Abstract

Using low parasitic microsolder bumping, we hybrid integrated efficient photonic devices from different platforms with advanced 40 nm CMOS VLSI circuits to build ultra-low power silicon photonic transmitters and receivers for potential applications in high performance inter/intra-chip interconnects. We used a depletion racetrack ring modulator with improved electro-optic efficiency to allow stepper optical photo lithography for reduced fabrication complexity. Integrated with a low power cascode 2 V CMOS driver, the hybrid silicon photonic transmitter achieved better than 7 dB extinction ratio for 10 Gbps operation with a record low power consumption of 1.35 mW. A received power penalty of about 1 dB was measured for a BER of 10−12 compared to an off-the-shelf lightwave LiNOb3 transmitter, which comes mostly from the non-perfect extinction ratio. Similarly, a Ge waveguide detector fabricated using 130 nm SOI CMOS process was integrated with low power VLSI circuits using hybrid bonding. The all CMOS hybrid silicon photonic receiver achieved sensitivity of −17 dBm for a BER of 10−12 at 10 Gbps, consuming an ultra-low power of 3.95 mW (or 395 fJ/bit in energy efficiency). The scalable hybrid integration enables continued photonic device improvements by leveraging advanced CMOS technologies with maximum flexibility, which is critical for developing ultra-low power high performance photonic interconnects for future computing systems.

