J. Feng and R. Akimoto, “A three-dimensional silicon nitride polarizing beam splitter,” IEEE Photon. Technol. Lett. 26(7), 706–709 (2014).
[Crossref]
M. Karppinen, N. Salminen, T. Korhonen, T. Alajoki, E. Bosman, G. V. Steenberge, J. Justice, U. Khan, B. Corbett, and A. Boersma, “Optical coupling structure made by imprinting between single-mode polymer waveguide and embedded VCSEL,” Proc. SPIE 9368, 936817 (2015).
R. A. S. Ferreira, P. S. Andre, and L. D. Carlos, “Organic–inorganic hybrid materials towards passive and active architectures for the next generation of optical networks,” Opt. Mater. 32(11), 1397–1409 (2010).
[Crossref]
W. S. Kim, J. H. Lee, S. Y. Shin, B. S. Bae, and Y. C. Kim, “Fabrication of ridge waveguides by UV embossing and stamping of sol-gel hybrid materials,” IEEE Photon. Technol. Lett. 16(8), 1888–1890 (2004).
[Crossref]
D. D. John, M. J. R. Heck, J. F. Bauters, R. Moreira, J. S. Barton, J. E. Bowers, and D. J. Blumenthal, “Multilayer platform for ultra-low-loss waveguide applications,” IEEE Photon. Technol. Lett. 24(11), 876–878 (2012).
[Crossref]
D. D. John, M. J. R. Heck, J. F. Bauters, R. Moreira, J. S. Barton, J. E. Bowers, and D. J. Blumenthal, “Multilayer platform for ultra-low-loss waveguide applications,” IEEE Photon. Technol. Lett. 24(11), 876–878 (2012).
[Crossref]
A. Boersma, B. J. Offrein, J. Duis, J. Delis, M. Ortsiefer, G. V. Steenberge, M. Karpinen, A. V. Blaaderen, and B. Corbett, “Polymer-based optical interconnects using nanoimprint lithography,” Proc. SPIE 8630, 86300Y (2013).
D. D. John, M. J. R. Heck, J. F. Bauters, R. Moreira, J. S. Barton, J. E. Bowers, and D. J. Blumenthal, “Multilayer platform for ultra-low-loss waveguide applications,” IEEE Photon. Technol. Lett. 24(11), 876–878 (2012).
[Crossref]
M. Karppinen, N. Salminen, T. Korhonen, T. Alajoki, E. Bosman, G. V. Steenberge, J. Justice, U. Khan, B. Corbett, and A. Boersma, “Optical coupling structure made by imprinting between single-mode polymer waveguide and embedded VCSEL,” Proc. SPIE 9368, 936817 (2015).
J. Justice, U. Khan, T. Korhonen, A. Boersma, S. Wiegersma, M. Karppinen, and B. Corbett, “Design, fabrication, and characterization of nano-imprinted single-mode waveguide structures for intra-chip optical communications,” Proc. SPIE 9368, 936834 (2015).
A. Boersma, B. J. Offrein, J. Duis, J. Delis, M. Ortsiefer, G. V. Steenberge, M. Karpinen, A. V. Blaaderen, and B. Corbett, “Polymer-based optical interconnects using nanoimprint lithography,” Proc. SPIE 8630, 86300Y (2013).
M. Karppinen, N. Salminen, T. Korhonen, T. Alajoki, E. Bosman, G. V. Steenberge, J. Justice, U. Khan, B. Corbett, and A. Boersma, “Optical coupling structure made by imprinting between single-mode polymer waveguide and embedded VCSEL,” Proc. SPIE 9368, 936817 (2015).
D. D. John, M. J. R. Heck, J. F. Bauters, R. Moreira, J. S. Barton, J. E. Bowers, and D. J. Blumenthal, “Multilayer platform for ultra-low-loss waveguide applications,” IEEE Photon. Technol. Lett. 24(11), 876–878 (2012).
[Crossref]
U. Streppel, P. Dannberg, C. Wächter, A. Bräuer, L. Fröhlich, R. Houbertz, and M. Popall, “New waferscale fabrication method for stacked optical waveguide interconnects and 3D micro-optic structures using photo-responsive (inorganic-organic hybrid) polymers,” Opt. Mater. 21(1-3), 475–483 (2003).
[Crossref]
R. A. S. Ferreira, P. S. Andre, and L. D. Carlos, “Organic–inorganic hybrid materials towards passive and active architectures for the next generation of optical networks,” Opt. Mater. 32(11), 1397–1409 (2010).
