Fabrication and experimental demonstration of the first 160 Gb/s hybrid silicon-on-insulator integrated all-optical wavelength converter

C. Stamatiadis; L. Stampoulidis; D. Kalavrouziotis; I. Lazarou; K. Vyrsokinos; L. Zimmermann; K. Voigt; G. B. Preve; L. Moerl; J. Kreissl; H. Avramopoulos

doi:10.1364/OE.20.003825

Fabrication and experimental demonstration of the first 160 Gb/s hybrid silicon-on-insulator integrated all-optical wavelength converter

C. Stamatiadis, L. Stampoulidis, D. Kalavrouziotis, I. Lazarou, K. Vyrsokinos, L. Zimmermann, K. Voigt, G. B. Preve, L. Moerl, J. Kreissl, and H. Avramopoulos

Optics Express
Vol. 20,
Issue 4,
pp. 3825-3831
(2012)
•https://doi.org/10.1364/OE.20.003825

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C. Stamatiadis, L. Stampoulidis, D. Kalavrouziotis, I. Lazarou, K. Vyrsokinos, L. Zimmermann, K. Voigt, G. B. Preve, L. Moerl, J. Kreissl, and H. Avramopoulos, "Fabrication and experimental demonstration of the first 160 Gb/s hybrid silicon-on-insulator integrated all-optical wavelength converter," Opt. Express 20, 3825-3831 (2012)

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Related Topics
Table of Contents Category
- Integrated Optics
Optics & Photonics Topics
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The topics in this list come from the OSA Optics and Photonics Topics applied to this article.
Previously assigned OCIS codes
- Integrated optics devices (130.3120)
- Wavelength conversion devices (130.7405)

About this Article
History
- Original Manuscript: October 17, 2011
- Manuscript Accepted: November 30, 2011
- Published: February 1, 2012

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Abstract

We present a hybrid integrated photonic circuit on a silicon-on-insulator substrate that performs ultra high-speed all-optical wavelength conversion. The chip incorporates a 1.25 mm non-linear SOA mounted on the SOI board using gold-tin bumps as small as 14 μm. Τhe device performs chirp filtering and signal polarity inversion with two multi-mode interference (MMI) - based cascaded delay interferometers (DIs) monolithically integrated on the same SOI substrate. Full free spectral range (FSR) tuning of the DIs is accomplished by two independently tuneable on-chip thermal heaters. We demonstrate 160Gb/s all-optical wavelength conversion with power penalties of less than 4.6dB.

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J. Gripp, J. E. Simsarian, J. D. LeGrange, P. G. Bernasconi, and D. T. Neilson, “Architectures, components, and subsystems for future optical packet switches,” IEEE J. Sel. Top. Quantum Electron. 16(5), 1394–1404 (2010).
[Crossref]
D. J. Blumenthal, J. Barton, N. Beheshti, J. E. Bowers, E. Burmeister, L. A. Coldren, M. Dummer, G. Epps, A. Fang, Y. Ganjali, J. Garcia, B. Koch, V. Lal, E. Lively, J. Mack, M. Masanovic, N. McKeown, K. Nguyen, S. C. Nicholes, H. Park, B. Stamenic, A. Tauke-Pedretti, H. Poulsen, and M. Sysakl, “Integrated Photonics for low-power networking,” IEEE J. Sel. Top. Quantum Electron. 17(2), 458–471 (2010).
[Crossref]
D. Chiaroni, R. Urata, J. Gripp, J. E. Simsarian, A. Gary, E. Sophie, T. Segawa, Y. Pointurier, C. Simonneau, Y. Suzaki, T. Nakahara, M. Thottan, A. L. Adamiecki, and D. Nielson, “Demonstration of the interconnection of two optical packet rings with a hybrid optoelectronic packet router,” in Proc. ECOC 2010, Turin, Italy, (2010), PD 3.5.
H. Hu, H. Ji, M. Galili, M. Pu, H. C. H. Mulvad, L. K. Oxenlowe, K. Yvind, J. M. Hvam, and P. Jeppesen, “Silicon chip based wavelength conversion of ultra-high repetition rate data signals,” in Proc. OFC2011, Los Angeles (CA), USA, PDPA8.
L. Stampoulidis, D. Apostolopoulos, D. Petrantonakis, P. Zakynthinos, P. Bakopoulos, O. Zouraraki, E. Kehayas, A. Poustie, G. Maxwell, and H. Avramopoulos, “Enabling Tb/s photonic routing: Development of advanced hybrid integrated photonic devices to realize high-speed, all- optical packet switching,” IEEE J. Sel. Top. Quantum Electron. 14(3), 849–860 (2008).
[Crossref]
J. Leuthold, C. H. Joyner, B. Mikkelsen, G. Raybon, J. L. Pleumeekers, B. I. Miller, K. Dreyer, and C. A. Burrus, “100Gbit/s all-optical wavelength conversion with integrated SOA delayed-interference configuration,” Electron. Lett. 36(13), 1129–1130 (2000).
[Crossref]
Y. Liu, E. Tangdiongga, Z. Li, H. de Waardt, A. M. J. Koonen, G. D. Khoe, and H. J. S. Dorren, “Error-free 320 Gbit/s SOA-based wavelength conversion using optical filtering,” in Proc. OFC2006, Anaheim (CA), USA, PDP28.
C. Stamatiadis, K. Vyrsokinos, L. Stampoulidis, I. Lazarou, A. Maziotis, J. Bolten, M. Karl, T. Wahlbrink, P. De Heyn, Z. Sheng, D. Van. Thourhout, and H. Avramopoulos, “Silicon-on-insulator nanowire resonators for compact and ultra-high speed all-optical wavelength converters,” J. Lightwave Technol. 29(20), 3054–3060 (2011).
[Crossref]
F. Gomez-Agis, O. Raz, S. J. Zhang, E. Tangdiongga, L. Zimmermann, K. Voigt, C. Vyrsokinos, L. Stampoulidis, and H. J. S. Dorren, “All-optical wavelength conversion at 160 Gbit/s using SOA and silicon-on- insulator photonic circuit,” Electron. Lett. 45(22), 1132–1133 (2009).
[Crossref]
J. Hofrichter, O. Raz, L. Liu, G. Morthier, F. Horst, P. Regreny, T. De Vries, H. J. S. Dorren, and B. J. Offrein, “All-optical wavelength conversion using mode switching in InP microdisc laser,” Electron. Lett. 47(16), 927–929 (2011).
[Crossref]
T. Aalto, M. Harjanne, M. Kapulainen, S. Ylinen, J. Ollila, V. Vilokkinen, L. Moerl, M. Moehrle, and R. Hamelin, “Integration of InP-based optoelectronics with silicon waveguides,” Proc. SPIE 7218, 72180O (2009).
L. Zimmermann, G. B. Preve, K. Voigt, G. Winzer, J. Kreissl, L. Moerl, C. Stamatiadis, L. Stampoulidis, and H. Avramopoulos, “High-precision flip-chip technology for all-optical wavelength conversion using SOI photonic circuit,” in Proc. IEEE Int. Conf. on Group IV photonics, London, England, (2011), P2.4.