© 2011 OSA

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  1. X. Zheng P. Koka, H. Schwetman, J. Lexau, R. Ho, J.E. Cunningham, A.V. Krishnamoorthy, “Silicon photonic WDM point-to-point network for multi-chip processor interconnects,” Group IV Photonics, 2008 5th IEEE International Conference on, pp. 380–382, 2008.
  2. D. Vantrease, R. Schreiber, M. Monchiero, M. McLaren, N. Jouppi, M. Fiorentino, A. Davis, N. Binkert, R. Beausoleil, and J. H. Ahn, “Corona: system implications of emerging nanophotonic technology,” Proceedings of the 35th Annual International Symposium on Computer Architecture (ISCA), pp. 153–164, June 2008.
  3. A. Shacham, K. Bergman, and L. Carloni, “On the design of a photonic network-on-chip,” Proceedings of the First International Symposium on Networks-on-Chip (NOCS), pp. 53–64, May 2007.
  4. C. Batten, A. Joshi, J. Orcutt, A. Khilo, B. Moss, C. Holzwarth, M. Popovic, H. Li, H. Smith, J. Hoyt, F. Kartner, R. Ram, V. Stojanović, and K. Asanović, “Building manycore processor-to-DRAM networks with monolithic silicon photonics,” Proceedings of the 16th IEEE Symposium on High Performance Interconnects (HOT-I), pp. 21–30, August 2008.
  5. A. V. Krishnamoorthy, R. Ho, X. Zheng, H. Schwetman, J. Lexau, P. Koka, G. Li, I. Shubin, and J. E. Cunningham, “Computer systems based on silicon photonic interconnects,” Proc. IEEE 97(7), 1337–1361 (2009).
    [CrossRef]
  6. A. Narasimha, B. Analui, Y. Liang, T. J. Sleboda, and C. Gunn, “A fully integrated 4x10Gb/s DWDM optoelectronic transceiver in a standard 0.13um CMOS SOI,” ISSCC 2007 Dig. Tech. Papers, Feb. 2007.
  7. A. Alduino, L. Liao, R. Jones, M. Morse, B. Kim, W. Lo, J. Basak, B. Koch, H. Liu, H. Rong, M. Sysak, C. Krause, R. Saba, D. Lazar, L. Horwitz, R. Bar, S. Litski, A. Liu, K. Sullivan, O. Dosunmu, N. Na, T. Yin, F. Haubensack, I. Hsieh, J. Heck, R. Beatty, H. Park, J. Bovington, S. Lee, H. Nguyen, H. Au, K. Nguyen, P. Merani, M. Hakami, and M. Paniccia, “Demonstration of a high speed 4-channel integrated silicon photonics WDM link with hybrid silicon lasers,” in Integrated Photonics Research, Silicon and Nanophotonics, OSA Technical Digest (CD), paper PDIWI5, 2010.
  8. L. Liao, A. Liu, D. Rubin, J. Basak, Y. Chetrit, H. Nguyen, R. Cohen, N. Izhaky, and M. Paniccia, “40 Gbit/s silicon optical modulator for highspeed applications,” Electron. Lett. 43(22), 1196–1197 (2007).
    [CrossRef]
  9. L. Liao, D. Samara-Rubio, M. Morse, A. Liu, D. Hodge, D. Rubin, U. Keil, and T. Franck, “High speed silicon Mach-Zehnder modulator,” Opt. Express 13(8), 3129–3135 (2005).
    [CrossRef] [PubMed]
  10. M. R. Watts, D. C. Trotter, R. W. Young, and A. L. Lentine, “Ultralow power silicon microdisk modulators and switches,” in Proceedings of the 5th IEEE International Conference on Group IV Photonics, pp. 4–6, 2009.
  11. P. Dong, S. Liao, D. Feng, H. Liang, D. Zheng, R. Shafiiha, C. C. Kung, W. Qian, G. Li, X. Zheng, A. V. Krishnamoorthy, and M. Asghari, “Low VPP, ultralow-energy, compact, high-speed silicon electro-optic modulator,” Opt. Express 17(25), 22484–22490 (2009).
    [CrossRef]
  12. P. Dong, R. Shafiiha, S. Liao, H. Liang, N.-N. Feng, D. Feng, G. Li, X. Zheng, A. V. Krishnamoorthy, and M. Asghari, “Wavelength-tunable silicon microring modulator,” Opt. Express 18(11), 10941–10946 (2010).
    [CrossRef] [PubMed]
  13. P. Dong, S. Liao, H. Liang, W. Qian, X. Wang, R. Shafiiha, D. Feng, G. Li, X. Zheng, A. V. Krishnamoorthy, and M. Asghari, “High-speed and compact silicon modulator based on a racetrack resonator with a 1 V drive voltage,” Opt. Lett. 35(19), 3246–3248 (2010).
    [CrossRef] [PubMed]
  14. G. Masini, S. Sahni, G. Capellini, J. Witzens, and C. Gunn, “High-speed near infrared optical receivers based on Ge waveguide photodetectors integrated in a CMOS process,” Advances in Optical Technologies, Hindawi Publishing Corporation, Volume 2008, Article ID 196572.
  15. D. Feng, S. Liao, P. Dong, N. Feng, H. Liang, D. Zheng, C. Kung, J. Fong, R. Shafiiha, J. Cunningham, A. V. Krishnamoorthy, and M. Asghari, “High-speed Ge photodetector monolithically integrated with large cross-section silicon-on-insulator waveguide,” Appl. Phys. Lett. 95(26), 261105 (2009).
    [CrossRef]
  16. N. N. Feng, P. Dong, D. Zheng, S. Liao, H. Liang, R. Shafiiha, D. Feng, G. Li, J. E. Cunningham, A. V. Krishnamoorthy, and M. Asghari, “Vertical p-i-n germanium photodetector with high external responsivity integrated with large core Si waveguides,” Opt. Express 18(1), 96–101 (2010).
    [CrossRef] [PubMed]
  17. X. Zheng, J. Lexau, Y. Luo, H. Thacker, T. Pinguet, A. Mekis, G. Li, J. Shi, P. Amberg, N. Pinckney, K. Raj, R. Ho, J. E. Cunningham, and A. V. Krishnamoorthy, “Ultra-low-energy all-CMOS modulator integrated with driver,” Opt. Express 18(3), 3059–3070 (2010).
    [CrossRef] [PubMed]
