Abstract

An optical interconnect transmitter based on guided-wave silicon optical bench is demonstrated. The guided-wave silicon optical bench (GW-SiOB) is developed on a silicon-on-insulator (SOI) substrate. The three-dimensional guided-wave optical paths on the silicon optical bench are realized using trapezoidal waveguides monolithically integrated with 45° micro-reflectors. Such three-dimensional guided-w ave optical paths of SiOB would simplify and shrink the intra-chip optical interconnects located on a SOI substrate. The clearly open eye patterns operated at a data rate of 5 Gbps verifies the proposed GW-SiOB is suitable for intra-chip optical interconnects.

© 2012 OSA

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2011 (1)

2009 (5)

2008 (3)

X. Wang and R. T. Chen, “Fully embedded board level optical interconnects—from point-to-point interconnection to optical bus architecture,” Proc. SPIE 6899, 6899031–6899039 (2008).

N. Hendrickx, J. Van Erps, E. Bosman, C. Debaes, H. Thienpont, and P. Van Daele, “Embedded micromirror inserts for optical printed circuit boards,” IEEE Photon. Technol. Lett. 20(20), 1727–1729 (2008).
[CrossRef]

J. T. Kim, J. J. Ju, S. Park, M. S. Kim, S. K. Park, and M. H. Lee, “Chip-to-chip optical interconnect using gold long-range surface plasmon polariton waveguides,” Opt. Express 16(17), 13133–13138 (2008).
[CrossRef] [PubMed]

2007 (1)

2006 (5)

O. Demichel, L. Mahler, T. Losco, C. Mauro, R. Green, A. Tredicucci, J. Xu, F. Beltram, H. E. Beere, D. A. Ritchie, and V. Tamosinuas, “Surface plasmon photonic structures in terahertz quantum cascade lasers,” Opt. Express 14(12), 5335–5345 (2006).
[CrossRef] [PubMed]

M. Aljada, K. E. Alameh, Y. T. Lee, and I. S. Chung, “High-speed (2.5 Gbps) reconfigurable inter-chip optical interconnects using opto-VLSI processors,” Opt. Express 14(15), 6823–6836 (2006).
[CrossRef] [PubMed]

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron. 12(5), 1032–1044 (2006).
[CrossRef]

D. Kim, J. Shim, Y. C. Keh, and M. Park, “Design and fabrication of a transmitter optical subassembly (TOSA) in 10-Gb/s small-form-factor pluggable (XFP) transceiver,” IEEE J. Quantum Electron. 12(4), 776–782 (2006).
[CrossRef]

S. Hiramatsu and T. Mikawa, “Optical design of active interposer for high-speed chip level optical interconnects,” IEEE J. Sel. Top. Quantum Electron. 24, 927–934 (2006).

2005 (2)

L. Wang, X. Wang, W. Jiang, J. Choi, H. Bi, and R. Chen, “45° polymer-based total internal reflection coupling mirrors for fully embedded intraboard guided wave optical interconnects,” Appl. Phys. Lett. 87(14), 141110 (2005).
[CrossRef]

H. Park, A. W. Fang, S. Kodama, and J. E. Bowers, “Hybrid silicon evanescent laser fabricated with a silicon waveguide and III-V offset quantum wells,” Opt. Express 13(23), 9460–9464 (2005).
[CrossRef] [PubMed]

2004 (3)

2001 (1)

2000 (1)

A. V. Krishnamoorthy, K. W. Goosen, L. M. F. Chirovsky, R. G. Rozier, P. Chandramani, S. P. Hui, J. Lopata, J. A. Walker, and L. A. D’Asaro, “16×16 VCSEL array flip-chip bonded to CMOS VLSI circuit,” IEEE Photon. Technol. Lett. 12(8), 1073–1075 (2000).
[CrossRef]

Ahearn, J. S.

Ahn, S. H.

Alameh, K. E.

Ali, M. E.

Aljada, M.

Baets, R.

