Abstract

We describe a multiwavelength hybrid-integrated solid-state link on a 3 µm silicon-on-insulator (SOI) nanophotonic platform. The link spans three chips and employs germanium-silicon electroabsorption waveguide modulators, silicon transport waveguides, echelle gratings for multiplexing and demultiplexing, and pure germanium waveguide photo-detectors. The 8λ WDM Tx and Rx components are interconnected via a routing “bridge” chip using edge-coupled optical proximity communication. The packaged, retimed digital WDM link is demonstrated at 10 Gb/s and 10−12 BER, with three wavelength channels consuming an on-chip power below 1.5 pJ/bit, excluding the external laser power.

© 2015 Optical Society of America

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References

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    [Crossref]
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    [Crossref] [PubMed]

2014 (1)

2012 (5)

F. Y. Liu, D. Patil, J. Lexau, P. Amberg, M. Dayringer, J. Gainsley, H. F. Moghadam, X. Zheng, J. E. Cunningham, A. V. Krishnamoorthy, E. Alon, and R. Ho, “10-Gbps, 5.3-mW optical transmitter and receiver circuits in 40-nm CMOS,” IEEE J. Solid-State Circuits 47(9), 2049–2067 (2012).
[Crossref]

A. J. Zilkie, P. Seddighian, B. J. Bijlani, W. Qian, D. C. Lee, S. Fathololoumi, J. Fong, R. Shafiiha, D. Feng, B. J. Luff, X. Zheng, J. E. Cunningham, A. V. Krishnamoorthy, and M. Asghari, “Power-efficient III-V/silicon external cavity DBR lasers,” Opt. Express 20(21), 23456–23462 (2012).
[Crossref] [PubMed]

X. Zheng, Y. Luo, J. Lexau, F. Liu, G. Li, H. D. Thacker, I. Shubin, J. Yao, R. Ho, J. E. Cunningham, and A. V. Krishnamoorthy, “2-pJ/bit (on-chip) 10-Gb/s digital CMOS silicon photonic link,” IEEE Photon. Technol. Lett. 24(14), 1260–1262 (2012).
[Crossref]

Y. Luo, X. Zheng, G. Li, I. Shubin, H. Thacker, J. Yao, J.-H. Lee, D. Feng, J. Fong, C.-C. Kung, S. Liao, R. Shafiiha, M. Asghari, K. Raj, A. V. Krishnamoorthy, and J. E. Cunningham, “Strong electro-absorption in GeSi epitaxy on silicon-on-insulator (SOI),” Micromachines 3(4), 345–363 (2012).
[Crossref]

D. Feng, S. Liao, H. Liang, J. Fong, B. Bijlani, R. Shafiiha, B. J. Luff, Y. Luo, J. Cunningham, A. V. Krishnamoorthy, and M. Asghari, “High speed GeSi electro-absorption modulator at 1550 nm wavelength on SOI waveguide,” Opt. Express 20(20), 22224–22232 (2012).
[Crossref] [PubMed]

2011 (2)

2009 (1)

A. V. Krishnamoorthy, R. Ho, X. Zheng, H. Schwetman, J. Lexau, P. Koka, G. Li, I. Shubin, and J. E. Cunningham, “Computer systems based on silicon photonic interconnects,” Proc. IEEE 97(7), 1337–1361 (2009).
[Crossref]

2008 (1)

J. F. Liu, M. Beals, A. Pomerene, S. Bernardis, R. Sun, J. Cheng, L. C. Kimerling, and J. Michel, “Waveguide-integrated, ultralow-energy GeSi electroabsorption modulators,” Nat. Photonics 2(7), 433–437 (2008).
[Crossref]

2004 (1)

2003 (1)

C. Cook, J. E. Cunningham, A. Hargrove, G. G. Ger, K. W. Goossen, W. Y. Jan, H. H. Kim, R. Krause, M. Manges, M. Morrissey, M. Perinpanayagam, A. Persaud, G. J. Shevchuk, V. Sinyansky, and A. V. Krishnamoorthy, “A 36-channel parallel optical interconnect module baed on optoelectronics-on-VLSI technology,” IEEE J. Sel. Top. Quantum Electron. 9(2), 387–399 (2003).
[Crossref]

1999 (1)

A. V. Krishnamoorthy, L. M. F. Chirovsky, W. S. Hobson, R. E. Leibengath, S. P. Hui, G. J. Zydzik, K. W. Goossen, J. D. Wynn, B. J. Tseng, J. Lopata, J. A. Walker, J. E. Cunningham, and L. A. D’Asaro, “Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits,” IEEE Photon. Technol. Lett. 11(1), 128–130 (1999).
[Crossref]

1997 (1)

T. K. Woodward, A. V. Krishnamoorthy, K. W. Goossen, J. A. Walker, B. Tseng, J. Lothian, S. Hui, and R. Leibenguth, “Modulator-driver circuits for optoelectronic VLSI,” IEEE Photon. Technol. Lett. 9(6), 839–841 (1997).
[Crossref]

1993 (1)

K. W. Goossen, J. E. Cunningham, and W. Y. Jan, “GaAs 850nm modulators solder-bonded to silicon,” IEEE Photon. Technol. Lett. 5(7), 776–778 (1993).
[Crossref]

Abdalla, S.

A. Narasimha, B. Analui, Y. Liang, T. J. Sleboda, S. Abdalla, E. Balmater, S. Gloeckner, D. Guckenberger, M. Harrison, R. Koumans, D. Kucharski, A. Mekis, S. Mirsaidi, D. Song, and T. Pinguet, “A fully integrated 4 x 10 Gb/s DWDM transceiver in standard 0.13 µm CMOS SOI,” in Proceedings of IEEE International Solid State Circuits Conference (IEEE, 2007), pp. 42–43.

Abed, A.

A. V. Krishnamoorthy, X. Zheng, D. Feng, J. Lexau, J. F. Buckwalter, H. D. Thacker, F. Liu, Y. Luo, E. Chang, P. Amberg, I. Shubin, S. S. Djordjevic, J.-H. Lee, S. Lin, H. Liang, A. Abed, R. Shafiiha, K. Raj, R. Ho, M. Asghari, and J. E. Cunningham, “A low-power, high-speed, 9-channel germanium-silicon electro-absorption modulator array integrated with digital CMOS driver and wavelength multiplexer,” Opt. Express 22(10), 12289–12295 (2014).
[Crossref] [PubMed]

H. D. Thacker, R. Shafiiha, J. Lexau, X. Zheng, S. S. Djordjevic, S. Lin, J. Simons, A. Abed, P. Amberg, E. Chang, I. Shubin, J.-H. Lee, Y. Luo, J. Yao, F. Liu, H. Liang, D. Feng, M. Asghari, R. Ho, K. Raj, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration and packaging of an energy-efficient WDM silicon photonic solid-state chip-to-chip interconnect,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2015).

Akagawa, T.

Akiyama, S.

Alon, E.

F. Y. Liu, D. Patil, J. Lexau, P. Amberg, M. Dayringer, J. Gainsley, H. F. Moghadam, X. Zheng, J. E. Cunningham, A. V. Krishnamoorthy, E. Alon, and R. Ho, “10-Gbps, 5.3-mW optical transmitter and receiver circuits in 40-nm CMOS,” IEEE J. Solid-State Circuits 47(9), 2049–2067 (2012).
[Crossref]

Amberg, P.

A. V. Krishnamoorthy, X. Zheng, D. Feng, J. Lexau, J. F. Buckwalter, H. D. Thacker, F. Liu, Y. Luo, E. Chang, P. Amberg, I. Shubin, S. S. Djordjevic, J.-H. Lee, S. Lin, H. Liang, A. Abed, R. Shafiiha, K. Raj, R. Ho, M. Asghari, and J. E. Cunningham, “A low-power, high-speed, 9-channel germanium-silicon electro-absorption modulator array integrated with digital CMOS driver and wavelength multiplexer,” Opt. Express 22(10), 12289–12295 (2014).
[Crossref] [PubMed]

F. Y. Liu, D. Patil, J. Lexau, P. Amberg, M. Dayringer, J. Gainsley, H. F. Moghadam, X. Zheng, J. E. Cunningham, A. V. Krishnamoorthy, E. Alon, and R. Ho, “10-Gbps, 5.3-mW optical transmitter and receiver circuits in 40-nm CMOS,” IEEE J. Solid-State Circuits 47(9), 2049–2067 (2012).
[Crossref]

H. D. Thacker, R. Shafiiha, J. Lexau, X. Zheng, S. S. Djordjevic, S. Lin, J. Simons, A. Abed, P. Amberg, E. Chang, I. Shubin, J.-H. Lee, Y. Luo, J. Yao, F. Liu, H. Liang, D. Feng, M. Asghari, R. Ho, K. Raj, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration and packaging of an energy-efficient WDM silicon photonic solid-state chip-to-chip interconnect,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2015).

Analui, B.

A. Narasimha, B. Analui, Y. Liang, T. J. Sleboda, S. Abdalla, E. Balmater, S. Gloeckner, D. Guckenberger, M. Harrison, R. Koumans, D. Kucharski, A. Mekis, S. Mirsaidi, D. Song, and T. Pinguet, “A fully integrated 4 x 10 Gb/s DWDM transceiver in standard 0.13 µm CMOS SOI,” in Proceedings of IEEE International Solid State Circuits Conference (IEEE, 2007), pp. 42–43.

Arakawa, Y.

Asghari, M.

A. V. Krishnamoorthy, X. Zheng, D. Feng, J. Lexau, J. F. Buckwalter, H. D. Thacker, F. Liu, Y. Luo, E. Chang, P. Amberg, I. Shubin, S. S. Djordjevic, J.-H. Lee, S. Lin, H. Liang, A. Abed, R. Shafiiha, K. Raj, R. Ho, M. Asghari, and J. E. Cunningham, “A low-power, high-speed, 9-channel germanium-silicon electro-absorption modulator array integrated with digital CMOS driver and wavelength multiplexer,” Opt. Express 22(10), 12289–12295 (2014).
[Crossref] [PubMed]

A. J. Zilkie, P. Seddighian, B. J. Bijlani, W. Qian, D. C. Lee, S. Fathololoumi, J. Fong, R. Shafiiha, D. Feng, B. J. Luff, X. Zheng, J. E. Cunningham, A. V. Krishnamoorthy, and M. Asghari, “Power-efficient III-V/silicon external cavity DBR lasers,” Opt. Express 20(21), 23456–23462 (2012).
[Crossref] [PubMed]

D. Feng, S. Liao, H. Liang, J. Fong, B. Bijlani, R. Shafiiha, B. J. Luff, Y. Luo, J. Cunningham, A. V. Krishnamoorthy, and M. Asghari, “High speed GeSi electro-absorption modulator at 1550 nm wavelength on SOI waveguide,” Opt. Express 20(20), 22224–22232 (2012).
[Crossref] [PubMed]

Y. Luo, X. Zheng, G. Li, I. Shubin, H. Thacker, J. Yao, J.-H. Lee, D. Feng, J. Fong, C.-C. Kung, S. Liao, R. Shafiiha, M. Asghari, K. Raj, A. V. Krishnamoorthy, and J. E. Cunningham, “Strong electro-absorption in GeSi epitaxy on silicon-on-insulator (SOI),” Micromachines 3(4), 345–363 (2012).
[Crossref]

A. V. Krishnamoorthy, K. W. Goossen, W. Jan, X. Zheng, R. Ho, G. Li, R. Rozier, F. Liu, D. Patil, J. Lexau, H. Schwetman, D. Feng, M. Asghari, T. Pinguet, and J. E. Cunningham, “Progress in low-power switched optical interconnects,” IEEE J. Sel. Top. Quantum Electron. 17(2), 357–376 (2011).
[Crossref]

H. D. Thacker, Y. Luo, J. Shi, I. Shubin, J. Lexau, X. Zheng, G. Li, J. Yao, J. Costa, T. Pinguet, A. Mekis, P. Dong, S. Liao, D. Feng, M. Asghari, R. Ho, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Flip-chip integrated silicon photonic bridge chips for sub-picojoule per bit optical links,” in Proceedings of IEEE Electronic Components and Technology Conference (IEEE, 2010), pp. 240–246.
[Crossref]

H. D. Thacker, R. Shafiiha, J. Lexau, X. Zheng, S. S. Djordjevic, S. Lin, J. Simons, A. Abed, P. Amberg, E. Chang, I. Shubin, J.-H. Lee, Y. Luo, J. Yao, F. Liu, H. Liang, D. Feng, M. Asghari, R. Ho, K. Raj, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration and packaging of an energy-efficient WDM silicon photonic solid-state chip-to-chip interconnect,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2015).

H. D. Thacker, I. Shubin, Y. Luo, J. Costa, J. Lexau, X. Zheng, G. Li, J. Yao, J. Li, D. Patil, F. Liu, R. Ho, D. Feng, M. Asghari, T. Pinguet, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration of silicon nanophotonics with 40nm-CMOS VLSI drivers and receivers,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2011), pp. 829–835.
[Crossref]

Baba, T.

Bafrali, R.

C. Sun, M. Georgas, J. S. Orcutt, B. R. Moss, Y.-H. Chen, J. Shainline, M. Wade, K. Mehta, K. Nammari, E. Timurdogan, D. Miller, O. Tehar-Zahav, Z. Sternberg, J. C. Leu, J. Chong, R. Bafrali, G. Sandhu, M. Watts, R. Meade, M. A. Popovic, R. J. Ram, and V. Stojanovic, “A monolithically-integrated chip-to-chip optical link in bulk CMOS,” in Proceedings of IEEE Symposium on VLSI Circuits (IEEE, 2014), pp. 1–2.
[Crossref]

Baks, C.

Balmater, E.

A. Narasimha, B. Analui, Y. Liang, T. J. Sleboda, S. Abdalla, E. Balmater, S. Gloeckner, D. Guckenberger, M. Harrison, R. Koumans, D. Kucharski, A. Mekis, S. Mirsaidi, D. Song, and T. Pinguet, “A fully integrated 4 x 10 Gb/s DWDM transceiver in standard 0.13 µm CMOS SOI,” in Proceedings of IEEE International Solid State Circuits Conference (IEEE, 2007), pp. 42–43.

Beals, M.

J. F. Liu, M. Beals, A. Pomerene, S. Bernardis, R. Sun, J. Cheng, L. C. Kimerling, and J. Michel, “Waveguide-integrated, ultralow-energy GeSi electroabsorption modulators,” Nat. Photonics 2(7), 433–437 (2008).
[Crossref]

Bernardis, S.

J. F. Liu, M. Beals, A. Pomerene, S. Bernardis, R. Sun, J. Cheng, L. C. Kimerling, and J. Michel, “Waveguide-integrated, ultralow-energy GeSi electroabsorption modulators,” Nat. Photonics 2(7), 433–437 (2008).
[Crossref]

Bijlani, B.

Bijlani, B. J.

Buckwalter, J. F.

Chang, E.