[Crossref]
C. T. Chen, P. K. Shen, T. Z. Zhu, C. C. Chang, S. S. Lin, M. Y. Zeng, C. Y. Chiu, H. L. Hsiao, H. C. Lan, Y. C. Lee, Y. S. Lin, and M. L. Wu, “Chip-level 1 × 2 optical interconnects using polymer vertical splitter on silicon substrate,” IEEE Photon. J. 6(2), 7900410 (2014).
[Crossref]
C. T. Chen, P. K. Shen, T. Z. Zhu, C. C. Chang, S. S. Lin, M. Y. Zeng, C. Y. Chiu, H. L. Hsiao, H. C. Lan, Y. C. Lee, Y. S. Lin, and M. L. Wu, “Chip-level 1 × 2 optical interconnects using polymer vertical splitter on silicon substrate,” IEEE Photon. J. 6(2), 7900410 (2014).
[Crossref]
C. T. Chen, P. K. Shen, T. Z. Zhu, C. C. Chang, S. S. Lin, M. Y. Zeng, C. Y. Chiu, H. L. Hsiao, H. C. Lan, Y. C. Lee, Y. S. Lin, and M. L. Wu, “Chip-level 1 × 2 optical interconnects using polymer vertical splitter on silicon substrate,” IEEE Photon. J. 6(2), 7900410 (2014).
[Crossref]
M. Karppinen, N. Salminen, T. Korhonen, T. Alajoki, E. Bosman, G. V. Steenberge, J. Justice, U. Khan, B. Corbett, and A. Boersma, “Optical coupling structure made by imprinting between single-mode polymer waveguide and embedded VCSEL,” Proc. SPIE 9368, 936817 (2015).
J. Justice, U. Khan, T. Korhonen, A. Boersma, S. Wiegersma, M. Karppinen, and B. Corbett, “Design, fabrication, and characterization of nano-imprinted single-mode waveguide structures for intra-chip optical communications,” Proc. SPIE 9368, 936834 (2015).
A. Boersma, B. J. Offrein, J. Duis, J. Delis, M. Ortsiefer, G. V. Steenberge, M. Karpinen, A. V. Blaaderen, and B. Corbett, “Polymer-based optical interconnects using nanoimprint lithography,” Proc. SPIE 8630, 86300Y (2013).
R. Dangel, J. Hofrichter, F. Horst, D. Jubin, A. La Porta, N. Meier, I. M. Soganci, J. Weiss, and B. J. Offrein, “Polymer waveguides for electro-optical integration in data centers and high-performance computers,” Opt. Express 23(4), 4736–4750 (2015).
[Crossref]
[PubMed]
U. Streppel, P. Dannberg, C. Wächter, A. Bräuer, L. Fröhlich, R. Houbertz, and M. Popall, “New waferscale fabrication method for stacked optical waveguide interconnects and 3D micro-optic structures using photo-responsive (inorganic-organic hybrid) polymers,” Opt. Mater. 21(1-3), 475–483 (2003).
[Crossref]
A. Boersma, B. J. Offrein, J. Duis, J. Delis, M. Ortsiefer, G. V. Steenberge, M. Karpinen, A. V. Blaaderen, and B. Corbett, “Polymer-based optical interconnects using nanoimprint lithography,” Proc. SPIE 8630, 86300Y (2013).
A. Boersma, B. J. Offrein, J. Duis, J. Delis, M. Ortsiefer, G. V. Steenberge, M. Karpinen, A. V. Blaaderen, and B. Corbett, “Polymer-based optical interconnects using nanoimprint lithography,” Proc. SPIE 8630, 86300Y (2013).
F. Gu, H. Yu, W. Fang, and L. Tong, “Nanoimprinted polymer micro nanofiber Bragg gratings for high-sensitive strain sensing,” IEEE Photon. Technol. Lett. 25(1), 22–24 (2013).
[Crossref]
J. Feng and R. Akimoto, “A three-dimensional silicon nitride polarizing beam splitter,” IEEE Photon. Technol. Lett. 26(7), 706–709 (2014).
[Crossref]
R. A. S. Ferreira, P. S. Andre, and L. D. Carlos, “Organic–inorganic hybrid materials towards passive and active architectures for the next generation of optical networks,” Opt. Mater. 32(11), 1397–1409 (2010).
