Abstract

A detailed study of the influence of the pulse duration, from the femtosecond to the nanosecond regime, on the evolution of the hole shape and depth during percussion drilling in silicon is presented. Real-time backlight imaging of the hole development is obtained for holes up to 2 mm deep with aspect ratios extending to 25:1. For low pulse energies, the hole-shape and drilling characteristics are similar for femtosecond, picoseconds and nanosecond regimes. At higher pulse energies, ns-pulses exhibit slower average drilling rates but eventually reach greater final depths. The shape of these holes is however dominated by branching and large internal cavities. For ps-pulses, a cylindrical shape is maintained with frequent small bulges on the side-walls. In contrast, fs-pulses cause only a limited number of imperfections on a tapered hole shape.

© 2012 OSA

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  1. D. Breitling, A. Ruf, and F. Dausinger, “Fundamental aspects in micromachining of metals with short and ultrashort laser pulses,” Proc. SPIE5339, 49–63 (2004).
    [CrossRef]
  2. C. Momma, B. N. Chichkov, S. Nolte, F. von Alvensleben, A. Tünnermann, H. Welling, and B. Wellegehausen, “Short-pulse laser ablation of solid targets,” Opt. Commun.129(1-2), 134–142 (1996).
    [CrossRef]
  3. S. Nolte, C. Momma, H. Jacobs, A. Tünnermann, B. N. Chichkov, B. Wellegehausen, and H. Welling, “Ablation of metals by ultrashort laser pulses,” J. Opt. Soc. Am. B14(10), 2716–2722 (1997).
    [CrossRef]
  4. H. Dachraoui, W. Husinsky, and G. Betz, “Ultrashort laser ablation of metals and semiconductors: evidence of ultra-fast coulomb explosion,” Appl. Phys., A Mater. Sci. Process.83(2), 333–336 (2006).
    [CrossRef]
  5. B. C. Stuart, M. D. Feit, S. Herman, A. M. Rubenchik, B. W. Shore, and M. D. Perry, “Optical ablation by high-power short-pulse lasers,” J. Opt. Soc. Am. B13(2), 459–468 (1996).
    [CrossRef]
  6. S. Amoruso, G. Ausanio, A. C. Barone, R. Bruzzese, L. Gragnaniello, M. Vitiello, and X. Wang, “Ultrashort laser ablation of solid matter in vacuum: a comparison between the picosecond and femtosecond regimes,” J. Phys. At. Mol. Opt. Phys.38(20), L329–L338 (2005).
    [CrossRef]
  7. S. M. Klimentov, T. V. Kononenko, P. A. Pivovarov, S. V. Garnov, V. I. Konov, A. M. Prokhorov, D. Breitling, and F. Dausinger, “The role of plasma in ablation of materials by ultrashort laser pulses,” Quantum Electron.31(5), 378–382 (2001).
    [CrossRef]
  8. L. Shah, J. Tawney, M. Richardson, and K. Richardson, “Femtosecond laser deep hole drilling of silica glasses in air,” Appl. Surf. Sci.183(3-4), 151–164 (2001).
    [CrossRef]
  9. T. V. Kononenko, S. M. Klimentov, S. V. Garnov, V. I. Konov, D. Breitling, C. Foehl, A. Ruf, J. Radtke, and F. Dausinger, “Hole formation process in laser deep drilling with short and ultrashort pulses,” Proc. SPIE4426, 108–112 (2002).
    [CrossRef]
  10. S. Bruneau, J. Hermann, G. Dumitru, M. Sentis, and E. Axente, “Ultra-fast laser ablation applied to deep-drilling of metals,” Appl. Surf. Sci.248(1-4), 299–303 (2005).
    [CrossRef]
  11. C. S. Nielsen and P. Balling, “Deep drilling of metals with ultrashort laser pulses: A two-stage process,” J. Appl. Phys.99(9), 093101 (2006).
    [CrossRef]
  12. P. J. L. Webster, M. S. Muller, and J. M. Fraser, “High speed in situ depth profiling of ultrafast micromachining,” Opt. Express15(23), 14967–14972 (2007).
    [CrossRef] [PubMed]
  13. A. Michalowski, D. Walter, F. Dausinger, and T. Graf, “Melt dynamics and hole formation during drilling with ultrashort pulses,” J. Laser Micro Nanoen.3(3), 211–215 (2008).
    [CrossRef]
  14. F. P. Mezzapesa, A. Ancona, T. Sibillano, F. De Lucia, M. Dabbicco, P. Mario Lugarà, and G. Scamarcio, “High-resolution monitoring of the hole depth during ultrafast laser ablation drilling by diode laser self-mixing interferometry,” Opt. Lett.36(6), 822–824 (2011).
    [CrossRef] [PubMed]
  15. E. Coyne, J. Magee, P. Mannion, and G. O’Connor, “A study of femtosecond laser interaction with wafer grade silicon,” Proc. SPIE4876, 487–499 (2003).
    [CrossRef]
  16. S. Döring, S. Richter, A. Tünnermann, and S. Nolte, “Evolution of the hole depth and shape in ultrashort pulse deep drilling in silicon,” Appl. Phys., A Mater. Sci. Process.105(1), 69–74 (2011).
    [CrossRef]
  17. S. Döring, S. Richter, S. Nolte, and A. Tünnermann, “In situ imaging of hole shape evolution in ultrashort pulse laser drilling,” Opt. Express18(19), 20395–20400 (2010).
    [CrossRef] [PubMed]