  18. X. Zheng, F. Liu, D. Patil, H. Thacker, Y. Luo, T. Pinguet, A. Mekis, J. Yao, G. Li, J. Shi, K. Raj, J. Lexau, E. Alon, R. Ho, J. E. Cunningham, and A. V. Krishnamoorthy, “A sub-picojoule-per-bit CMOS photonic receiver for densely integrated systems,” Opt. Express 18(1), 204–211 (2010).
    [CrossRef] [PubMed]
  19. G. Li, X. Zheng, J. Lexau, Y. Luo, H. Thacker, P. Dong, S. Liao, M. Asghari, J. Yao, J. Shi, P. Amberg, N. Pinckney, K. Raj, R. Ho, J. Cunningham, and A. V. Krishnamoorthy, “Ultralow-power high-performance Si photonic transmitter,” OFC/NFOEC 2010, OMI2, pp.1–3 2010.
  20. S. Palermo, and M. Horowitz, “High-speed transmitters in 90nm CMOS for high-density optical interconnects,” Proceedings of the 32nd European Solid-State Circuits Conference (ESSCIRC), pp. 508–511, September 2006.
  21. D. Dobberpuhl, “The design of a high performance low power microprocessor,” Proceedings of the IEEE International Symposium on Low-Power Electronics and Design (ISLPED), pp. 11–16, 1996.
  22. M. Ingels and M. S. J. Steyaert, “A 1-gb/s, 0.7- um CMOS optical receiver with full rail-to-rail output swing,” IEEE J. Solid-State Circuits 34(7), 971–977 (1999).
    [CrossRef]
  23. K. W. Goossen, J. E. Cunningham, and W. Y. Jan, “GaAs 850nm modulators solder-bonded to silicon,” IEEE Photon. Technol. Lett. 5(7), 776–778 (1993).
    [CrossRef]
  24. A. L. Lentine, K. W. Goossen, J. A. Walker, L. M. F. Chirovsky, L. A. D’Asaro, S. P. Hui, B. J. Tseng, R. E. Leibenguth, J. E. Cunningham, W. Y. Jan, J.-M. Kuo, D. W. Dahringer, D. P. Kossives, D. D. Bacon, G. Livescu, R. L. Morrison, R. A. Novotny, and D. B. Buchholz, “High-speed optoelectronic VLSI switching chip with >4000 optical I/O based on flip-chip bonding of MQW modulators and detectors to silicon CMOS,” IEEE J. Sel. Top. Quantum Electron. 2(1iss.1), 77–84 (1996).
    [CrossRef]
  25. A. V. Krishnamoorthy, L. M. F. Chirovsky, W. S. Hobson, R. E. Leibengath, S. P. Hui, G. J. Zydzik, K. W. Goossen, J. D. Wynn, B. J. Tseng, J. Lopata, J. A. Walker, J. E. Cunningham, and L. A. D’Asaro, “Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits,” IEEE Photon. Technol. Lett. 11(1), 128–130 (1999).
    [CrossRef]
  26. J. E. Cunningham, A. V. Krishnamoorthy, R. Ho, I. Shubin, H. Thacker, J. Lexau, D. C. Lee, D. Feng, E. Chow, Y. Luo, X. Zheng, G. Li, J. Yao, T. Pinguet, K. Raj, M. Asghari, and J. G. Mitchell, “Integration and Packaging of a Macrochip with Silicon Nanophotonic Links,” IEEE J. Sel. Top. Quantum Electron. in press.
  27. A. Majumdar, J.E. Cunningham, and A.V. Krishnamoorthy, “Alignment and performance considerations for capacitive, inductive and optical proximity communication,” IEEE Trans. Adv. Packag. 3327690–701 (2010).
    [CrossRef]
  28. J. E. Cunninghmam, A. V. Krishnamoorthy, I. Shubin, J. G. Mitchell, and X. Zheng, “Aligning chips face to face for dense capacitive communication,” Coupled Data Techniques, Springer, R. Ho and R. Drost Ed., 2010.
  29. H. D. Thacker, Y. Luo, J. Shi, I. Shubin, J. Lexau, X. Zheng, G. Li, J. Yao, J. Costa, T. Pinguet, A. Mekis, P. Dong, S. Liao, D. Feng, M. Asghari, R. Ho, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Flip-chip integrated silicon photonic bridge chips for sub-picojoule per bit optical links,” IEEE Electronic Components and Technology Conference, pp. 240–246, 2010.
  30. H. D. Thacker, I. Shubin, Y. Luo, J. Costa, J. Lexau, X. Zheng, G. Li, J. Yao, J. Li, D. Patil, F. Liu, R. Ho, M. Asghari, T. Pinguet, K. Raj, J. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration of silicon nanophotonics with 40nm-CMOS VLSI drivers and receivers,” IEEE Electronic Components and Technology Conference, 2011, in press.
  31. Barkai,A. Liu, D. Kim, R. Cohen, N. Elek, H. Chang, B. H. Malik, R. Gabay, R. Jones, M. Paniccia, and N. Izhaky, “Efficient mode converter for coupling between fiber and micrometer size silicon waveguides,” Group IV Photonics, 4th IEEE International Conference, 19–21 Sept. 2007, 49–51 2007.
  32. V. R. Almeida, R. R. Panepucci, and M. Lipson, “Nanotaper for compact mode conversion,” Opt. Lett. 28(15), 1302–1304 (2003).
    [CrossRef] [PubMed]
  33. L. Vivien, et al., “A high efficiency silicon nitride grating coupler,” Group IV Photonics, 4th IEEE International Conference, 19–21 Sept. 2007, 162–164 2007.
  34. J. Yao, X. Zheng, G. Li, Y. Luo, H. Thacker, A. Mekis, T. Pinguet, K. Raj, J. E. Cunningham, and A. V. Krishnamoorthy, “Grating coupler based optical proximity coupling for scalable computing systems,” SPIE Photonics West 2011, Optoelectronic Interconnects and Component Integration XI (OE112), 2011.
  35. X. Zheng, J. E. Cunningham, I. Shubin, J. Simons, M. Asghari, D. Feng, H. Lei, D. Zheng, H. Liang, C. C. Kung, J. Luff, T. Sze, D. Cohen, and A. V. Krishnamoorthy, “Optical proximity communication using reflective mirrors,” Opt. Express 16(19), 15052–15058 (2008).
    [CrossRef] [PubMed]