[Crossref]
U. Streppel, P. Dannberg, C. Wächter, A. Bräuer, L. Fröhlich, R. Houbertz, and M. Popall, “New waferscale fabrication method for stacked optical waveguide interconnects and 3D micro-optic structures using photo-responsive (inorganic-organic hybrid) polymers,” Opt. Mater. 21(1-3), 475–483 (2003).
[Crossref]
C. Gimkiewicz, H. D. Thiele, C. Zschokke, S. Mahmud-Skender, S. Westenhofer, and M. T. Gale, “Cost-effective fabrication of waveguides for PLCs by replication in UV-curable sol-gel material,” Proc. SPIE 5451, 465–474 (2004).
C. Gimkiewicz, H. D. Thiele, C. Zschokke, S. Mahmud-Skender, S. Westenhofer, and M. T. Gale, “Cost-effective fabrication of waveguides for PLCs by replication in UV-curable sol-gel material,” Proc. SPIE 5451, 465–474 (2004).
F. Gu, H. Yu, W. Fang, and L. Tong, “Nanoimprinted polymer micro nanofiber Bragg gratings for high-sensitive strain sensing,” IEEE Photon. Technol. Lett. 25(1), 22–24 (2013).
[Crossref]
D. D. John, M. J. R. Heck, J. F. Bauters, R. Moreira, J. S. Barton, J. E. Bowers, and D. J. Blumenthal, “Multilayer platform for ultra-low-loss waveguide applications,” IEEE Photon. Technol. Lett. 24(11), 876–878 (2012).
[Crossref]
J. Hiltunen, A. Kokkonen, J. Puustinen, M. Hiltunen, and J. Lappalainen, “UV-imprinted single-mode waveguides with low loss at visible wavelength,” IEEE Photon. Technol. Lett. 25(10), 996–998 (2013).
[Crossref]
M. Wang, J. Hiltunen, S. Uusitalo, J. Puustinen, J. Lappalainen, P. Karioja, and R. Myllylä, “Fabrication of optical inverted-rib waveguides using UV-imprinting,” Microelectron. Eng. 88(2), 175–178 (2011).
[Crossref]
J. Hiltunen, M. Hiltunen, J. Puustinen, J. Lappalainen, and P. Karioja, “Fabrication of optical waveguides by imprinting: usage of positive tone resist as a mould for UV-curable polymer,” Opt. Express 17(25), 22813–22822 (2009).
[PubMed]
J. Hiltunen, A. Kokkonen, J. Puustinen, M. Hiltunen, and J. Lappalainen, “UV-imprinted single-mode waveguides with low loss at visible wavelength,” IEEE Photon. Technol. Lett. 25(10), 996–998 (2013).
[Crossref]
J. Hiltunen, M. Hiltunen, J. Puustinen, J. Lappalainen, and P. Karioja, “Fabrication of optical waveguides by imprinting: usage of positive tone resist as a mould for UV-curable polymer,” Opt. Express 17(25), 22813–22822 (2009).
[PubMed]
R. Dangel, J. Hofrichter, F. Horst, D. Jubin, A. La Porta, N. Meier, I. M. Soganci, J. Weiss, and B. J. Offrein, “Polymer waveguides for electro-optical integration in data centers and high-performance computers,” Opt. Express 23(4), 4736–4750 (2015).
[Crossref]
[PubMed]
M. Horowitz, C. K. K. Yang, and S. Sidiropoulos, “High-speed electrical signaling: overview and limitations,” IEEE Micro 18(1), 12–24 (1998).
[Crossref]
R. Dangel, J. Hofrichter, F. Horst, D. Jubin, A. La Porta, N. Meier, I. M. Soganci, J. Weiss, and B. J. Offrein, “Polymer waveguides for electro-optical integration in data centers and high-performance computers,” Opt. Express 23(4), 4736–4750 (2015).
[Crossref]
[PubMed]
U. Streppel, P. Dannberg, C. Wächter, A. Bräuer, L. Fröhlich, R. Houbertz, and M. Popall, “New waferscale fabrication method for stacked optical waveguide interconnects and 3D micro-optic structures using photo-responsive (inorganic-organic hybrid) polymers,” Opt. Mater. 21(1-3), 475–483 (2003).