2011 (2)

F. P. Mezzapesa, A. Ancona, T. Sibillano, F. De Lucia, M. Dabbicco, P. Mario Lugarà, and G. Scamarcio, “High-resolution monitoring of the hole depth during ultrafast laser ablation drilling by diode laser self-mixing interferometry,” Opt. Lett.36(6), 822–824 (2011).
[CrossRef] [PubMed]

S. Döring, S. Richter, A. Tünnermann, and S. Nolte, “Evolution of the hole depth and shape in ultrashort pulse deep drilling in silicon,” Appl. Phys., A Mater. Sci. Process.105(1), 69–74 (2011).
[CrossRef]

2010 (1)

2008 (1)

A. Michalowski, D. Walter, F. Dausinger, and T. Graf, “Melt dynamics and hole formation during drilling with ultrashort pulses,” J. Laser Micro Nanoen.3(3), 211–215 (2008).
[CrossRef]

2007 (1)

2006 (2)

C. S. Nielsen and P. Balling, “Deep drilling of metals with ultrashort laser pulses: A two-stage process,” J. Appl. Phys.99(9), 093101 (2006).
[CrossRef]

H. Dachraoui, W. Husinsky, and G. Betz, “Ultrashort laser ablation of metals and semiconductors: evidence of ultra-fast coulomb explosion,” Appl. Phys., A Mater. Sci. Process.83(2), 333–336 (2006).
[CrossRef]

2005 (2)

S. Amoruso, G. Ausanio, A. C. Barone, R. Bruzzese, L. Gragnaniello, M. Vitiello, and X. Wang, “Ultrashort laser ablation of solid matter in vacuum: a comparison between the picosecond and femtosecond regimes,” J. Phys. At. Mol. Opt. Phys.38(20), L329–L338 (2005).
[CrossRef]

S. Bruneau, J. Hermann, G. Dumitru, M. Sentis, and E. Axente, “Ultra-fast laser ablation applied to deep-drilling of metals,” Appl. Surf. Sci.248(1-4), 299–303 (2005).
[CrossRef]

2004 (1)

D. Breitling, A. Ruf, and F. Dausinger, “Fundamental aspects in micromachining of metals with short and ultrashort laser pulses,” Proc. SPIE5339, 49–63 (2004).
[CrossRef]

2003 (1)

E. Coyne, J. Magee, P. Mannion, and G. O’Connor, “A study of femtosecond laser interaction with wafer grade silicon,” Proc. SPIE4876, 487–499 (2003).
[CrossRef]

2002 (1)

T. V. Kononenko, S. M. Klimentov, S. V. Garnov, V. I. Konov, D. Breitling, C. Foehl, A. Ruf, J. Radtke, and F. Dausinger, “Hole formation process in laser deep drilling with short and ultrashort pulses,” Proc. SPIE4426, 108–112 (2002).
[CrossRef]

2001 (2)

S. M. Klimentov, T. V. Kononenko, P. A. Pivovarov, S. V. Garnov, V. I. Konov, A. M. Prokhorov, D. Breitling, and F. Dausinger, “The role of plasma in ablation of materials by ultrashort laser pulses,” Quantum Electron.31(5), 378–382 (2001).
[CrossRef]

L. Shah, J. Tawney, M. Richardson, and K. Richardson, “Femtosecond laser deep hole drilling of silica glasses in air,” Appl. Surf. Sci.183(3-4), 151–164 (2001).
[CrossRef]

1997 (1)

1996 (2)

C. Momma, B. N. Chichkov, S. Nolte, F. von Alvensleben, A. Tünnermann, H. Welling, and B. Wellegehausen, “Short-pulse laser ablation of solid targets,” Opt. Commun.129(1-2), 134–142 (1996).
[CrossRef]

B. C. Stuart, M. D. Feit, S. Herman, A. M. Rubenchik, B. W. Shore, and M. D. Perry, “Optical ablation by high-power short-pulse lasers,” J. Opt. Soc. Am. B13(2), 459–468 (1996).
[CrossRef]

Amoruso, S.

