Abstract

We present a compact and stable terahertz (THz) vector spectroscopy system using silicon photonics technology. A silicon-based integrated phase control circuit greatly reduces the physical size of the continuous-wave THz spectroscopy system and enhances environmental phase stability. Differential lightwave phase control using two carrier-injection electro-optic modulators enables fast and linear phase sweeps of THz-waves. Using the silicon-photonic circuit, we demonstrate a THz vector spectrometer; the dynamic ranges are 65 and 35 dB at 300 GHz and 1 THz with 1-ms integration time and phase variation is less than ± 10° without thermal packaging.

© 2014 Optical Society of America

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2014 (1)

2013 (6)

D. M. Charron, K. Ajito, J.-Y. Kim, Y. Ueno, “Chemical mapping of pharmaceutical cocrystals using terahertz spectroscopic imaging,” Anal. Chem. 85(4), 1980–1984 (2013).
[CrossRef] [PubMed]

S. Hisatake, G. Kitahara, K. Ajito, Y. Fukada, N. Yoshimoto, T. Nagatsuma, “Phase-sensitive terahertz self-heterodyne system based on photodiode and low-temperature-grown GaAs photoconductor at 1.55 μm,” IEEE Sens. J. 13(1), 31–36 (2013).
[CrossRef]

J. -Y. Kim, H. -J. Song, K. Ajito, M. Yaita, N. Kukutsu, “Continuous-Wave THz Homodyne Spectroscopy and Imaging System With Electro-Optical Phase Modulation for High Dynamic Range,” IEEE Trans. THz, Sci. Tech. (Paris) 3, 158–164 (2013).

T. Hiraki, H. Nishi, T. Tsuchizawa, R. Kou, H. Fukuda, K. Takeda, Y. Ishikawa, K. Wada, K. Yamada, “Si-Ge-Silica Monolithic Integration Platform and Its Application to a 22-Gb/s x 16-ch WDM Receiver,” IEEE Photonics J. 5(4), 4500407 (2013).
[CrossRef]

D. Korn, R. Palmer, H. Yu, P. C. Schindler, L. Alloatti, M. Baier, R. Schmogrow, W. Bogaerts, S. K. Selvaraja, G. Lepage, M. Pantouvaki, J. M. D. Wouters, P. Verheyen, J. Van Campenhout, B. Chen, R. Baets, P. Absil, R. Dinu, C. Koos, W. Freude, J. Leuthold, “Silicon-organic hybrid (SOH) IQ modulator using the linear electro-optic effect for transmitting 16QAM at 112 Gbit/s,” Opt. Express 21(11), 13219–13227 (2013).
[CrossRef] [PubMed]

T. Göbel, D. Stanze, B. Globisch, R. J. B. Dietz, H. Roehle, M. Schell, “Telecom technology based continuous wave terahertz photomixing system with 105 decibel signal-to-noise ratio and 3.5 terahertz bandwidth,” Opt. Lett. 38(20), 4197–4199 (2013).
[CrossRef] [PubMed]

2012 (2)

2011 (3)

T. Tsuchizawa, K. Yamada, T. Watanabe, S. Park, H. Nishi, R. Kou, S. Itabashi, “Monolithic Integration of Silicon-, Germanium-, and Silica-Based Optical Devices for Telecommunications Applications,” IEEE J. Sel. Top. Quantum Electron. 17(3), 516–525 (2011).
[CrossRef]

F. Friederich, W. V. Spiegel, M. Bauer, F. Meng, M. D. Thomson, S. Boppel, A. Lisauskas, B. Hils, V. Krozer, A. Keil, T. Löffler, R. Henneberger, A. K. Huhn, G. Spickermann, P. H. Bolívar, H. G. Roskos, “THz Active Imaging Systems With Real-Time Capabilities,” IEEE Trans. THz Sci. Tech. (Paris) 1, 183–200 (2011).

N. Kim, S.-P. Han, H. Ko, Y. A. Leem, H.-C. Ryu, C. W. Lee, D. Lee, M. Y. Jeon, S. K. Noh, K. H. Park, “Tunable continuous-wave terahertz generation/detection with compact 1.55 μm detuned dual-mode laser diode and InGaAs based photomixer,” Opt. Express 19(16), 15397–15403 (2011).
[CrossRef] [PubMed]

2010 (1)

H. Nishi, T. Tsuchizawa, T. Watanabe, H. Shinojima, K. Yamada, S. Itabashi, “Compact and Polarization-Independent Variable Optical Attenuator Based on a Silicon Wire Waveguide with a Carrier Injection Structure,” Jpn. J. Appl. Phys. 49(4), 04DG20 (2010).
[CrossRef]

2009 (1)

S. J. B. Yoo, “Future prospects of silicon photonics in next generation communication and computing systems,” Electron. Lett. 45(12), 584–588 (2009).
[CrossRef]

2008 (1)

2007 (2)

2005 (1)

2004 (1)

2003 (1)

Absil, P.

