cavity distributed feedback hybrid silicon lasers,” Opt. Express 22(9), 10202–10209 (2014).
[Crossref] [PubMed]

M. J. R. Heck, J. F. Bauters, M. L. Davenport, J. K. Doylend, S. Jain, G. Kurczveil, S. Srinivasan, Y. Tang, and J. E. Bowers, “Hybrid silicon photonic integrated circuit technology,” IEEE J. Sel. Top. Quantum Electron. 19(4), 6100117 (2013).
[Crossref]

Descos, A.

Doi, K.

K. Doi, T. Shindo, J. Lee, T. Amemiya, N. Nishiyama, and S. Arai, “Thermal analysis of lateral current injection membrane distributed feedback laser,” IEEE J. Quantum Electron. 50(5), 321–326 (2014).
[Crossref]

D. Inoue, J. Lee, K. Doi, T. Hiratani, Y. Atsuji, T. Amemiya, N. Nishiyama, and S. Arai, “Room-temperature continuous-wave operation of GaInAsP/InP lateral-current-injection membrane laser bonded on Si substrate,” Appl. Phys. Express 7(7), 072701 (2014).
[Crossref]

T. Shindo, T. Koguchi, M. Futami, K. Doi, Y. Yamahara, J. Lee, T. Amemiya, N. Nishiyama, and S. Arai, “10 Gbps operation of top air-clad lateral junction waveguide-type photodiodes,” Jpn. J. Appl. Phys. 52(11R), 118002 (2013).
[Crossref]

T. Shindo, M. Futami, K. Doi, T. Amemiya, N. Nishiyama, and S. Arai, “Design of lateral current injection type membrane distributed-feedback lasers for on-chip optical interconnections,” IEEE J. Sel. Top. Quantum Electron. 19(4), 1502009 (2013).
[Crossref]

Dou, X.

Doylend, J. K.

M. J. R. Heck, J. F. Bauters, M. L. Davenport, J. K. Doylend, S. Jain, G. Kurczveil, S. Srinivasan, Y. Tang, and J. E. Bowers, “Hybrid silicon photonic integrated circuit technology,” IEEE J. Sel. Top. Quantum Electron. 19(4), 6100117 (2013).
[Crossref]

Duan, G. H.

Duprez, H.

Fang, A.

J. E. Bowers, D. Liang, A. Fang, H. Park, R. Jones, and M. Paniccia, “Hybrid silicon lasers: the final frontier to integrated computing,” Opt. Photonics News 21(5), 28–33 (2010).
[Crossref]

G. Roelkens, L. Liu, D. Liang, R. Jones, A. Fang, B. Koch, and J. Bowers, “III-V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photonics Rev. 4(6), 751–779 (2010).
[Crossref]

Fang, A. W.

Fazzi, A.

A. Fazzi, R. Canegallo, L. Ciccarelli, L. Magagni, F. Natali, E. Jung, P. Rolandi, and R. Guerrieri, “3-D capacitive interconnections with mono-and bi-directional capabilities,” IEEE J. Solid-State Circuits 43(1), 275–284 (2008).
[Crossref]

Fedeli, J. M.

Ferrotti, T.

Fish, G.

S. Srinivasan, A. Arrighi, M. J. R. Heck, J. Hutchinson, E. Norberg, G. Fish, and J. E. Bowers, “Harmonically mode-locked hybrid silicon laser with intra-cavity filter to suppress supermode noise,” IEEE J. Sel. Top. Quantum Electron. 20(4), 1100208 (2014).
[Crossref]

Freude, W.

C. Koos, J. Leuthold, W. Freude, N. Lindenmann, S. Koeber, G. Balthasar, J. Hoffmann, T. Hoose, P. Huebner, D. Hillerkuss, and R. Schmogrow, “Photonic wire bonding: connecting nanophotonic circuits across chip boundaries,” Proc. SPIE 8613, 86130W (2013).
[Crossref]

N. Lindenmann, G. Balthasar, D. Hillerkuss, R. Schmogrow, M. Jordan, J. Leuthold, W. Freude, and C. Koos, “Photonic wire bonding: a novel concept for chip-scale interconnects,” Opt. Express 20(16), 17667–17677 (2012).
[Crossref] [PubMed]

Futami, M.

T. Shindo, T. Koguchi, M. Futami, K. Doi, Y. Yamahara, J. Lee, T. Amemiya, N. Nishiyama, and S. Arai, “10 Gbps operation of top air-clad lateral junction waveguide-type photodiodes,” Jpn. J. Appl. Phys. 52(11R), 118002 (2013).
[Crossref]

T. Shindo, M. Futami, K. Doi, T. Amemiya, N. Nishiyama, and S. Arai, “Design of lateral current injection type membrane distributed-feedback lasers for on-chip optical interconnections,” IEEE J. Sel. Top. Quantum Electron. 19(4), 1502009 (2013).
[Crossref]

García, J. F.

Gu, Z.

Z. Gu, T. Amemiya, A. Ishikawa, J. Kang, T. Hiratani, Y. Hayashi, J. Suzuki, N. Nishiyama, T. Tanaka, and S. Arai, “Investigation of optical interconnection by using photonic wire bonding,” J. Laser Micro/Nanoeng. 10(2), 148–153 (2015).
[Crossref]

Guerrieri, R.