S. Amoruso, G. Ausanio, A. C. Barone, R. Bruzzese, L. Gragnaniello, M. Vitiello, and X. Wang, “Ultrashort laser ablation of solid matter in vacuum: a comparison between the picosecond and femtosecond regimes,” J. Phys. At. Mol. Opt. Phys.38(20), L329–L338 (2005).
[CrossRef]

Ancona, A.

Ausanio, G.

S. Amoruso, G. Ausanio, A. C. Barone, R. Bruzzese, L. Gragnaniello, M. Vitiello, and X. Wang, “Ultrashort laser ablation of solid matter in vacuum: a comparison between the picosecond and femtosecond regimes,” J. Phys. At. Mol. Opt. Phys.38(20), L329–L338 (2005).
[CrossRef]

Axente, E.

S. Bruneau, J. Hermann, G. Dumitru, M. Sentis, and E. Axente, “Ultra-fast laser ablation applied to deep-drilling of metals,” Appl. Surf. Sci.248(1-4), 299–303 (2005).
[CrossRef]

Balling, P.

C. S. Nielsen and P. Balling, “Deep drilling of metals with ultrashort laser pulses: A two-stage process,” J. Appl. Phys.99(9), 093101 (2006).
[CrossRef]

Barone, A. C.

S. Amoruso, G. Ausanio, A. C. Barone, R. Bruzzese, L. Gragnaniello, M. Vitiello, and X. Wang, “Ultrashort laser ablation of solid matter in vacuum: a comparison between the picosecond and femtosecond regimes,” J. Phys. At. Mol. Opt. Phys.38(20), L329–L338 (2005).
[CrossRef]

Betz, G.

H. Dachraoui, W. Husinsky, and G. Betz, “Ultrashort laser ablation of metals and semiconductors: evidence of ultra-fast coulomb explosion,” Appl. Phys., A Mater. Sci. Process.83(2), 333–336 (2006).
[CrossRef]

Breitling, D.

D. Breitling, A. Ruf, and F. Dausinger, “Fundamental aspects in micromachining of metals with short and ultrashort laser pulses,” Proc. SPIE5339, 49–63 (2004).
[CrossRef]

T. V. Kononenko, S. M. Klimentov, S. V. Garnov, V. I. Konov, D. Breitling, C. Foehl, A. Ruf, J. Radtke, and F. Dausinger, “Hole formation process in laser deep drilling with short and ultrashort pulses,” Proc. SPIE4426, 108–112 (2002).
[CrossRef]

S. M. Klimentov, T. V. Kononenko, P. A. Pivovarov, S. V. Garnov, V. I. Konov, A. M. Prokhorov, D. Breitling, and F. Dausinger, “The role of plasma in ablation of materials by ultrashort laser pulses,” Quantum Electron.31(5), 378–382 (2001).
[CrossRef]

Bruneau, S.

S. Bruneau, J. Hermann, G. Dumitru, M. Sentis, and E. Axente, “Ultra-fast laser ablation applied to deep-drilling of metals,” Appl. Surf. Sci.248(1-4), 299–303 (2005).
[CrossRef]

Bruzzese, R.

S. Amoruso, G. Ausanio, A. C. Barone, R. Bruzzese, L. Gragnaniello, M. Vitiello, and X. Wang, “Ultrashort laser ablation of solid matter in vacuum: a comparison between the picosecond and femtosecond regimes,” J. Phys. At. Mol. Opt. Phys.38(20), L329–L338 (2005).
[CrossRef]

Chichkov, B. N.

S. Nolte, C. Momma, H. Jacobs, A. Tünnermann, B. N. Chichkov, B. Wellegehausen, and H. Welling, “Ablation of metals by ultrashort laser pulses,” J. Opt. Soc. Am. B14(10), 2716–2722 (1997).
[CrossRef]

C. Momma, B. N. Chichkov, S. Nolte, F. von Alvensleben, A. Tünnermann, H. Welling, and B. Wellegehausen, “Short-pulse laser ablation of solid targets,” Opt. Commun.129(1-2), 134–142 (1996).
[CrossRef]

Coyne, E.