[Crossref]
C. T. Chen, P. K. Shen, T. Z. Zhu, C. C. Chang, S. S. Lin, M. Y. Zeng, C. Y. Chiu, H. L. Hsiao, H. C. Lan, Y. C. Lee, Y. S. Lin, and M. L. Wu, “Chip-level 1 × 2 optical interconnects using polymer vertical splitter on silicon substrate,” IEEE Photon. J. 6(2), 7900410 (2014).
[Crossref]
R. Yoshimura, H. Nakagome, S. Imamura, and T. Izawa, “Coupling ratio control of polymeric waveguide couplers by bending,” Electron. Lett. 28(23), 2135–2136 (1992).
[Crossref]
R. Yoshimura, H. Nakagome, S. Imamura, and T. Izawa, “Coupling ratio control of polymeric waveguide couplers by bending,” Electron. Lett. 28(23), 2135–2136 (1992).
[Crossref]
D. D. John, M. J. R. Heck, J. F. Bauters, R. Moreira, J. S. Barton, J. E. Bowers, and D. J. Blumenthal, “Multilayer platform for ultra-low-loss waveguide applications,” IEEE Photon. Technol. Lett. 24(11), 876–878 (2012).
[Crossref]
R. Dangel, J. Hofrichter, F. Horst, D. Jubin, A. La Porta, N. Meier, I. M. Soganci, J. Weiss, and B. J. Offrein, “Polymer waveguides for electro-optical integration in data centers and high-performance computers,” Opt. Express 23(4), 4736–4750 (2015).
[Crossref]
[PubMed]
M. Karppinen, N. Salminen, T. Korhonen, T. Alajoki, E. Bosman, G. V. Steenberge, J. Justice, U. Khan, B. Corbett, and A. Boersma, “Optical coupling structure made by imprinting between single-mode polymer waveguide and embedded VCSEL,” Proc. SPIE 9368, 936817 (2015).
J. Justice, U. Khan, T. Korhonen, A. Boersma, S. Wiegersma, M. Karppinen, and B. Corbett, “Design, fabrication, and characterization of nano-imprinted single-mode waveguide structures for intra-chip optical communications,” Proc. SPIE 9368, 936834 (2015).
M. Wang, J. Hiltunen, S. Uusitalo, J. Puustinen, J. Lappalainen, P. Karioja, and R. Myllylä, “Fabrication of optical inverted-rib waveguides using UV-imprinting,” Microelectron. Eng. 88(2), 175–178 (2011).
[Crossref]
J. Hiltunen, M. Hiltunen, J. Puustinen, J. Lappalainen, and P. Karioja, “Fabrication of optical waveguides by imprinting: usage of positive tone resist as a mould for UV-curable polymer,” Opt. Express 17(25), 22813–22822 (2009).
[PubMed]
A. Boersma, B. J. Offrein, J. Duis, J. Delis, M. Ortsiefer, G. V. Steenberge, M. Karpinen, A. V. Blaaderen, and B. Corbett, “Polymer-based optical interconnects using nanoimprint lithography,” Proc. SPIE 8630, 86300Y (2013).
J. Justice, U. Khan, T. Korhonen, A. Boersma, S. Wiegersma, M. Karppinen, and B. Corbett, “Design, fabrication, and characterization of nano-imprinted single-mode waveguide structures for intra-chip optical communications,” Proc. SPIE 9368, 936834 (2015).
M. Karppinen, N. Salminen, T. Korhonen, T. Alajoki, E. Bosman, G. V. Steenberge, J. Justice, U. Khan, B. Corbett, and A. Boersma, “Optical coupling structure made by imprinting between single-mode polymer waveguide and embedded VCSEL,” Proc. SPIE 9368, 936817 (2015).
T. Korhonen, N. Salminen, A. Kokkonen, N. Masuda, and M. Karppinen, “Multilayer single-mode polymeric waveguides by imprint patterning for optical interconnects,” Proc. SPIE 8991, 899103 (2014).
J. Justice, U. Khan, T. Korhonen, A. Boersma, S. Wiegersma, M. Karppinen, and B. Corbett, “Design, fabrication, and characterization of nano-imprinted single-mode waveguide structures for intra-chip optical communications,” Proc. SPIE 9368, 936834 (2015).
M. Karppinen, N. Salminen, T. Korhonen, T. Alajoki, E. Bosman, G. V. Steenberge, J. Justice, U. Khan, B. Corbett, and A. Boersma, “Optical coupling structure made by imprinting between single-mode polymer waveguide and embedded VCSEL,” Proc. SPIE 9368, 936817 (2015).