A. V. Krishnamoorthy, X. Zheng, D. Feng, J. Lexau, J. F. Buckwalter, H. D. Thacker, F. Liu, Y. Luo, E. Chang, P. Amberg, I. Shubin, S. S. Djordjevic, J.-H. Lee, S. Lin, H. Liang, A. Abed, R. Shafiiha, K. Raj, R. Ho, M. Asghari, and J. E. Cunningham, “A low-power, high-speed, 9-channel germanium-silicon electro-absorption modulator array integrated with digital CMOS driver and wavelength multiplexer,” Opt. Express 22(10), 12289–12295 (2014).
[Crossref] [PubMed]

H. D. Thacker, R. Shafiiha, J. Lexau, X. Zheng, S. S. Djordjevic, S. Lin, J. Simons, A. Abed, P. Amberg, E. Chang, I. Shubin, J.-H. Lee, Y. Luo, J. Yao, F. Liu, H. Liang, D. Feng, M. Asghari, R. Ho, K. Raj, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration and packaging of an energy-efficient WDM silicon photonic solid-state chip-to-chip interconnect,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2015).

Chen, A.

G. Denoyer, A. Chen, B. Park, Y. Zhou, A. Santipo, and R. Russo, “Hybrid silicon photonic circuits and transceiver for 56 Gb/s NRZ 2.2km transmission over single mode fiber,” in Proceedings of IEEE European Conference on Optical Communication (IEEE, 2014), pp. 1–3.

Chen, Y.-H.

C. Sun, M. Georgas, J. S. Orcutt, B. R. Moss, Y.-H. Chen, J. Shainline, M. Wade, K. Mehta, K. Nammari, E. Timurdogan, D. Miller, O. Tehar-Zahav, Z. Sternberg, J. C. Leu, J. Chong, R. Bafrali, G. Sandhu, M. Watts, R. Meade, M. A. Popovic, R. J. Ram, and V. Stojanovic, “A monolithically-integrated chip-to-chip optical link in bulk CMOS,” in Proceedings of IEEE Symposium on VLSI Circuits (IEEE, 2014), pp. 1–2.
[Crossref]

Cheng, J.

J. F. Liu, M. Beals, A. Pomerene, S. Bernardis, R. Sun, J. Cheng, L. C. Kimerling, and J. Michel, “Waveguide-integrated, ultralow-energy GeSi electroabsorption modulators,” Nat. Photonics 2(7), 433–437 (2008).
[Crossref]

Chirovsky, L. M. F.

A. V. Krishnamoorthy, L. M. F. Chirovsky, W. S. Hobson, R. E. Leibengath, S. P. Hui, G. J. Zydzik, K. W. Goossen, J. D. Wynn, B. J. Tseng, J. Lopata, J. A. Walker, J. E. Cunningham, and L. A. D’Asaro, “Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits,” IEEE Photon. Technol. Lett. 11(1), 128–130 (1999).
[Crossref]

Chong, J.

C. Sun, M. Georgas, J. S. Orcutt, B. R. Moss, Y.-H. Chen, J. Shainline, M. Wade, K. Mehta, K. Nammari, E. Timurdogan, D. Miller, O. Tehar-Zahav, Z. Sternberg, J. C. Leu, J. Chong, R. Bafrali, G. Sandhu, M. Watts, R. Meade, M. A. Popovic, R. J. Ram, and V. Stojanovic, “A monolithically-integrated chip-to-chip optical link in bulk CMOS,” in Proceedings of IEEE Symposium on VLSI Circuits (IEEE, 2014), pp. 1–2.
[Crossref]

Cook, C.

C. Cook, J. E. Cunningham, A. Hargrove, G. G. Ger, K. W. Goossen, W. Y. Jan, H. H. Kim, R. Krause, M. Manges, M. Morrissey, M. Perinpanayagam, A. Persaud, G. J. Shevchuk, V. Sinyansky, and A. V. Krishnamoorthy, “A 36-channel parallel optical interconnect module baed on optoelectronics-on-VLSI technology,” IEEE J. Sel. Top. Quantum Electron. 9(2), 387–399 (2003).
[Crossref]

Costa, J.

H. D. Thacker, I. Shubin, Y. Luo, J. Costa, J. Lexau, X. Zheng, G. Li, J. Yao, J. Li, D. Patil, F. Liu, R. Ho, D. Feng, M. Asghari, T. Pinguet, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration of silicon nanophotonics with 40nm-CMOS VLSI drivers and receivers,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2011), pp. 829–835.
[Crossref]

H. D. Thacker, Y. Luo, J. Shi, I. Shubin, J. Lexau, X. Zheng, G. Li, J. Yao, J. Costa, T. Pinguet, A. Mekis, P. Dong, S. Liao, D. Feng, M. Asghari, R. Ho, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Flip-chip integrated silicon photonic bridge chips for sub-picojoule per bit optical links,” in Proceedings of IEEE Electronic Components and Technology Conference (IEEE, 2010), pp. 240–246.
[Crossref]

Cunningham, J.

Cunningham, J. E.

A. V. Krishnamoorthy, X. Zheng, D. Feng, J. Lexau, J. F. Buckwalter, H. D. Thacker, F. Liu, Y. Luo, E. Chang, P. Amberg, I. Shubin, S. S. Djordjevic, J.-H. Lee, S. Lin, H. Liang, A. Abed, R. Shafiiha, K. Raj, R. Ho, M. Asghari, and J. E. Cunningham, “A low-power, high-speed, 9-channel germanium-silicon electro-absorption modulator array integrated with digital CMOS driver and wavelength multiplexer,” Opt. Express 22(10), 12289–12295 (2014).
[Crossref] [PubMed]

A. J. Zilkie, P. Seddighian, B. J. Bijlani, W. Qian, D. C. Lee, S. Fathololoumi, J. Fong, R. Shafiiha, D. Feng, B. J. Luff, X. Zheng, J. E. Cunningham, A. V. Krishnamoorthy, and M. Asghari, “Power-efficient III-V/silicon external cavity DBR lasers,” Opt. Express 20(21), 23456–23462 (2012).
[Crossref] [PubMed]

Y. Luo, X. Zheng, G. Li, I. Shubin, H. Thacker, J. Yao, J.-H. Lee, D. Feng, J. Fong, C.-C. Kung, S. Liao, R. Shafiiha, M. Asghari, K. Raj, A. V. Krishnamoorthy, and J. E. Cunningham, “Strong electro-absorption in GeSi epitaxy on silicon-on-insulator (SOI),” Micromachines 3(4), 345–363 (2012).
[Crossref]

F. Y. Liu, D. Patil, J. Lexau, P. Amberg, M. Dayringer, J. Gainsley, H. F. Moghadam, X. Zheng, J. E. Cunningham, A. V. Krishnamoorthy, E. Alon, and R. Ho, “10-Gbps, 5.3-mW optical transmitter and receiver circuits in 40-nm CMOS,” IEEE J. Solid-State Circuits 47(9), 2049–2067 (2012).
[Crossref]

X. Zheng, Y. Luo, J. Lexau, F. Liu, G. Li, H. D. Thacker, I. Shubin, J. Yao, R. Ho, J. E. Cunningham, and A. V. Krishnamoorthy, “2-pJ/bit (on-chip) 10-Gb/s digital CMOS silicon photonic link,” IEEE Photon. Technol. Lett. 24(14), 1260–1262 (2012).
[Crossref]

A. V. Krishnamoorthy, K. W. Goossen, W. Jan, X. Zheng, R. Ho, G. Li, R. Rozier, F. Liu, D. Patil, J. Lexau, H. Schwetman, D. Feng, M. Asghari, T. Pinguet, and J. E. Cunningham, “Progress in low-power switched optical interconnects,” IEEE J. Sel. Top. Quantum Electron. 17(2), 357–376 (2011).
[Crossref]

A. V. Krishnamoorthy, R. Ho, X. Zheng, H. Schwetman, J. Lexau, P. Koka, G. Li, I. Shubin, and J. E. Cunningham, “Computer systems based on silicon photonic interconnects,” Proc. IEEE 97(7), 1337–1361 (2009).
[Crossref]

C. Cook, J. E. Cunningham, A. Hargrove, G. G. Ger, K. W. Goossen, W. Y. Jan, H. H. Kim, R. Krause, M. Manges, M. Morrissey, M. Perinpanayagam, A. Persaud, G. J. Shevchuk, V. Sinyansky, and A. V. Krishnamoorthy, “A 36-channel parallel optical interconnect module baed on optoelectronics-on-VLSI technology,” IEEE J. Sel. Top. Quantum Electron. 9(2), 387–399 (2003).
[Crossref]

A. V. Krishnamoorthy, L. M. F. Chirovsky, W. S. Hobson, R. E. Leibengath, S. P. Hui, G. J. Zydzik, K. W. Goossen, J. D. Wynn, B. J. Tseng, J. Lopata, J. A. Walker, J. E. Cunningham, and L. A. D’Asaro, “Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits,” IEEE Photon. Technol. Lett. 11(1), 128–130 (1999).
[Crossref]

K. W. Goossen, J. E. Cunningham, and W. Y. Jan, “GaAs 850nm modulators solder-bonded to silicon,” IEEE Photon. Technol. Lett. 5(7), 776–778 (1993).
[Crossref]

H. D. Thacker, I. Shubin, Y. Luo, J. Costa, J. Lexau, X. Zheng, G. Li, J. Yao, J. Li, D. Patil, F. Liu, R. Ho, D. Feng, M. Asghari, T. Pinguet, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration of silicon nanophotonics with 40nm-CMOS VLSI drivers and receivers,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2011), pp. 829–835.
[Crossref]

H. D. Thacker, R. Shafiiha, J. Lexau, X. Zheng, S. S. Djordjevic, S. Lin, J. Simons, A. Abed, P. Amberg, E. Chang, I. Shubin, J.-H. Lee, Y. Luo, J. Yao, F. Liu, H. Liang, D. Feng, M. Asghari, R. Ho, K. Raj, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration and packaging of an energy-efficient WDM silicon photonic solid-state chip-to-chip interconnect,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2015).

H. D. Thacker, Y. Luo, J. Shi, I. Shubin, J. Lexau, X. Zheng, G. Li, J. Yao, J. Costa, T. Pinguet, A. Mekis, P. Dong, S. Liao, D. Feng, M. Asghari, R. Ho, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Flip-chip integrated silicon photonic bridge chips for sub-picojoule per bit optical links,” in Proceedings of IEEE Electronic Components and Technology Conference (IEEE, 2010), pp. 240–246.
[Crossref]

D’Asaro, L. A.

A. V. Krishnamoorthy, L. M. F. Chirovsky, W. S. Hobson, R. E. Leibengath, S. P. Hui, G. J. Zydzik, K. W. Goossen, J. D. Wynn, B. J. Tseng, J. Lopata, J. A. Walker, J. E. Cunningham, and L. A. D’Asaro, “Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits,” IEEE Photon. Technol. Lett. 11(1), 128–130 (1999).
[Crossref]

Dayringer, M.

F. Y. Liu, D. Patil, J. Lexau, P. Amberg, M. Dayringer, J. Gainsley, H. F. Moghadam, X. Zheng, J. E. Cunningham, A. V. Krishnamoorthy, E. Alon, and R. Ho, “10-Gbps, 5.3-mW optical transmitter and receiver circuits in 40-nm CMOS,” IEEE J. Solid-State Circuits 47(9), 2049–2067 (2012).
[Crossref]

DeHaven, K.

K. DeHaven and J. Dietz, “Controlled Collapse Chip Connection (C4) – An Enabling Technology,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 1994), pp. 1–6.
[Crossref]

Denoyer, G.

G. Denoyer, A. Chen, B. Park, Y. Zhou, A. Santipo, and R. Russo, “Hybrid silicon photonic circuits and transceiver for 56 Gb/s NRZ 2.2km transmission over single mode fiber,” in Proceedings of IEEE European Conference on Optical Communication (IEEE, 2014), pp. 1–3.

Dietz, J.

K. DeHaven and J. Dietz, “Controlled Collapse Chip Connection (C4) – An Enabling Technology,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 1994), pp. 1–6.
[Crossref]

Djordjevic, S. S.

A. V. Krishnamoorthy, X. Zheng, D. Feng, J. Lexau, J. F. Buckwalter, H. D. Thacker, F. Liu, Y. Luo, E. Chang, P. Amberg, I. Shubin, S. S. Djordjevic, J.-H. Lee, S. Lin, H. Liang, A. Abed, R. Shafiiha, K. Raj, R. Ho, M. Asghari, and J. E. Cunningham, “A low-power, high-speed, 9-channel germanium-silicon electro-absorption modulator array integrated with digital CMOS driver and wavelength multiplexer,” Opt. Express 22(10), 12289–12295 (2014).
[Crossref] [PubMed]

H. D. Thacker, R. Shafiiha, J. Lexau, X. Zheng, S. S. Djordjevic, S. Lin, J. Simons, A. Abed, P. Amberg, E. Chang, I. Shubin, J.-H. Lee, Y. Luo, J. Yao, F. Liu, H. Liang, D. Feng, M. Asghari, R. Ho, K. Raj, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration and packaging of an energy-efficient WDM silicon photonic solid-state chip-to-chip interconnect,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2015).

Dong, P.

H. D. Thacker, Y. Luo, J. Shi, I. Shubin, J. Lexau, X. Zheng, G. Li, J. Yao, J. Costa, T. Pinguet, A. Mekis, P. Dong, S. Liao, D. Feng, M. Asghari, R. Ho, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Flip-chip integrated silicon photonic bridge chips for sub-picojoule per bit optical links,” in Proceedings of IEEE Electronic Components and Technology Conference (IEEE, 2010), pp. 240–246.
[Crossref]

Fathololoumi, S.

Feng, D.