E. Coyne, J. Magee, P. Mannion, and G. O’Connor, “A study of femtosecond laser interaction with wafer grade silicon,” Proc. SPIE4876, 487–499 (2003).
[CrossRef]

Dabbicco, M.

Dachraoui, H.

H. Dachraoui, W. Husinsky, and G. Betz, “Ultrashort laser ablation of metals and semiconductors: evidence of ultra-fast coulomb explosion,” Appl. Phys., A Mater. Sci. Process.83(2), 333–336 (2006).
[CrossRef]

Dausinger, F.

A. Michalowski, D. Walter, F. Dausinger, and T. Graf, “Melt dynamics and hole formation during drilling with ultrashort pulses,” J. Laser Micro Nanoen.3(3), 211–215 (2008).
[CrossRef]

D. Breitling, A. Ruf, and F. Dausinger, “Fundamental aspects in micromachining of metals with short and ultrashort laser pulses,” Proc. SPIE5339, 49–63 (2004).
[CrossRef]

T. V. Kononenko, S. M. Klimentov, S. V. Garnov, V. I. Konov, D. Breitling, C. Foehl, A. Ruf, J. Radtke, and F. Dausinger, “Hole formation process in laser deep drilling with short and ultrashort pulses,” Proc. SPIE4426, 108–112 (2002).
[CrossRef]

S. M. Klimentov, T. V. Kononenko, P. A. Pivovarov, S. V. Garnov, V. I. Konov, A. M. Prokhorov, D. Breitling, and F. Dausinger, “The role of plasma in ablation of materials by ultrashort laser pulses,” Quantum Electron.31(5), 378–382 (2001).
[CrossRef]

De Lucia, F.

Döring, S.

S. Döring, S. Richter, A. Tünnermann, and S. Nolte, “Evolution of the hole depth and shape in ultrashort pulse deep drilling in silicon,” Appl. Phys., A Mater. Sci. Process.105(1), 69–74 (2011).
[CrossRef]

S. Döring, S. Richter, S. Nolte, and A. Tünnermann, “In situ imaging of hole shape evolution in ultrashort pulse laser drilling,” Opt. Express18(19), 20395–20400 (2010).
[CrossRef] [PubMed]

Dumitru, G.

S. Bruneau, J. Hermann, G. Dumitru, M. Sentis, and E. Axente, “Ultra-fast laser ablation applied to deep-drilling of metals,” Appl. Surf. Sci.248(1-4), 299–303 (2005).
[CrossRef]

Feit, M. D.

Foehl, C.

T. V. Kononenko, S. M. Klimentov, S. V. Garnov, V. I. Konov, D. Breitling, C. Foehl, A. Ruf, J. Radtke, and F. Dausinger, “Hole formation process in laser deep drilling with short and ultrashort pulses,” Proc. SPIE4426, 108–112 (2002).
[CrossRef]

Fraser, J. M.

Garnov, S. V.

T. V. Kononenko, S. M. Klimentov, S. V. Garnov, V. I. Konov, D. Breitling, C. Foehl, A. Ruf, J. Radtke, and F. Dausinger, “Hole formation process in laser deep drilling with short and ultrashort pulses,” Proc. SPIE4426, 108–112 (2002).
[CrossRef]

S. M. Klimentov, T. V. Kononenko, P. A. Pivovarov, S. V. Garnov, V. I. Konov, A. M. Prokhorov, D. Breitling, and F. Dausinger, “The role of plasma in ablation of materials by ultrashort laser pulses,” Quantum Electron.31(5), 378–382 (2001).
[CrossRef]

Graf, T.

A. Michalowski, D. Walter, F. Dausinger, and T. Graf, “Melt dynamics and hole formation during drilling with ultrashort pulses,” J. Laser Micro Nanoen.3(3), 211–215 (2008).
[CrossRef]

Gragnaniello, L.

S. Amoruso, G. Ausanio, A. C. Barone, R. Bruzzese, L. Gragnaniello, M. Vitiello, and X. Wang, “Ultrashort laser ablation of solid matter in vacuum: a comparison between the picosecond and femtosecond regimes,” J. Phys. At. Mol. Opt. Phys.38(20), L329–L338 (2005).
[CrossRef]

Herman, S.

Hermann, J.

