C. L. Schow, F. E. Doany, A. V. Rylyakov, B. G. Lee, C. V. Jahnes, Y. H. Kwark, C. W. Baks, D. M. Kuchta, and J. A. Kash, “A 24-Channel, 300 Gb/s, 8.2 pJ/bit, full-duplex fiber-coupled optical transceiver module based on a single “Holey” CMOS IC,” J. Lightwave Technol. 29(4), 542–553 (2011).
[Crossref]
L. Dellmann, U. Drechsler, T. Morf, H. Rothuizen, R. Stutz, J. Weiss, and M. Despont, “3D opto-electrical device stacking on CMOS,” Microelectron. Eng. 87(5-8), 1210–1212 (2010).
[Crossref]
D. A. B. Miller, “Device requirements for optical interconnects to silicon chips,” Proc. IEEE 97(7), 1166–1185 (2009).
[Crossref]
D. A. B. Miller, “Rationale and challenges for optical interconnects to electronic chips,” Proc. IEEE 88(6), 728–749 (2000).
[Crossref]
C. L. Schow, F. E. Doany, A. V. Rylyakov, B. G. Lee, C. V. Jahnes, Y. H. Kwark, C. W. Baks, D. M. Kuchta, and J. A. Kash, “A 24-Channel, 300 Gb/s, 8.2 pJ/bit, full-duplex fiber-coupled optical transceiver module based on a single “Holey” CMOS IC,” J. Lightwave Technol. 29(4), 542–553 (2011).
[Crossref]
L. Dellmann, U. Drechsler, T. Morf, H. Rothuizen, R. Stutz, J. Weiss, and M. Despont, “3D opto-electrical device stacking on CMOS,” Microelectron. Eng. 87(5-8), 1210–1212 (2010).
[Crossref]
L. Dellmann, U. Drechsler, T. Morf, H. Rothuizen, R. Stutz, J. Weiss, and M. Despont, “3D opto-electrical device stacking on CMOS,” Microelectron. Eng. 87(5-8), 1210–1212 (2010).
[Crossref]
C. L. Schow, F. E. Doany, A. V. Rylyakov, B. G. Lee, C. V. Jahnes, Y. H. Kwark, C. W. Baks, D. M. Kuchta, and J. A. Kash, “A 24-Channel, 300 Gb/s, 8.2 pJ/bit, full-duplex fiber-coupled optical transceiver module based on a single “Holey” CMOS IC,” J. Lightwave Technol. 29(4), 542–553 (2011).
[Crossref]
L. Dellmann, U. Drechsler, T. Morf, H. Rothuizen, R. Stutz, J. Weiss, and M. Despont, “3D opto-electrical device stacking on CMOS,” Microelectron. Eng. 87(5-8), 1210–1212 (2010).
[Crossref]
C. L. Schow, F. E. Doany, A. V. Rylyakov, B. G. Lee, C. V. Jahnes, Y. H. Kwark, C. W. Baks, D. M. Kuchta, and J. A. Kash, “A 24-Channel, 300 Gb/s, 8.2 pJ/bit, full-duplex fiber-coupled optical transceiver module based on a single “Holey” CMOS IC,” J. Lightwave Technol. 29(4), 542–553 (2011).
[Crossref]
C. L. Schow, F. E. Doany, A. V. Rylyakov, B. G. Lee, C. V. Jahnes, Y. H. Kwark, C. W. Baks, D. M. Kuchta, and J. A. Kash, “A 24-Channel, 300 Gb/s, 8.2 pJ/bit, full-duplex fiber-coupled optical transceiver module based on a single “Holey” CMOS IC,” J. Lightwave Technol. 29(4), 542–553 (2011).
[Crossref]
C. L. Schow, F. E. Doany, A. V. Rylyakov, B. G. Lee, C. V. Jahnes, Y. H. Kwark, C. W. Baks, D. M. Kuchta, and J. A. Kash, “A 24-Channel, 300 Gb/s, 8.2 pJ/bit, full-duplex fiber-coupled optical transceiver module based on a single “Holey” CMOS IC,” J. Lightwave Technol. 29(4), 542–553 (2011).
[Crossref]
C. L. Schow, F. E. Doany, A. V. Rylyakov, B. G. Lee, C. V. Jahnes, Y. H. Kwark, C. W. Baks, D. M. Kuchta, and J. A. Kash, “A 24-Channel, 300 Gb/s, 8.2 pJ/bit, full-duplex fiber-coupled optical transceiver module based on a single “Holey” CMOS IC,” J. Lightwave Technol. 29(4), 542–553 (2011).