A. V. Krishnamoorthy, X. Zheng, D. Feng, J. Lexau, J. F. Buckwalter, H. D. Thacker, F. Liu, Y. Luo, E. Chang, P. Amberg, I. Shubin, S. S. Djordjevic, J.-H. Lee, S. Lin, H. Liang, A. Abed, R. Shafiiha, K. Raj, R. Ho, M. Asghari, and J. E. Cunningham, “A low-power, high-speed, 9-channel germanium-silicon electro-absorption modulator array integrated with digital CMOS driver and wavelength multiplexer,” Opt. Express 22(10), 12289–12295 (2014).
[Crossref] [PubMed]

A. J. Zilkie, P. Seddighian, B. J. Bijlani, W. Qian, D. C. Lee, S. Fathololoumi, J. Fong, R. Shafiiha, D. Feng, B. J. Luff, X. Zheng, J. E. Cunningham, A. V. Krishnamoorthy, and M. Asghari, “Power-efficient III-V/silicon external cavity DBR lasers,” Opt. Express 20(21), 23456–23462 (2012).
[Crossref] [PubMed]

D. Feng, S. Liao, H. Liang, J. Fong, B. Bijlani, R. Shafiiha, B. J. Luff, Y. Luo, J. Cunningham, A. V. Krishnamoorthy, and M. Asghari, “High speed GeSi electro-absorption modulator at 1550 nm wavelength on SOI waveguide,” Opt. Express 20(20), 22224–22232 (2012).
[Crossref] [PubMed]

Y. Luo, X. Zheng, G. Li, I. Shubin, H. Thacker, J. Yao, J.-H. Lee, D. Feng, J. Fong, C.-C. Kung, S. Liao, R. Shafiiha, M. Asghari, K. Raj, A. V. Krishnamoorthy, and J. E. Cunningham, “Strong electro-absorption in GeSi epitaxy on silicon-on-insulator (SOI),” Micromachines 3(4), 345–363 (2012).
[Crossref]

A. V. Krishnamoorthy, K. W. Goossen, W. Jan, X. Zheng, R. Ho, G. Li, R. Rozier, F. Liu, D. Patil, J. Lexau, H. Schwetman, D. Feng, M. Asghari, T. Pinguet, and J. E. Cunningham, “Progress in low-power switched optical interconnects,” IEEE J. Sel. Top. Quantum Electron. 17(2), 357–376 (2011).
[Crossref]

H. D. Thacker, Y. Luo, J. Shi, I. Shubin, J. Lexau, X. Zheng, G. Li, J. Yao, J. Costa, T. Pinguet, A. Mekis, P. Dong, S. Liao, D. Feng, M. Asghari, R. Ho, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Flip-chip integrated silicon photonic bridge chips for sub-picojoule per bit optical links,” in Proceedings of IEEE Electronic Components and Technology Conference (IEEE, 2010), pp. 240–246.
[Crossref]

H. D. Thacker, R. Shafiiha, J. Lexau, X. Zheng, S. S. Djordjevic, S. Lin, J. Simons, A. Abed, P. Amberg, E. Chang, I. Shubin, J.-H. Lee, Y. Luo, J. Yao, F. Liu, H. Liang, D. Feng, M. Asghari, R. Ho, K. Raj, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration and packaging of an energy-efficient WDM silicon photonic solid-state chip-to-chip interconnect,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2015).

H. D. Thacker, I. Shubin, Y. Luo, J. Costa, J. Lexau, X. Zheng, G. Li, J. Yao, J. Li, D. Patil, F. Liu, R. Ho, D. Feng, M. Asghari, T. Pinguet, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration of silicon nanophotonics with 40nm-CMOS VLSI drivers and receivers,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2011), pp. 829–835.
[Crossref]

Fong, J.

Fujikata, J.

Gainsley, J.

F. Y. Liu, D. Patil, J. Lexau, P. Amberg, M. Dayringer, J. Gainsley, H. F. Moghadam, X. Zheng, J. E. Cunningham, A. V. Krishnamoorthy, E. Alon, and R. Ho, “10-Gbps, 5.3-mW optical transmitter and receiver circuits in 40-nm CMOS,” IEEE J. Solid-State Circuits 47(9), 2049–2067 (2012).
[Crossref]

Georgas, M.

C. Sun, M. Georgas, J. S. Orcutt, B. R. Moss, Y.-H. Chen, J. Shainline, M. Wade, K. Mehta, K. Nammari, E. Timurdogan, D. Miller, O. Tehar-Zahav, Z. Sternberg, J. C. Leu, J. Chong, R. Bafrali, G. Sandhu, M. Watts, R. Meade, M. A. Popovic, R. J. Ram, and V. Stojanovic, “A monolithically-integrated chip-to-chip optical link in bulk CMOS,” in Proceedings of IEEE Symposium on VLSI Circuits (IEEE, 2014), pp. 1–2.
[Crossref]

Ger, G. G.

C. Cook, J. E. Cunningham, A. Hargrove, G. G. Ger, K. W. Goossen, W. Y. Jan, H. H. Kim, R. Krause, M. Manges, M. Morrissey, M. Perinpanayagam, A. Persaud, G. J. Shevchuk, V. Sinyansky, and A. V. Krishnamoorthy, “A 36-channel parallel optical interconnect module baed on optoelectronics-on-VLSI technology,” IEEE J. Sel. Top. Quantum Electron. 9(2), 387–399 (2003).
[Crossref]

Gloeckner, S.

A. Narasimha, B. Analui, Y. Liang, T. J. Sleboda, S. Abdalla, E. Balmater, S. Gloeckner, D. Guckenberger, M. Harrison, R. Koumans, D. Kucharski, A. Mekis, S. Mirsaidi, D. Song, and T. Pinguet, “A fully integrated 4 x 10 Gb/s DWDM transceiver in standard 0.13 µm CMOS SOI,” in Proceedings of IEEE International Solid State Circuits Conference (IEEE, 2007), pp. 42–43.

Goossen, K. W.

A. V. Krishnamoorthy, K. W. Goossen, W. Jan, X. Zheng, R. Ho, G. Li, R. Rozier, F. Liu, D. Patil, J. Lexau, H. Schwetman, D. Feng, M. Asghari, T. Pinguet, and J. E. Cunningham, “Progress in low-power switched optical interconnects,” IEEE J. Sel. Top. Quantum Electron. 17(2), 357–376 (2011).
[Crossref]

C. Cook, J. E. Cunningham, A. Hargrove, G. G. Ger, K. W. Goossen, W. Y. Jan, H. H. Kim, R. Krause, M. Manges, M. Morrissey, M. Perinpanayagam, A. Persaud, G. J. Shevchuk, V. Sinyansky, and A. V. Krishnamoorthy, “A 36-channel parallel optical interconnect module baed on optoelectronics-on-VLSI technology,” IEEE J. Sel. Top. Quantum Electron. 9(2), 387–399 (2003).
[Crossref]

A. V. Krishnamoorthy, L. M. F. Chirovsky, W. S. Hobson, R. E. Leibengath, S. P. Hui, G. J. Zydzik, K. W. Goossen, J. D. Wynn, B. J. Tseng, J. Lopata, J. A. Walker, J. E. Cunningham, and L. A. D’Asaro, “Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits,” IEEE Photon. Technol. Lett. 11(1), 128–130 (1999).
[Crossref]

T. K. Woodward, A. V. Krishnamoorthy, K. W. Goossen, J. A. Walker, B. Tseng, J. Lothian, S. Hui, and R. Leibenguth, “Modulator-driver circuits for optoelectronic VLSI,” IEEE Photon. Technol. Lett. 9(6), 839–841 (1997).
[Crossref]

K. W. Goossen, J. E. Cunningham, and W. Y. Jan, “GaAs 850nm modulators solder-bonded to silicon,” IEEE Photon. Technol. Lett. 5(7), 776–778 (1993).
[Crossref]

Graham, L. A.

Guckenberger, D.

A. Narasimha, B. Analui, Y. Liang, T. J. Sleboda, S. Abdalla, E. Balmater, S. Gloeckner, D. Guckenberger, M. Harrison, R. Koumans, D. Kucharski, A. Mekis, S. Mirsaidi, D. Song, and T. Pinguet, “A fully integrated 4 x 10 Gb/s DWDM transceiver in standard 0.13 µm CMOS SOI,” in Proceedings of IEEE International Solid State Circuits Conference (IEEE, 2007), pp. 42–43.

Hargrove, A.

C. Cook, J. E. Cunningham, A. Hargrove, G. G. Ger, K. W. Goossen, W. Y. Jan, H. H. Kim, R. Krause, M. Manges, M. Morrissey, M. Perinpanayagam, A. Persaud, G. J. Shevchuk, V. Sinyansky, and A. V. Krishnamoorthy, “A 36-channel parallel optical interconnect module baed on optoelectronics-on-VLSI technology,” IEEE J. Sel. Top. Quantum Electron. 9(2), 387–399 (2003).
[Crossref]

Harrison, M.

A. Narasimha, B. Analui, Y. Liang, T. J. Sleboda, S. Abdalla, E. Balmater, S. Gloeckner, D. Guckenberger, M. Harrison, R. Koumans, D. Kucharski, A. Mekis, S. Mirsaidi, D. Song, and T. Pinguet, “A fully integrated 4 x 10 Gb/s DWDM transceiver in standard 0.13 µm CMOS SOI,” in Proceedings of IEEE International Solid State Circuits Conference (IEEE, 2007), pp. 42–43.

Hatori, N.

Haymes, C.

Ho, R.

A. V. Krishnamoorthy, X. Zheng, D. Feng, J. Lexau, J. F. Buckwalter, H. D. Thacker, F. Liu, Y. Luo, E. Chang, P. Amberg, I. Shubin, S. S. Djordjevic, J.-H. Lee, S. Lin, H. Liang, A. Abed, R. Shafiiha, K. Raj, R. Ho, M. Asghari, and J. E. Cunningham, “A low-power, high-speed, 9-channel germanium-silicon electro-absorption modulator array integrated with digital CMOS driver and wavelength multiplexer,” Opt. Express 22(10), 12289–12295 (2014).
[Crossref] [PubMed]

X. Zheng, Y. Luo, J. Lexau, F. Liu, G. Li, H. D. Thacker, I. Shubin, J. Yao, R. Ho, J. E. Cunningham, and A. V. Krishnamoorthy, “2-pJ/bit (on-chip) 10-Gb/s digital CMOS silicon photonic link,” IEEE Photon. Technol. Lett. 24(14), 1260–1262 (2012).
[Crossref]

F. Y. Liu, D. Patil, J. Lexau, P. Amberg, M. Dayringer, J. Gainsley, H. F. Moghadam, X. Zheng, J. E. Cunningham, A. V. Krishnamoorthy, E. Alon, and R. Ho, “10-Gbps, 5.3-mW optical transmitter and receiver circuits in 40-nm CMOS,” IEEE J. Solid-State Circuits 47(9), 2049–2067 (2012).
[Crossref]

A. V. Krishnamoorthy, K. W. Goossen, W. Jan, X. Zheng, R. Ho, G. Li, R. Rozier, F. Liu, D. Patil, J. Lexau, H. Schwetman, D. Feng, M. Asghari, T. Pinguet, and J. E. Cunningham, “Progress in low-power switched optical interconnects,” IEEE J. Sel. Top. Quantum Electron. 17(2), 357–376 (2011).
[Crossref]

A. V. Krishnamoorthy, R. Ho, X. Zheng, H. Schwetman, J. Lexau, P. Koka, G. Li, I. Shubin, and J. E. Cunningham, “Computer systems based on silicon photonic interconnects,” Proc. IEEE 97(7), 1337–1361 (2009).
[Crossref]

H. D. Thacker, Y. Luo, J. Shi, I. Shubin, J. Lexau, X. Zheng, G. Li, J. Yao, J. Costa, T. Pinguet, A. Mekis, P. Dong, S. Liao, D. Feng, M. Asghari, R. Ho, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Flip-chip integrated silicon photonic bridge chips for sub-picojoule per bit optical links,” in Proceedings of IEEE Electronic Components and Technology Conference (IEEE, 2010), pp. 240–246.
[Crossref]

H. D. Thacker, R. Shafiiha, J. Lexau, X. Zheng, S. S. Djordjevic, S. Lin, J. Simons, A. Abed, P. Amberg, E. Chang, I. Shubin, J.-H. Lee, Y. Luo, J. Yao, F. Liu, H. Liang, D. Feng, M. Asghari, R. Ho, K. Raj, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration and packaging of an energy-efficient WDM silicon photonic solid-state chip-to-chip interconnect,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2015).

H. D. Thacker, I. Shubin, Y. Luo, J. Costa, J. Lexau, X. Zheng, G. Li, J. Yao, J. Li, D. Patil, F. Liu, R. Ho, D. Feng, M. Asghari, T. Pinguet, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration of silicon nanophotonics with 40nm-CMOS VLSI drivers and receivers,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2011), pp. 829–835.
[Crossref]

Hobson, W. S.

A. V. Krishnamoorthy, L. M. F. Chirovsky, W. S. Hobson, R. E. Leibengath, S. P. Hui, G. J. Zydzik, K. W. Goossen, J. D. Wynn, B. J. Tseng, J. Lopata, J. A. Walker, J. E. Cunningham, and L. A. D’Asaro, “Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits,” IEEE Photon. Technol. Lett. 11(1), 128–130 (1999).
[Crossref]

Hui, S.

T. K. Woodward, A. V. Krishnamoorthy, K. W. Goossen, J. A. Walker, B. Tseng, J. Lothian, S. Hui, and R. Leibenguth, “Modulator-driver circuits for optoelectronic VLSI,” IEEE Photon. Technol. Lett. 9(6), 839–841 (1997).
[Crossref]

Hui, S. P.

A. V. Krishnamoorthy, L. M. F. Chirovsky, W. S. Hobson, R. E. Leibengath, S. P. Hui, G. J. Zydzik, K. W. Goossen, J. D. Wynn, B. J. Tseng, J. Lopata, J. A. Walker, J. E. Cunningham, and L. A. D’Asaro, “Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits,” IEEE Photon. Technol. Lett. 11(1), 128–130 (1999).
[Crossref]

Ishizaka, M.

Itabashi, S.

Jan, W.

A. V. Krishnamoorthy, K. W. Goossen, W. Jan, X. Zheng, R. Ho, G. Li, R. Rozier, F. Liu, D. Patil, J. Lexau, H. Schwetman, D. Feng, M. Asghari, T. Pinguet, and J. E. Cunningham, “Progress in low-power switched optical interconnects,” IEEE J. Sel. Top. Quantum Electron. 17(2), 357–376 (2011).
[Crossref]

Jan, W. Y.

C. Cook, J. E. Cunningham, A. Hargrove, G. G. Ger, K. W. Goossen, W. Y. Jan, H. H. Kim, R. Krause, M. Manges, M. Morrissey, M. Perinpanayagam, A. Persaud, G. J. Shevchuk, V. Sinyansky, and A. V. Krishnamoorthy, “A 36-channel parallel optical interconnect module baed on optoelectronics-on-VLSI technology,” IEEE J. Sel. Top. Quantum Electron. 9(2), 387–399 (2003).
[Crossref]

K. W. Goossen, J. E. Cunningham, and W. Y. Jan, “GaAs 850nm modulators solder-bonded to silicon,” IEEE Photon. Technol. Lett. 5(7), 776–778 (1993).
[Crossref]

Jewell, J.

John, R.

Kim, H. H.

C. Cook, J. E. Cunningham, A. Hargrove, G. G. Ger, K. W. Goossen, W. Y. Jan, H. H. Kim, R. Krause, M. Manges, M. Morrissey, M. Perinpanayagam, A. Persaud, G. J. Shevchuk, V. Sinyansky, and A. V. Krishnamoorthy, “A 36-channel parallel optical interconnect module baed on optoelectronics-on-VLSI technology,” IEEE J. Sel. Top. Quantum Electron. 9(2), 387–399 (2003).
[Crossref]

Kimerling, L. C.

J. F. Liu, M. Beals, A. Pomerene, S. Bernardis, R. Sun, J. Cheng, L. C. Kimerling, and J. Michel, “Waveguide-integrated, ultralow-energy GeSi electroabsorption modulators,” Nat. Photonics 2(7), 433–437 (2008).
[Crossref]

Koka, P.

A. V. Krishnamoorthy, R. Ho, X. Zheng, H. Schwetman, J. Lexau, P. Koka, G. Li, I. Shubin, and J. E. Cunningham, “Computer systems based on silicon photonic interconnects,” Proc. IEEE 97(7), 1337–1361 (2009).
[Crossref]

Koumans, R.