A. Fazzi, R. Canegallo, L. Ciccarelli, L. Magagni, F. Natali, E. Jung, P. Rolandi, and R. Guerrieri, “3-D capacitive interconnections with mono-and bi-directional capabilities,” IEEE J. Solid-State Circuits 43(1), 275–284 (2008).
[Crossref]

Hassan, K.

Hayashi, Y.

Z. Gu, T. Amemiya, A. Ishikawa, J. Kang, T. Hiratani, Y. Hayashi, J. Suzuki, N. Nishiyama, T. Tanaka, and S. Arai, “Investigation of optical interconnection by using photonic wire bonding,” J. Laser Micro/Nanoeng. 10(2), 148–153 (2015).
[Crossref]

Heck, J. M.

S. Stankovic, R. Jones, M. N. Sysak, J. M. Heck, G. Roelkens, and D. Van Thourhout, “1310 nm hybrid III-V/Si Fabry-Perot laser based on adhesive bonding,” IEEE Photonics Technol. Lett. 23(23), 1781–1783 (2011).
[Crossref]

Heck, M. J. R.

S. Srinivasan, A. Arrighi, M. J. R. Heck, J. Hutchinson, E. Norberg, G. Fish, and J. E. Bowers, “Harmonically mode-locked hybrid silicon laser with intra-cavity filter to suppress supermode noise,” IEEE J. Sel. Top. Quantum Electron. 20(4), 1100208 (2014).
[Crossref]

C. Zhang, S. Srinivasan, Y. Tang, M. J. R. Heck, M. L. Davenport, and J. E. Bowers, “Low threshold and high speed short cavity distributed feedback hybrid silicon lasers,” Opt. Express 22(9), 10202–10209 (2014).
[Crossref] [PubMed]

M. J. R. Heck, J. F. Bauters, M. L. Davenport, J. K. Doylend, S. Jain, G. Kurczveil, S. Srinivasan, Y. Tang, and J. E. Bowers, “Hybrid silicon photonic integrated circuit technology,” IEEE J. Sel. Top. Quantum Electron. 19(4), 6100117 (2013).
[Crossref]

Hillerkuss, D.

C. Koos, J. Leuthold, W. Freude, N. Lindenmann, S. Koeber, G. Balthasar, J. Hoffmann, T. Hoose, P. Huebner, D. Hillerkuss, and R. Schmogrow, “Photonic wire bonding: connecting nanophotonic circuits across chip boundaries,” Proc. SPIE 8613, 86130W (2013).
[Crossref]

N. Lindenmann, G. Balthasar, D. Hillerkuss, R. Schmogrow, M. Jordan, J. Leuthold, W. Freude, and C. Koos, “Photonic wire bonding: a novel concept for chip-scale interconnects,” Opt. Express 20(16), 17667–17677 (2012).
[Crossref] [PubMed]

Hiratani, T.

Z. Gu, T. Amemiya, A. Ishikawa, J. Kang, T. Hiratani, Y. Hayashi, J. Suzuki, N. Nishiyama, T. Tanaka, and S. Arai, “Investigation of optical interconnection by using photonic wire bonding,” J. Laser Micro/Nanoeng. 10(2), 148–153 (2015).
[Crossref]

D. Inoue, J. Lee, K. Doi, T. Hiratani, Y. Atsuji, T. Amemiya, N. Nishiyama, and S. Arai, “Room-temperature continuous-wave operation of GaInAsP/InP lateral-current-injection membrane laser bonded on Si substrate,” Appl. Phys. Express 7(7), 072701 (2014).
[Crossref]

Hoffmann, J.

C. Koos, J. Leuthold, W. Freude, N. Lindenmann, S. Koeber, G. Balthasar, J. Hoffmann, T. Hoose, P. Huebner, D. Hillerkuss, and R. Schmogrow, “Photonic wire bonding: connecting nanophotonic circuits across chip boundaries,” Proc. SPIE 8613, 86130W (2013).
[Crossref]

Hoose, T.

C. Koos, J. Leuthold, W. Freude, N. Lindenmann, S. Koeber, G. Balthasar, J. Hoffmann, T. Hoose, P. Huebner, D. Hillerkuss, and R. Schmogrow, “Photonic wire bonding: connecting nanophotonic circuits across chip boundaries,” Proc. SPIE 8613, 86130W (2013).
[Crossref]

Hosseini, A.

Huebner, P.

C. Koos, J. Leuthold, W. Freude, N. Lindenmann, S. Koeber, G. Balthasar, J. Hoffmann, T. Hoose, P. Huebner, D. Hillerkuss, and R. Schmogrow, “Photonic wire bonding: connecting nanophotonic circuits across chip boundaries,” Proc. SPIE 8613, 86130W (2013).
[Crossref]

Hutchinson, J.

S. Srinivasan, A. Arrighi, M. J. R. Heck, J. Hutchinson, E. Norberg, G. Fish, and J. E. Bowers, “Harmonically mode-locked hybrid silicon laser with intra-cavity filter to suppress supermode noise,” IEEE J. Sel. Top. Quantum Electron. 20(4), 1100208 (2014).
[Crossref]

Inoue, D.