2011 (2)

C. Stamatiadis, K. Vyrsokinos, L. Stampoulidis, I. Lazarou, A. Maziotis, J. Bolten, M. Karl, T. Wahlbrink, P. De Heyn, Z. Sheng, D. Van. Thourhout, and H. Avramopoulos, “Silicon-on-insulator nanowire resonators for compact and ultra-high speed all-optical wavelength converters,” J. Lightwave Technol. 29(20), 3054–3060 (2011).
[Crossref]

J. Hofrichter, O. Raz, L. Liu, G. Morthier, F. Horst, P. Regreny, T. De Vries, H. J. S. Dorren, and B. J. Offrein, “All-optical wavelength conversion using mode switching in InP microdisc laser,” Electron. Lett. 47(16), 927–929 (2011).
[Crossref]

2010 (2)

J. Gripp, J. E. Simsarian, J. D. LeGrange, P. G. Bernasconi, and D. T. Neilson, “Architectures, components, and subsystems for future optical packet switches,” IEEE J. Sel. Top. Quantum Electron. 16(5), 1394–1404 (2010).
[Crossref]

D. J. Blumenthal, J. Barton, N. Beheshti, J. E. Bowers, E. Burmeister, L. A. Coldren, M. Dummer, G. Epps, A. Fang, Y. Ganjali, J. Garcia, B. Koch, V. Lal, E. Lively, J. Mack, M. Masanovic, N. McKeown, K. Nguyen, S. C. Nicholes, H. Park, B. Stamenic, A. Tauke-Pedretti, H. Poulsen, and M. Sysakl, “Integrated Photonics for low-power networking,” IEEE J. Sel. Top. Quantum Electron. 17(2), 458–471 (2010).
[Crossref]

2009 (2)

T. Aalto, M. Harjanne, M. Kapulainen, S. Ylinen, J. Ollila, V. Vilokkinen, L. Moerl, M. Moehrle, and R. Hamelin, “Integration of InP-based optoelectronics with silicon waveguides,” Proc. SPIE 7218, 72180O (2009).

F. Gomez-Agis, O. Raz, S. J. Zhang, E. Tangdiongga, L. Zimmermann, K. Voigt, C. Vyrsokinos, L. Stampoulidis, and H. J. S. Dorren, “All-optical wavelength conversion at 160 Gbit/s using SOA and silicon-on- insulator photonic circuit,” Electron. Lett. 45(22), 1132–1133 (2009).
[Crossref]

2008 (1)

L. Stampoulidis, D. Apostolopoulos, D. Petrantonakis, P. Zakynthinos, P. Bakopoulos, O. Zouraraki, E. Kehayas, A. Poustie, G. Maxwell, and H. Avramopoulos, “Enabling Tb/s photonic routing: Development of advanced hybrid integrated photonic devices to realize high-speed, all- optical packet switching,” IEEE J. Sel. Top. Quantum Electron. 14(3), 849–860 (2008).
[Crossref]

2000 (1)

J. Leuthold, C. H. Joyner, B. Mikkelsen, G. Raybon, J. L. Pleumeekers, B. I. Miller, K. Dreyer, and C. A. Burrus, “100Gbit/s all-optical wavelength conversion with integrated SOA delayed-interference configuration,” Electron. Lett. 36(13), 1129–1130 (2000).
[Crossref]

Aalto, T.