W. S. Kim, J. H. Lee, S. Y. Shin, B. S. Bae, and Y. C. Kim, “Fabrication of ridge waveguides by UV embossing and stamping of sol-gel hybrid materials,” IEEE Photon. Technol. Lett. 16(8), 1888–1890 (2004).
[Crossref]
W. S. Kim, J. H. Lee, S. Y. Shin, B. S. Bae, and Y. C. Kim, “Fabrication of ridge waveguides by UV embossing and stamping of sol-gel hybrid materials,” IEEE Photon. Technol. Lett. 16(8), 1888–1890 (2004).
[Crossref]
T. Korhonen, N. Salminen, A. Kokkonen, N. Masuda, and M. Karppinen, “Multilayer single-mode polymeric waveguides by imprint patterning for optical interconnects,” Proc. SPIE 8991, 899103 (2014).
J. Hiltunen, A. Kokkonen, J. Puustinen, M. Hiltunen, and J. Lappalainen, “UV-imprinted single-mode waveguides with low loss at visible wavelength,” IEEE Photon. Technol. Lett. 25(10), 996–998 (2013).
[Crossref]
M. Karppinen, N. Salminen, T. Korhonen, T. Alajoki, E. Bosman, G. V. Steenberge, J. Justice, U. Khan, B. Corbett, and A. Boersma, “Optical coupling structure made by imprinting between single-mode polymer waveguide and embedded VCSEL,” Proc. SPIE 9368, 936817 (2015).
J. Justice, U. Khan, T. Korhonen, A. Boersma, S. Wiegersma, M. Karppinen, and B. Corbett, “Design, fabrication, and characterization of nano-imprinted single-mode waveguide structures for intra-chip optical communications,” Proc. SPIE 9368, 936834 (2015).
T. Korhonen, N. Salminen, A. Kokkonen, N. Masuda, and M. Karppinen, “Multilayer single-mode polymeric waveguides by imprint patterning for optical interconnects,” Proc. SPIE 8991, 899103 (2014).
R. Dangel, J. Hofrichter, F. Horst, D. Jubin, A. La Porta, N. Meier, I. M. Soganci, J. Weiss, and B. J. Offrein, “Polymer waveguides for electro-optical integration in data centers and high-performance computers,” Opt. Express 23(4), 4736–4750 (2015).
[Crossref]
[PubMed]
C. T. Chen, P. K. Shen, T. Z. Zhu, C. C. Chang, S. S. Lin, M. Y. Zeng, C. Y. Chiu, H. L. Hsiao, H. C. Lan, Y. C. Lee, Y. S. Lin, and M. L. Wu, “Chip-level 1 × 2 optical interconnects using polymer vertical splitter on silicon substrate,” IEEE Photon. J. 6(2), 7900410 (2014).
[Crossref]
J. Hiltunen, A. Kokkonen, J. Puustinen, M. Hiltunen, and J. Lappalainen, “UV-imprinted single-mode waveguides with low loss at visible wavelength,” IEEE Photon. Technol. Lett. 25(10), 996–998 (2013).
[Crossref]
M. Wang, J. Hiltunen, S. Uusitalo, J. Puustinen, J. Lappalainen, P. Karioja, and R. Myllylä, “Fabrication of optical inverted-rib waveguides using UV-imprinting,” Microelectron. Eng. 88(2), 175–178 (2011).
[Crossref]
J. Hiltunen, M. Hiltunen, J. Puustinen, J. Lappalainen, and P. Karioja, “Fabrication of optical waveguides by imprinting: usage of positive tone resist as a mould for UV-curable polymer,” Opt. Express 17(25), 22813–22822 (2009).
[PubMed]
M.-C. Oh, M.-H. Lee, and H.-J. Lee, “Polymeric waveguide polarization splitter with a buried birefringent polymer,” IEEE Photon. Technol. Lett. 11(9), 1144–1146 (1999).
[Crossref]
W. S. Kim, J. H. Lee, S. Y. Shin, B. S. Bae, and Y. C. Kim, “Fabrication of ridge waveguides by UV embossing and stamping of sol-gel hybrid materials,” IEEE Photon. Technol. Lett. 16(8), 1888–1890 (2004).
[Crossref]
M.-C. Oh, M.-H. Lee, and H.-J. Lee, “Polymeric waveguide polarization splitter with a buried birefringent polymer,” IEEE Photon. Technol. Lett. 11(9), 1144–1146 (1999).