D. Inoue, J. Lee, K. Doi, T. Hiratani, Y. Atsuji, T. Amemiya, N. Nishiyama, and S. Arai, “Room-temperature continuous-wave operation of GaInAsP/InP lateral-current-injection membrane laser bonded on Si substrate,” Appl. Phys. Express 7(7), 072701 (2014).
[Crossref]

Ishikawa, A.

Z. Gu, T. Amemiya, A. Ishikawa, J. Kang, T. Hiratani, Y. Hayashi, J. Suzuki, N. Nishiyama, T. Tanaka, and S. Arai, “Investigation of optical interconnection by using photonic wire bonding,” J. Laser Micro/Nanoeng. 10(2), 148–153 (2015).
[Crossref]

Ito, H.

T T. Shindo, T. Okumura, H. Ito, T. Koguchi, D. Takahashi, Y. Atsumi, J. Kang, R. Osabe, T. Amemiya, N. Nishiyama, and S. Arai, “Lateral-current-injection distributed feedback laser with surface grating structure,” IEEE J. Sel. Top. Quantum Electron. 17(5), 1175–1182 (2011).
[Crossref]

Jain, S.

M. J. R. Heck, J. F. Bauters, M. L. Davenport, J. K. Doylend, S. Jain, G. Kurczveil, S. Srinivasan, Y. Tang, and J. E. Bowers, “Hybrid silicon photonic integrated circuit technology,” IEEE J. Sel. Top. Quantum Electron. 19(4), 6100117 (2013).
[Crossref]

Jany, C.

Jones, R.

S. Stankovic, R. Jones, M. N. Sysak, J. M. Heck, G. Roelkens, and D. Van Thourhout, “1310 nm hybrid III-V/Si Fabry-Perot laser based on adhesive bonding,” IEEE Photonics Technol. Lett. 23(23), 1781–1783 (2011).
[Crossref]

J. E. Bowers, D. Liang, A. Fang, H. Park, R. Jones, and M. Paniccia, “Hybrid silicon lasers: the final frontier to integrated computing,” Opt. Photonics News 21(5), 28–33 (2010).
[Crossref]

G. Roelkens, L. Liu, D. Liang, R. Jones, A. Fang, B. Koch, and J. Bowers, “III-V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photonics Rev. 4(6), 751–779 (2010).
[Crossref]

Jordan, M.

Jung, E.

A. Fazzi, R. Canegallo, L. Ciccarelli, L. Magagni, F. Natali, E. Jung, P. Rolandi, and R. Guerrieri, “3-D capacitive interconnections with mono-and bi-directional capabilities,” IEEE J. Solid-State Circuits 43(1), 275–284 (2008).
[Crossref]

Kada, M.

M. Kada, “Development of functionally innovative 3D-integrated circuit (dream chip) technology/high- density 3D-integration technology for multifunctional devices,” in IEEE International Conference on 3D System Integration (3DIC) (IEEE, 2009), pp. 1–6.
[Crossref]

Kang, J.

Z. Gu, T. Amemiya, A. Ishikawa, J. Kang, T. Hiratani, Y. Hayashi, J. Suzuki, N. Nishiyama, T. Tanaka, and S. Arai, “Investigation of optical interconnection by using photonic wire bonding,” J. Laser Micro/Nanoeng. 10(2), 148–153 (2015).
[Crossref]

T T. Shindo, T. Okumura, H. Ito, T. Koguchi, D. Takahashi, Y. Atsumi, J. Kang, R. Osabe, T. Amemiya, N. Nishiyama, and S. Arai, “Lateral-current-injection distributed feedback laser with surface grating structure,” IEEE J. Sel. Top. Quantum Electron. 17(5), 1175–1182 (2011).
[Crossref]

Keyvaninia, S.

Koch, B.

G. Roelkens, L. Liu, D. Liang, R. Jones, A. Fang, B. Koch, and J. Bowers, “III-V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photonics Rev. 4(6), 751–779 (2010).
[Crossref]

Koeber, S.

C. Koos, J. Leuthold, W. Freude, N. Lindenmann, S. Koeber, G. Balthasar, J. Hoffmann, T. Hoose, P. Huebner, D. Hillerkuss, and R. Schmogrow, “Photonic wire bonding: connecting nanophotonic circuits across chip boundaries,” Proc. SPIE 8613, 86130W (2013).
[Crossref]

Koguchi, T.

T. Shindo, T. Koguchi, M. Futami, K. Doi, Y. Yamahara, J. Lee, T. Amemiya, N. Nishiyama, and S. Arai, “10 Gbps operation of top air-clad lateral junction waveguide-type photodiodes,” Jpn. J. Appl. Phys. 52(11R), 118002 (2013).
[Crossref]

T T. Shindo, T. Okumura, H. Ito, T. Koguchi, D. Takahashi, Y. Atsumi, J. Kang, R. Osabe, T. Amemiya, N. Nishiyama, and S. Arai, “Lateral-current-injection distributed feedback laser with surface grating structure,” IEEE J. Sel. Top. Quantum Electron. 17(5), 1175–1182 (2011).
[Crossref]

Koos, C.