A. Narasimha, B. Analui, Y. Liang, T. J. Sleboda, S. Abdalla, E. Balmater, S. Gloeckner, D. Guckenberger, M. Harrison, R. Koumans, D. Kucharski, A. Mekis, S. Mirsaidi, D. Song, and T. Pinguet, “A fully integrated 4 x 10 Gb/s DWDM transceiver in standard 0.13 µm CMOS SOI,” in Proceedings of IEEE International Solid State Circuits Conference (IEEE, 2007), pp. 42–43.

Krause, R.

C. Cook, J. E. Cunningham, A. Hargrove, G. G. Ger, K. W. Goossen, W. Y. Jan, H. H. Kim, R. Krause, M. Manges, M. Morrissey, M. Perinpanayagam, A. Persaud, G. J. Shevchuk, V. Sinyansky, and A. V. Krishnamoorthy, “A 36-channel parallel optical interconnect module baed on optoelectronics-on-VLSI technology,” IEEE J. Sel. Top. Quantum Electron. 9(2), 387–399 (2003).
[Crossref]

Krishnamoorthy, A. V.

A. V. Krishnamoorthy, X. Zheng, D. Feng, J. Lexau, J. F. Buckwalter, H. D. Thacker, F. Liu, Y. Luo, E. Chang, P. Amberg, I. Shubin, S. S. Djordjevic, J.-H. Lee, S. Lin, H. Liang, A. Abed, R. Shafiiha, K. Raj, R. Ho, M. Asghari, and J. E. Cunningham, “A low-power, high-speed, 9-channel germanium-silicon electro-absorption modulator array integrated with digital CMOS driver and wavelength multiplexer,” Opt. Express 22(10), 12289–12295 (2014).
[Crossref] [PubMed]

A. J. Zilkie, P. Seddighian, B. J. Bijlani, W. Qian, D. C. Lee, S. Fathololoumi, J. Fong, R. Shafiiha, D. Feng, B. J. Luff, X. Zheng, J. E. Cunningham, A. V. Krishnamoorthy, and M. Asghari, “Power-efficient III-V/silicon external cavity DBR lasers,” Opt. Express 20(21), 23456–23462 (2012).
[Crossref] [PubMed]

D. Feng, S. Liao, H. Liang, J. Fong, B. Bijlani, R. Shafiiha, B. J. Luff, Y. Luo, J. Cunningham, A. V. Krishnamoorthy, and M. Asghari, “High speed GeSi electro-absorption modulator at 1550 nm wavelength on SOI waveguide,” Opt. Express 20(20), 22224–22232 (2012).
[Crossref] [PubMed]

X. Zheng, Y. Luo, J. Lexau, F. Liu, G. Li, H. D. Thacker, I. Shubin, J. Yao, R. Ho, J. E. Cunningham, and A. V. Krishnamoorthy, “2-pJ/bit (on-chip) 10-Gb/s digital CMOS silicon photonic link,” IEEE Photon. Technol. Lett. 24(14), 1260–1262 (2012).
[Crossref]

F. Y. Liu, D. Patil, J. Lexau, P. Amberg, M. Dayringer, J. Gainsley, H. F. Moghadam, X. Zheng, J. E. Cunningham, A. V. Krishnamoorthy, E. Alon, and R. Ho, “10-Gbps, 5.3-mW optical transmitter and receiver circuits in 40-nm CMOS,” IEEE J. Solid-State Circuits 47(9), 2049–2067 (2012).
[Crossref]

Y. Luo, X. Zheng, G. Li, I. Shubin, H. Thacker, J. Yao, J.-H. Lee, D. Feng, J. Fong, C.-C. Kung, S. Liao, R. Shafiiha, M. Asghari, K. Raj, A. V. Krishnamoorthy, and J. E. Cunningham, “Strong electro-absorption in GeSi epitaxy on silicon-on-insulator (SOI),” Micromachines 3(4), 345–363 (2012).
[Crossref]

A. V. Krishnamoorthy, K. W. Goossen, W. Jan, X. Zheng, R. Ho, G. Li, R. Rozier, F. Liu, D. Patil, J. Lexau, H. Schwetman, D. Feng, M. Asghari, T. Pinguet, and J. E. Cunningham, “Progress in low-power switched optical interconnects,” IEEE J. Sel. Top. Quantum Electron. 17(2), 357–376 (2011).
[Crossref]

A. V. Krishnamoorthy, R. Ho, X. Zheng, H. Schwetman, J. Lexau, P. Koka, G. Li, I. Shubin, and J. E. Cunningham, “Computer systems based on silicon photonic interconnects,” Proc. IEEE 97(7), 1337–1361 (2009).
[Crossref]

C. Cook, J. E. Cunningham, A. Hargrove, G. G. Ger, K. W. Goossen, W. Y. Jan, H. H. Kim, R. Krause, M. Manges, M. Morrissey, M. Perinpanayagam, A. Persaud, G. J. Shevchuk, V. Sinyansky, and A. V. Krishnamoorthy, “A 36-channel parallel optical interconnect module baed on optoelectronics-on-VLSI technology,” IEEE J. Sel. Top. Quantum Electron. 9(2), 387–399 (2003).
[Crossref]

A. V. Krishnamoorthy, L. M. F. Chirovsky, W. S. Hobson, R. E. Leibengath, S. P. Hui, G. J. Zydzik, K. W. Goossen, J. D. Wynn, B. J. Tseng, J. Lopata, J. A. Walker, J. E. Cunningham, and L. A. D’Asaro, “Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits,” IEEE Photon. Technol. Lett. 11(1), 128–130 (1999).
[Crossref]

T. K. Woodward, A. V. Krishnamoorthy, K. W. Goossen, J. A. Walker, B. Tseng, J. Lothian, S. Hui, and R. Leibenguth, “Modulator-driver circuits for optoelectronic VLSI,” IEEE Photon. Technol. Lett. 9(6), 839–841 (1997).
[Crossref]

H. D. Thacker, Y. Luo, J. Shi, I. Shubin, J. Lexau, X. Zheng, G. Li, J. Yao, J. Costa, T. Pinguet, A. Mekis, P. Dong, S. Liao, D. Feng, M. Asghari, R. Ho, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Flip-chip integrated silicon photonic bridge chips for sub-picojoule per bit optical links,” in Proceedings of IEEE Electronic Components and Technology Conference (IEEE, 2010), pp. 240–246.
[Crossref]

H. D. Thacker, I. Shubin, Y. Luo, J. Costa, J. Lexau, X. Zheng, G. Li, J. Yao, J. Li, D. Patil, F. Liu, R. Ho, D. Feng, M. Asghari, T. Pinguet, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration of silicon nanophotonics with 40nm-CMOS VLSI drivers and receivers,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2011), pp. 829–835.
[Crossref]

H. D. Thacker, R. Shafiiha, J. Lexau, X. Zheng, S. S. Djordjevic, S. Lin, J. Simons, A. Abed, P. Amberg, E. Chang, I. Shubin, J.-H. Lee, Y. Luo, J. Yao, F. Liu, H. Liang, D. Feng, M. Asghari, R. Ho, K. Raj, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration and packaging of an energy-efficient WDM silicon photonic solid-state chip-to-chip interconnect,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2015).

Kucharski, D.

D. M. Kuchta, Y. H. Kwark, C. Schuster, C. Baks, C. Haymes, J. Schaub, P. Pepeljugoski, L. Shan, R. John, D. Kucharski, D. Rogers, M. Ritter, J. Jewell, L. A. Graham, K. Schrödinger, A. Schild, and H.-M. Rein, “120-Gb/s VCSEL-based parallel-optical interconnect and custom 120-Gb/s testing station,” J. Lightwave Technol. 22(9), 2200–2212 (2004).
[Crossref]

A. Narasimha, B. Analui, Y. Liang, T. J. Sleboda, S. Abdalla, E. Balmater, S. Gloeckner, D. Guckenberger, M. Harrison, R. Koumans, D. Kucharski, A. Mekis, S. Mirsaidi, D. Song, and T. Pinguet, “A fully integrated 4 x 10 Gb/s DWDM transceiver in standard 0.13 µm CMOS SOI,” in Proceedings of IEEE International Solid State Circuits Conference (IEEE, 2007), pp. 42–43.

Kuchta, D. M.

Kung, C.-C.

Y. Luo, X. Zheng, G. Li, I. Shubin, H. Thacker, J. Yao, J.-H. Lee, D. Feng, J. Fong, C.-C. Kung, S. Liao, R. Shafiiha, M. Asghari, K. Raj, A. V. Krishnamoorthy, and J. E. Cunningham, “Strong electro-absorption in GeSi epitaxy on silicon-on-insulator (SOI),” Micromachines 3(4), 345–363 (2012).
[Crossref]

Kwark, Y. H.

Lee, D. C.

Lee, J.-H.

A. V. Krishnamoorthy, X. Zheng, D. Feng, J. Lexau, J. F. Buckwalter, H. D. Thacker, F. Liu, Y. Luo, E. Chang, P. Amberg, I. Shubin, S. S. Djordjevic, J.-H. Lee, S. Lin, H. Liang, A. Abed, R. Shafiiha, K. Raj, R. Ho, M. Asghari, and J. E. Cunningham, “A low-power, high-speed, 9-channel germanium-silicon electro-absorption modulator array integrated with digital CMOS driver and wavelength multiplexer,” Opt. Express 22(10), 12289–12295 (2014).
[Crossref] [PubMed]

Y. Luo, X. Zheng, G. Li, I. Shubin, H. Thacker, J. Yao, J.-H. Lee, D. Feng, J. Fong, C.-C. Kung, S. Liao, R. Shafiiha, M. Asghari, K. Raj, A. V. Krishnamoorthy, and J. E. Cunningham, “Strong electro-absorption in GeSi epitaxy on silicon-on-insulator (SOI),” Micromachines 3(4), 345–363 (2012).
[Crossref]

H. D. Thacker, R. Shafiiha, J. Lexau, X. Zheng, S. S. Djordjevic, S. Lin, J. Simons, A. Abed, P. Amberg, E. Chang, I. Shubin, J.-H. Lee, Y. Luo, J. Yao, F. Liu, H. Liang, D. Feng, M. Asghari, R. Ho, K. Raj, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration and packaging of an energy-efficient WDM silicon photonic solid-state chip-to-chip interconnect,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2015).

Leibengath, R. E.

A. V. Krishnamoorthy, L. M. F. Chirovsky, W. S. Hobson, R. E. Leibengath, S. P. Hui, G. J. Zydzik, K. W. Goossen, J. D. Wynn, B. J. Tseng, J. Lopata, J. A. Walker, J. E. Cunningham, and L. A. D’Asaro, “Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits,” IEEE Photon. Technol. Lett. 11(1), 128–130 (1999).
[Crossref]

Leibenguth, R.

T. K. Woodward, A. V. Krishnamoorthy, K. W. Goossen, J. A. Walker, B. Tseng, J. Lothian, S. Hui, and R. Leibenguth, “Modulator-driver circuits for optoelectronic VLSI,” IEEE Photon. Technol. Lett. 9(6), 839–841 (1997).
[Crossref]

Leu, J. C.

C. Sun, M. Georgas, J. S. Orcutt, B. R. Moss, Y.-H. Chen, J. Shainline, M. Wade, K. Mehta, K. Nammari, E. Timurdogan, D. Miller, O. Tehar-Zahav, Z. Sternberg, J. C. Leu, J. Chong, R. Bafrali, G. Sandhu, M. Watts, R. Meade, M. A. Popovic, R. J. Ram, and V. Stojanovic, “A monolithically-integrated chip-to-chip optical link in bulk CMOS,” in Proceedings of IEEE Symposium on VLSI Circuits (IEEE, 2014), pp. 1–2.
[Crossref]

Lexau, J.

A. V. Krishnamoorthy, X. Zheng, D. Feng, J. Lexau, J. F. Buckwalter, H. D. Thacker, F. Liu, Y. Luo, E. Chang, P. Amberg, I. Shubin, S. S. Djordjevic, J.-H. Lee, S. Lin, H. Liang, A. Abed, R. Shafiiha, K. Raj, R. Ho, M. Asghari, and J. E. Cunningham, “A low-power, high-speed, 9-channel germanium-silicon electro-absorption modulator array integrated with digital CMOS driver and wavelength multiplexer,” Opt. Express 22(10), 12289–12295 (2014).
[Crossref] [PubMed]

X. Zheng, Y. Luo, J. Lexau, F. Liu, G. Li, H. D. Thacker, I. Shubin, J. Yao, R. Ho, J. E. Cunningham, and A. V. Krishnamoorthy, “2-pJ/bit (on-chip) 10-Gb/s digital CMOS silicon photonic link,” IEEE Photon. Technol. Lett. 24(14), 1260–1262 (2012).
[Crossref]

F. Y. Liu, D. Patil, J. Lexau, P. Amberg, M. Dayringer, J. Gainsley, H. F. Moghadam, X. Zheng, J. E. Cunningham, A. V. Krishnamoorthy, E. Alon, and R. Ho, “10-Gbps, 5.3-mW optical transmitter and receiver circuits in 40-nm CMOS,” IEEE J. Solid-State Circuits 47(9), 2049–2067 (2012).
[Crossref]

A. V. Krishnamoorthy, K. W. Goossen, W. Jan, X. Zheng, R. Ho, G. Li, R. Rozier, F. Liu, D. Patil, J. Lexau, H. Schwetman, D. Feng, M. Asghari, T. Pinguet, and J. E. Cunningham, “Progress in low-power switched optical interconnects,” IEEE J. Sel. Top. Quantum Electron. 17(2), 357–376 (2011).
[Crossref]

A. V. Krishnamoorthy, R. Ho, X. Zheng, H. Schwetman, J. Lexau, P. Koka, G. Li, I. Shubin, and J. E. Cunningham, “Computer systems based on silicon photonic interconnects,” Proc. IEEE 97(7), 1337–1361 (2009).
[Crossref]

H. D. Thacker, Y. Luo, J. Shi, I. Shubin, J. Lexau, X. Zheng, G. Li, J. Yao, J. Costa, T. Pinguet, A. Mekis, P. Dong, S. Liao, D. Feng, M. Asghari, R. Ho, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Flip-chip integrated silicon photonic bridge chips for sub-picojoule per bit optical links,” in Proceedings of IEEE Electronic Components and Technology Conference (IEEE, 2010), pp. 240–246.
[Crossref]

H. D. Thacker, R. Shafiiha, J. Lexau, X. Zheng, S. S. Djordjevic, S. Lin, J. Simons, A. Abed, P. Amberg, E. Chang, I. Shubin, J.-H. Lee, Y. Luo, J. Yao, F. Liu, H. Liang, D. Feng, M. Asghari, R. Ho, K. Raj, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration and packaging of an energy-efficient WDM silicon photonic solid-state chip-to-chip interconnect,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2015).

H. D. Thacker, I. Shubin, Y. Luo, J. Costa, J. Lexau, X. Zheng, G. Li, J. Yao, J. Li, D. Patil, F. Liu, R. Ho, D. Feng, M. Asghari, T. Pinguet, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration of silicon nanophotonics with 40nm-CMOS VLSI drivers and receivers,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2011), pp. 829–835.
[Crossref]

Li, G.