Ajito, K.

J.-Y. Kim, H.-J. Song, M. Yaita, A. Hirata, K. Ajito, “CW-THz vector spectroscopy and imaging system based on 1.55-µm fiber-optics,” Opt. Express 22(2), 1735–1741 (2014).
[CrossRef] [PubMed]

S. Hisatake, G. Kitahara, K. Ajito, Y. Fukada, N. Yoshimoto, T. Nagatsuma, “Phase-sensitive terahertz self-heterodyne system based on photodiode and low-temperature-grown GaAs photoconductor at 1.55 μm,” IEEE Sens. J. 13(1), 31–36 (2013).
[CrossRef]

J. -Y. Kim, H. -J. Song, K. Ajito, M. Yaita, N. Kukutsu, “Continuous-Wave THz Homodyne Spectroscopy and Imaging System With Electro-Optical Phase Modulation for High Dynamic Range,” IEEE Trans. THz, Sci. Tech. (Paris) 3, 158–164 (2013).

D. M. Charron, K. Ajito, J.-Y. Kim, Y. Ueno, “Chemical mapping of pharmaceutical cocrystals using terahertz spectroscopic imaging,” Anal. Chem. 85(4), 1980–1984 (2013).
[CrossRef] [PubMed]

Alloatti, L.

Baets, R.

Baier, M.

Barat, R. B.

Bartolozzi, I.

Bauer, M.

F. Friederich, W. V. Spiegel, M. Bauer, F. Meng, M. D. Thomson, S. Boppel, A. Lisauskas, B. Hils, V. Krozer, A. Keil, T. Löffler, R. Henneberger, A. K. Huhn, G. Spickermann, P. H. Bolívar, H. G. Roskos, “THz Active Imaging Systems With Real-Time Capabilities,” IEEE Trans. THz Sci. Tech. (Paris) 1, 183–200 (2011).

Bienstman, P.

Bogaerts, W.

Bolívar, P. H.

F. Friederich, W. V. Spiegel, M. Bauer, F. Meng, M. D. Thomson, S. Boppel, A. Lisauskas, B. Hils, V. Krozer, A. Keil, T. Löffler, R. Henneberger, A. K. Huhn, G. Spickermann, P. H. Bolívar, H. G. Roskos, “THz Active Imaging Systems With Real-Time Capabilities,” IEEE Trans. THz Sci. Tech. (Paris) 1, 183–200 (2011).

Boppel, S.

F. Friederich, W. V. Spiegel, M. Bauer, F. Meng, M. D. Thomson, S. Boppel, A. Lisauskas, B. Hils, V. Krozer, A. Keil, T. Löffler, R. Henneberger, A. K. Huhn, G. Spickermann, P. H. Bolívar, H. G. Roskos, “THz Active Imaging Systems With Real-Time Capabilities,” IEEE Trans. THz Sci. Tech. (Paris) 1, 183–200 (2011).

Chan, S. P.

Charron, D. M.

D. M. Charron, K. Ajito, J.-Y. Kim, Y. Ueno, “Chemical mapping of pharmaceutical cocrystals using terahertz spectroscopic imaging,” Anal. Chem. 85(4), 1980–1984 (2013).
[CrossRef] [PubMed]

Chen, B.

De Vos, K.

Dietz, R. J. B.

Dinu, R.

Federici, J. F.

Freude, W.

Friederich, F.

F. Friederich, W. V. Spiegel, M. Bauer, F. Meng, M. D. Thomson, S. Boppel, A. Lisauskas, B. Hils, V. Krozer, A. Keil, T. Löffler, R. Henneberger, A. K. Huhn, G. Spickermann, P. H. Bolívar, H. G. Roskos, “THz Active Imaging Systems With Real-Time Capabilities,” IEEE Trans. THz Sci. Tech. (Paris) 1, 183–200 (2011).

Fukada, Y.

S. Hisatake, G. Kitahara, K. Ajito, Y. Fukada, N. Yoshimoto, T. Nagatsuma, “Phase-sensitive terahertz self-heterodyne system based on photodiode and low-temperature-grown GaAs photoconductor at 1.55 μm,” IEEE Sens. J. 13(1), 31–36 (2013).
[CrossRef]

Fukuda, H.

T. Hiraki, H. Nishi, T. Tsuchizawa, R. Kou, H. Fukuda, K. Takeda, Y. Ishikawa, K. Wada, K. Yamada, “Si-Ge-Silica Monolithic Integration Platform and Its Application to a 22-Gb/s x 16-ch WDM Receiver,” IEEE Photonics J. 5(4), 4500407 (2013).
[CrossRef]

Furuta, T.

Gary, D. E.

Globisch, B.

Göbel, T.

Han, S.-P.

Henneberger, R.