C. Koos, J. Leuthold, W. Freude, N. Lindenmann, S. Koeber, G. Balthasar, J. Hoffmann, T. Hoose, P. Huebner, D. Hillerkuss, and R. Schmogrow, “Photonic wire bonding: connecting nanophotonic circuits across chip boundaries,” Proc. SPIE 8613, 86130W (2013).
[Crossref]

N. Lindenmann, G. Balthasar, D. Hillerkuss, R. Schmogrow, M. Jordan, J. Leuthold, W. Freude, and C. Koos, “Photonic wire bonding: a novel concept for chip-scale interconnects,” Opt. Express 20(16), 17667–17677 (2012).
[Crossref] [PubMed]

Kuo, Y.-H.

Kurczveil, G.

M. J. R. Heck, J. F. Bauters, M. L. Davenport, J. K. Doylend, S. Jain, G. Kurczveil, S. Srinivasan, Y. Tang, and J. E. Bowers, “Hybrid silicon photonic integrated circuit technology,” IEEE J. Sel. Top. Quantum Electron. 19(4), 6100117 (2013).
[Crossref]

Lamponi, M.

Le Liepvre, A.

Lee, J.

K. Doi, T. Shindo, J. Lee, T. Amemiya, N. Nishiyama, and S. Arai, “Thermal analysis of lateral current injection membrane distributed feedback laser,” IEEE J. Quantum Electron. 50(5), 321–326 (2014).
[Crossref]

D. Inoue, J. Lee, K. Doi, T. Hiratani, Y. Atsuji, T. Amemiya, N. Nishiyama, and S. Arai, “Room-temperature continuous-wave operation of GaInAsP/InP lateral-current-injection membrane laser bonded on Si substrate,” Appl. Phys. Express 7(7), 072701 (2014).
[Crossref]

T. Shindo, T. Koguchi, M. Futami, K. Doi, Y. Yamahara, J. Lee, T. Amemiya, N. Nishiyama, and S. Arai, “10 Gbps operation of top air-clad lateral junction waveguide-type photodiodes,” Jpn. J. Appl. Phys. 52(11R), 118002 (2013).
[Crossref]

Lelarge, F.

Leuthold, J.

C. Koos, J. Leuthold, W. Freude, N. Lindenmann, S. Koeber, G. Balthasar, J. Hoffmann, T. Hoose, P. Huebner, D. Hillerkuss, and R. Schmogrow, “Photonic wire bonding: connecting nanophotonic circuits across chip boundaries,” Proc. SPIE 8613, 86130W (2013).
[Crossref]

N. Lindenmann, G. Balthasar, D. Hillerkuss, R. Schmogrow, M. Jordan, J. Leuthold, W. Freude, and C. Koos, “Photonic wire bonding: a novel concept for chip-scale interconnects,” Opt. Express 20(16), 17667–17677 (2012).
[Crossref] [PubMed]

Liang, D.

G. Roelkens, L. Liu, D. Liang, R. Jones, A. Fang, B. Koch, and J. Bowers, “III-V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photonics Rev. 4(6), 751–779 (2010).
[Crossref]

J. E. Bowers, D. Liang, A. Fang, H. Park, R. Jones, and M. Paniccia, “Hybrid silicon lasers: the final frontier to integrated computing,” Opt. Photonics News 21(5), 28–33 (2010).
[Crossref]

A. W. Fang, E. Lively, Y.-H. Kuo, D. Liang, and J. E. Bowers, “A distributed feedback silicon evanescent laser,” Opt. Express 16(7), 4413–4419 (2008).
[Crossref] [PubMed]

Lin, X.

Lindenmann, N.

C. Koos, J. Leuthold, W. Freude, N. Lindenmann, S. Koeber, G. Balthasar, J. Hoffmann, T. Hoose, P. Huebner, D. Hillerkuss, and R. Schmogrow, “Photonic wire bonding: connecting nanophotonic circuits across chip boundaries,” Proc. SPIE 8613, 86130W (2013).
[Crossref]

N. Lindenmann, G. Balthasar, D. Hillerkuss, R. Schmogrow, M. Jordan, J. Leuthold, W. Freude, and C. Koos, “Photonic wire bonding: a novel concept for chip-scale interconnects,” Opt. Express 20(16), 17667–17677 (2012).
[Crossref] [PubMed]

Liu, L.

G. Roelkens, L. Liu, D. Liang, R. Jones, A. Fang, B. Koch, and J. Bowers, “III-V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photonics Rev. 4(6), 751–779 (2010).
[Crossref]

Liu, Y.

Y. Liu, D. D. Nolte, and L. J. Pyrak-Nolte, “Large-format fabrication by two-photon polymerization of SU-8,” Appl. Phys., A Mater. Sci. Process. 100(1), 181–191 (2010).
[Crossref]

Lively, E.

Magagni, L.

A. Fazzi, R. Canegallo, L. Ciccarelli, L. Magagni, F. Natali, E. Jung, P. Rolandi, and R. Guerrieri, “3-D capacitive interconnections with mono-and bi-directional capabilities,” IEEE J. Solid-State Circuits 43(1), 275–284 (2008).
[Crossref]

Make, D.

Mazur, E.

Menezo, S.