Y. Luo, X. Zheng, G. Li, I. Shubin, H. Thacker, J. Yao, J.-H. Lee, D. Feng, J. Fong, C.-C. Kung, S. Liao, R. Shafiiha, M. Asghari, K. Raj, A. V. Krishnamoorthy, and J. E. Cunningham, “Strong electro-absorption in GeSi epitaxy on silicon-on-insulator (SOI),” Micromachines 3(4), 345–363 (2012).
[Crossref]

X. Zheng, Y. Luo, J. Lexau, F. Liu, G. Li, H. D. Thacker, I. Shubin, J. Yao, R. Ho, J. E. Cunningham, and A. V. Krishnamoorthy, “2-pJ/bit (on-chip) 10-Gb/s digital CMOS silicon photonic link,” IEEE Photon. Technol. Lett. 24(14), 1260–1262 (2012).
[Crossref]

A. V. Krishnamoorthy, K. W. Goossen, W. Jan, X. Zheng, R. Ho, G. Li, R. Rozier, F. Liu, D. Patil, J. Lexau, H. Schwetman, D. Feng, M. Asghari, T. Pinguet, and J. E. Cunningham, “Progress in low-power switched optical interconnects,” IEEE J. Sel. Top. Quantum Electron. 17(2), 357–376 (2011).
[Crossref]

A. V. Krishnamoorthy, R. Ho, X. Zheng, H. Schwetman, J. Lexau, P. Koka, G. Li, I. Shubin, and J. E. Cunningham, “Computer systems based on silicon photonic interconnects,” Proc. IEEE 97(7), 1337–1361 (2009).
[Crossref]

H. D. Thacker, Y. Luo, J. Shi, I. Shubin, J. Lexau, X. Zheng, G. Li, J. Yao, J. Costa, T. Pinguet, A. Mekis, P. Dong, S. Liao, D. Feng, M. Asghari, R. Ho, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Flip-chip integrated silicon photonic bridge chips for sub-picojoule per bit optical links,” in Proceedings of IEEE Electronic Components and Technology Conference (IEEE, 2010), pp. 240–246.
[Crossref]

H. D. Thacker, I. Shubin, Y. Luo, J. Costa, J. Lexau, X. Zheng, G. Li, J. Yao, J. Li, D. Patil, F. Liu, R. Ho, D. Feng, M. Asghari, T. Pinguet, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration of silicon nanophotonics with 40nm-CMOS VLSI drivers and receivers,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2011), pp. 829–835.
[Crossref]

Li, J.

H. D. Thacker, I. Shubin, Y. Luo, J. Costa, J. Lexau, X. Zheng, G. Li, J. Yao, J. Li, D. Patil, F. Liu, R. Ho, D. Feng, M. Asghari, T. Pinguet, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration of silicon nanophotonics with 40nm-CMOS VLSI drivers and receivers,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2011), pp. 829–835.
[Crossref]

Liang, H.

Liang, Y.

A. Narasimha, B. Analui, Y. Liang, T. J. Sleboda, S. Abdalla, E. Balmater, S. Gloeckner, D. Guckenberger, M. Harrison, R. Koumans, D. Kucharski, A. Mekis, S. Mirsaidi, D. Song, and T. Pinguet, “A fully integrated 4 x 10 Gb/s DWDM transceiver in standard 0.13 µm CMOS SOI,” in Proceedings of IEEE International Solid State Circuits Conference (IEEE, 2007), pp. 42–43.

Liao, S.

Y. Luo, X. Zheng, G. Li, I. Shubin, H. Thacker, J. Yao, J.-H. Lee, D. Feng, J. Fong, C.-C. Kung, S. Liao, R. Shafiiha, M. Asghari, K. Raj, A. V. Krishnamoorthy, and J. E. Cunningham, “Strong electro-absorption in GeSi epitaxy on silicon-on-insulator (SOI),” Micromachines 3(4), 345–363 (2012).
[Crossref]

D. Feng, S. Liao, H. Liang, J. Fong, B. Bijlani, R. Shafiiha, B. J. Luff, Y. Luo, J. Cunningham, A. V. Krishnamoorthy, and M. Asghari, “High speed GeSi electro-absorption modulator at 1550 nm wavelength on SOI waveguide,” Opt. Express 20(20), 22224–22232 (2012).
[Crossref] [PubMed]

H. D. Thacker, Y. Luo, J. Shi, I. Shubin, J. Lexau, X. Zheng, G. Li, J. Yao, J. Costa, T. Pinguet, A. Mekis, P. Dong, S. Liao, D. Feng, M. Asghari, R. Ho, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Flip-chip integrated silicon photonic bridge chips for sub-picojoule per bit optical links,” in Proceedings of IEEE Electronic Components and Technology Conference (IEEE, 2010), pp. 240–246.
[Crossref]

Lin, S.

A. V. Krishnamoorthy, X. Zheng, D. Feng, J. Lexau, J. F. Buckwalter, H. D. Thacker, F. Liu, Y. Luo, E. Chang, P. Amberg, I. Shubin, S. S. Djordjevic, J.-H. Lee, S. Lin, H. Liang, A. Abed, R. Shafiiha, K. Raj, R. Ho, M. Asghari, and J. E. Cunningham, “A low-power, high-speed, 9-channel germanium-silicon electro-absorption modulator array integrated with digital CMOS driver and wavelength multiplexer,” Opt. Express 22(10), 12289–12295 (2014).
[Crossref] [PubMed]

H. D. Thacker, R. Shafiiha, J. Lexau, X. Zheng, S. S. Djordjevic, S. Lin, J. Simons, A. Abed, P. Amberg, E. Chang, I. Shubin, J.-H. Lee, Y. Luo, J. Yao, F. Liu, H. Liang, D. Feng, M. Asghari, R. Ho, K. Raj, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration and packaging of an energy-efficient WDM silicon photonic solid-state chip-to-chip interconnect,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2015).

Liu, F.

A. V. Krishnamoorthy, X. Zheng, D. Feng, J. Lexau, J. F. Buckwalter, H. D. Thacker, F. Liu, Y. Luo, E. Chang, P. Amberg, I. Shubin, S. S. Djordjevic, J.-H. Lee, S. Lin, H. Liang, A. Abed, R. Shafiiha, K. Raj, R. Ho, M. Asghari, and J. E. Cunningham, “A low-power, high-speed, 9-channel germanium-silicon electro-absorption modulator array integrated with digital CMOS driver and wavelength multiplexer,” Opt. Express 22(10), 12289–12295 (2014).
[Crossref] [PubMed]

X. Zheng, Y. Luo, J. Lexau, F. Liu, G. Li, H. D. Thacker, I. Shubin, J. Yao, R. Ho, J. E. Cunningham, and A. V. Krishnamoorthy, “2-pJ/bit (on-chip) 10-Gb/s digital CMOS silicon photonic link,” IEEE Photon. Technol. Lett. 24(14), 1260–1262 (2012).
[Crossref]

A. V. Krishnamoorthy, K. W. Goossen, W. Jan, X. Zheng, R. Ho, G. Li, R. Rozier, F. Liu, D. Patil, J. Lexau, H. Schwetman, D. Feng, M. Asghari, T. Pinguet, and J. E. Cunningham, “Progress in low-power switched optical interconnects,” IEEE J. Sel. Top. Quantum Electron. 17(2), 357–376 (2011).
[Crossref]

H. D. Thacker, R. Shafiiha, J. Lexau, X. Zheng, S. S. Djordjevic, S. Lin, J. Simons, A. Abed, P. Amberg, E. Chang, I. Shubin, J.-H. Lee, Y. Luo, J. Yao, F. Liu, H. Liang, D. Feng, M. Asghari, R. Ho, K. Raj, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration and packaging of an energy-efficient WDM silicon photonic solid-state chip-to-chip interconnect,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2015).

H. D. Thacker, I. Shubin, Y. Luo, J. Costa, J. Lexau, X. Zheng, G. Li, J. Yao, J. Li, D. Patil, F. Liu, R. Ho, D. Feng, M. Asghari, T. Pinguet, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration of silicon nanophotonics with 40nm-CMOS VLSI drivers and receivers,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2011), pp. 829–835.
[Crossref]

Liu, F. Y.

F. Y. Liu, D. Patil, J. Lexau, P. Amberg, M. Dayringer, J. Gainsley, H. F. Moghadam, X. Zheng, J. E. Cunningham, A. V. Krishnamoorthy, E. Alon, and R. Ho, “10-Gbps, 5.3-mW optical transmitter and receiver circuits in 40-nm CMOS,” IEEE J. Solid-State Circuits 47(9), 2049–2067 (2012).
[Crossref]

Liu, J. F.

J. F. Liu, M. Beals, A. Pomerene, S. Bernardis, R. Sun, J. Cheng, L. C. Kimerling, and J. Michel, “Waveguide-integrated, ultralow-energy GeSi electroabsorption modulators,” Nat. Photonics 2(7), 433–437 (2008).
[Crossref]

Lopata, J.

A. V. Krishnamoorthy, L. M. F. Chirovsky, W. S. Hobson, R. E. Leibengath, S. P. Hui, G. J. Zydzik, K. W. Goossen, J. D. Wynn, B. J. Tseng, J. Lopata, J. A. Walker, J. E. Cunningham, and L. A. D’Asaro, “Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits,” IEEE Photon. Technol. Lett. 11(1), 128–130 (1999).
[Crossref]

Lothian, J.

T. K. Woodward, A. V. Krishnamoorthy, K. W. Goossen, J. A. Walker, B. Tseng, J. Lothian, S. Hui, and R. Leibenguth, “Modulator-driver circuits for optoelectronic VLSI,” IEEE Photon. Technol. Lett. 9(6), 839–841 (1997).
[Crossref]

Luff, B. J.

Luo, Y.

A. V. Krishnamoorthy, X. Zheng, D. Feng, J. Lexau, J. F. Buckwalter, H. D. Thacker, F. Liu, Y. Luo, E. Chang, P. Amberg, I. Shubin, S. S. Djordjevic, J.-H. Lee, S. Lin, H. Liang, A. Abed, R. Shafiiha, K. Raj, R. Ho, M. Asghari, and J. E. Cunningham, “A low-power, high-speed, 9-channel germanium-silicon electro-absorption modulator array integrated with digital CMOS driver and wavelength multiplexer,” Opt. Express 22(10), 12289–12295 (2014).
[Crossref] [PubMed]

D. Feng, S. Liao, H. Liang, J. Fong, B. Bijlani, R. Shafiiha, B. J. Luff, Y. Luo, J. Cunningham, A. V. Krishnamoorthy, and M. Asghari, “High speed GeSi electro-absorption modulator at 1550 nm wavelength on SOI waveguide,” Opt. Express 20(20), 22224–22232 (2012).
[Crossref] [PubMed]

Y. Luo, X. Zheng, G. Li, I. Shubin, H. Thacker, J. Yao, J.-H. Lee, D. Feng, J. Fong, C.-C. Kung, S. Liao, R. Shafiiha, M. Asghari, K. Raj, A. V. Krishnamoorthy, and J. E. Cunningham, “Strong electro-absorption in GeSi epitaxy on silicon-on-insulator (SOI),” Micromachines 3(4), 345–363 (2012).
[Crossref]

X. Zheng, Y. Luo, J. Lexau, F. Liu, G. Li, H. D. Thacker, I. Shubin, J. Yao, R. Ho, J. E. Cunningham, and A. V. Krishnamoorthy, “2-pJ/bit (on-chip) 10-Gb/s digital CMOS silicon photonic link,” IEEE Photon. Technol. Lett. 24(14), 1260–1262 (2012).
[Crossref]

H. D. Thacker, I. Shubin, Y. Luo, J. Costa, J. Lexau, X. Zheng, G. Li, J. Yao, J. Li, D. Patil, F. Liu, R. Ho, D. Feng, M. Asghari, T. Pinguet, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration of silicon nanophotonics with 40nm-CMOS VLSI drivers and receivers,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2011), pp. 829–835.
[Crossref]

H. D. Thacker, Y. Luo, J. Shi, I. Shubin, J. Lexau, X. Zheng, G. Li, J. Yao, J. Costa, T. Pinguet, A. Mekis, P. Dong, S. Liao, D. Feng, M. Asghari, R. Ho, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Flip-chip integrated silicon photonic bridge chips for sub-picojoule per bit optical links,” in Proceedings of IEEE Electronic Components and Technology Conference (IEEE, 2010), pp. 240–246.
[Crossref]

H. D. Thacker, R. Shafiiha, J. Lexau, X. Zheng, S. S. Djordjevic, S. Lin, J. Simons, A. Abed, P. Amberg, E. Chang, I. Shubin, J.-H. Lee, Y. Luo, J. Yao, F. Liu, H. Liang, D. Feng, M. Asghari, R. Ho, K. Raj, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration and packaging of an energy-efficient WDM silicon photonic solid-state chip-to-chip interconnect,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2015).

Manges, M.

C. Cook, J. E. Cunningham, A. Hargrove, G. G. Ger, K. W. Goossen, W. Y. Jan, H. H. Kim, R. Krause, M. Manges, M. Morrissey, M. Perinpanayagam, A. Persaud, G. J. Shevchuk, V. Sinyansky, and A. V. Krishnamoorthy, “A 36-channel parallel optical interconnect module baed on optoelectronics-on-VLSI technology,” IEEE J. Sel. Top. Quantum Electron. 9(2), 387–399 (2003).
[Crossref]

Meade, R.

C. Sun, M. Georgas, J. S. Orcutt, B. R. Moss, Y.-H. Chen, J. Shainline, M. Wade, K. Mehta, K. Nammari, E. Timurdogan, D. Miller, O. Tehar-Zahav, Z. Sternberg, J. C. Leu, J. Chong, R. Bafrali, G. Sandhu, M. Watts, R. Meade, M. A. Popovic, R. J. Ram, and V. Stojanovic, “A monolithically-integrated chip-to-chip optical link in bulk CMOS,” in Proceedings of IEEE Symposium on VLSI Circuits (IEEE, 2014), pp. 1–2.
[Crossref]

Mehta, K.

C. Sun, M. Georgas, J. S. Orcutt, B. R. Moss, Y.-H. Chen, J. Shainline, M. Wade, K. Mehta, K. Nammari, E. Timurdogan, D. Miller, O. Tehar-Zahav, Z. Sternberg, J. C. Leu, J. Chong, R. Bafrali, G. Sandhu, M. Watts, R. Meade, M. A. Popovic, R. J. Ram, and V. Stojanovic, “A monolithically-integrated chip-to-chip optical link in bulk CMOS,” in Proceedings of IEEE Symposium on VLSI Circuits (IEEE, 2014), pp. 1–2.
[Crossref]

Mekis, A.

A. Narasimha, B. Analui, Y. Liang, T. J. Sleboda, S. Abdalla, E. Balmater, S. Gloeckner, D. Guckenberger, M. Harrison, R. Koumans, D. Kucharski, A. Mekis, S. Mirsaidi, D. Song, and T. Pinguet, “A fully integrated 4 x 10 Gb/s DWDM transceiver in standard 0.13 µm CMOS SOI,” in Proceedings of IEEE International Solid State Circuits Conference (IEEE, 2007), pp. 42–43.