F. Friederich, W. V. Spiegel, M. Bauer, F. Meng, M. D. Thomson, S. Boppel, A. Lisauskas, B. Hils, V. Krozer, A. Keil, T. Löffler, R. Henneberger, A. K. Huhn, G. Spickermann, P. H. Bolívar, H. G. Roskos, “THz Active Imaging Systems With Real-Time Capabilities,” IEEE Trans. THz Sci. Tech. (Paris) 1, 183–200 (2011).

Hils, B.

F. Friederich, W. V. Spiegel, M. Bauer, F. Meng, M. D. Thomson, S. Boppel, A. Lisauskas, B. Hils, V. Krozer, A. Keil, T. Löffler, R. Henneberger, A. K. Huhn, G. Spickermann, P. H. Bolívar, H. G. Roskos, “THz Active Imaging Systems With Real-Time Capabilities,” IEEE Trans. THz Sci. Tech. (Paris) 1, 183–200 (2011).

Hiraki, T.

T. Hiraki, H. Nishi, T. Tsuchizawa, R. Kou, H. Fukuda, K. Takeda, Y. Ishikawa, K. Wada, K. Yamada, “Si-Ge-Silica Monolithic Integration Platform and Its Application to a 22-Gb/s x 16-ch WDM Receiver,” IEEE Photonics J. 5(4), 4500407 (2013).
[CrossRef]

Hirata, A.

Hisatake, S.

S. Hisatake, G. Kitahara, K. Ajito, Y. Fukada, N. Yoshimoto, T. Nagatsuma, “Phase-sensitive terahertz self-heterodyne system based on photodiode and low-temperature-grown GaAs photoconductor at 1.55 μm,” IEEE Sens. J. 13(1), 31–36 (2013).
[CrossRef]

Hor, Y. L.

Huhn, A. K.

F. Friederich, W. V. Spiegel, M. Bauer, F. Meng, M. D. Thomson, S. Boppel, A. Lisauskas, B. Hils, V. Krozer, A. Keil, T. Löffler, R. Henneberger, A. K. Huhn, G. Spickermann, P. H. Bolívar, H. G. Roskos, “THz Active Imaging Systems With Real-Time Capabilities,” IEEE Trans. THz Sci. Tech. (Paris) 1, 183–200 (2011).

Inoue, H.

Ishibashi, T.

Ishikawa, Y.

T. Hiraki, H. Nishi, T. Tsuchizawa, R. Kou, H. Fukuda, K. Takeda, Y. Ishikawa, K. Wada, K. Yamada, “Si-Ge-Silica Monolithic Integration Platform and Its Application to a 22-Gb/s x 16-ch WDM Receiver,” IEEE Photonics J. 5(4), 4500407 (2013).
[CrossRef]

H. Nishi, T. Tsuchizawa, R. Kou, H. Shinojima, T. Yamada, H. Kimura, Y. Ishikawa, K. Wada, K. Yamada, “Monolithic integration of a silica AWG and Ge photodiodes on Si photonic platform for one-chip WDM receiver,” Opt. Express 20(8), 9312–9321 (2012).
[CrossRef] [PubMed]

Itabashi, S.

T. Tsuchizawa, K. Yamada, T. Watanabe, S. Park, H. Nishi, R. Kou, S. Itabashi, “Monolithic Integration of Silicon-, Germanium-, and Silica-Based Optical Devices for Telecommunications Applications,” IEEE J. Sel. Top. Quantum Electron. 17(3), 516–525 (2011).
[CrossRef]

H. Nishi, T. Tsuchizawa, T. Watanabe, H. Shinojima, K. Yamada, S. Itabashi, “Compact and Polarization-Independent Variable Optical Attenuator Based on a Silicon Wire Waveguide with a Carrier Injection Structure,” Jpn. J. Appl. Phys. 49(4), 04DG20 (2010).
[CrossRef]

Ito, H.

Jeon, M. Y.

Kawase, K.

Keil, A.

F. Friederich, W. V. Spiegel, M. Bauer, F. Meng, M. D. Thomson, S. Boppel, A. Lisauskas, B. Hils, V. Krozer, A. Keil, T. Löffler, R. Henneberger, A. K. Huhn, G. Spickermann, P. H. Bolívar, H. G. Roskos, “THz Active Imaging Systems With Real-Time Capabilities,” IEEE Trans. THz Sci. Tech. (Paris) 1, 183–200 (2011).

Kim, J. -Y.

J. -Y. Kim, H. -J. Song, K. Ajito, M. Yaita, N. Kukutsu, “Continuous-Wave THz Homodyne Spectroscopy and Imaging System With Electro-Optical Phase Modulation for High Dynamic Range,” IEEE Trans. THz, Sci. Tech. (Paris) 3, 158–164 (2013).

Kim, J.-Y.