J. V. Campenhout, P. R. A. Binetti, P. R. Romeo, P. Regreny, C. Seassal, X. J. M. Leijtens, T. de Vries, Y. S. Oei, R. P. J. van Veldhoven, R. Nötzel, L. Di Cioccio, J. M. Fedeli, M. K. Smit, D. Van Thourhout, and R. Baets, “Low-footprint optical interconnect on an SOI chip through heterogeneous integration of InP-based microdisk lasers and microdetectors,” IEEE Photon. Technol. Lett. 21(8), 522–524 (2009).
[CrossRef]

Baks, C. W.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron. 12(5), 1032–1044 (2006).
[CrossRef]

Beere, H. E.

Beltram, F.

Bi, H.

L. Wang, X. Wang, W. Jiang, J. Choi, H. Bi, and R. Chen, “45° polymer-based total internal reflection coupling mirrors for fully embedded intraboard guided wave optical interconnects,” Appl. Phys. Lett. 87(14), 141110 (2005).
[CrossRef]

Binetti, P. R. A.

J. V. Campenhout, P. R. A. Binetti, P. R. Romeo, P. Regreny, C. Seassal, X. J. M. Leijtens, T. de Vries, Y. S. Oei, R. P. J. van Veldhoven, R. Nötzel, L. Di Cioccio, J. M. Fedeli, M. K. Smit, D. Van Thourhout, and R. Baets, “Low-footprint optical interconnect on an SOI chip through heterogeneous integration of InP-based microdisk lasers and microdetectors,” IEEE Photon. Technol. Lett. 21(8), 522–524 (2009).
[CrossRef]

Bosman, E.

N. Hendrickx, J. Van Erps, E. Bosman, C. Debaes, H. Thienpont, and P. Van Daele, “Embedded micromirror inserts for optical printed circuit boards,” IEEE Photon. Technol. Lett. 20(20), 1727–1729 (2008).
[CrossRef]

Bour, D. P.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron. 12(5), 1032–1044 (2006).
[CrossRef]

Bowers, J. E.

Budd, R. A.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron. 12(5), 1032–1044 (2006).
[CrossRef]

Campenhout, J. V.

J. V. Campenhout, P. R. A. Binetti, P. R. Romeo, P. Regreny, C. Seassal, X. J. M. Leijtens, T. de Vries, Y. S. Oei, R. P. J. van Veldhoven, R. Nötzel, L. Di Cioccio, J. M. Fedeli, M. K. Smit, D. Van Thourhout, and R. Baets, “Low-footprint optical interconnect on an SOI chip through heterogeneous integration of InP-based microdisk lasers and microdetectors,” IEEE Photon. Technol. Lett. 21(8), 522–524 (2009).
[CrossRef]

Cassan, E.

Chandramani, P.

A. V. Krishnamoorthy, K. W. Goosen, L. M. F. Chirovsky, R. G. Rozier, P. Chandramani, S. P. Hui, J. Lopata, J. A. Walker, and L. A. D’Asaro, “16×16 VCSEL array flip-chip bonded to CMOS VLSI circuit,” IEEE Photon. Technol. Lett. 12(8), 1073–1075 (2000).
[CrossRef]

Chang, C. C.

Chang, S. F.

Chateauneuf, M.

Chen, L.

Chen, R.

L. Wang, X. Wang, W. Jiang, J. Choi, H. Bi, and R. Chen, “45° polymer-based total internal reflection coupling mirrors for fully embedded intraboard guided wave optical interconnects,” Appl. Phys. Lett. 87(14), 141110 (2005).
[CrossRef]

Chen, R. T.

X. Dou, A. X. Wang, X. Lin, and R. T. Chen, “Photolithography-free polymer optical waveguide arrays for optical backplane bus,” Opt. Express 19(15), 14403–14410 (2011).
[CrossRef] [PubMed]

X. Wang and R. T. Chen, “Fully embedded board level optical interconnects—from point-to-point interconnection to optical bus architecture,” Proc. SPIE 6899, 6899031–6899039 (2008).

Chen, S. P.