S. Bruneau, J. Hermann, G. Dumitru, M. Sentis, and E. Axente, “Ultra-fast laser ablation applied to deep-drilling of metals,” Appl. Surf. Sci.248(1-4), 299–303 (2005).
[CrossRef]

Husinsky, W.

H. Dachraoui, W. Husinsky, and G. Betz, “Ultrashort laser ablation of metals and semiconductors: evidence of ultra-fast coulomb explosion,” Appl. Phys., A Mater. Sci. Process.83(2), 333–336 (2006).
[CrossRef]

Jacobs, H.

Klimentov, S. M.

T. V. Kononenko, S. M. Klimentov, S. V. Garnov, V. I. Konov, D. Breitling, C. Foehl, A. Ruf, J. Radtke, and F. Dausinger, “Hole formation process in laser deep drilling with short and ultrashort pulses,” Proc. SPIE4426, 108–112 (2002).
[CrossRef]

S. M. Klimentov, T. V. Kononenko, P. A. Pivovarov, S. V. Garnov, V. I. Konov, A. M. Prokhorov, D. Breitling, and F. Dausinger, “The role of plasma in ablation of materials by ultrashort laser pulses,” Quantum Electron.31(5), 378–382 (2001).
[CrossRef]

Kononenko, T. V.

T. V. Kononenko, S. M. Klimentov, S. V. Garnov, V. I. Konov, D. Breitling, C. Foehl, A. Ruf, J. Radtke, and F. Dausinger, “Hole formation process in laser deep drilling with short and ultrashort pulses,” Proc. SPIE4426, 108–112 (2002).
[CrossRef]

S. M. Klimentov, T. V. Kononenko, P. A. Pivovarov, S. V. Garnov, V. I. Konov, A. M. Prokhorov, D. Breitling, and F. Dausinger, “The role of plasma in ablation of materials by ultrashort laser pulses,” Quantum Electron.31(5), 378–382 (2001).
[CrossRef]

Konov, V. I.

T. V. Kononenko, S. M. Klimentov, S. V. Garnov, V. I. Konov, D. Breitling, C. Foehl, A. Ruf, J. Radtke, and F. Dausinger, “Hole formation process in laser deep drilling with short and ultrashort pulses,” Proc. SPIE4426, 108–112 (2002).
[CrossRef]

S. M. Klimentov, T. V. Kononenko, P. A. Pivovarov, S. V. Garnov, V. I. Konov, A. M. Prokhorov, D. Breitling, and F. Dausinger, “The role of plasma in ablation of materials by ultrashort laser pulses,” Quantum Electron.31(5), 378–382 (2001).
[CrossRef]

Magee, J.

E. Coyne, J. Magee, P. Mannion, and G. O’Connor, “A study of femtosecond laser interaction with wafer grade silicon,” Proc. SPIE4876, 487–499 (2003).
[CrossRef]

Mannion, P.

E. Coyne, J. Magee, P. Mannion, and G. O’Connor, “A study of femtosecond laser interaction with wafer grade silicon,” Proc. SPIE4876, 487–499 (2003).
[CrossRef]

Mario Lugarà, P.

Mezzapesa, F. P.

Michalowski, A.

A. Michalowski, D. Walter, F. Dausinger, and T. Graf, “Melt dynamics and hole formation during drilling with ultrashort pulses,” J. Laser Micro Nanoen.3(3), 211–215 (2008).
[CrossRef]

Momma, C.

S. Nolte, C. Momma, H. Jacobs, A. Tünnermann, B. N. Chichkov, B. Wellegehausen, and H. Welling, “Ablation of metals by ultrashort laser pulses,” J. Opt. Soc. Am. B14(10), 2716–2722 (1997).
[CrossRef]

C. Momma, B. N. Chichkov, S. Nolte, F. von Alvensleben, A. Tünnermann, H. Welling, and B. Wellegehausen, “Short-pulse laser ablation of solid targets,” Opt. Commun.129(1-2), 134–142 (1996).
[CrossRef]

Muller, M. S.

Nielsen, C. S.

C. S. Nielsen and P. Balling, “Deep drilling of metals with ultrashort laser pulses: A two-stage process,” J. Appl. Phys.99(9), 093101 (2006).
[CrossRef]

Nolte, S.