J.-Y. Kim, H.-J. Song, M. Yaita, A. Hirata, K. Ajito, “CW-THz vector spectroscopy and imaging system based on 1.55-µm fiber-optics,” Opt. Express 22(2), 1735–1741 (2014).
[CrossRef] [PubMed]

D. M. Charron, K. Ajito, J.-Y. Kim, Y. Ueno, “Chemical mapping of pharmaceutical cocrystals using terahertz spectroscopic imaging,” Anal. Chem. 85(4), 1980–1984 (2013).
[CrossRef] [PubMed]

Kim, N.

Kimura, H.

Kitahara, G.

S. Hisatake, G. Kitahara, K. Ajito, Y. Fukada, N. Yoshimoto, T. Nagatsuma, “Phase-sensitive terahertz self-heterodyne system based on photodiode and low-temperature-grown GaAs photoconductor at 1.55 μm,” IEEE Sens. J. 13(1), 31–36 (2013).
[CrossRef]

Ko, H.

Koos, C.

Korn, D.

Kou, R.

T. Hiraki, H. Nishi, T. Tsuchizawa, R. Kou, H. Fukuda, K. Takeda, Y. Ishikawa, K. Wada, K. Yamada, “Si-Ge-Silica Monolithic Integration Platform and Its Application to a 22-Gb/s x 16-ch WDM Receiver,” IEEE Photonics J. 5(4), 4500407 (2013).
[CrossRef]

H. Nishi, T. Tsuchizawa, R. Kou, H. Shinojima, T. Yamada, H. Kimura, Y. Ishikawa, K. Wada, K. Yamada, “Monolithic integration of a silica AWG and Ge photodiodes on Si photonic platform for one-chip WDM receiver,” Opt. Express 20(8), 9312–9321 (2012).
[CrossRef] [PubMed]

T. Tsuchizawa, K. Yamada, T. Watanabe, S. Park, H. Nishi, R. Kou, S. Itabashi, “Monolithic Integration of Silicon-, Germanium-, and Silica-Based Optical Devices for Telecommunications Applications,” IEEE J. Sel. Top. Quantum Electron. 17(3), 516–525 (2011).
[CrossRef]

Krozer, V.

F. Friederich, W. V. Spiegel, M. Bauer, F. Meng, M. D. Thomson, S. Boppel, A. Lisauskas, B. Hils, V. Krozer, A. Keil, T. Löffler, R. Henneberger, A. K. Huhn, G. Spickermann, P. H. Bolívar, H. G. Roskos, “THz Active Imaging Systems With Real-Time Capabilities,” IEEE Trans. THz Sci. Tech. (Paris) 1, 183–200 (2011).

Kukutsu, N.

J. -Y. Kim, H. -J. Song, K. Ajito, M. Yaita, N. Kukutsu, “Continuous-Wave THz Homodyne Spectroscopy and Imaging System With Electro-Optical Phase Modulation for High Dynamic Range,” IEEE Trans. THz, Sci. Tech. (Paris) 3, 158–164 (2013).

Lee, C. W.

Lee, D.

Leem, Y. A.

Lepage, G.

Leuthold, J.

Lim, S. T.

Lisauskas, A.

F. Friederich, W. V. Spiegel, M. Bauer, F. Meng, M. D. Thomson, S. Boppel, A. Lisauskas, B. Hils, V. Krozer, A. Keil, T. Löffler, R. Henneberger, A. K. Huhn, G. Spickermann, P. H. Bolívar, H. G. Roskos, “THz Active Imaging Systems With Real-Time Capabilities,” IEEE Trans. THz Sci. Tech. (Paris) 1, 183–200 (2011).

Liu, Z.

Löffler, T.

F. Friederich, W. V. Spiegel, M. Bauer, F. Meng, M. D. Thomson, S. Boppel, A. Lisauskas, B. Hils, V. Krozer, A. Keil, T. Löffler, R. Henneberger, A. K. Huhn, G. Spickermann, P. H. Bolívar, H. G. Roskos, “THz Active Imaging Systems With Real-Time Capabilities,” IEEE Trans. THz Sci. Tech. (Paris) 1, 183–200 (2011).

Meng, F.

F. Friederich, W. V. Spiegel, M. Bauer, F. Meng, M. D. Thomson, S. Boppel, A. Lisauskas, B. Hils, V. Krozer, A. Keil, T. Löffler, R. Henneberger, A. K. Huhn, G. Spickermann, P. H. Bolívar, H. G. Roskos, “THz Active Imaging Systems With Real-Time Capabilities,” IEEE Trans. THz Sci. Tech. (Paris) 1, 183–200 (2011).

Michalopoulou, Z.-H.

Nagatsuma, T.

S. Hisatake, G. Kitahara, K. Ajito, Y. Fukada, N. Yoshimoto, T. Nagatsuma, “Phase-sensitive terahertz self-heterodyne system based on photodiode and low-temperature-grown GaAs photoconductor at 1.55 μm,” IEEE Sens. J. 13(1), 31–36 (2013).
[CrossRef]

Nakajima, F.

Nishi, H.