Chiniwalla, P.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron. 12(5), 1032–1044 (2006).
[CrossRef]

Chirovsky, L. M. F.

A. V. Krishnamoorthy, K. W. Goosen, L. M. F. Chirovsky, R. G. Rozier, P. Chandramani, S. P. Hui, J. Lopata, J. A. Walker, and L. A. D’Asaro, “16×16 VCSEL array flip-chip bonded to CMOS VLSI circuit,” IEEE Photon. Technol. Lett. 12(8), 1073–1075 (2000).
[CrossRef]

Cho, H. S.

Cho, I.-K.

Choi, J.

L. Wang, X. Wang, W. Jiang, J. Choi, H. Bi, and R. Chen, “45° polymer-based total internal reflection coupling mirrors for fully embedded intraboard guided wave optical interconnects,” Appl. Phys. Lett. 87(14), 141110 (2005).
[CrossRef]

Chung, I. S.

Crozat, P.

D’Asaro, L. A.

A. V. Krishnamoorthy, K. W. Goosen, L. M. F. Chirovsky, R. G. Rozier, P. Chandramani, S. P. Hui, J. Lopata, J. A. Walker, and L. A. D’Asaro, “16×16 VCSEL array flip-chip bonded to CMOS VLSI circuit,” IEEE Photon. Technol. Lett. 12(8), 1073–1075 (2000).
[CrossRef]

Damlencourt, J. F.

Dangel, R.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron. 12(5), 1032–1044 (2006).
[CrossRef]

de Vries, T.

J. V. Campenhout, P. R. A. Binetti, P. R. Romeo, P. Regreny, C. Seassal, X. J. M. Leijtens, T. de Vries, Y. S. Oei, R. P. J. van Veldhoven, R. Nötzel, L. Di Cioccio, J. M. Fedeli, M. K. Smit, D. Van Thourhout, and R. Baets, “Low-footprint optical interconnect on an SOI chip through heterogeneous integration of InP-based microdisk lasers and microdetectors,” IEEE Photon. Technol. Lett. 21(8), 522–524 (2009).
[CrossRef]

Debaes, C.

N. Hendrickx, J. Van Erps, E. Bosman, C. Debaes, H. Thienpont, and P. Van Daele, “Embedded micromirror inserts for optical printed circuit boards,” IEEE Photon. Technol. Lett. 20(20), 1727–1729 (2008).
[CrossRef]

Demichel, O.

Di Cioccio, L.

J. V. Campenhout, P. R. A. Binetti, P. R. Romeo, P. Regreny, C. Seassal, X. J. M. Leijtens, T. de Vries, Y. S. Oei, R. P. J. van Veldhoven, R. Nötzel, L. Di Cioccio, J. M. Fedeli, M. K. Smit, D. Van Thourhout, and R. Baets, “Low-footprint optical interconnect on an SOI chip through heterogeneous integration of InP-based microdisk lasers and microdetectors,” IEEE Photon. Technol. Lett. 21(8), 522–524 (2009).
[CrossRef]

Doany, F. E.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron. 12(5), 1032–1044 (2006).
[CrossRef]

Dolfi, D. W.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron. 12(5), 1032–1044 (2006).
[CrossRef]

B. E. Lemoff, M. E. Ali, G. Panotopoulos, G. M. Flower, B. Mahdavan, A. F. J. Levi, and D. W. Dolfi, “MAUI: Enabling fiber-to-processor with parallel multiwavelength optical interconnects,” J. Lightwave Technol. 22(9), 2043–2054 (2004).
[CrossRef]

Dou, X.

El Melhaoui, L.

Fang, A. W.

Faucher, J.

Fedeli, J. M.

J. V. Campenhout, P. R. A. Binetti, P. R. Romeo, P. Regreny, C. Seassal, X. J. M. Leijtens, T. de Vries, Y. S. Oei, R. P. J. van Veldhoven, R. Nötzel, L. Di Cioccio, J. M. Fedeli, M. K. Smit, D. Van Thourhout, and R. Baets, “Low-footprint optical interconnect on an SOI chip through heterogeneous integration of InP-based microdisk lasers and microdetectors,” IEEE Photon. Technol. Lett. 21(8), 522–524 (2009).
[CrossRef]

Fédéli, J. M.