S. Döring, S. Richter, A. Tünnermann, and S. Nolte, “Evolution of the hole depth and shape in ultrashort pulse deep drilling in silicon,” Appl. Phys., A Mater. Sci. Process.105(1), 69–74 (2011).
[CrossRef]

S. Döring, S. Richter, S. Nolte, and A. Tünnermann, “In situ imaging of hole shape evolution in ultrashort pulse laser drilling,” Opt. Express18(19), 20395–20400 (2010).
[CrossRef] [PubMed]

S. Nolte, C. Momma, H. Jacobs, A. Tünnermann, B. N. Chichkov, B. Wellegehausen, and H. Welling, “Ablation of metals by ultrashort laser pulses,” J. Opt. Soc. Am. B14(10), 2716–2722 (1997).
[CrossRef]

C. Momma, B. N. Chichkov, S. Nolte, F. von Alvensleben, A. Tünnermann, H. Welling, and B. Wellegehausen, “Short-pulse laser ablation of solid targets,” Opt. Commun.129(1-2), 134–142 (1996).
[CrossRef]

O’Connor, G.

E. Coyne, J. Magee, P. Mannion, and G. O’Connor, “A study of femtosecond laser interaction with wafer grade silicon,” Proc. SPIE4876, 487–499 (2003).
[CrossRef]

Perry, M. D.

Pivovarov, P. A.

S. M. Klimentov, T. V. Kononenko, P. A. Pivovarov, S. V. Garnov, V. I. Konov, A. M. Prokhorov, D. Breitling, and F. Dausinger, “The role of plasma in ablation of materials by ultrashort laser pulses,” Quantum Electron.31(5), 378–382 (2001).
[CrossRef]

Prokhorov, A. M.

S. M. Klimentov, T. V. Kononenko, P. A. Pivovarov, S. V. Garnov, V. I. Konov, A. M. Prokhorov, D. Breitling, and F. Dausinger, “The role of plasma in ablation of materials by ultrashort laser pulses,” Quantum Electron.31(5), 378–382 (2001).
[CrossRef]

Radtke, J.

T. V. Kononenko, S. M. Klimentov, S. V. Garnov, V. I. Konov, D. Breitling, C. Foehl, A. Ruf, J. Radtke, and F. Dausinger, “Hole formation process in laser deep drilling with short and ultrashort pulses,” Proc. SPIE4426, 108–112 (2002).
[CrossRef]

Richardson, K.

L. Shah, J. Tawney, M. Richardson, and K. Richardson, “Femtosecond laser deep hole drilling of silica glasses in air,” Appl. Surf. Sci.183(3-4), 151–164 (2001).
[CrossRef]

Richardson, M.

L. Shah, J. Tawney, M. Richardson, and K. Richardson, “Femtosecond laser deep hole drilling of silica glasses in air,” Appl. Surf. Sci.183(3-4), 151–164 (2001).
[CrossRef]

Richter, S.

S. Döring, S. Richter, A. Tünnermann, and S. Nolte, “Evolution of the hole depth and shape in ultrashort pulse deep drilling in silicon,” Appl. Phys., A Mater. Sci. Process.105(1), 69–74 (2011).
[CrossRef]

S. Döring, S. Richter, S. Nolte, and A. Tünnermann, “In situ imaging of hole shape evolution in ultrashort pulse laser drilling,” Opt. Express18(19), 20395–20400 (2010).
[CrossRef] [PubMed]

Rubenchik, A. M.

Ruf, A.

D. Breitling, A. Ruf, and F. Dausinger, “Fundamental aspects in micromachining of metals with short and ultrashort laser pulses,” Proc. SPIE5339, 49–63 (2004).
[CrossRef]

T. V. Kononenko, S. M. Klimentov, S. V. Garnov, V. I. Konov, D. Breitling, C. Foehl, A. Ruf, J. Radtke, and F. Dausinger, “Hole formation process in laser deep drilling with short and ultrashort pulses,” Proc. SPIE4426, 108–112 (2002).
[CrossRef]

Scamarcio, G.

Sentis, M.

S. Bruneau, J. Hermann, G. Dumitru, M. Sentis, and E. Axente, “Ultra-fast laser ablation applied to deep-drilling of metals,” Appl. Surf. Sci.248(1-4), 299–303 (2005).
[CrossRef]

Shah, L.

L. Shah, J. Tawney, M. Richardson, and K. Richardson, “Femtosecond laser deep hole drilling of silica glasses in air,” Appl. Surf. Sci.183(3-4), 151–164 (2001).
[CrossRef]

Shore, B. W.

Sibillano, T.

Stuart, B. C.

Tawney, J.

L. Shah, J. Tawney, M. Richardson, and K. Richardson, “Femtosecond laser deep hole drilling of silica glasses in air,” Appl. Surf. Sci.183(3-4), 151–164 (2001).
[CrossRef]

Tünnermann, A.