T. Hiraki, H. Nishi, T. Tsuchizawa, R. Kou, H. Fukuda, K. Takeda, Y. Ishikawa, K. Wada, K. Yamada, “Si-Ge-Silica Monolithic Integration Platform and Its Application to a 22-Gb/s x 16-ch WDM Receiver,” IEEE Photonics J. 5(4), 4500407 (2013).
[CrossRef]

H. Nishi, T. Tsuchizawa, R. Kou, H. Shinojima, T. Yamada, H. Kimura, Y. Ishikawa, K. Wada, K. Yamada, “Monolithic integration of a silica AWG and Ge photodiodes on Si photonic platform for one-chip WDM receiver,” Opt. Express 20(8), 9312–9321 (2012).
[CrossRef] [PubMed]

T. Tsuchizawa, K. Yamada, T. Watanabe, S. Park, H. Nishi, R. Kou, S. Itabashi, “Monolithic Integration of Silicon-, Germanium-, and Silica-Based Optical Devices for Telecommunications Applications,” IEEE J. Sel. Top. Quantum Electron. 17(3), 516–525 (2011).
[CrossRef]

H. Nishi, T. Tsuchizawa, T. Watanabe, H. Shinojima, K. Yamada, S. Itabashi, “Compact and Polarization-Independent Variable Optical Attenuator Based on a Silicon Wire Waveguide with a Carrier Injection Structure,” Jpn. J. Appl. Phys. 49(4), 04DG20 (2010).
[CrossRef]

Noh, S. K.

Ogawa, Y.

Palmer, R.

Pantouvaki, M.

Park, K. H.

Park, S.

T. Tsuchizawa, K. Yamada, T. Watanabe, S. Park, H. Nishi, R. Kou, S. Itabashi, “Monolithic Integration of Silicon-, Germanium-, and Silica-Based Optical Devices for Telecommunications Applications,” IEEE J. Sel. Top. Quantum Electron. 17(3), 516–525 (2011).
[CrossRef]

Png, C. E.

Reed, G. T.

Roehle, H.

Roskos, H. G.

F. Friederich, W. V. Spiegel, M. Bauer, F. Meng, M. D. Thomson, S. Boppel, A. Lisauskas, B. Hils, V. Krozer, A. Keil, T. Löffler, R. Henneberger, A. K. Huhn, G. Spickermann, P. H. Bolívar, H. G. Roskos, “THz Active Imaging Systems With Real-Time Capabilities,” IEEE Trans. THz Sci. Tech. (Paris) 1, 183–200 (2011).

Ryu, H.-C.

Schacht, E.

Schell, M.

Schindler, P. C.

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Selvaraja, S. K.

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H. Nishi, T. Tsuchizawa, R. Kou, H. Shinojima, T. Yamada, H. Kimura, Y. Ishikawa, K. Wada, K. Yamada, “Monolithic integration of a silica AWG and Ge photodiodes on Si photonic platform for one-chip WDM receiver,” Opt. Express 20(8), 9312–9321 (2012).
[CrossRef] [PubMed]

H. Nishi, T. Tsuchizawa, T. Watanabe, H. Shinojima, K. Yamada, S. Itabashi, “Compact and Polarization-Independent Variable Optical Attenuator Based on a Silicon Wire Waveguide with a Carrier Injection Structure,” Jpn. J. Appl. Phys. 49(4), 04DG20 (2010).
[CrossRef]

Sinyukov, A. M.

Song, H. -J.

J. -Y. Kim, H. -J. Song, K. Ajito, M. Yaita, N. Kukutsu, “Continuous-Wave THz Homodyne Spectroscopy and Imaging System With Electro-Optical Phase Modulation for High Dynamic Range,” IEEE Trans. THz, Sci. Tech. (Paris) 3, 158–164 (2013).

Song, H.-J.

Spickermann, G.

F. Friederich, W. V. Spiegel, M. Bauer, F. Meng, M. D. Thomson, S. Boppel, A. Lisauskas, B. Hils, V. Krozer, A. Keil, T. Löffler, R. Henneberger, A. K. Huhn, G. Spickermann, P. H. Bolívar, H. G. Roskos, “THz Active Imaging Systems With Real-Time Capabilities,” IEEE Trans. THz Sci. Tech. (Paris) 1, 183–200 (2011).

Spiegel, W. V.

F. Friederich, W. V. Spiegel, M. Bauer, F. Meng, M. D. Thomson, S. Boppel, A. Lisauskas, B. Hils, V. Krozer, A. Keil, T. Löffler, R. Henneberger, A. K. Huhn, G. Spickermann, P. H. Bolívar, H. G. Roskos, “THz Active Imaging Systems With Real-Time Capabilities,” IEEE Trans. THz Sci. Tech. (Paris) 1, 183–200 (2011).

Stanze, D.

Su, K.

Takeda, K.