Apostolopoulos, D.

Avramopoulos, H.

Bakopoulos, P.

Barton, J.

Beheshti, N.

Bernasconi, P. G.

Blumenthal, D. J.

Bolten, J.

Bowers, J. E.

Burmeister, E.

Burrus, C. A.

Coldren, L. A.

De Heyn, P.

De Vries, T.

Dorren, H. J. S.

Dreyer, K.

Dummer, M.

Epps, G.

Fang, A.

Ganjali, Y.

Garcia, J.

Gomez-Agis, F.

Gripp, J.

Hamelin, R.

Harjanne, M.

Hofrichter, J.

Horst, F.

Joyner, C. H.

Kapulainen, M.

Karl, M.

Kehayas, E.

Koch, B.

Lal, V.

Lazarou, I.

LeGrange, J. D.

Leuthold, J.

Liu, L.

Lively, E.

Mack, J.

Masanovic, M.

Maxwell, G.

Maziotis, A.

McKeown, N.

Mikkelsen, B.

Miller, B. I.

Moehrle, M.

Moerl, L.

Morthier, G.

Neilson, D. T.

Nguyen, K.

Nicholes, S. C.

Offrein, B. J.

Ollila, J.

Park, H.

Petrantonakis, D.

Pleumeekers, J. L.

Poulsen, H.

Poustie, A.

Raybon, G.

Raz, O.

Regreny, P.

Sheng, Z.

Simsarian, J. E.

Stamatiadis, C.

Stamenic, B.

Stampoulidis, L.

Sysakl, M.

Tangdiongga, E.

Tauke-Pedretti, A.

Van. Thourhout, D.

Vilokkinen, V.

Voigt, K.

Vyrsokinos, C.

Vyrsokinos, K.

Wahlbrink, T.

Ylinen, S.

Zakynthinos, P.

Zhang, S. J.

Zimmermann, L.

Zouraraki, O.

Electron. Lett. (3)

IEEE J. Sel. Top. Quantum Electron. (3)

J. Lightwave Technol. (1)

Proc. SPIE (1)

Other (4)

L. Zimmermann, G. B. Preve, K. Voigt, G. Winzer, J. Kreissl, L. Moerl, C. Stamatiadis, L. Stampoulidis, and H. Avramopoulos, “High-precision flip-chip technology for all-optical wavelength conversion using SOI photonic circuit,” in Proc. IEEE Int. Conf. on Group IV photonics, London, England, (2011), P2.4.

Y. Liu, E. Tangdiongga, Z. Li, H. de Waardt, A. M. J. Koonen, G. D. Khoe, and H. J. S. Dorren, “Error-free 320 Gbit/s SOA-based wavelength conversion using optical filtering,” in Proc. OFC2006, Anaheim (CA), USA, PDP28.

D. Chiaroni, R. Urata, J. Gripp, J. E. Simsarian, A. Gary, E. Sophie, T. Segawa, Y. Pointurier, C. Simonneau, Y. Suzaki, T. Nakahara, M. Thottan, A. L. Adamiecki, and D. Nielson, “Demonstration of the interconnection of two optical packet rings with a hybrid optoelectronic packet router,” in Proc. ECOC 2010, Turin, Italy, (2010), PD 3.5.

H. Hu, H. Ji, M. Galili, M. Pu, H. C. H. Mulvad, L. K. Oxenlowe, K. Yvind, J. M. Hvam, and P. Jeppesen, “Silicon chip based wavelength conversion of ultra-high repetition rate data signals,” in Proc. OFC2011, Los Angeles (CA), USA, PDPA8.

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Fig. 1

(a) Layout of hybrid AOWC. (b) Mask design. (c) SEM image of SOA bonded on SOI. (d) SEM of SOA and SOI taper section.

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Fig. 2

(a) Experimental setup. (b) Hybrid AOWC chip. (c) Fiber and probe alignment. (d) DI spectral responses.

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Fig. 3

Eye diagrams. (a-c) 80Gb/s B2B, Inverted WC, Non-Inverted WC. (d-f) 160Gb/s B2B, Inverted WC, Non-Inverted WC.

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Fig. 4

(a) BER curves of 80Gb/s WC. (b) Output spectrum of AOWC at 80Gb/s. (c) Spectrum of 80Gb/s Nον-Inverted WC. (d) BER curves of 160Gb/s WC. (e) Output spectrum of AOWC at 160Gb/s. (f) Spectrum of 160Gb/s Nον-Inverted WC.

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