Flower, G. M.

Goosen, K. W.

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L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron. 12(5), 1032–1044 (2006).
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A. V. Krishnamoorthy, K. W. Goosen, L. M. F. Chirovsky, R. G. Rozier, P. Chandramani, S. P. Hui, J. Lopata, J. A. Walker, and L. A. D’Asaro, “16×16 VCSEL array flip-chip bonded to CMOS VLSI circuit,” IEEE Photon. Technol. Lett. 12(8), 1073–1075 (2000).
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L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron. 12(5), 1032–1044 (2006).
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D. Kim, J. Shim, Y. C. Keh, and M. Park, “Design and fabrication of a transmitter optical subassembly (TOSA) in 10-Gb/s small-form-factor pluggable (XFP) transceiver,” IEEE J. Quantum Electron. 12(4), 776–782 (2006).
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A. V. Krishnamoorthy, K. W. Goosen, L. M. F. Chirovsky, R. G. Rozier, P. Chandramani, S. P. Hui, J. Lopata, J. A. Walker, and L. A. D’Asaro, “16×16 VCSEL array flip-chip bonded to CMOS VLSI circuit,” IEEE Photon. Technol. Lett. 12(8), 1073–1075 (2000).
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Kucharski, D.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron. 12(5), 1032–1044 (2006).
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Kuchta, D. M.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron. 12(5), 1032–1044 (2006).
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L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron. 12(5), 1032–1044 (2006).
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Lan, H. C.

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Leijtens, X. J. M.

J. V. Campenhout, P. R. A. Binetti, P. R. Romeo, P. Regreny, C. Seassal, X. J. M. Leijtens, T. de Vries, Y. S. Oei, R. P. J. van Veldhoven, R. Nötzel, L. Di Cioccio, J. M. Fedeli, M. K. Smit, D. Van Thourhout, and R. Baets, “Low-footprint optical interconnect on an SOI chip through heterogeneous integration of InP-based microdisk lasers and microdetectors,” IEEE Photon. Technol. Lett. 21(8), 522–524 (2009).
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Lemoff, B. E.

Levi, A. F. J.

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L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron. 12(5), 1032–1044 (2006).
[CrossRef]

Lin, C. K.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron. 12(5), 1032–1044 (2006).
[CrossRef]

Lin, X.

Lin, Y. S.

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A. V. Krishnamoorthy, K. W. Goosen, L. M. F. Chirovsky, R. G. Rozier, P. Chandramani, S. P. Hui, J. Lopata, J. A. Walker, and L. A. D’Asaro, “16×16 VCSEL array flip-chip bonded to CMOS VLSI circuit,” IEEE Photon. Technol. Lett. 12(8), 1073–1075 (2000).
[CrossRef]

Losco, T.

Mahdavan, B.

Mahler, L.

Mangeney, J.

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Marris-Morini, D.

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S. Hiramatsu and T. Mikawa, “Optical design of active interposer for high-speed chip level optical interconnects,” IEEE J. Sel. Top. Quantum Electron. 24, 927–934 (2006).

Nötzel, R.

J. V. Campenhout, P. R. A. Binetti, P. R. Romeo, P. Regreny, C. Seassal, X. J. M. Leijtens, T. de Vries, Y. S. Oei, R. P. J. van Veldhoven, R. Nötzel, L. Di Cioccio, J. M. Fedeli, M. K. Smit, D. Van Thourhout, and R. Baets, “Low-footprint optical interconnect on an SOI chip through heterogeneous integration of InP-based microdisk lasers and microdetectors,” IEEE Photon. Technol. Lett. 21(8), 522–524 (2009).
[CrossRef]

Nyikal, H.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron. 12(5), 1032–1044 (2006).
[CrossRef]

Nystrom, M.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron. 12(5), 1032–1044 (2006).
[CrossRef]

Oei, Y. S.