T. Hiraki, H. Nishi, T. Tsuchizawa, R. Kou, H. Fukuda, K. Takeda, Y. Ishikawa, K. Wada, K. Yamada, “Si-Ge-Silica Monolithic Integration Platform and Its Application to a 22-Gb/s x 16-ch WDM Receiver,” IEEE Photonics J. 5(4), 4500407 (2013).
[CrossRef]

Thomson, M. D.

F. Friederich, W. V. Spiegel, M. Bauer, F. Meng, M. D. Thomson, S. Boppel, A. Lisauskas, B. Hils, V. Krozer, A. Keil, T. Löffler, R. Henneberger, A. K. Huhn, G. Spickermann, P. H. Bolívar, H. G. Roskos, “THz Active Imaging Systems With Real-Time Capabilities,” IEEE Trans. THz Sci. Tech. (Paris) 1, 183–200 (2011).

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M. Tonouchi, “Cutting-edge terahertz technology,” Nat. Photonics 1(2), 97–105 (2007).
[CrossRef]

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T. Hiraki, H. Nishi, T. Tsuchizawa, R. Kou, H. Fukuda, K. Takeda, Y. Ishikawa, K. Wada, K. Yamada, “Si-Ge-Silica Monolithic Integration Platform and Its Application to a 22-Gb/s x 16-ch WDM Receiver,” IEEE Photonics J. 5(4), 4500407 (2013).
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H. Nishi, T. Tsuchizawa, R. Kou, H. Shinojima, T. Yamada, H. Kimura, Y. Ishikawa, K. Wada, K. Yamada, “Monolithic integration of a silica AWG and Ge photodiodes on Si photonic platform for one-chip WDM receiver,” Opt. Express 20(8), 9312–9321 (2012).
[CrossRef] [PubMed]

T. Tsuchizawa, K. Yamada, T. Watanabe, S. Park, H. Nishi, R. Kou, S. Itabashi, “Monolithic Integration of Silicon-, Germanium-, and Silica-Based Optical Devices for Telecommunications Applications,” IEEE J. Sel. Top. Quantum Electron. 17(3), 516–525 (2011).
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H. Nishi, T. Tsuchizawa, T. Watanabe, H. Shinojima, K. Yamada, S. Itabashi, “Compact and Polarization-Independent Variable Optical Attenuator Based on a Silicon Wire Waveguide with a Carrier Injection Structure,” Jpn. J. Appl. Phys. 49(4), 04DG20 (2010).
[CrossRef]

Ueno, Y.

D. M. Charron, K. Ajito, J.-Y. Kim, Y. Ueno, “Chemical mapping of pharmaceutical cocrystals using terahertz spectroscopic imaging,” Anal. Chem. 85(4), 1980–1984 (2013).
[CrossRef] [PubMed]

Van Campenhout, J.

Verheyen, P.

Vlasov, Y. A.

Y. A. Vlasov, “Silicon CMOS-Integrated Nano-Photonics for Computer and Data Communications Beyond 100G,” IEEE Commun. Mag. 50(2), s67–s72 (2012).
[CrossRef]

Wada, K.

T. Hiraki, H. Nishi, T. Tsuchizawa, R. Kou, H. Fukuda, K. Takeda, Y. Ishikawa, K. Wada, K. Yamada, “Si-Ge-Silica Monolithic Integration Platform and Its Application to a 22-Gb/s x 16-ch WDM Receiver,” IEEE Photonics J. 5(4), 4500407 (2013).
[CrossRef]

H. Nishi, T. Tsuchizawa, R. Kou, H. Shinojima, T. Yamada, H. Kimura, Y. Ishikawa, K. Wada, K. Yamada, “Monolithic integration of a silica AWG and Ge photodiodes on Si photonic platform for one-chip WDM receiver,” Opt. Express 20(8), 9312–9321 (2012).
[CrossRef] [PubMed]

Watanabe, T.

T. Tsuchizawa, K. Yamada, T. Watanabe, S. Park, H. Nishi, R. Kou, S. Itabashi, “Monolithic Integration of Silicon-, Germanium-, and Silica-Based Optical Devices for Telecommunications Applications,” IEEE J. Sel. Top. Quantum Electron. 17(3), 516–525 (2011).
[CrossRef]

H. Nishi, T. Tsuchizawa, T. Watanabe, H. Shinojima, K. Yamada, S. Itabashi, “Compact and Polarization-Independent Variable Optical Attenuator Based on a Silicon Wire Waveguide with a Carrier Injection Structure,” Jpn. J. Appl. Phys. 49(4), 04DG20 (2010).
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Wouters, J. M. D.

Yaita, M.

J.-Y. Kim, H.-J. Song, M. Yaita, A. Hirata, K. Ajito, “CW-THz vector spectroscopy and imaging system based on 1.55-µm fiber-optics,” Opt. Express 22(2), 1735–1741 (2014).
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J. -Y. Kim, H. -J. Song, K. Ajito, M. Yaita, N. Kukutsu, “Continuous-Wave THz Homodyne Spectroscopy and Imaging System With Electro-Optical Phase Modulation for High Dynamic Range,” IEEE Trans. THz, Sci. Tech. (Paris) 3, 158–164 (2013).