[Crossref]
C. L. Schow, F. E. Doany, A. V. Rylyakov, B. G. Lee, C. V. Jahnes, Y. H. Kwark, C. W. Baks, D. M. Kuchta, and J. A. Kash, “A 24-Channel, 300 Gb/s, 8.2 pJ/bit, full-duplex fiber-coupled optical transceiver module based on a single “Holey” CMOS IC,” J. Lightwave Technol. 29(4), 542–553 (2011).
[Crossref]
D. A. B. Miller, “Device requirements for optical interconnects to silicon chips,” Proc. IEEE 97(7), 1166–1185 (2009).
[Crossref]
D. A. B. Miller, “Rationale and challenges for optical interconnects to electronic chips,” Proc. IEEE 88(6), 728–749 (2000).
[Crossref]
L. Dellmann, U. Drechsler, T. Morf, H. Rothuizen, R. Stutz, J. Weiss, and M. Despont, “3D opto-electrical device stacking on CMOS,” Microelectron. Eng. 87(5-8), 1210–1212 (2010).
[Crossref]
L. Dellmann, U. Drechsler, T. Morf, H. Rothuizen, R. Stutz, J. Weiss, and M. Despont, “3D opto-electrical device stacking on CMOS,” Microelectron. Eng. 87(5-8), 1210–1212 (2010).
[Crossref]
C. L. Schow, F. E. Doany, A. V. Rylyakov, B. G. Lee, C. V. Jahnes, Y. H. Kwark, C. W. Baks, D. M. Kuchta, and J. A. Kash, “A 24-Channel, 300 Gb/s, 8.2 pJ/bit, full-duplex fiber-coupled optical transceiver module based on a single “Holey” CMOS IC,” J. Lightwave Technol. 29(4), 542–553 (2011).
[Crossref]
C. L. Schow, F. E. Doany, A. V. Rylyakov, B. G. Lee, C. V. Jahnes, Y. H. Kwark, C. W. Baks, D. M. Kuchta, and J. A. Kash, “A 24-Channel, 300 Gb/s, 8.2 pJ/bit, full-duplex fiber-coupled optical transceiver module based on a single “Holey” CMOS IC,” J. Lightwave Technol. 29(4), 542–553 (2011).
[Crossref]
L. Dellmann, U. Drechsler, T. Morf, H. Rothuizen, R. Stutz, J. Weiss, and M. Despont, “3D opto-electrical device stacking on CMOS,” Microelectron. Eng. 87(5-8), 1210–1212 (2010).
[Crossref]
L. Dellmann, U. Drechsler, T. Morf, H. Rothuizen, R. Stutz, J. Weiss, and M. Despont, “3D opto-electrical device stacking on CMOS,” Microelectron. Eng. 87(5-8), 1210–1212 (2010).
[Crossref]
C. L. Schow, F. E. Doany, A. V. Rylyakov, B. G. Lee, C. V. Jahnes, Y. H. Kwark, C. W. Baks, D. M. Kuchta, and J. A. Kash, “A 24-Channel, 300 Gb/s, 8.2 pJ/bit, full-duplex fiber-coupled optical transceiver module based on a single “Holey” CMOS IC,” J. Lightwave Technol. 29(4), 542–553 (2011).
[Crossref]
L. Dellmann, U. Drechsler, T. Morf, H. Rothuizen, R. Stutz, J. Weiss, and M. Despont, “3D opto-electrical device stacking on CMOS,” Microelectron. Eng. 87(5-8), 1210–1212 (2010).
[Crossref]
D. A. B. Miller, “Rationale and challenges for optical interconnects to electronic chips,” Proc. IEEE 88(6), 728–749 (2000).
[Crossref]
D. A. B. Miller, “Device requirements for optical interconnects to silicon chips,” Proc. IEEE 97(7), 1166–1185 (2009).
[Crossref]
H. J. S. Dorren, P. Duan, O. Raz, and R. P. Luijten, “Fundamental bounds for photonic interconnects,” 13th International Conference on Transparent Optical Networks (ICTON, Stockholm, 2011), paper Mo.C1.1.
F. E. Doany, B. G. Lee, A. V. Rylyakov, D. M. Kuchta, C. Baks, C. Jahnes, F. Libsch, and C. L. Schow, “Terabit/sec VCSEL-based parallel optical module based on Holey CMOS transceiver IC”. In Proceeding of the Optical Fiber communication conference (OFC/NFOEC, Los Angeles, 2012), PDP5D.9.
P. Duan, O. Raz, B. E. Smalbrugge, J. Duis, and H. J. S. Dorren, “Chip-to-chip interconnects based on 3D stacking of opto-electrical dies on Si, ” in the Proc. SPIE. 8267, Optoelectronic Interconnects XII, 82670U (San Francisco, 2012).