H. D. Thacker, Y. Luo, J. Shi, I. Shubin, J. Lexau, X. Zheng, G. Li, J. Yao, J. Costa, T. Pinguet, A. Mekis, P. Dong, S. Liao, D. Feng, M. Asghari, R. Ho, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Flip-chip integrated silicon photonic bridge chips for sub-picojoule per bit optical links,” in Proceedings of IEEE Electronic Components and Technology Conference (IEEE, 2010), pp. 240–246.
[Crossref]

Michel, J.

J. F. Liu, M. Beals, A. Pomerene, S. Bernardis, R. Sun, J. Cheng, L. C. Kimerling, and J. Michel, “Waveguide-integrated, ultralow-energy GeSi electroabsorption modulators,” Nat. Photonics 2(7), 433–437 (2008).
[Crossref]

Miller, D.

C. Sun, M. Georgas, J. S. Orcutt, B. R. Moss, Y.-H. Chen, J. Shainline, M. Wade, K. Mehta, K. Nammari, E. Timurdogan, D. Miller, O. Tehar-Zahav, Z. Sternberg, J. C. Leu, J. Chong, R. Bafrali, G. Sandhu, M. Watts, R. Meade, M. A. Popovic, R. J. Ram, and V. Stojanovic, “A monolithically-integrated chip-to-chip optical link in bulk CMOS,” in Proceedings of IEEE Symposium on VLSI Circuits (IEEE, 2014), pp. 1–2.
[Crossref]

Mirsaidi, S.

A. Narasimha, B. Analui, Y. Liang, T. J. Sleboda, S. Abdalla, E. Balmater, S. Gloeckner, D. Guckenberger, M. Harrison, R. Koumans, D. Kucharski, A. Mekis, S. Mirsaidi, D. Song, and T. Pinguet, “A fully integrated 4 x 10 Gb/s DWDM transceiver in standard 0.13 µm CMOS SOI,” in Proceedings of IEEE International Solid State Circuits Conference (IEEE, 2007), pp. 42–43.

Mitchell, J. G.

H. D. Thacker, Y. Luo, J. Shi, I. Shubin, J. Lexau, X. Zheng, G. Li, J. Yao, J. Costa, T. Pinguet, A. Mekis, P. Dong, S. Liao, D. Feng, M. Asghari, R. Ho, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Flip-chip integrated silicon photonic bridge chips for sub-picojoule per bit optical links,” in Proceedings of IEEE Electronic Components and Technology Conference (IEEE, 2010), pp. 240–246.
[Crossref]

H. D. Thacker, I. Shubin, Y. Luo, J. Costa, J. Lexau, X. Zheng, G. Li, J. Yao, J. Li, D. Patil, F. Liu, R. Ho, D. Feng, M. Asghari, T. Pinguet, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration of silicon nanophotonics with 40nm-CMOS VLSI drivers and receivers,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2011), pp. 829–835.
[Crossref]

Miura, M.

Moghadam, H. F.

F. Y. Liu, D. Patil, J. Lexau, P. Amberg, M. Dayringer, J. Gainsley, H. F. Moghadam, X. Zheng, J. E. Cunningham, A. V. Krishnamoorthy, E. Alon, and R. Ho, “10-Gbps, 5.3-mW optical transmitter and receiver circuits in 40-nm CMOS,” IEEE J. Solid-State Circuits 47(9), 2049–2067 (2012).
[Crossref]

Morrissey, M.

C. Cook, J. E. Cunningham, A. Hargrove, G. G. Ger, K. W. Goossen, W. Y. Jan, H. H. Kim, R. Krause, M. Manges, M. Morrissey, M. Perinpanayagam, A. Persaud, G. J. Shevchuk, V. Sinyansky, and A. V. Krishnamoorthy, “A 36-channel parallel optical interconnect module baed on optoelectronics-on-VLSI technology,” IEEE J. Sel. Top. Quantum Electron. 9(2), 387–399 (2003).
[Crossref]

Moss, B. R.

C. Sun, M. Georgas, J. S. Orcutt, B. R. Moss, Y.-H. Chen, J. Shainline, M. Wade, K. Mehta, K. Nammari, E. Timurdogan, D. Miller, O. Tehar-Zahav, Z. Sternberg, J. C. Leu, J. Chong, R. Bafrali, G. Sandhu, M. Watts, R. Meade, M. A. Popovic, R. J. Ram, and V. Stojanovic, “A monolithically-integrated chip-to-chip optical link in bulk CMOS,” in Proceedings of IEEE Symposium on VLSI Circuits (IEEE, 2014), pp. 1–2.
[Crossref]

Nakamura, T.

Nammari, K.

C. Sun, M. Georgas, J. S. Orcutt, B. R. Moss, Y.-H. Chen, J. Shainline, M. Wade, K. Mehta, K. Nammari, E. Timurdogan, D. Miller, O. Tehar-Zahav, Z. Sternberg, J. C. Leu, J. Chong, R. Bafrali, G. Sandhu, M. Watts, R. Meade, M. A. Popovic, R. J. Ram, and V. Stojanovic, “A monolithically-integrated chip-to-chip optical link in bulk CMOS,” in Proceedings of IEEE Symposium on VLSI Circuits (IEEE, 2014), pp. 1–2.
[Crossref]

Narasimha, A.

A. Narasimha, B. Analui, Y. Liang, T. J. Sleboda, S. Abdalla, E. Balmater, S. Gloeckner, D. Guckenberger, M. Harrison, R. Koumans, D. Kucharski, A. Mekis, S. Mirsaidi, D. Song, and T. Pinguet, “A fully integrated 4 x 10 Gb/s DWDM transceiver in standard 0.13 µm CMOS SOI,” in Proceedings of IEEE International Solid State Circuits Conference (IEEE, 2007), pp. 42–43.

Noguchi, M.

Okamoto, D.

Okano, M.

Okayam, H.

Orcutt, J. S.

C. Sun, M. Georgas, J. S. Orcutt, B. R. Moss, Y.-H. Chen, J. Shainline, M. Wade, K. Mehta, K. Nammari, E. Timurdogan, D. Miller, O. Tehar-Zahav, Z. Sternberg, J. C. Leu, J. Chong, R. Bafrali, G. Sandhu, M. Watts, R. Meade, M. A. Popovic, R. J. Ram, and V. Stojanovic, “A monolithically-integrated chip-to-chip optical link in bulk CMOS,” in Proceedings of IEEE Symposium on VLSI Circuits (IEEE, 2014), pp. 1–2.
[Crossref]

Park, B.

G. Denoyer, A. Chen, B. Park, Y. Zhou, A. Santipo, and R. Russo, “Hybrid silicon photonic circuits and transceiver for 56 Gb/s NRZ 2.2km transmission over single mode fiber,” in Proceedings of IEEE European Conference on Optical Communication (IEEE, 2014), pp. 1–3.

Patil, D.

F. Y. Liu, D. Patil, J. Lexau, P. Amberg, M. Dayringer, J. Gainsley, H. F. Moghadam, X. Zheng, J. E. Cunningham, A. V. Krishnamoorthy, E. Alon, and R. Ho, “10-Gbps, 5.3-mW optical transmitter and receiver circuits in 40-nm CMOS,” IEEE J. Solid-State Circuits 47(9), 2049–2067 (2012).
[Crossref]

A. V. Krishnamoorthy, K. W. Goossen, W. Jan, X. Zheng, R. Ho, G. Li, R. Rozier, F. Liu, D. Patil, J. Lexau, H. Schwetman, D. Feng, M. Asghari, T. Pinguet, and J. E. Cunningham, “Progress in low-power switched optical interconnects,” IEEE J. Sel. Top. Quantum Electron. 17(2), 357–376 (2011).
[Crossref]

H. D. Thacker, I. Shubin, Y. Luo, J. Costa, J. Lexau, X. Zheng, G. Li, J. Yao, J. Li, D. Patil, F. Liu, R. Ho, D. Feng, M. Asghari, T. Pinguet, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration of silicon nanophotonics with 40nm-CMOS VLSI drivers and receivers,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2011), pp. 829–835.
[Crossref]

Pepeljugoski, P.

Perinpanayagam, M.

C. Cook, J. E. Cunningham, A. Hargrove, G. G. Ger, K. W. Goossen, W. Y. Jan, H. H. Kim, R. Krause, M. Manges, M. Morrissey, M. Perinpanayagam, A. Persaud, G. J. Shevchuk, V. Sinyansky, and A. V. Krishnamoorthy, “A 36-channel parallel optical interconnect module baed on optoelectronics-on-VLSI technology,” IEEE J. Sel. Top. Quantum Electron. 9(2), 387–399 (2003).
[Crossref]

Persaud, A.

C. Cook, J. E. Cunningham, A. Hargrove, G. G. Ger, K. W. Goossen, W. Y. Jan, H. H. Kim, R. Krause, M. Manges, M. Morrissey, M. Perinpanayagam, A. Persaud, G. J. Shevchuk, V. Sinyansky, and A. V. Krishnamoorthy, “A 36-channel parallel optical interconnect module baed on optoelectronics-on-VLSI technology,” IEEE J. Sel. Top. Quantum Electron. 9(2), 387–399 (2003).
[Crossref]

Pinguet, T.

A. V. Krishnamoorthy, K. W. Goossen, W. Jan, X. Zheng, R. Ho, G. Li, R. Rozier, F. Liu, D. Patil, J. Lexau, H. Schwetman, D. Feng, M. Asghari, T. Pinguet, and J. E. Cunningham, “Progress in low-power switched optical interconnects,” IEEE J. Sel. Top. Quantum Electron. 17(2), 357–376 (2011).
[Crossref]

A. Narasimha, B. Analui, Y. Liang, T. J. Sleboda, S. Abdalla, E. Balmater, S. Gloeckner, D. Guckenberger, M. Harrison, R. Koumans, D. Kucharski, A. Mekis, S. Mirsaidi, D. Song, and T. Pinguet, “A fully integrated 4 x 10 Gb/s DWDM transceiver in standard 0.13 µm CMOS SOI,” in Proceedings of IEEE International Solid State Circuits Conference (IEEE, 2007), pp. 42–43.

H. D. Thacker, Y. Luo, J. Shi, I. Shubin, J. Lexau, X. Zheng, G. Li, J. Yao, J. Costa, T. Pinguet, A. Mekis, P. Dong, S. Liao, D. Feng, M. Asghari, R. Ho, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Flip-chip integrated silicon photonic bridge chips for sub-picojoule per bit optical links,” in Proceedings of IEEE Electronic Components and Technology Conference (IEEE, 2010), pp. 240–246.
[Crossref]

H. D. Thacker, I. Shubin, Y. Luo, J. Costa, J. Lexau, X. Zheng, G. Li, J. Yao, J. Li, D. Patil, F. Liu, R. Ho, D. Feng, M. Asghari, T. Pinguet, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration of silicon nanophotonics with 40nm-CMOS VLSI drivers and receivers,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2011), pp. 829–835.
[Crossref]

Pomerene, A.

J. F. Liu, M. Beals, A. Pomerene, S. Bernardis, R. Sun, J. Cheng, L. C. Kimerling, and J. Michel, “Waveguide-integrated, ultralow-energy GeSi electroabsorption modulators,” Nat. Photonics 2(7), 433–437 (2008).
[Crossref]

Popovic, M. A.

C. Sun, M. Georgas, J. S. Orcutt, B. R. Moss, Y.-H. Chen, J. Shainline, M. Wade, K. Mehta, K. Nammari, E. Timurdogan, D. Miller, O. Tehar-Zahav, Z. Sternberg, J. C. Leu, J. Chong, R. Bafrali, G. Sandhu, M. Watts, R. Meade, M. A. Popovic, R. J. Ram, and V. Stojanovic, “A monolithically-integrated chip-to-chip optical link in bulk CMOS,” in Proceedings of IEEE Symposium on VLSI Circuits (IEEE, 2014), pp. 1–2.
[Crossref]

Qian, W.

Raj, K.

A. V. Krishnamoorthy, X. Zheng, D. Feng, J. Lexau, J. F. Buckwalter, H. D. Thacker, F. Liu, Y. Luo, E. Chang, P. Amberg, I. Shubin, S. S. Djordjevic, J.-H. Lee, S. Lin, H. Liang, A. Abed, R. Shafiiha, K. Raj, R. Ho, M. Asghari, and J. E. Cunningham, “A low-power, high-speed, 9-channel germanium-silicon electro-absorption modulator array integrated with digital CMOS driver and wavelength multiplexer,” Opt. Express 22(10), 12289–12295 (2014).
[Crossref] [PubMed]

Y. Luo, X. Zheng, G. Li, I. Shubin, H. Thacker, J. Yao, J.-H. Lee, D. Feng, J. Fong, C.-C. Kung, S. Liao, R. Shafiiha, M. Asghari, K. Raj, A. V. Krishnamoorthy, and J. E. Cunningham, “Strong electro-absorption in GeSi epitaxy on silicon-on-insulator (SOI),” Micromachines 3(4), 345–363 (2012).
[Crossref]

H. D. Thacker, Y. Luo, J. Shi, I. Shubin, J. Lexau, X. Zheng, G. Li, J. Yao, J. Costa, T. Pinguet, A. Mekis, P. Dong, S. Liao, D. Feng, M. Asghari, R. Ho, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Flip-chip integrated silicon photonic bridge chips for sub-picojoule per bit optical links,” in Proceedings of IEEE Electronic Components and Technology Conference (IEEE, 2010), pp. 240–246.
[Crossref]

H. D. Thacker, I. Shubin, Y. Luo, J. Costa, J. Lexau, X. Zheng, G. Li, J. Yao, J. Li, D. Patil, F. Liu, R. Ho, D. Feng, M. Asghari, T. Pinguet, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration of silicon nanophotonics with 40nm-CMOS VLSI drivers and receivers,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2011), pp. 829–835.
[Crossref]

H. D. Thacker, R. Shafiiha, J. Lexau, X. Zheng, S. S. Djordjevic, S. Lin, J. Simons, A. Abed, P. Amberg, E. Chang, I. Shubin, J.-H. Lee, Y. Luo, J. Yao, F. Liu, H. Liang, D. Feng, M. Asghari, R. Ho, K. Raj, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration and packaging of an energy-efficient WDM silicon photonic solid-state chip-to-chip interconnect,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2015).

Ram, R. J.

C. Sun, M. Georgas, J. S. Orcutt, B. R. Moss, Y.-H. Chen, J. Shainline, M. Wade, K. Mehta, K. Nammari, E. Timurdogan, D. Miller, O. Tehar-Zahav, Z. Sternberg, J. C. Leu, J. Chong, R. Bafrali, G. Sandhu, M. Watts, R. Meade, M. A. Popovic, R. J. Ram, and V. Stojanovic, “A monolithically-integrated chip-to-chip optical link in bulk CMOS,” in Proceedings of IEEE Symposium on VLSI Circuits (IEEE, 2014), pp. 1–2.
[Crossref]

Rein, H.-M.