S. Döring, S. Richter, A. Tünnermann, and S. Nolte, “Evolution of the hole depth and shape in ultrashort pulse deep drilling in silicon,” Appl. Phys., A Mater. Sci. Process.105(1), 69–74 (2011).
[CrossRef]

S. Döring, S. Richter, S. Nolte, and A. Tünnermann, “In situ imaging of hole shape evolution in ultrashort pulse laser drilling,” Opt. Express18(19), 20395–20400 (2010).
[CrossRef] [PubMed]

S. Nolte, C. Momma, H. Jacobs, A. Tünnermann, B. N. Chichkov, B. Wellegehausen, and H. Welling, “Ablation of metals by ultrashort laser pulses,” J. Opt. Soc. Am. B14(10), 2716–2722 (1997).
[CrossRef]

C. Momma, B. N. Chichkov, S. Nolte, F. von Alvensleben, A. Tünnermann, H. Welling, and B. Wellegehausen, “Short-pulse laser ablation of solid targets,” Opt. Commun.129(1-2), 134–142 (1996).
[CrossRef]

Vitiello, M.

S. Amoruso, G. Ausanio, A. C. Barone, R. Bruzzese, L. Gragnaniello, M. Vitiello, and X. Wang, “Ultrashort laser ablation of solid matter in vacuum: a comparison between the picosecond and femtosecond regimes,” J. Phys. At. Mol. Opt. Phys.38(20), L329–L338 (2005).
[CrossRef]

von Alvensleben, F.

C. Momma, B. N. Chichkov, S. Nolte, F. von Alvensleben, A. Tünnermann, H. Welling, and B. Wellegehausen, “Short-pulse laser ablation of solid targets,” Opt. Commun.129(1-2), 134–142 (1996).
[CrossRef]

Walter, D.

A. Michalowski, D. Walter, F. Dausinger, and T. Graf, “Melt dynamics and hole formation during drilling with ultrashort pulses,” J. Laser Micro Nanoen.3(3), 211–215 (2008).
[CrossRef]

Wang, X.

S. Amoruso, G. Ausanio, A. C. Barone, R. Bruzzese, L. Gragnaniello, M. Vitiello, and X. Wang, “Ultrashort laser ablation of solid matter in vacuum: a comparison between the picosecond and femtosecond regimes,” J. Phys. At. Mol. Opt. Phys.38(20), L329–L338 (2005).
[CrossRef]

Webster, P. J. L.

Wellegehausen, B.

S. Nolte, C. Momma, H. Jacobs, A. Tünnermann, B. N. Chichkov, B. Wellegehausen, and H. Welling, “Ablation of metals by ultrashort laser pulses,” J. Opt. Soc. Am. B14(10), 2716–2722 (1997).
[CrossRef]

C. Momma, B. N. Chichkov, S. Nolte, F. von Alvensleben, A. Tünnermann, H. Welling, and B. Wellegehausen, “Short-pulse laser ablation of solid targets,” Opt. Commun.129(1-2), 134–142 (1996).
[CrossRef]

Welling, H.

S. Nolte, C. Momma, H. Jacobs, A. Tünnermann, B. N. Chichkov, B. Wellegehausen, and H. Welling, “Ablation of metals by ultrashort laser pulses,” J. Opt. Soc. Am. B14(10), 2716–2722 (1997).
[CrossRef]

C. Momma, B. N. Chichkov, S. Nolte, F. von Alvensleben, A. Tünnermann, H. Welling, and B. Wellegehausen, “Short-pulse laser ablation of solid targets,” Opt. Commun.129(1-2), 134–142 (1996).
[CrossRef]

Appl. Phys., A Mater. Sci. Process. (2)

H. Dachraoui, W. Husinsky, and G. Betz, “Ultrashort laser ablation of metals and semiconductors: evidence of ultra-fast coulomb explosion,” Appl. Phys., A Mater. Sci. Process.83(2), 333–336 (2006).
[CrossRef]

S. Döring, S. Richter, A. Tünnermann, and S. Nolte, “Evolution of the hole depth and shape in ultrashort pulse deep drilling in silicon,” Appl. Phys., A Mater. Sci. Process.105(1), 69–74 (2011).
[CrossRef]

Appl. Surf. Sci. (2)

S. Bruneau, J. Hermann, G. Dumitru, M. Sentis, and E. Axente, “Ultra-fast laser ablation applied to deep-drilling of metals,” Appl. Surf. Sci.248(1-4), 299–303 (2005).
[CrossRef]