[Crossref]
C. T. Chen, P. K. Shen, T. Z. Zhu, C. C. Chang, S. S. Lin, M. Y. Zeng, C. Y. Chiu, H. L. Hsiao, H. C. Lan, Y. C. Lee, Y. S. Lin, and M. L. Wu, “Chip-level 1 × 2 optical interconnects using polymer vertical splitter on silicon substrate,” IEEE Photon. J. 6(2), 7900410 (2014).
[Crossref]
C. T. Chen, P. K. Shen, T. Z. Zhu, C. C. Chang, S. S. Lin, M. Y. Zeng, C. Y. Chiu, H. L. Hsiao, H. C. Lan, Y. C. Lee, Y. S. Lin, and M. L. Wu, “Chip-level 1 × 2 optical interconnects using polymer vertical splitter on silicon substrate,” IEEE Photon. J. 6(2), 7900410 (2014).
[Crossref]
C. T. Chen, P. K. Shen, T. Z. Zhu, C. C. Chang, S. S. Lin, M. Y. Zeng, C. Y. Chiu, H. L. Hsiao, H. C. Lan, Y. C. Lee, Y. S. Lin, and M. L. Wu, “Chip-level 1 × 2 optical interconnects using polymer vertical splitter on silicon substrate,” IEEE Photon. J. 6(2), 7900410 (2014).
[Crossref]
C. Gimkiewicz, H. D. Thiele, C. Zschokke, S. Mahmud-Skender, S. Westenhofer, and M. T. Gale, “Cost-effective fabrication of waveguides for PLCs by replication in UV-curable sol-gel material,” Proc. SPIE 5451, 465–474 (2004).
T. Korhonen, N. Salminen, A. Kokkonen, N. Masuda, and M. Karppinen, “Multilayer single-mode polymeric waveguides by imprint patterning for optical interconnects,” Proc. SPIE 8991, 899103 (2014).
R. Dangel, J. Hofrichter, F. Horst, D. Jubin, A. La Porta, N. Meier, I. M. Soganci, J. Weiss, and B. J. Offrein, “Polymer waveguides for electro-optical integration in data centers and high-performance computers,” Opt. Express 23(4), 4736–4750 (2015).
[Crossref]
[PubMed]
D. A. B. Miller, “Physical reasons for optical interconnection,” J. Optoelectron. 11, 155 (1997).
D. D. John, M. J. R. Heck, J. F. Bauters, R. Moreira, J. S. Barton, J. E. Bowers, and D. J. Blumenthal, “Multilayer platform for ultra-low-loss waveguide applications,” IEEE Photon. Technol. Lett. 24(11), 876–878 (2012).
[Crossref]
M. Wang, J. Hiltunen, S. Uusitalo, J. Puustinen, J. Lappalainen, P. Karioja, and R. Myllylä, “Fabrication of optical inverted-rib waveguides using UV-imprinting,” Microelectron. Eng. 88(2), 175–178 (2011).
[Crossref]
R. Yoshimura, H. Nakagome, S. Imamura, and T. Izawa, “Coupling ratio control of polymeric waveguide couplers by bending,” Electron. Lett. 28(23), 2135–2136 (1992).
[Crossref]
R. Dangel, J. Hofrichter, F. Horst, D. Jubin, A. La Porta, N. Meier, I. M. Soganci, J. Weiss, and B. J. Offrein, “Polymer waveguides for electro-optical integration in data centers and high-performance computers,” Opt. Express 23(4), 4736–4750 (2015).
[Crossref]
[PubMed]
A. Boersma, B. J. Offrein, J. Duis, J. Delis, M. Ortsiefer, G. V. Steenberge, M. Karpinen, A. V. Blaaderen, and B. Corbett, “Polymer-based optical interconnects using nanoimprint lithography,” Proc. SPIE 8630, 86300Y (2013).
M.-C. Oh, M.-H. Lee, and H.-J. Lee, “Polymeric waveguide polarization splitter with a buried birefringent polymer,” IEEE Photon. Technol. Lett. 11(9), 1144–1146 (1999).
[Crossref]
A. Boersma, B. J. Offrein, J. Duis, J. Delis, M. Ortsiefer, G. V. Steenberge, M. Karpinen, A. V. Blaaderen, and B. Corbett, “Polymer-based optical interconnects using nanoimprint lithography,” Proc. SPIE 8630, 86300Y (2013).