Ritter, M.

Rogers, D.

Rozier, R.

A. V. Krishnamoorthy, K. W. Goossen, W. Jan, X. Zheng, R. Ho, G. Li, R. Rozier, F. Liu, D. Patil, J. Lexau, H. Schwetman, D. Feng, M. Asghari, T. Pinguet, and J. E. Cunningham, “Progress in low-power switched optical interconnects,” IEEE J. Sel. Top. Quantum Electron. 17(2), 357–376 (2011).
[Crossref]

Russo, R.

G. Denoyer, A. Chen, B. Park, Y. Zhou, A. Santipo, and R. Russo, “Hybrid silicon photonic circuits and transceiver for 56 Gb/s NRZ 2.2km transmission over single mode fiber,” in Proceedings of IEEE European Conference on Optical Communication (IEEE, 2014), pp. 1–3.

Saito, E.

Sandhu, G.

C. Sun, M. Georgas, J. S. Orcutt, B. R. Moss, Y.-H. Chen, J. Shainline, M. Wade, K. Mehta, K. Nammari, E. Timurdogan, D. Miller, O. Tehar-Zahav, Z. Sternberg, J. C. Leu, J. Chong, R. Bafrali, G. Sandhu, M. Watts, R. Meade, M. A. Popovic, R. J. Ram, and V. Stojanovic, “A monolithically-integrated chip-to-chip optical link in bulk CMOS,” in Proceedings of IEEE Symposium on VLSI Circuits (IEEE, 2014), pp. 1–2.
[Crossref]

Santipo, A.

G. Denoyer, A. Chen, B. Park, Y. Zhou, A. Santipo, and R. Russo, “Hybrid silicon photonic circuits and transceiver for 56 Gb/s NRZ 2.2km transmission over single mode fiber,” in Proceedings of IEEE European Conference on Optical Communication (IEEE, 2014), pp. 1–3.

Schaub, J.

Schild, A.

Schrödinger, K.

Schuster, C.

Schwetman, H.

A. V. Krishnamoorthy, K. W. Goossen, W. Jan, X. Zheng, R. Ho, G. Li, R. Rozier, F. Liu, D. Patil, J. Lexau, H. Schwetman, D. Feng, M. Asghari, T. Pinguet, and J. E. Cunningham, “Progress in low-power switched optical interconnects,” IEEE J. Sel. Top. Quantum Electron. 17(2), 357–376 (2011).
[Crossref]

A. V. Krishnamoorthy, R. Ho, X. Zheng, H. Schwetman, J. Lexau, P. Koka, G. Li, I. Shubin, and J. E. Cunningham, “Computer systems based on silicon photonic interconnects,” Proc. IEEE 97(7), 1337–1361 (2009).
[Crossref]

Seddighian, P.

Shafiiha, R.

A. V. Krishnamoorthy, X. Zheng, D. Feng, J. Lexau, J. F. Buckwalter, H. D. Thacker, F. Liu, Y. Luo, E. Chang, P. Amberg, I. Shubin, S. S. Djordjevic, J.-H. Lee, S. Lin, H. Liang, A. Abed, R. Shafiiha, K. Raj, R. Ho, M. Asghari, and J. E. Cunningham, “A low-power, high-speed, 9-channel germanium-silicon electro-absorption modulator array integrated with digital CMOS driver and wavelength multiplexer,” Opt. Express 22(10), 12289–12295 (2014).
[Crossref] [PubMed]

A. J. Zilkie, P. Seddighian, B. J. Bijlani, W. Qian, D. C. Lee, S. Fathololoumi, J. Fong, R. Shafiiha, D. Feng, B. J. Luff, X. Zheng, J. E. Cunningham, A. V. Krishnamoorthy, and M. Asghari, “Power-efficient III-V/silicon external cavity DBR lasers,” Opt. Express 20(21), 23456–23462 (2012).
[Crossref] [PubMed]

D. Feng, S. Liao, H. Liang, J. Fong, B. Bijlani, R. Shafiiha, B. J. Luff, Y. Luo, J. Cunningham, A. V. Krishnamoorthy, and M. Asghari, “High speed GeSi electro-absorption modulator at 1550 nm wavelength on SOI waveguide,” Opt. Express 20(20), 22224–22232 (2012).
[Crossref] [PubMed]

Y. Luo, X. Zheng, G. Li, I. Shubin, H. Thacker, J. Yao, J.-H. Lee, D. Feng, J. Fong, C.-C. Kung, S. Liao, R. Shafiiha, M. Asghari, K. Raj, A. V. Krishnamoorthy, and J. E. Cunningham, “Strong electro-absorption in GeSi epitaxy on silicon-on-insulator (SOI),” Micromachines 3(4), 345–363 (2012).
[Crossref]

H. D. Thacker, R. Shafiiha, J. Lexau, X. Zheng, S. S. Djordjevic, S. Lin, J. Simons, A. Abed, P. Amberg, E. Chang, I. Shubin, J.-H. Lee, Y. Luo, J. Yao, F. Liu, H. Liang, D. Feng, M. Asghari, R. Ho, K. Raj, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration and packaging of an energy-efficient WDM silicon photonic solid-state chip-to-chip interconnect,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2015).

Shainline, J.

C. Sun, M. Georgas, J. S. Orcutt, B. R. Moss, Y.-H. Chen, J. Shainline, M. Wade, K. Mehta, K. Nammari, E. Timurdogan, D. Miller, O. Tehar-Zahav, Z. Sternberg, J. C. Leu, J. Chong, R. Bafrali, G. Sandhu, M. Watts, R. Meade, M. A. Popovic, R. J. Ram, and V. Stojanovic, “A monolithically-integrated chip-to-chip optical link in bulk CMOS,” in Proceedings of IEEE Symposium on VLSI Circuits (IEEE, 2014), pp. 1–2.
[Crossref]

Shan, L.

Shevchuk, G. J.

C. Cook, J. E. Cunningham, A. Hargrove, G. G. Ger, K. W. Goossen, W. Y. Jan, H. H. Kim, R. Krause, M. Manges, M. Morrissey, M. Perinpanayagam, A. Persaud, G. J. Shevchuk, V. Sinyansky, and A. V. Krishnamoorthy, “A 36-channel parallel optical interconnect module baed on optoelectronics-on-VLSI technology,” IEEE J. Sel. Top. Quantum Electron. 9(2), 387–399 (2003).
[Crossref]

Shi, J.

H. D. Thacker, Y. Luo, J. Shi, I. Shubin, J. Lexau, X. Zheng, G. Li, J. Yao, J. Costa, T. Pinguet, A. Mekis, P. Dong, S. Liao, D. Feng, M. Asghari, R. Ho, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Flip-chip integrated silicon photonic bridge chips for sub-picojoule per bit optical links,” in Proceedings of IEEE Electronic Components and Technology Conference (IEEE, 2010), pp. 240–246.
[Crossref]

Shimizu, T.

Shimura, D.

Shubin, I.

A. V. Krishnamoorthy, X. Zheng, D. Feng, J. Lexau, J. F. Buckwalter, H. D. Thacker, F. Liu, Y. Luo, E. Chang, P. Amberg, I. Shubin, S. S. Djordjevic, J.-H. Lee, S. Lin, H. Liang, A. Abed, R. Shafiiha, K. Raj, R. Ho, M. Asghari, and J. E. Cunningham, “A low-power, high-speed, 9-channel germanium-silicon electro-absorption modulator array integrated with digital CMOS driver and wavelength multiplexer,” Opt. Express 22(10), 12289–12295 (2014).
[Crossref] [PubMed]

Y. Luo, X. Zheng, G. Li, I. Shubin, H. Thacker, J. Yao, J.-H. Lee, D. Feng, J. Fong, C.-C. Kung, S. Liao, R. Shafiiha, M. Asghari, K. Raj, A. V. Krishnamoorthy, and J. E. Cunningham, “Strong electro-absorption in GeSi epitaxy on silicon-on-insulator (SOI),” Micromachines 3(4), 345–363 (2012).
[Crossref]

X. Zheng, Y. Luo, J. Lexau, F. Liu, G. Li, H. D. Thacker, I. Shubin, J. Yao, R. Ho, J. E. Cunningham, and A. V. Krishnamoorthy, “2-pJ/bit (on-chip) 10-Gb/s digital CMOS silicon photonic link,” IEEE Photon. Technol. Lett. 24(14), 1260–1262 (2012).
[Crossref]

A. V. Krishnamoorthy, R. Ho, X. Zheng, H. Schwetman, J. Lexau, P. Koka, G. Li, I. Shubin, and J. E. Cunningham, “Computer systems based on silicon photonic interconnects,” Proc. IEEE 97(7), 1337–1361 (2009).
[Crossref]

H. D. Thacker, Y. Luo, J. Shi, I. Shubin, J. Lexau, X. Zheng, G. Li, J. Yao, J. Costa, T. Pinguet, A. Mekis, P. Dong, S. Liao, D. Feng, M. Asghari, R. Ho, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Flip-chip integrated silicon photonic bridge chips for sub-picojoule per bit optical links,” in Proceedings of IEEE Electronic Components and Technology Conference (IEEE, 2010), pp. 240–246.
[Crossref]

H. D. Thacker, I. Shubin, Y. Luo, J. Costa, J. Lexau, X. Zheng, G. Li, J. Yao, J. Li, D. Patil, F. Liu, R. Ho, D. Feng, M. Asghari, T. Pinguet, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration of silicon nanophotonics with 40nm-CMOS VLSI drivers and receivers,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2011), pp. 829–835.
[Crossref]

H. D. Thacker, R. Shafiiha, J. Lexau, X. Zheng, S. S. Djordjevic, S. Lin, J. Simons, A. Abed, P. Amberg, E. Chang, I. Shubin, J.-H. Lee, Y. Luo, J. Yao, F. Liu, H. Liang, D. Feng, M. Asghari, R. Ho, K. Raj, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration and packaging of an energy-efficient WDM silicon photonic solid-state chip-to-chip interconnect,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2015).

Simons, J.

H. D. Thacker, R. Shafiiha, J. Lexau, X. Zheng, S. S. Djordjevic, S. Lin, J. Simons, A. Abed, P. Amberg, E. Chang, I. Shubin, J.-H. Lee, Y. Luo, J. Yao, F. Liu, H. Liang, D. Feng, M. Asghari, R. Ho, K. Raj, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration and packaging of an energy-efficient WDM silicon photonic solid-state chip-to-chip interconnect,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2015).

Sinyansky, V.

C. Cook, J. E. Cunningham, A. Hargrove, G. G. Ger, K. W. Goossen, W. Y. Jan, H. H. Kim, R. Krause, M. Manges, M. Morrissey, M. Perinpanayagam, A. Persaud, G. J. Shevchuk, V. Sinyansky, and A. V. Krishnamoorthy, “A 36-channel parallel optical interconnect module baed on optoelectronics-on-VLSI technology,” IEEE J. Sel. Top. Quantum Electron. 9(2), 387–399 (2003).
[Crossref]

Sleboda, T. J.

A. Narasimha, B. Analui, Y. Liang, T. J. Sleboda, S. Abdalla, E. Balmater, S. Gloeckner, D. Guckenberger, M. Harrison, R. Koumans, D. Kucharski, A. Mekis, S. Mirsaidi, D. Song, and T. Pinguet, “A fully integrated 4 x 10 Gb/s DWDM transceiver in standard 0.13 µm CMOS SOI,” in Proceedings of IEEE International Solid State Circuits Conference (IEEE, 2007), pp. 42–43.

Song, D.

A. Narasimha, B. Analui, Y. Liang, T. J. Sleboda, S. Abdalla, E. Balmater, S. Gloeckner, D. Guckenberger, M. Harrison, R. Koumans, D. Kucharski, A. Mekis, S. Mirsaidi, D. Song, and T. Pinguet, “A fully integrated 4 x 10 Gb/s DWDM transceiver in standard 0.13 µm CMOS SOI,” in Proceedings of IEEE International Solid State Circuits Conference (IEEE, 2007), pp. 42–43.

Sternberg, Z.

C. Sun, M. Georgas, J. S. Orcutt, B. R. Moss, Y.-H. Chen, J. Shainline, M. Wade, K. Mehta, K. Nammari, E. Timurdogan, D. Miller, O. Tehar-Zahav, Z. Sternberg, J. C. Leu, J. Chong, R. Bafrali, G. Sandhu, M. Watts, R. Meade, M. A. Popovic, R. J. Ram, and V. Stojanovic, “A monolithically-integrated chip-to-chip optical link in bulk CMOS,” in Proceedings of IEEE Symposium on VLSI Circuits (IEEE, 2014), pp. 1–2.
[Crossref]

Stojanovic, V.

C. Sun, M. Georgas, J. S. Orcutt, B. R. Moss, Y.-H. Chen, J. Shainline, M. Wade, K. Mehta, K. Nammari, E. Timurdogan, D. Miller, O. Tehar-Zahav, Z. Sternberg, J. C. Leu, J. Chong, R. Bafrali, G. Sandhu, M. Watts, R. Meade, M. A. Popovic, R. J. Ram, and V. Stojanovic, “A monolithically-integrated chip-to-chip optical link in bulk CMOS,” in Proceedings of IEEE Symposium on VLSI Circuits (IEEE, 2014), pp. 1–2.
[Crossref]

Sun, C.

C. Sun, M. Georgas, J. S. Orcutt, B. R. Moss, Y.-H. Chen, J. Shainline, M. Wade, K. Mehta, K. Nammari, E. Timurdogan, D. Miller, O. Tehar-Zahav, Z. Sternberg, J. C. Leu, J. Chong, R. Bafrali, G. Sandhu, M. Watts, R. Meade, M. A. Popovic, R. J. Ram, and V. Stojanovic, “A monolithically-integrated chip-to-chip optical link in bulk CMOS,” in Proceedings of IEEE Symposium on VLSI Circuits (IEEE, 2014), pp. 1–2.
[Crossref]

Sun, R.

J. F. Liu, M. Beals, A. Pomerene, S. Bernardis, R. Sun, J. Cheng, L. C. Kimerling, and J. Michel, “Waveguide-integrated, ultralow-energy GeSi electroabsorption modulators,” Nat. Photonics 2(7), 433–437 (2008).
[Crossref]

Tehar-Zahav, O.

C. Sun, M. Georgas, J. S. Orcutt, B. R. Moss, Y.-H. Chen, J. Shainline, M. Wade, K. Mehta, K. Nammari, E. Timurdogan, D. Miller, O. Tehar-Zahav, Z. Sternberg, J. C. Leu, J. Chong, R. Bafrali, G. Sandhu, M. Watts, R. Meade, M. A. Popovic, R. J. Ram, and V. Stojanovic, “A monolithically-integrated chip-to-chip optical link in bulk CMOS,” in Proceedings of IEEE Symposium on VLSI Circuits (IEEE, 2014), pp. 1–2.
[Crossref]

Thacker, H.