Natali, F.

A. Fazzi, R. Canegallo, L. Ciccarelli, L. Magagni, F. Natali, E. Jung, P. Rolandi, and R. Guerrieri, “3-D capacitive interconnections with mono-and bi-directional capabilities,” IEEE J. Solid-State Circuits 43(1), 275–284 (2008).
[Crossref]

Nishiyama, N.

Z. Gu, T. Amemiya, A. Ishikawa, J. Kang, T. Hiratani, Y. Hayashi, J. Suzuki, N. Nishiyama, T. Tanaka, and S. Arai, “Investigation of optical interconnection by using photonic wire bonding,” J. Laser Micro/Nanoeng. 10(2), 148–153 (2015).
[Crossref]

D. Inoue, J. Lee, K. Doi, T. Hiratani, Y. Atsuji, T. Amemiya, N. Nishiyama, and S. Arai, “Room-temperature continuous-wave operation of GaInAsP/InP lateral-current-injection membrane laser bonded on Si substrate,” Appl. Phys. Express 7(7), 072701 (2014).
[Crossref]

K. Doi, T. Shindo, J. Lee, T. Amemiya, N. Nishiyama, and S. Arai, “Thermal analysis of lateral current injection membrane distributed feedback laser,” IEEE J. Quantum Electron. 50(5), 321–326 (2014).
[Crossref]

T. Shindo, T. Koguchi, M. Futami, K. Doi, Y. Yamahara, J. Lee, T. Amemiya, N. Nishiyama, and S. Arai, “10 Gbps operation of top air-clad lateral junction waveguide-type photodiodes,” Jpn. J. Appl. Phys. 52(11R), 118002 (2013).
[Crossref]

T. Shindo, M. Futami, K. Doi, T. Amemiya, N. Nishiyama, and S. Arai, “Design of lateral current injection type membrane distributed-feedback lasers for on-chip optical interconnections,” IEEE J. Sel. Top. Quantum Electron. 19(4), 1502009 (2013).
[Crossref]

T T. Shindo, T. Okumura, H. Ito, T. Koguchi, D. Takahashi, Y. Atsumi, J. Kang, R. Osabe, T. Amemiya, N. Nishiyama, and S. Arai, “Lateral-current-injection distributed feedback laser with surface grating structure,” IEEE J. Sel. Top. Quantum Electron. 17(5), 1175–1182 (2011).
[Crossref]

Nolte, D. D.

Y. Liu, D. D. Nolte, and L. J. Pyrak-Nolte, “Large-format fabrication by two-photon polymerization of SU-8,” Appl. Phys., A Mater. Sci. Process. 100(1), 181–191 (2010).
[Crossref]

Norberg, E.

S. Srinivasan, A. Arrighi, M. J. R. Heck, J. Hutchinson, E. Norberg, G. Fish, and J. E. Bowers, “Harmonically mode-locked hybrid silicon laser with intra-cavity filter to suppress supermode noise,” IEEE J. Sel. Top. Quantum Electron. 20(4), 1100208 (2014).
[Crossref]

Okumura, T.

T T. Shindo, T. Okumura, H. Ito, T. Koguchi, D. Takahashi, Y. Atsumi, J. Kang, R. Osabe, T. Amemiya, N. Nishiyama, and S. Arai, “Lateral-current-injection distributed feedback laser with surface grating structure,” IEEE J. Sel. Top. Quantum Electron. 17(5), 1175–1182 (2011).
[Crossref]

Osabe, R.

T T. Shindo, T. Okumura, H. Ito, T. Koguchi, D. Takahashi, Y. Atsumi, J. Kang, R. Osabe, T. Amemiya, N. Nishiyama, and S. Arai, “Lateral-current-injection distributed feedback laser with surface grating structure,” IEEE J. Sel. Top. Quantum Electron. 17(5), 1175–1182 (2011).
[Crossref]

Paniccia, M.

J. E. Bowers, D. Liang, A. Fang, H. Park, R. Jones, and M. Paniccia, “Hybrid silicon lasers: the final frontier to integrated computing,” Opt. Photonics News 21(5), 28–33 (2010).
[Crossref]

Park, H.

J. E. Bowers, D. Liang, A. Fang, H. Park, R. Jones, and M. Paniccia, “Hybrid silicon lasers: the final frontier to integrated computing,” Opt. Photonics News 21(5), 28–33 (2010).
[Crossref]

Pyrak-Nolte, L. J.

Y. Liu, D. D. Nolte, and L. J. Pyrak-Nolte, “Large-format fabrication by two-photon polymerization of SU-8,” Appl. Phys., A Mater. Sci. Process. 100(1), 181–191 (2010).
[Crossref]

Roelkens, G.

S. Keyvaninia, G. Roelkens, D. Van Thourhout, C. Jany, M. Lamponi, A. Le Liepvre, F. Lelarge, D. Make, G. H. Duan, D. Bordel, and J. M. Fedeli, “Demonstration of a heterogeneously integrated III-V/SOI single wavelength tunable laser,” Opt. Express 21(3), 3784–3792 (2013).
[Crossref] [PubMed]

S. Stankovic, R. Jones, M. N. Sysak, J. M. Heck, G. Roelkens, and D. Van Thourhout, “1310 nm hybrid III-V/Si Fabry-Perot laser based on adhesive bonding,” IEEE Photonics Technol. Lett. 23(23), 1781–1783 (2011).
[Crossref]

G. Roelkens, L. Liu, D. Liang, R. Jones, A. Fang, B. Koch, and J. Bowers, “III-V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photonics Rev. 4(6), 751–779 (2010).
[Crossref]

Rolandi, P.