Yamada, K.

T. Hiraki, H. Nishi, T. Tsuchizawa, R. Kou, H. Fukuda, K. Takeda, Y. Ishikawa, K. Wada, K. Yamada, “Si-Ge-Silica Monolithic Integration Platform and Its Application to a 22-Gb/s x 16-ch WDM Receiver,” IEEE Photonics J. 5(4), 4500407 (2013).
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H. Nishi, T. Tsuchizawa, R. Kou, H. Shinojima, T. Yamada, H. Kimura, Y. Ishikawa, K. Wada, K. Yamada, “Monolithic integration of a silica AWG and Ge photodiodes on Si photonic platform for one-chip WDM receiver,” Opt. Express 20(8), 9312–9321 (2012).
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T. Tsuchizawa, K. Yamada, T. Watanabe, S. Park, H. Nishi, R. Kou, S. Itabashi, “Monolithic Integration of Silicon-, Germanium-, and Silica-Based Optical Devices for Telecommunications Applications,” IEEE J. Sel. Top. Quantum Electron. 17(3), 516–525 (2011).
[CrossRef]

H. Nishi, T. Tsuchizawa, T. Watanabe, H. Shinojima, K. Yamada, S. Itabashi, “Compact and Polarization-Independent Variable Optical Attenuator Based on a Silicon Wire Waveguide with a Carrier Injection Structure,” Jpn. J. Appl. Phys. 49(4), 04DG20 (2010).
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S. J. B. Yoo, “Future prospects of silicon photonics in next generation communication and computing systems,” Electron. Lett. 45(12), 584–588 (2009).
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S. Hisatake, G. Kitahara, K. Ajito, Y. Fukada, N. Yoshimoto, T. Nagatsuma, “Phase-sensitive terahertz self-heterodyne system based on photodiode and low-temperature-grown GaAs photoconductor at 1.55 μm,” IEEE Sens. J. 13(1), 31–36 (2013).
[CrossRef]

Yoshino, K.

Yu, H.

Zimdars, D.

Zorych, I.

Anal. Chem. (1)

D. M. Charron, K. Ajito, J.-Y. Kim, Y. Ueno, “Chemical mapping of pharmaceutical cocrystals using terahertz spectroscopic imaging,” Anal. Chem. 85(4), 1980–1984 (2013).
[CrossRef] [PubMed]

Electron. Lett. (1)

S. J. B. Yoo, “Future prospects of silicon photonics in next generation communication and computing systems,” Electron. Lett. 45(12), 584–588 (2009).
[CrossRef]

IEEE Commun. Mag. (1)

Y. A. Vlasov, “Silicon CMOS-Integrated Nano-Photonics for Computer and Data Communications Beyond 100G,” IEEE Commun. Mag. 50(2), s67–s72 (2012).
[CrossRef]

IEEE J. Sel. Top. Quantum Electron. (1)

T. Tsuchizawa, K. Yamada, T. Watanabe, S. Park, H. Nishi, R. Kou, S. Itabashi, “Monolithic Integration of Silicon-, Germanium-, and Silica-Based Optical Devices for Telecommunications Applications,” IEEE J. Sel. Top. Quantum Electron. 17(3), 516–525 (2011).
[CrossRef]

IEEE Photonics J. (1)

T. Hiraki, H. Nishi, T. Tsuchizawa, R. Kou, H. Fukuda, K. Takeda, Y. Ishikawa, K. Wada, K. Yamada, “Si-Ge-Silica Monolithic Integration Platform and Its Application to a 22-Gb/s x 16-ch WDM Receiver,” IEEE Photonics J. 5(4), 4500407 (2013).
[CrossRef]

IEEE Sens. J. (1)

S. Hisatake, G. Kitahara, K. Ajito, Y. Fukada, N. Yoshimoto, T. Nagatsuma, “Phase-sensitive terahertz self-heterodyne system based on photodiode and low-temperature-grown GaAs photoconductor at 1.55 μm,” IEEE Sens. J. 13(1), 31–36 (2013).
[CrossRef]

IEEE Trans. THz Sci. Tech. (Paris) (1)

F. Friederich, W. V. Spiegel, M. Bauer, F. Meng, M. D. Thomson, S. Boppel, A. Lisauskas, B. Hils, V. Krozer, A. Keil, T. Löffler, R. Henneberger, A. K. Huhn, G. Spickermann, P. H. Bolívar, H. G. Roskos, “THz Active Imaging Systems With Real-Time Capabilities,” IEEE Trans. THz Sci. Tech. (Paris) 1, 183–200 (2011).