Y. Luo, X. Zheng, G. Li, I. Shubin, H. Thacker, J. Yao, J.-H. Lee, D. Feng, J. Fong, C.-C. Kung, S. Liao, R. Shafiiha, M. Asghari, K. Raj, A. V. Krishnamoorthy, and J. E. Cunningham, “Strong electro-absorption in GeSi epitaxy on silicon-on-insulator (SOI),” Micromachines 3(4), 345–363 (2012).
[Crossref]

Thacker, H. D.

A. V. Krishnamoorthy, X. Zheng, D. Feng, J. Lexau, J. F. Buckwalter, H. D. Thacker, F. Liu, Y. Luo, E. Chang, P. Amberg, I. Shubin, S. S. Djordjevic, J.-H. Lee, S. Lin, H. Liang, A. Abed, R. Shafiiha, K. Raj, R. Ho, M. Asghari, and J. E. Cunningham, “A low-power, high-speed, 9-channel germanium-silicon electro-absorption modulator array integrated with digital CMOS driver and wavelength multiplexer,” Opt. Express 22(10), 12289–12295 (2014).
[Crossref] [PubMed]

X. Zheng, Y. Luo, J. Lexau, F. Liu, G. Li, H. D. Thacker, I. Shubin, J. Yao, R. Ho, J. E. Cunningham, and A. V. Krishnamoorthy, “2-pJ/bit (on-chip) 10-Gb/s digital CMOS silicon photonic link,” IEEE Photon. Technol. Lett. 24(14), 1260–1262 (2012).
[Crossref]

H. D. Thacker, Y. Luo, J. Shi, I. Shubin, J. Lexau, X. Zheng, G. Li, J. Yao, J. Costa, T. Pinguet, A. Mekis, P. Dong, S. Liao, D. Feng, M. Asghari, R. Ho, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Flip-chip integrated silicon photonic bridge chips for sub-picojoule per bit optical links,” in Proceedings of IEEE Electronic Components and Technology Conference (IEEE, 2010), pp. 240–246.
[Crossref]

H. D. Thacker, I. Shubin, Y. Luo, J. Costa, J. Lexau, X. Zheng, G. Li, J. Yao, J. Li, D. Patil, F. Liu, R. Ho, D. Feng, M. Asghari, T. Pinguet, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration of silicon nanophotonics with 40nm-CMOS VLSI drivers and receivers,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2011), pp. 829–835.
[Crossref]

H. D. Thacker, R. Shafiiha, J. Lexau, X. Zheng, S. S. Djordjevic, S. Lin, J. Simons, A. Abed, P. Amberg, E. Chang, I. Shubin, J.-H. Lee, Y. Luo, J. Yao, F. Liu, H. Liang, D. Feng, M. Asghari, R. Ho, K. Raj, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration and packaging of an energy-efficient WDM silicon photonic solid-state chip-to-chip interconnect,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2015).

Timurdogan, E.

C. Sun, M. Georgas, J. S. Orcutt, B. R. Moss, Y.-H. Chen, J. Shainline, M. Wade, K. Mehta, K. Nammari, E. Timurdogan, D. Miller, O. Tehar-Zahav, Z. Sternberg, J. C. Leu, J. Chong, R. Bafrali, G. Sandhu, M. Watts, R. Meade, M. A. Popovic, R. J. Ram, and V. Stojanovic, “A monolithically-integrated chip-to-chip optical link in bulk CMOS,” in Proceedings of IEEE Symposium on VLSI Circuits (IEEE, 2014), pp. 1–2.
[Crossref]

Tseng, B.

T. K. Woodward, A. V. Krishnamoorthy, K. W. Goossen, J. A. Walker, B. Tseng, J. Lothian, S. Hui, and R. Leibenguth, “Modulator-driver circuits for optoelectronic VLSI,” IEEE Photon. Technol. Lett. 9(6), 839–841 (1997).
[Crossref]

Tseng, B. J.

A. V. Krishnamoorthy, L. M. F. Chirovsky, W. S. Hobson, R. E. Leibengath, S. P. Hui, G. J. Zydzik, K. W. Goossen, J. D. Wynn, B. J. Tseng, J. Lopata, J. A. Walker, J. E. Cunningham, and L. A. D’Asaro, “Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits,” IEEE Photon. Technol. Lett. 11(1), 128–130 (1999).
[Crossref]

Tshuchizawa, T.

Urino, Y.

Usuki, T.

Wade, M.

C. Sun, M. Georgas, J. S. Orcutt, B. R. Moss, Y.-H. Chen, J. Shainline, M. Wade, K. Mehta, K. Nammari, E. Timurdogan, D. Miller, O. Tehar-Zahav, Z. Sternberg, J. C. Leu, J. Chong, R. Bafrali, G. Sandhu, M. Watts, R. Meade, M. A. Popovic, R. J. Ram, and V. Stojanovic, “A monolithically-integrated chip-to-chip optical link in bulk CMOS,” in Proceedings of IEEE Symposium on VLSI Circuits (IEEE, 2014), pp. 1–2.
[Crossref]

Walker, J. A.

A. V. Krishnamoorthy, L. M. F. Chirovsky, W. S. Hobson, R. E. Leibengath, S. P. Hui, G. J. Zydzik, K. W. Goossen, J. D. Wynn, B. J. Tseng, J. Lopata, J. A. Walker, J. E. Cunningham, and L. A. D’Asaro, “Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits,” IEEE Photon. Technol. Lett. 11(1), 128–130 (1999).
[Crossref]

T. K. Woodward, A. V. Krishnamoorthy, K. W. Goossen, J. A. Walker, B. Tseng, J. Lothian, S. Hui, and R. Leibenguth, “Modulator-driver circuits for optoelectronic VLSI,” IEEE Photon. Technol. Lett. 9(6), 839–841 (1997).
[Crossref]

Watanabe, T.

Watts, M.

C. Sun, M. Georgas, J. S. Orcutt, B. R. Moss, Y.-H. Chen, J. Shainline, M. Wade, K. Mehta, K. Nammari, E. Timurdogan, D. Miller, O. Tehar-Zahav, Z. Sternberg, J. C. Leu, J. Chong, R. Bafrali, G. Sandhu, M. Watts, R. Meade, M. A. Popovic, R. J. Ram, and V. Stojanovic, “A monolithically-integrated chip-to-chip optical link in bulk CMOS,” in Proceedings of IEEE Symposium on VLSI Circuits (IEEE, 2014), pp. 1–2.
[Crossref]

Woodward, T. K.

T. K. Woodward, A. V. Krishnamoorthy, K. W. Goossen, J. A. Walker, B. Tseng, J. Lothian, S. Hui, and R. Leibenguth, “Modulator-driver circuits for optoelectronic VLSI,” IEEE Photon. Technol. Lett. 9(6), 839–841 (1997).
[Crossref]

Wynn, J. D.

A. V. Krishnamoorthy, L. M. F. Chirovsky, W. S. Hobson, R. E. Leibengath, S. P. Hui, G. J. Zydzik, K. W. Goossen, J. D. Wynn, B. J. Tseng, J. Lopata, J. A. Walker, J. E. Cunningham, and L. A. D’Asaro, “Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits,” IEEE Photon. Technol. Lett. 11(1), 128–130 (1999).
[Crossref]

Yamada, K.

Yamamoto, T.

Yao, J.

Y. Luo, X. Zheng, G. Li, I. Shubin, H. Thacker, J. Yao, J.-H. Lee, D. Feng, J. Fong, C.-C. Kung, S. Liao, R. Shafiiha, M. Asghari, K. Raj, A. V. Krishnamoorthy, and J. E. Cunningham, “Strong electro-absorption in GeSi epitaxy on silicon-on-insulator (SOI),” Micromachines 3(4), 345–363 (2012).
[Crossref]

X. Zheng, Y. Luo, J. Lexau, F. Liu, G. Li, H. D. Thacker, I. Shubin, J. Yao, R. Ho, J. E. Cunningham, and A. V. Krishnamoorthy, “2-pJ/bit (on-chip) 10-Gb/s digital CMOS silicon photonic link,” IEEE Photon. Technol. Lett. 24(14), 1260–1262 (2012).
[Crossref]

H. D. Thacker, Y. Luo, J. Shi, I. Shubin, J. Lexau, X. Zheng, G. Li, J. Yao, J. Costa, T. Pinguet, A. Mekis, P. Dong, S. Liao, D. Feng, M. Asghari, R. Ho, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Flip-chip integrated silicon photonic bridge chips for sub-picojoule per bit optical links,” in Proceedings of IEEE Electronic Components and Technology Conference (IEEE, 2010), pp. 240–246.
[Crossref]

H. D. Thacker, I. Shubin, Y. Luo, J. Costa, J. Lexau, X. Zheng, G. Li, J. Yao, J. Li, D. Patil, F. Liu, R. Ho, D. Feng, M. Asghari, T. Pinguet, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration of silicon nanophotonics with 40nm-CMOS VLSI drivers and receivers,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2011), pp. 829–835.
[Crossref]

H. D. Thacker, R. Shafiiha, J. Lexau, X. Zheng, S. S. Djordjevic, S. Lin, J. Simons, A. Abed, P. Amberg, E. Chang, I. Shubin, J.-H. Lee, Y. Luo, J. Yao, F. Liu, H. Liang, D. Feng, M. Asghari, R. Ho, K. Raj, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration and packaging of an energy-efficient WDM silicon photonic solid-state chip-to-chip interconnect,” in Proceedings of IEEE Electronic Components & Technology Conference (IEEE, 2015).

Zheng, X.

A. V. Krishnamoorthy, X. Zheng, D. Feng, J. Lexau, J. F. Buckwalter, H. D. Thacker, F. Liu, Y. Luo, E. Chang, P. Amberg, I. Shubin, S. S. Djordjevic, J.-H. Lee, S. Lin, H. Liang, A. Abed, R. Shafiiha, K. Raj, R. Ho, M. Asghari, and J. E. Cunningham, “A low-power, high-speed, 9-channel germanium-silicon electro-absorption modulator array integrated with digital CMOS driver and wavelength multiplexer,” Opt. Express 22(10), 12289–12295 (2014).
[Crossref] [PubMed]

A. J. Zilkie, P. Seddighian, B. J. Bijlani, W. Qian, D. C. Lee, S. Fathololoumi, J. Fong, R. Shafiiha, D. Feng, B. J. Luff, X. Zheng, J. E. Cunningham, A. V. Krishnamoorthy, and M. Asghari, “Power-efficient III-V/silicon external cavity DBR lasers,” Opt. Express 20(21), 23456–23462 (2012).
[Crossref] [PubMed]

Y. Luo, X. Zheng, G. Li, I. Shubin, H. Thacker, J. Yao, J.-H. Lee, D. Feng, J. Fong, C.-C. Kung, S. Liao, R. Shafiiha, M. Asghari, K. Raj, A. V. Krishnamoorthy, and J. E. Cunningham, “Strong electro-absorption in GeSi epitaxy on silicon-on-insulator (SOI),” Micromachines 3(4), 345–363 (2012).
[Crossref]

F. Y. Liu, D. Patil, J. Lexau, P. Amberg, M. Dayringer, J. Gainsley, H. F. Moghadam, X. Zheng, J. E. Cunningham, A. V. Krishnamoorthy, E. Alon, and R. Ho, “10-Gbps, 5.3-mW optical transmitter and receiver circuits in 40-nm CMOS,” IEEE J. Solid-State Circuits 47(9), 2049–2067 (2012).
[Crossref]

X. Zheng, Y. Luo, J. Lexau, F. Liu, G. Li, H. D. Thacker, I. Shubin, J. Yao, R. Ho, J. E. Cunningham, and A. V. Krishnamoorthy, “2-pJ/bit (on-chip) 10-Gb/s digital CMOS silicon photonic link,” IEEE Photon. Technol. Lett. 24(14), 1260–1262 (2012).
[Crossref]

A. V. Krishnamoorthy, K. W. Goossen, W. Jan, X. Zheng, R. Ho, G. Li, R. Rozier, F. Liu, D. Patil, J. Lexau, H. Schwetman, D. Feng, M. Asghari, T. Pinguet, and J. E. Cunningham, “Progress in low-power switched optical interconnects,” IEEE J. Sel. Top. Quantum Electron. 17(2), 357–376 (2011).
[Crossref]

A. V. Krishnamoorthy, R. Ho, X. Zheng, H. Schwetman, J. Lexau, P. Koka, G. Li, I. Shubin, and J. E. Cunningham, “Computer systems based on silicon photonic interconnects,” Proc. IEEE 97(7), 1337–1361 (2009).
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Figures (21)

Fig. 1
Fig. 1 Conceptual illustration of a photonically interconnected macrochip.
Fig. 2
Fig. 2 Schematic of WDM solid-state link with two edge-coupled interfaces.
Fig. 3
Fig. 3 Layout schematic of photonic (a) Tx IC, (b) Rx IC, (c) Passive “bridge” chip.
Fig. 4
Fig. 4 (a) Optical image of the fabricated waveguide Franz Keldysh modulator, (b) Device cross-section.
Fig. 5
Fig. 5 FK electroabsorption modulator characterization: (a) Insertion loss and extinction ratio vs wavelength and reverse-bias voltages, (b) RF response.
Fig. 6
Fig. 6 25 Gb/s operation of an FK modulator across a broad temperature range.
Fig. 7
Fig. 7 (a) Mux/demux 200 GHz ITU grid definitions, (b) Spectral response of the fabricated echelle mux/demux.
Fig. 8
Fig. 8 DC performance of the WDM transmitter.
Fig. 9
Fig. 9 High-speed performance of the WDM transmitter.
Fig. 10
Fig. 10 3 μm Ge HPIN photodetector typical measurements: (a) Dark current IV plot, (b) RF response.
Fig. 11
Fig. 11 WDM receiver DC performance.
Fig. 12
Fig. 12 High speed performance of the WDM receiver.
Fig. 13
Fig. 13 (a) Die image of 40 nm CMOS Tx IC, (b) Schematic of a pulsed cascode driver circuit [20].
Fig. 14
Fig. 14 (a) Die image of 40 nm CMOS Rx IC, (b) Block diagram of the receiver, showing an adjustable shunt current, an adjustable offset voltage (one of two shown here), and an adjustable clock strobe.
Fig. 15
Fig. 15 Link integration and assembly process flow.
Fig. 16
Fig. 16 (a) Schematic of a microsolder bump interconnect, (b) SEM image of a single microsolder bump, (c) array of microsolder bumps fabricated on the VLSI Tx-IC
Fig. 17
Fig. 17 Hybrid integrated components (a) Tx, (b) Rx.
Fig. 18
Fig. 18 (a) Image of edge-coupled optical interface between a bridge chip and a photonic Tx, both of which are attached to a common glass piece. The inset illustrates sub-micron lateral misalignment. (b) Photograph of an assembled WDM photonic link.
Fig. 19
Fig. 19 Photograph of a fully-packaged WDM link.
Fig. 20
Fig. 20 Average transmitted optical power measured at various stages of packaging to verify link integrity.
Fig. 21
Fig. 21 (a) Picture of the FK link demo board on test station, (b) FK WDM link optical transmission spectra.

Tables (2)

Tables Icon

Table 1 Summary of high-speed performance for the 8L WDM link.

Tables Icon

Table 2 Power measurements for all working channels in the link measured at BER of 10−12

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