L. Shah, J. Tawney, M. Richardson, and K. Richardson, “Femtosecond laser deep hole drilling of silica glasses in air,” Appl. Surf. Sci.183(3-4), 151–164 (2001).
[CrossRef]

J. Appl. Phys. (1)

C. S. Nielsen and P. Balling, “Deep drilling of metals with ultrashort laser pulses: A two-stage process,” J. Appl. Phys.99(9), 093101 (2006).
[CrossRef]

J. Laser Micro Nanoen. (1)

A. Michalowski, D. Walter, F. Dausinger, and T. Graf, “Melt dynamics and hole formation during drilling with ultrashort pulses,” J. Laser Micro Nanoen.3(3), 211–215 (2008).
[CrossRef]

J. Opt. Soc. Am. B (2)

J. Phys. At. Mol. Opt. Phys. (1)

S. Amoruso, G. Ausanio, A. C. Barone, R. Bruzzese, L. Gragnaniello, M. Vitiello, and X. Wang, “Ultrashort laser ablation of solid matter in vacuum: a comparison between the picosecond and femtosecond regimes,” J. Phys. At. Mol. Opt. Phys.38(20), L329–L338 (2005).
[CrossRef]

Opt. Commun. (1)

C. Momma, B. N. Chichkov, S. Nolte, F. von Alvensleben, A. Tünnermann, H. Welling, and B. Wellegehausen, “Short-pulse laser ablation of solid targets,” Opt. Commun.129(1-2), 134–142 (1996).
[CrossRef]

Opt. Express (2)

Opt. Lett. (1)

Proc. SPIE (3)

E. Coyne, J. Magee, P. Mannion, and G. O’Connor, “A study of femtosecond laser interaction with wafer grade silicon,” Proc. SPIE4876, 487–499 (2003).
[CrossRef]

D. Breitling, A. Ruf, and F. Dausinger, “Fundamental aspects in micromachining of metals with short and ultrashort laser pulses,” Proc. SPIE5339, 49–63 (2004).
[CrossRef]

T. V. Kononenko, S. M. Klimentov, S. V. Garnov, V. I. Konov, D. Breitling, C. Foehl, A. Ruf, J. Radtke, and F. Dausinger, “Hole formation process in laser deep drilling with short and ultrashort pulses,” Proc. SPIE4426, 108–112 (2002).
[CrossRef]

Quantum Electron. (1)

S. M. Klimentov, T. V. Kononenko, P. A. Pivovarov, S. V. Garnov, V. I. Konov, A. M. Prokhorov, D. Breitling, and F. Dausinger, “The role of plasma in ablation of materials by ultrashort laser pulses,” Quantum Electron.31(5), 378–382 (2001).
[CrossRef]

Supplementary Material (2)

» Media 1: MOV (5259 KB)     
» Media 2: MOV (37606 KB)     

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Figures (7)

Fig. 1
Fig. 1

A Ti:Sa CPA laser system is used for percussion drilling in a silicon sample. The silhouette of the hole is recorded in transversal direction by a CCD camera.

Fig. 2
Fig. 2

Formation of the bore holes in the low pulse energy regime (EP = 50 µJ), shown in cumulative shades of gray. (Media 1)

Fig. 3
Fig. 3

fs-, ps- and ns-pulses show a similar drilling behavior for low pulse energies with three process phases and a few thousand pulses till the stop of forward drilling.

Fig. 4
Fig. 4

Formation of the bore holes in the high pulse energy regime (EP = 500 µJ), shown in cumulative shades of gray. (Media 2)

Fig. 5
Fig. 5

For a high pulse energy of 500 µJ, fs- and ps- pulses show similar behavior with stop of forward drilling after a few thousand pulses. ns-pulses lead to a significantly extended second drilling phase up to a few hundred thousand pulses with very long intermediate periods of predominant transversal growth.

Fig. 6
Fig. 6

The final hole depth increases with the applied pulse energy for short and ultrashort pulses. For low pulse energies (see insert), fs- and ps-pulses reach larger final depths compared to ns-pulses. For higher pulse energies, ultrashort pulses show a saturation of the final depth, while ns-pulses feature a nearly linear increase, which leads to an increasing hole depth for prolonged pulse durations.

Fig. 7
Fig. 7

The variation of the hole diameter strongly increases with pulse energy for fs- and ns-pulses, while ps-pulses show a low variation due to their almost cylindrical shape.

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