U. Streppel, P. Dannberg, C. Wächter, A. Bräuer, L. Fröhlich, R. Houbertz, and M. Popall, “New waferscale fabrication method for stacked optical waveguide interconnects and 3D micro-optic structures using photo-responsive (inorganic-organic hybrid) polymers,” Opt. Mater. 21(1-3), 475–483 (2003).
[Crossref]
J. Hiltunen, A. Kokkonen, J. Puustinen, M. Hiltunen, and J. Lappalainen, “UV-imprinted single-mode waveguides with low loss at visible wavelength,” IEEE Photon. Technol. Lett. 25(10), 996–998 (2013).
[Crossref]
M. Wang, J. Hiltunen, S. Uusitalo, J. Puustinen, J. Lappalainen, P. Karioja, and R. Myllylä, “Fabrication of optical inverted-rib waveguides using UV-imprinting,” Microelectron. Eng. 88(2), 175–178 (2011).
[Crossref]
J. Hiltunen, M. Hiltunen, J. Puustinen, J. Lappalainen, and P. Karioja, “Fabrication of optical waveguides by imprinting: usage of positive tone resist as a mould for UV-curable polymer,” Opt. Express 17(25), 22813–22822 (2009).
[PubMed]
M. Karppinen, N. Salminen, T. Korhonen, T. Alajoki, E. Bosman, G. V. Steenberge, J. Justice, U. Khan, B. Corbett, and A. Boersma, “Optical coupling structure made by imprinting between single-mode polymer waveguide and embedded VCSEL,” Proc. SPIE 9368, 936817 (2015).
T. Korhonen, N. Salminen, A. Kokkonen, N. Masuda, and M. Karppinen, “Multilayer single-mode polymeric waveguides by imprint patterning for optical interconnects,” Proc. SPIE 8991, 899103 (2014).
C. T. Chen, P. K. Shen, T. Z. Zhu, C. C. Chang, S. S. Lin, M. Y. Zeng, C. Y. Chiu, H. L. Hsiao, H. C. Lan, Y. C. Lee, Y. S. Lin, and M. L. Wu, “Chip-level 1 × 2 optical interconnects using polymer vertical splitter on silicon substrate,” IEEE Photon. J. 6(2), 7900410 (2014).
[Crossref]
W. S. Kim, J. H. Lee, S. Y. Shin, B. S. Bae, and Y. C. Kim, “Fabrication of ridge waveguides by UV embossing and stamping of sol-gel hybrid materials,” IEEE Photon. Technol. Lett. 16(8), 1888–1890 (2004).
[Crossref]
M. Horowitz, C. K. K. Yang, and S. Sidiropoulos, “High-speed electrical signaling: overview and limitations,” IEEE Micro 18(1), 12–24 (1998).
[Crossref]
R. Dangel, J. Hofrichter, F. Horst, D. Jubin, A. La Porta, N. Meier, I. M. Soganci, J. Weiss, and B. J. Offrein, “Polymer waveguides for electro-optical integration in data centers and high-performance computers,” Opt. Express 23(4), 4736–4750 (2015).
[Crossref]
[PubMed]
M. Karppinen, N. Salminen, T. Korhonen, T. Alajoki, E. Bosman, G. V. Steenberge, J. Justice, U. Khan, B. Corbett, and A. Boersma, “Optical coupling structure made by imprinting between single-mode polymer waveguide and embedded VCSEL,” Proc. SPIE 9368, 936817 (2015).
A. Boersma, B. J. Offrein, J. Duis, J. Delis, M. Ortsiefer, G. V. Steenberge, M. Karpinen, A. V. Blaaderen, and B. Corbett, “Polymer-based optical interconnects using nanoimprint lithography,” Proc. SPIE 8630, 86300Y (2013).
U. Streppel, P. Dannberg, C. Wächter, A. Bräuer, L. Fröhlich, R. Houbertz, and M. Popall, “New waferscale fabrication method for stacked optical waveguide interconnects and 3D micro-optic structures using photo-responsive (inorganic-organic hybrid) polymers,” Opt. Mater. 21(1-3), 475–483 (2003).
[Crossref]
C. Gimkiewicz, H. D. Thiele, C. Zschokke, S. Mahmud-Skender, S. Westenhofer, and M. T. Gale, “Cost-effective fabrication of waveguides for PLCs by replication in UV-curable sol-gel material,” Proc. SPIE 5451, 465–474 (2004).