A. Fazzi, R. Canegallo, L. Ciccarelli, L. Magagni, F. Natali, E. Jung, P. Rolandi, and R. Guerrieri, “3-D capacitive interconnections with mono-and bi-directional capabilities,” IEEE J. Solid-State Circuits 43(1), 275–284 (2008).
[Crossref]

Schaffer, C. B.

Schmogrow, R.

C. Koos, J. Leuthold, W. Freude, N. Lindenmann, S. Koeber, G. Balthasar, J. Hoffmann, T. Hoose, P. Huebner, D. Hillerkuss, and R. Schmogrow, “Photonic wire bonding: connecting nanophotonic circuits across chip boundaries,” Proc. SPIE 8613, 86130W (2013).
[Crossref]

N. Lindenmann, G. Balthasar, D. Hillerkuss, R. Schmogrow, M. Jordan, J. Leuthold, W. Freude, and C. Koos, “Photonic wire bonding: a novel concept for chip-scale interconnects,” Opt. Express 20(16), 17667–17677 (2012).
[Crossref] [PubMed]

Sciancalepore, C.

Seassal, C.

Shindo, T T.

T T. Shindo, T. Okumura, H. Ito, T. Koguchi, D. Takahashi, Y. Atsumi, J. Kang, R. Osabe, T. Amemiya, N. Nishiyama, and S. Arai, “Lateral-current-injection distributed feedback laser with surface grating structure,” IEEE J. Sel. Top. Quantum Electron. 17(5), 1175–1182 (2011).
[Crossref]

Shindo, T.

K. Doi, T. Shindo, J. Lee, T. Amemiya, N. Nishiyama, and S. Arai, “Thermal analysis of lateral current injection membrane distributed feedback laser,” IEEE J. Quantum Electron. 50(5), 321–326 (2014).
[Crossref]

T. Shindo, T. Koguchi, M. Futami, K. Doi, Y. Yamahara, J. Lee, T. Amemiya, N. Nishiyama, and S. Arai, “10 Gbps operation of top air-clad lateral junction waveguide-type photodiodes,” Jpn. J. Appl. Phys. 52(11R), 118002 (2013).
[Crossref]

T. Shindo, M. Futami, K. Doi, T. Amemiya, N. Nishiyama, and S. Arai, “Design of lateral current injection type membrane distributed-feedback lasers for on-chip optical interconnections,” IEEE J. Sel. Top. Quantum Electron. 19(4), 1502009 (2013).
[Crossref]

Shinohara, H.

H. Shinohara, “Broadband access in Japan: rapidly growing FTTH market,” IEEE Commun. Mag. 43(9), 72–78 (2005).
[Crossref]

Srinivasan, S.

S. Srinivasan, A. Arrighi, M. J. R. Heck, J. Hutchinson, E. Norberg, G. Fish, and J. E. Bowers, “Harmonically mode-locked hybrid silicon laser with intra-cavity filter to suppress supermode noise,” IEEE J. Sel. Top. Quantum Electron. 20(4), 1100208 (2014).
[Crossref]

C. Zhang, S. Srinivasan, Y. Tang, M. J. R. Heck, M. L. Davenport, and J. E. Bowers, “Low threshold and high speed short cavity distributed feedback hybrid silicon lasers,” Opt. Express 22(9), 10202–10209 (2014).
[Crossref] [PubMed]

M. J. R. Heck, J. F. Bauters, M. L. Davenport, J. K. Doylend, S. Jain, G. Kurczveil, S. Srinivasan, Y. Tang, and J. E. Bowers, “Hybrid silicon photonic integrated circuit technology,” IEEE J. Sel. Top. Quantum Electron. 19(4), 6100117 (2013).
[Crossref]

Stankovic, S.

S. Stankovic, R. Jones, M. N. Sysak, J. M. Heck, G. Roelkens, and D. Van Thourhout, “1310 nm hybrid III-V/Si Fabry-Perot laser based on adhesive bonding,” IEEE Photonics Technol. Lett. 23(23), 1781–1783 (2011).
[Crossref]

Subbaraman, H.

Suzuki, J.

Z. Gu, T. Amemiya, A. Ishikawa, J. Kang, T. Hiratani, Y. Hayashi, J. Suzuki, N. Nishiyama, T. Tanaka, and S. Arai, “Investigation of optical interconnection by using photonic wire bonding,” J. Laser Micro/Nanoeng. 10(2), 148–153 (2015).
[Crossref]

Sysak, M. N.

S. Stankovic, R. Jones, M. N. Sysak, J. M. Heck, G. Roelkens, and D. Van Thourhout, “1310 nm hybrid III-V/Si Fabry-Perot laser based on adhesive bonding,” IEEE Photonics Technol. Lett. 23(23), 1781–1783 (2011).
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Takahashi, D.