J. V. Campenhout, P. R. A. Binetti, P. R. Romeo, P. Regreny, C. Seassal, X. J. M. Leijtens, T. de Vries, Y. S. Oei, R. P. J. van Veldhoven, R. Nötzel, L. Di Cioccio, J. M. Fedeli, M. K. Smit, D. Van Thourhout, and R. Baets, “Low-footprint optical interconnect on an SOI chip through heterogeneous integration of InP-based microdisk lasers and microdetectors,” IEEE Photon. Technol. Lett. 21(8), 522–524 (2009).
[CrossRef]

Offrein, B. J.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron. 12(5), 1032–1044 (2006).
[CrossRef]

Panotopoulos, G.

Park, H.

Park, H.-H.

Park, M.

D. Kim, J. Shim, Y. C. Keh, and M. Park, “Design and fabrication of a transmitter optical subassembly (TOSA) in 10-Gb/s small-form-factor pluggable (XFP) transceiver,” IEEE J. Quantum Electron. 12(4), 776–782 (2006).
[CrossRef]

Park, S.

Park, S. K.

Pascal, D.

Patel, C. S.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron. 12(5), 1032–1044 (2006).
[CrossRef]

Pepeljugoski, P. K.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron. 12(5), 1032–1044 (2006).
[CrossRef]

Plant, D. V.

Preston, K.

Razavi, K.

Regreny, P.

J. V. Campenhout, P. R. A. Binetti, P. R. Romeo, P. Regreny, C. Seassal, X. J. M. Leijtens, T. de Vries, Y. S. Oei, R. P. J. van Veldhoven, R. Nötzel, L. Di Cioccio, J. M. Fedeli, M. K. Smit, D. Van Thourhout, and R. Baets, “Low-footprint optical interconnect on an SOI chip through heterogeneous integration of InP-based microdisk lasers and microdetectors,” IEEE Photon. Technol. Lett. 21(8), 522–524 (2009).
[CrossRef]

Rhee, B.-H.

Rho, B. S.

Ritchie, D. A.

Romeo, P. R.

J. V. Campenhout, P. R. A. Binetti, P. R. Romeo, P. Regreny, C. Seassal, X. J. M. Leijtens, T. de Vries, Y. S. Oei, R. P. J. van Veldhoven, R. Nötzel, L. Di Cioccio, J. M. Fedeli, M. K. Smit, D. Van Thourhout, and R. Baets, “Low-footprint optical interconnect on an SOI chip through heterogeneous integration of InP-based microdisk lasers and microdetectors,” IEEE Photon. Technol. Lett. 21(8), 522–524 (2009).
[CrossRef]

Rosner, J.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron. 12(5), 1032–1044 (2006).
[CrossRef]

Rouvière, M.

Rozier, R. G.

A. V. Krishnamoorthy, K. W. Goosen, L. M. F. Chirovsky, R. G. Rozier, P. Chandramani, S. P. Hui, J. Lopata, J. A. Walker, and L. A. D’Asaro, “16×16 VCSEL array flip-chip bonded to CMOS VLSI circuit,” IEEE Photon. Technol. Lett. 12(8), 1073–1075 (2000).
[CrossRef]

Schares, L.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron. 12(5), 1032–1044 (2006).
[CrossRef]

Schaub, J. D.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron. 12(5), 1032–1044 (2006).
[CrossRef]

Schow, C. L.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron. 12(5), 1032–1044 (2006).
[CrossRef]

Schuster, C.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron. 12(5), 1032–1044 (2006).
[CrossRef]

Seassal, C.

J. V. Campenhout, P. R. A. Binetti, P. R. Romeo, P. Regreny, C. Seassal, X. J. M. Leijtens, T. de Vries, Y. S. Oei, R. P. J. van Veldhoven, R. Nötzel, L. Di Cioccio, J. M. Fedeli, M. K. Smit, D. Van Thourhout, and R. Baets, “Low-footprint optical interconnect on an SOI chip through heterogeneous integration of InP-based microdisk lasers and microdetectors,” IEEE Photon. Technol. Lett. 21(8), 522–524 (2009).
[CrossRef]

Shan, L.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron. 12(5), 1032–1044 (2006).
[CrossRef]

Shi, J. W.