F. Gu, H. Yu, W. Fang, and L. Tong, “Nanoimprinted polymer micro nanofiber Bragg gratings for high-sensitive strain sensing,” IEEE Photon. Technol. Lett. 25(1), 22–24 (2013).
[Crossref]
M. Wang, J. Hiltunen, S. Uusitalo, J. Puustinen, J. Lappalainen, P. Karioja, and R. Myllylä, “Fabrication of optical inverted-rib waveguides using UV-imprinting,” Microelectron. Eng. 88(2), 175–178 (2011).
[Crossref]
U. Streppel, P. Dannberg, C. Wächter, A. Bräuer, L. Fröhlich, R. Houbertz, and M. Popall, “New waferscale fabrication method for stacked optical waveguide interconnects and 3D micro-optic structures using photo-responsive (inorganic-organic hybrid) polymers,” Opt. Mater. 21(1-3), 475–483 (2003).
[Crossref]
M. Wang, J. Hiltunen, S. Uusitalo, J. Puustinen, J. Lappalainen, P. Karioja, and R. Myllylä, “Fabrication of optical inverted-rib waveguides using UV-imprinting,” Microelectron. Eng. 88(2), 175–178 (2011).
[Crossref]
R. Dangel, J. Hofrichter, F. Horst, D. Jubin, A. La Porta, N. Meier, I. M. Soganci, J. Weiss, and B. J. Offrein, “Polymer waveguides for electro-optical integration in data centers and high-performance computers,” Opt. Express 23(4), 4736–4750 (2015).
[Crossref]
[PubMed]
C. Gimkiewicz, H. D. Thiele, C. Zschokke, S. Mahmud-Skender, S. Westenhofer, and M. T. Gale, “Cost-effective fabrication of waveguides for PLCs by replication in UV-curable sol-gel material,” Proc. SPIE 5451, 465–474 (2004).
J. Justice, U. Khan, T. Korhonen, A. Boersma, S. Wiegersma, M. Karppinen, and B. Corbett, “Design, fabrication, and characterization of nano-imprinted single-mode waveguide structures for intra-chip optical communications,” Proc. SPIE 9368, 936834 (2015).
C. T. Chen, P. K. Shen, T. Z. Zhu, C. C. Chang, S. S. Lin, M. Y. Zeng, C. Y. Chiu, H. L. Hsiao, H. C. Lan, Y. C. Lee, Y. S. Lin, and M. L. Wu, “Chip-level 1 × 2 optical interconnects using polymer vertical splitter on silicon substrate,” IEEE Photon. J. 6(2), 7900410 (2014).
[Crossref]
M. Horowitz, C. K. K. Yang, and S. Sidiropoulos, “High-speed electrical signaling: overview and limitations,” IEEE Micro 18(1), 12–24 (1998).
[Crossref]
R. Yoshimura, H. Nakagome, S. Imamura, and T. Izawa, “Coupling ratio control of polymeric waveguide couplers by bending,” Electron. Lett. 28(23), 2135–2136 (1992).
[Crossref]
F. Gu, H. Yu, W. Fang, and L. Tong, “Nanoimprinted polymer micro nanofiber Bragg gratings for high-sensitive strain sensing,” IEEE Photon. Technol. Lett. 25(1), 22–24 (2013).
[Crossref]
C. T. Chen, P. K. Shen, T. Z. Zhu, C. C. Chang, S. S. Lin, M. Y. Zeng, C. Y. Chiu, H. L. Hsiao, H. C. Lan, Y. C. Lee, Y. S. Lin, and M. L. Wu, “Chip-level 1 × 2 optical interconnects using polymer vertical splitter on silicon substrate,” IEEE Photon. J. 6(2), 7900410 (2014).
[Crossref]
C. T. Chen, P. K. Shen, T. Z. Zhu, C. C. Chang, S. S. Lin, M. Y. Zeng, C. Y. Chiu, H. L. Hsiao, H. C. Lan, Y. C. Lee, Y. S. Lin, and M. L. Wu, “Chip-level 1 × 2 optical interconnects using polymer vertical splitter on silicon substrate,” IEEE Photon. J. 6(2), 7900410 (2014).
[Crossref]
C. Gimkiewicz, H. D. Thiele, C. Zschokke, S. Mahmud-Skender, S. Westenhofer, and M. T. Gale, “Cost-effective fabrication of waveguides for PLCs by replication in UV-curable sol-gel material,” Proc. SPIE 5451, 465–474 (2004).