T T. Shindo, T. Okumura, H. Ito, T. Koguchi, D. Takahashi, Y. Atsumi, J. Kang, R. Osabe, T. Amemiya, N. Nishiyama, and S. Arai, “Lateral-current-injection distributed feedback laser with surface grating structure,” IEEE J. Sel. Top. Quantum Electron. 17(5), 1175–1182 (2011).
[Crossref]

Tanaka, T.

Z. Gu, T. Amemiya, A. Ishikawa, J. Kang, T. Hiratani, Y. Hayashi, J. Suzuki, N. Nishiyama, T. Tanaka, and S. Arai, “Investigation of optical interconnection by using photonic wire bonding,” J. Laser Micro/Nanoeng. 10(2), 148–153 (2015).
[Crossref]

Tang, Y.

C. Zhang, S. Srinivasan, Y. Tang, M. J. R. Heck, M. L. Davenport, and J. E. Bowers, “Low threshold and high speed short cavity distributed feedback hybrid silicon lasers,” Opt. Express 22(9), 10202–10209 (2014).
[Crossref] [PubMed]

M. J. R. Heck, J. F. Bauters, M. L. Davenport, J. K. Doylend, S. Jain, G. Kurczveil, S. Srinivasan, Y. Tang, and J. E. Bowers, “Hybrid silicon photonic integrated circuit technology,” IEEE J. Sel. Top. Quantum Electron. 19(4), 6100117 (2013).
[Crossref]

Van Thourhout, D.

S. Keyvaninia, G. Roelkens, D. Van Thourhout, C. Jany, M. Lamponi, A. Le Liepvre, F. Lelarge, D. Make, G. H. Duan, D. Bordel, and J. M. Fedeli, “Demonstration of a heterogeneously integrated III-V/SOI single wavelength tunable laser,” Opt. Express 21(3), 3784–3792 (2013).
[Crossref] [PubMed]

S. Stankovic, R. Jones, M. N. Sysak, J. M. Heck, G. Roelkens, and D. Van Thourhout, “1310 nm hybrid III-V/Si Fabry-Perot laser based on adhesive bonding,” IEEE Photonics Technol. Lett. 23(23), 1781–1783 (2011).
[Crossref]

Yamahara, Y.

T. Shindo, T. Koguchi, M. Futami, K. Doi, Y. Yamahara, J. Lee, T. Amemiya, N. Nishiyama, and S. Arai, “10 Gbps operation of top air-clad lateral junction waveguide-type photodiodes,” Jpn. J. Appl. Phys. 52(11R), 118002 (2013).
[Crossref]

Zhang, C.

Appl. Phys. Express (1)

D. Inoue, J. Lee, K. Doi, T. Hiratani, Y. Atsuji, T. Amemiya, N. Nishiyama, and S. Arai, “Room-temperature continuous-wave operation of GaInAsP/InP lateral-current-injection membrane laser bonded on Si substrate,” Appl. Phys. Express 7(7), 072701 (2014).
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Y. Liu, D. D. Nolte, and L. J. Pyrak-Nolte, “Large-format fabrication by two-photon polymerization of SU-8,” Appl. Phys., A Mater. Sci. Process. 100(1), 181–191 (2010).
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K. Doi, T. Shindo, J. Lee, T. Amemiya, N. Nishiyama, and S. Arai, “Thermal analysis of lateral current injection membrane distributed feedback laser,” IEEE J. Quantum Electron. 50(5), 321–326 (2014).
[Crossref]

IEEE J. Sel. Top. Quantum Electron. (4)

T T. Shindo, T. Okumura, H. Ito, T. Koguchi, D. Takahashi, Y. Atsumi, J. Kang, R. Osabe, T. Amemiya, N. Nishiyama, and S. Arai, “Lateral-current-injection distributed feedback laser with surface grating structure,” IEEE J. Sel. Top. Quantum Electron. 17(5), 1175–1182 (2011).
[Crossref]

S. Srinivasan, A. Arrighi, M. J. R. Heck, J. Hutchinson, E. Norberg, G. Fish, and J. E. Bowers, “Harmonically mode-locked hybrid silicon laser with intra-cavity filter to suppress supermode noise,” IEEE J. Sel. Top. Quantum Electron. 20(4), 1100208 (2014).
[Crossref]

M. J. R. Heck, J. F. Bauters, M. L. Davenport, J. K. Doylend, S. Jain, G. Kurczveil, S. Srinivasan, Y. Tang, and J. E. Bowers, “Hybrid silicon photonic integrated circuit technology,” IEEE J. Sel. Top. Quantum Electron. 19(4), 6100117 (2013).
[Crossref]

T. Shindo, M. Futami, K. Doi, T. Amemiya, N. Nishiyama, and S. Arai, “Design of lateral current injection type membrane distributed-feedback lasers for on-chip optical interconnections,” IEEE J. Sel. Top. Quantum Electron. 19(4), 1502009 (2013).
[Crossref]

IEEE J. Solid-State Circuits (1)

A. Fazzi, R. Canegallo, L. Ciccarelli, L. Magagni, F. Natali, E. Jung, P. Rolandi, and R. Guerrieri, “3-D capacitive interconnections with mono-and bi-directional capabilities,” IEEE J. Solid-State Circuits 43(1), 275–284 (2008).
[Crossref]