Shim, J.

D. Kim, J. Shim, Y. C. Keh, and M. Park, “Design and fabrication of a transmitter optical subassembly (TOSA) in 10-Gb/s small-form-factor pluggable (XFP) transceiver,” IEEE J. Quantum Electron. 12(4), 776–782 (2006).
[CrossRef]

Smit, M. K.

J. V. Campenhout, P. R. A. Binetti, P. R. Romeo, P. Regreny, C. Seassal, X. J. M. Leijtens, T. de Vries, Y. S. Oei, R. P. J. van Veldhoven, R. Nötzel, L. Di Cioccio, J. M. Fedeli, M. K. Smit, D. Van Thourhout, and R. Baets, “Low-footprint optical interconnect on an SOI chip through heterogeneous integration of InP-based microdisk lasers and microdetectors,” IEEE Photon. Technol. Lett. 21(8), 522–524 (2009).
[CrossRef]

Tamosinuas, V.

Tan, M. R. T.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron. 12(5), 1032–1044 (2006).
[CrossRef]

Tandon, A.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron. 12(5), 1032–1044 (2006).
[CrossRef]

Thienpont, H.

N. Hendrickx, J. Van Erps, E. Bosman, C. Debaes, H. Thienpont, and P. Van Daele, “Embedded micromirror inserts for optical printed circuit boards,” IEEE Photon. Technol. Lett. 20(20), 1727–1729 (2008).
[CrossRef]

Tredicucci, A.

Trewhella, J. M.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron. 12(5), 1032–1044 (2006).
[CrossRef]

Trott, G. R.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron. 12(5), 1032–1044 (2006).
[CrossRef]

Tsang, C. K.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron. 12(5), 1032–1044 (2006).
[CrossRef]

Van Daele, P.

N. Hendrickx, J. Van Erps, E. Bosman, C. Debaes, H. Thienpont, and P. Van Daele, “Embedded micromirror inserts for optical printed circuit boards,” IEEE Photon. Technol. Lett. 20(20), 1727–1729 (2008).
[CrossRef]

Van Erps, J.

N. Hendrickx, J. Van Erps, E. Bosman, C. Debaes, H. Thienpont, and P. Van Daele, “Embedded micromirror inserts for optical printed circuit boards,” IEEE Photon. Technol. Lett. 20(20), 1727–1729 (2008).
[CrossRef]

Van Thourhout, D.

J. V. Campenhout, P. R. A. Binetti, P. R. Romeo, P. Regreny, C. Seassal, X. J. M. Leijtens, T. de Vries, Y. S. Oei, R. P. J. van Veldhoven, R. Nötzel, L. Di Cioccio, J. M. Fedeli, M. K. Smit, D. Van Thourhout, and R. Baets, “Low-footprint optical interconnect on an SOI chip through heterogeneous integration of InP-based microdisk lasers and microdetectors,” IEEE Photon. Technol. Lett. 21(8), 522–524 (2009).
[CrossRef]

van Veldhoven, R. P. J.

J. V. Campenhout, P. R. A. Binetti, P. R. Romeo, P. Regreny, C. Seassal, X. J. M. Leijtens, T. de Vries, Y. S. Oei, R. P. J. van Veldhoven, R. Nötzel, L. Di Cioccio, J. M. Fedeli, M. K. Smit, D. Van Thourhout, and R. Baets, “Low-footprint optical interconnect on an SOI chip through heterogeneous integration of InP-based microdisk lasers and microdetectors,” IEEE Photon. Technol. Lett. 21(8), 522–524 (2009).
[CrossRef]

Venditti, M. B.

Vivien, L.

Walker, J. A.

