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Effects of the refractive index of the encapsulant on the light-extraction efficiency of light-emitting diodes

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Abstract

We investigate the effects of the refractive index of the encapsulant on the light-extraction efficiency (LEE) of light-emitting diodes (LEDs) for GaN LEDs (n ≈ 2.5) and AlGaInP LEDs (n ≈ 3.0). For non-absorbing rectangular parallelepiped LED chips, as the refractive index of the encapsulant increases, the LEE first increases quasi-linearly, then increases sub-linearly, and finally a saturation is reached. Furthermore, LEDs with a dual-layer graded-refractive-index (GRIN) encapsulant (n encapsulant1 = 1.57 and n encapsulant2 = 1.41) is fabricated through a two-step curing process. We demonstrate that such an LED further enhances the LEE by reducing Fresnel reflection loss at the encapsulant/air interface by 35% compared with an LED encapsulated with a single-layer encapsulant (n encapsulant = 1.57).

©2011 Optical Society of America

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Figures (4)

Fig. 1
Fig. 1 Analytical calculation of the LEE as a function of the refractive index of the encapsulant for GaN LEDs and AlGaInP LEDs.
Fig. 2
Fig. 2 (a) The numerically calculated LEE as a function of θ C at the semiconductor/encapsulant interface for a non-absorbing rectangular parallelepiped LED. (b) Numerical calculation results and the 3D ray-tracing simulation results of the LEE as a function of the refractive index of the encapsulant for GaN LEDs. (c) Numerical calculation results and the 3D ray-tracing simulation results of the LEE as a function of the refractive index of the encapsulant for AlGaInP LEDs.
Fig. 3
Fig. 3 Comparison between the measured LOP and the 3D ray-tracing simulated LEE as a function of the refractive index of the encapsulant for GaN LEDs and AlGaInP LEDs.
Fig. 4
Fig. 4 Measured LOP as a function of the refractive index of the encapsulant for unencapsulated AlGaInP LED chips, AlGaInP LEDs encapsulated with encapsulants having different refractive indices (n encapsulant = 1.41 and 1.57), and AlGaInP LEDs encapsulated with a dual-layer GRIN encapsulant (n encapsulant1 = 1.57 and n encapsulant2 = 1.41). The inset shows the schematic diagram of a fabricated AlGaInP LED encapsulated with a dual-layer GRIN encapsulant.

Equations (1)

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η LEE(encapsulated) = 1 cos θ C, encapsulant 1 cos θ C, air η LEE(unencapsulated) = 1 cos ( arcsin n encapsulant n semiconductor ) 1 cos ( arcsin 1 n semiconductor ) η LEE(unencapsulated)
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