IEEE Photonics Technol. Lett. (1)

S. Stankovic, R. Jones, M. N. Sysak, J. M. Heck, G. Roelkens, and D. Van Thourhout, “1310 nm hybrid III-V/Si Fabry-Perot laser based on adhesive bonding,” IEEE Photonics Technol. Lett. 23(23), 1781–1783 (2011).
[Crossref]

J. Laser Micro/Nanoeng. (1)

Z. Gu, T. Amemiya, A. Ishikawa, J. Kang, T. Hiratani, Y. Hayashi, J. Suzuki, N. Nishiyama, T. Tanaka, and S. Arai, “Investigation of optical interconnection by using photonic wire bonding,” J. Laser Micro/Nanoeng. 10(2), 148–153 (2015).
[Crossref]

Jpn. J. Appl. Phys. (1)

T. Shindo, T. Koguchi, M. Futami, K. Doi, Y. Yamahara, J. Lee, T. Amemiya, N. Nishiyama, and S. Arai, “10 Gbps operation of top air-clad lateral junction waveguide-type photodiodes,” Jpn. J. Appl. Phys. 52(11R), 118002 (2013).
[Crossref]

Laser Photonics Rev. (1)

G. Roelkens, L. Liu, D. Liang, R. Jones, A. Fang, B. Koch, and J. Bowers, “III-V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photonics Rev. 4(6), 751–779 (2010).
[Crossref]

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A. W. Fang, E. Lively, Y.-H. Kuo, D. Liang, and J. E. Bowers, “A distributed feedback silicon evanescent laser,” Opt. Express 16(7), 4413–4419 (2008).
[Crossref] [PubMed]

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N. Lindenmann, G. Balthasar, D. Hillerkuss, R. Schmogrow, M. Jordan, J. Leuthold, W. Freude, and C. Koos, “Photonic wire bonding: a novel concept for chip-scale interconnects,” Opt. Express 20(16), 17667–17677 (2012).
[Crossref] [PubMed]

S. Keyvaninia, G. Roelkens, D. Van Thourhout, C. Jany, M. Lamponi, A. Le Liepvre, F. Lelarge, D. Make, G. H. Duan, D. Bordel, and J. M. Fedeli, “Demonstration of a heterogeneously integrated III-V/SOI single wavelength tunable laser,” Opt. Express 21(3), 3784–3792 (2013).
[Crossref] [PubMed]

C. Zhang, S. Srinivasan, Y. Tang, M. J. R. Heck, M. L. Davenport, and J. E. Bowers, “Low threshold and high speed short cavity distributed feedback hybrid silicon lasers,” Opt. Express 22(9), 10202–10209 (2014).
[Crossref] [PubMed]

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Figures (8)

Fig. 1
Fig. 1

(a) Concept of inter-chip optical interconnection between two lateral-current-injection (LCI) optical chips based on photonic wire bonding (PWB). (b) Details of the transition section between a polymer PWB waveguide and an LCI-FP laser, together with their mode profiles. (c) The enlarged modal intensity distribution of the core layer of LCI-FP laser and its cross-sectional structure.

Fig. 2
Fig. 2

The calculated equivalent refractive index neq of several low-order modes as a function of the width of the PWB with aspect ratios of (a) 1:1 and (b) 1:3, the coupling efficiency of each mode in the two types of the PWB to the TE0 mode of LCI-FP laser and their modal intensity distribution.

Fig. 3
Fig. 3

Process flow for fabricating photonic wire bonding between two optical chips.

Fig. 4
Fig. 4

Calculation result of the PWB width D in terms of average laser power P with two values of ω0 and fixed scanning speed v = 10 μm/s; the experimental result of the PWB width with fixed scanning speed v = 10 μm/s in terms of the average laser power.

Fig. 5
Fig. 5

Scanning electron microscope images of the fabricated PWB with different laser power (a) P = 56 mW, (b) P = 70 mW, (c) P = 88 mW on a dummy SOI chip.

Fig. 6
Fig. 6

(a) Two dummy SOI chips connected by PWB with different bonding angles ranging from 0° to 35°. (b) Bird’s-eye view of the suspended PWBs between two chips and a cross-sectional image of the pier part of the PWB on the SOI chip taken from an oblique angle by 45 degrees.

Fig. 7
Fig. 7

(a) Optical microscope image of the completed sample. (b) Detailed scanning electron microscope image of PWB. (c) Schematic of optical transmission between the laser and detector chips.

Fig. 8
Fig. 8

(a) Measured photocurrent Ipd of the detector in terms of the injection current to laser I1 under different bias voltages. The lasing characteristic of the laser P1 vs. I1 is given for reference. (b) Result of photosensitivity measurement of the detector.

Equations (5)

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D= ω 0 ln 4 P 2 π 2 ω 0 2 v C th ,
ω 0 = λ πNA .
P 2 = ( 1 R 2 ) R 1 ( 1 R 1 ) R 2 P 1 .
P 3 = I pd η pd .
PWB loss=10log P 3 P 2 10log I pd / η pd 2 P 1 10dB.

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