A. V. Krishnamoorthy, K. W. Goosen, L. M. F. Chirovsky, R. G. Rozier, P. Chandramani, S. P. Hui, J. Lopata, J. A. Walker, and L. A. D’Asaro, “16×16 VCSEL array flip-chip bonded to CMOS VLSI circuit,” IEEE Photon. Technol. Lett. 12(8), 1073–1075 (2000).
[CrossRef]

Wang, A. X.

Wang, C. M.

Wang, L.

L. Wang, X. Wang, W. Jiang, J. Choi, H. Bi, and R. Chen, “45° polymer-based total internal reflection coupling mirrors for fully embedded intraboard guided wave optical interconnects,” Appl. Phys. Lett. 87(14), 141110 (2005).
[CrossRef]

Wang, X.

X. Wang and R. T. Chen, “Fully embedded board level optical interconnects—from point-to-point interconnection to optical bus architecture,” Proc. SPIE 6899, 6899031–6899039 (2008).

L. Wang, X. Wang, W. Jiang, J. Choi, H. Bi, and R. Chen, “45° polymer-based total internal reflection coupling mirrors for fully embedded intraboard guided wave optical interconnects,” Appl. Phys. Lett. 87(14), 141110 (2005).
[CrossRef]

Wu, M. L.

Xu, J.

Yoon, K. B.

Appl. Phys. Lett. (1)

L. Wang, X. Wang, W. Jiang, J. Choi, H. Bi, and R. Chen, “45° polymer-based total internal reflection coupling mirrors for fully embedded intraboard guided wave optical interconnects,” Appl. Phys. Lett. 87(14), 141110 (2005).
[CrossRef]

IEEE J. Quantum Electron. (1)

D. Kim, J. Shim, Y. C. Keh, and M. Park, “Design and fabrication of a transmitter optical subassembly (TOSA) in 10-Gb/s small-form-factor pluggable (XFP) transceiver,” IEEE J. Quantum Electron. 12(4), 776–782 (2006).
[CrossRef]

IEEE J. Sel. Top. Quantum Electron. (2)

S. Hiramatsu and T. Mikawa, “Optical design of active interposer for high-speed chip level optical interconnects,” IEEE J. Sel. Top. Quantum Electron. 24, 927–934 (2006).

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron. 12(5), 1032–1044 (2006).
[CrossRef]

IEEE Photon. Technol. Lett. (3)

A. V. Krishnamoorthy, K. W. Goosen, L. M. F. Chirovsky, R. G. Rozier, P. Chandramani, S. P. Hui, J. Lopata, J. A. Walker, and L. A. D’Asaro, “16×16 VCSEL array flip-chip bonded to CMOS VLSI circuit,” IEEE Photon. Technol. Lett. 12(8), 1073–1075 (2000).
[CrossRef]

N. Hendrickx, J. Van Erps, E. Bosman, C. Debaes, H. Thienpont, and P. Van Daele, “Embedded micromirror inserts for optical printed circuit boards,” IEEE Photon. Technol. Lett. 20(20), 1727–1729 (2008).
[CrossRef]

J. V. Campenhout, P. R. A. Binetti, P. R. Romeo, P. Regreny, C. Seassal, X. J. M. Leijtens, T. de Vries, Y. S. Oei, R. P. J. van Veldhoven, R. Nötzel, L. Di Cioccio, J. M. Fedeli, M. K. Smit, D. Van Thourhout, and R. Baets, “Low-footprint optical interconnect on an SOI chip through heterogeneous integration of InP-based microdisk lasers and microdetectors,” IEEE Photon. Technol. Lett. 21(8), 522–524 (2009).
[CrossRef]

J. Lightwave Technol. (4)

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[CrossRef] [PubMed]

M. Aljada, K. E. Alameh, Y. T. Lee, and I. S. Chung, “High-speed (2.5 Gbps) reconfigurable inter-chip optical interconnects using opto-VLSI processors,” Opt. Express 14(15), 6823–6836 (2006).
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Proc. SPIE (1)

X. Wang and R. T. Chen, “Fully embedded board level optical interconnects—from point-to-point interconnection to optical bus architecture,” Proc. SPIE 6899, 6899031–6899039 (2008).