IEEE Trans. THz, Sci. Tech. (Paris) (1)

J. -Y. Kim, H. -J. Song, K. Ajito, M. Yaita, N. Kukutsu, “Continuous-Wave THz Homodyne Spectroscopy and Imaging System With Electro-Optical Phase Modulation for High Dynamic Range,” IEEE Trans. THz, Sci. Tech. (Paris) 3, 158–164 (2013).

J. Lightwave Technol. (2)

Jpn. J. Appl. Phys. (1)

H. Nishi, T. Tsuchizawa, T. Watanabe, H. Shinojima, K. Yamada, S. Itabashi, “Compact and Polarization-Independent Variable Optical Attenuator Based on a Silicon Wire Waveguide with a Carrier Injection Structure,” Jpn. J. Appl. Phys. 49(4), 04DG20 (2010).
[CrossRef]

Nat. Photonics (1)

M. Tonouchi, “Cutting-edge terahertz technology,” Nat. Photonics 1(2), 97–105 (2007).
[CrossRef]

Opt. Express (6)

K. De Vos, I. Bartolozzi, E. Schacht, P. Bienstman, R. Baets, “Silicon-on-Insulator microring resonator for sensitive and label-free biosensing,” Opt. Express 15(12), 7610–7615 (2007).
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N. Kim, S.-P. Han, H. Ko, Y. A. Leem, H.-C. Ryu, C. W. Lee, D. Lee, M. Y. Jeon, S. K. Noh, K. H. Park, “Tunable continuous-wave terahertz generation/detection with compact 1.55 μm detuned dual-mode laser diode and InGaAs based photomixer,” Opt. Express 19(16), 15397–15403 (2011).
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H. Nishi, T. Tsuchizawa, R. Kou, H. Shinojima, T. Yamada, H. Kimura, Y. Ishikawa, K. Wada, K. Yamada, “Monolithic integration of a silica AWG and Ge photodiodes on Si photonic platform for one-chip WDM receiver,” Opt. Express 20(8), 9312–9321 (2012).
[CrossRef] [PubMed]

D. Korn, R. Palmer, H. Yu, P. C. Schindler, L. Alloatti, M. Baier, R. Schmogrow, W. Bogaerts, S. K. Selvaraja, G. Lepage, M. Pantouvaki, J. M. D. Wouters, P. Verheyen, J. Van Campenhout, B. Chen, R. Baets, P. Absil, R. Dinu, C. Koos, W. Freude, J. Leuthold, “Silicon-organic hybrid (SOH) IQ modulator using the linear electro-optic effect for transmitting 16QAM at 112 Gbit/s,” Opt. Express 21(11), 13219–13227 (2013).
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K. Kawase, Y. Ogawa, Y. Watanabe, H. Inoue, “Non-destructive terahertz imaging of illicit drugs using spectral fingerprints,” Opt. Express 11(20), 2549–2554 (2003).
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J.-Y. Kim, H.-J. Song, M. Yaita, A. Hirata, K. Ajito, “CW-THz vector spectroscopy and imaging system based on 1.55-µm fiber-optics,” Opt. Express 22(2), 1735–1741 (2014).
[CrossRef] [PubMed]

Opt. Lett. (2)

Other (2)

R. T. Logan, Jr., J. R. Demers, and B. L. Kasper, “Field-Portable THz Spectrometer for Characterization of Explosives and Chemicals,” in proceeding of 36th Int.Conf. on Infrared, Millimeter and Terahertz Waves (Houston, Texas, 2011), pp. 1–3.
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T. Göbel, D. Stanze, U. Troppenz, J. Kreissl, B. Sartorius, and M. Schell, “Integrated Continuous-Wave THz Control Unit with 1 THz Tuning Range,” in proceeding of 37th Int.Conf. on Infrared, Millimeter and Terahertz Waves (Wollongong, Australia, 2012), pp. 1–3.
[CrossRef]

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Figures (5)

Fig. 1
Fig. 1

Schematic diagram and operation principle of photonic-THz phase control circuit integrated on the silicon-on-insulator (SOI) photonic platform.

Fig. 2
Fig. 2

(a) Measured static phase shift and intensity loss of EO modulator as a function of current bias. Simulated waveforms of the THz probe signal after homodyne detection using (b) single-ended EO modulation and (c) differential EO modulation. Iπ is π-radian drive current.

Fig. 3
Fig. 3

Chip micrograph of fabricated photonic phase control circuit and SEMs of MMI coupler and Si rib waveguide.

Fig. 4
Fig. 4

Experimental setup for CW-THz homodyne spectroscopy system with on-wafer optical and electrical probing of fabricated silicon photonics chip for THz phase control.

Fig. 5
Fig. 5

Measured (a) waveform of detected signal, (b) frequency response of THz spectroscopy system with a 30-cm-long air path, and (c) variation of phase response for 1 h. (d) Comparison of mean phase variation to earlier two fiber-optic setups using 0.4- and 5-m-long optical paths. Δφ is phase variation, δn/δT is the temperature coefficient of the refractive index, ΔT is temperature variation in the photonic circuit, and L is optical path length.

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