Other (3)

R. Ammendola, A. Biagioni, G. Chiodi, O. Frezza, F. Lo Cicero, A. Lonardo, R. Lunadei, P. S. Paolucci, D. Rossetti, A. Salamon, G. Salina, F. Simula, L. Tosoratto, and P. Vicini, “High-speed data transfer with FPGAs and QSFP+ modules,” JINST, Aachen, Germany, 20–24 September 2010.

S. K. Selvaraja, D. Vermeulen, M. Schaekers, E. Sleeckx, W. Bogaerts, G. Roelkens, P. Dumon, D. Van Thourhout, and R. Baets, “Highly efficient grating coupler between optical fiber and silicon photonic circuit,” in “Conference on lasers and electro-optics/international quantum electronics conference,” OSA Technical Digest, CTuC6., 2009.

R. Dangel, U. Bapst, C. Berger, R. Beyeler, L. Dellmann, F. Horst, B. Offrein, and G.-L. Bona, “Development of a low-cost low-loss polymer waveguide technology for parallel optical interconnect applications,” Tech. Dig. IEEE/LEOS Summer Topical Meetings, San Diego, CA, Jun. 2004.

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Figures (11)

Fig. 1
Fig. 1

The sketch of SOI-based intra-chip optical interconnect module with a three-dimensional guided-wave path.

Fig. 2
Fig. 2

(a) The layered configuration of SOI substrate applied to the proposed SOI-based optical interconnect transmitter. (b) The cross-section of proposed trapezoidal waveguide and its structural parameters.

Fig. 3
Fig. 3

The proposed SOI-based optical interconnect transmitter with a VCSEL chip and a trapezoidal waveguide located on the opposite facets.

Fig. 4
Fig. 4

The simulated light-propagation and its intensity profile evolution in the proposed structure using the ray tracing method. (a) The light propagation along the SOI-based trapezoidal waveguide bend. (b) Intensity profile at the emitting area of VCSEL. (c) Intensity profile at the 45° micro-reflector facet. (d) Intensity profile in the trapezoidal waveguide. (e) Intensity profile in the facet of MMF.

Fig. 5
Fig. 5

The simulated alignment tolerances of 1-dB power variation at the lateral directions. (a) VCSEL-to-waveguide alignment tolerance. (b) Waveguide-to-MMF alignment tolerance.

Fig. 6
Fig. 6

The layout of high-frequency transmission lines for connections of driver-to-VCSEL and PD-to-amplifier. The inset shows the crisscross-shaped alignment keys for VCSEL/PD–to-waveguide alignment.

Fig. 7
Fig. 7

The simulation results of high-frequency transmission lines operated at the frequency below 25 GHz. (a) The return loss S11. (b) The insertion loss S21.

Fig. 8
Fig. 8

(a) The SEM photos of fabricated multi-channel trapezoidal waveguides with micro-reflectors. (b) The ground end surface and sidewalls of trapezoidal waveguide. (c) The fabricated transmission lines with Au/Sn solder bumps. (d) The VCSEL chip flip-chip assembled on the Si device layer.

Fig. 9
Fig. 9

The measured and simulated results of waveguide-to-MMF alignment tolerances for 1-dB variation at (a) X-direction and (b) Y-direction.

Fig. 10
Fig. 10

The measured S parameters of transmission line and compared with the simulated values. (a) The return loss S11. (b) Insertion loss S21.

Fig. 11
Fig. 11

The eye pattern of the SOI-based optical interconnect transmitter operated at the data rate of 5 Gbps.

Tables (4)

Tables Icon

Table 1 Simulated Return Loss and Insertion Loss of Proposed Transmission Lines Operated at 5-Gbps Data Rate

Tables Icon

Table 2 Measured Return Loss and Insertion Loss of Proposed Transmission Lines Operated at 5-Gbps data rate

Tables Icon

Table 3 Eye-Pattern Measurement Conditions

Tables Icon

Table 4 The eye-Pattern Characteristics of SOI-Based Optical Interconnect Transmitter

Metrics