2010 (6)

A. Majumdar, J.E. Cunningham, and A.V. Krishnamoorthy, “Alignment and performance considerations for capacitive, inductive and optical proximity communication,” IEEE Trans. Adv. Packag. 3327690–701 (2010).
[CrossRef]

X. Zheng, F. Liu, D. Patil, H. Thacker, Y. Luo, T. Pinguet, A. Mekis, J. Yao, G. Li, J. Shi, K. Raj, J. Lexau, E. Alon, R. Ho, J. E. Cunningham, and A. V. Krishnamoorthy, “A sub-picojoule-per-bit CMOS photonic receiver for densely integrated systems,” Opt. Express 18(1), 204–211 (2010).
[CrossRef] [PubMed]

N. N. Feng, P. Dong, D. Zheng, S. Liao, H. Liang, R. Shafiiha, D. Feng, G. Li, J. E. Cunningham, A. V. Krishnamoorthy, and M. Asghari, “Vertical p-i-n germanium photodetector with high external responsivity integrated with large core Si waveguides,” Opt. Express 18(1), 96–101 (2010).
[CrossRef] [PubMed]

X. Zheng, J. Lexau, Y. Luo, H. Thacker, T. Pinguet, A. Mekis, G. Li, J. Shi, P. Amberg, N. Pinckney, K. Raj, R. Ho, J. E. Cunningham, and A. V. Krishnamoorthy, “Ultra-low-energy all-CMOS modulator integrated with driver,” Opt. Express 18(3), 3059–3070 (2010).
[CrossRef] [PubMed]

P. Dong, R. Shafiiha, S. Liao, H. Liang, N.-N. Feng, D. Feng, G. Li, X. Zheng, A. V. Krishnamoorthy, and M. Asghari, “Wavelength-tunable silicon microring modulator,” Opt. Express 18(11), 10941–10946 (2010).
[CrossRef] [PubMed]

P. Dong, S. Liao, H. Liang, W. Qian, X. Wang, R. Shafiiha, D. Feng, G. Li, X. Zheng, A. V. Krishnamoorthy, and M. Asghari, “High-speed and compact silicon modulator based on a racetrack resonator with a 1 V drive voltage,” Opt. Lett. 35(19), 3246–3248 (2010).
[CrossRef] [PubMed]

2009 (3)

P. Dong, S. Liao, D. Feng, H. Liang, D. Zheng, R. Shafiiha, C. C. Kung, W. Qian, G. Li, X. Zheng, A. V. Krishnamoorthy, and M. Asghari, “Low VPP, ultralow-energy, compact, high-speed silicon electro-optic modulator,” Opt. Express 17(25), 22484–22490 (2009).
[CrossRef]

D. Feng, S. Liao, P. Dong, N. Feng, H. Liang, D. Zheng, C. Kung, J. Fong, R. Shafiiha, J. Cunningham, A. V. Krishnamoorthy, and M. Asghari, “High-speed Ge photodetector monolithically integrated with large cross-section silicon-on-insulator waveguide,” Appl. Phys. Lett. 95(26), 261105 (2009).
[CrossRef]

A. V. Krishnamoorthy, R. Ho, X. Zheng, H. Schwetman, J. Lexau, P. Koka, G. Li, I. Shubin, and J. E. Cunningham, “Computer systems based on silicon photonic interconnects,” Proc. IEEE 97(7), 1337–1361 (2009).
[CrossRef]

2008 (1)

2007 (1)

L. Liao, A. Liu, D. Rubin, J. Basak, Y. Chetrit, H. Nguyen, R. Cohen, N. Izhaky, and M. Paniccia, “40 Gbit/s silicon optical modulator for highspeed applications,” Electron. Lett. 43(22), 1196–1197 (2007).
[CrossRef]

2005 (1)

2003 (1)

1999 (2)

A. V. Krishnamoorthy, L. M. F. Chirovsky, W. S. Hobson, R. E. Leibengath, S. P. Hui, G. J. Zydzik, K. W. Goossen, J. D. Wynn, B. J. Tseng, J. Lopata, J. A. Walker, J. E. Cunningham, and L. A. D’Asaro, “Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits,” IEEE Photon. Technol. Lett. 11(1), 128–130 (1999).
[CrossRef]

M. Ingels and M. S. J. Steyaert, “A 1-gb/s, 0.7- um CMOS optical receiver with full rail-to-rail output swing,” IEEE J. Solid-State Circuits 34(7), 971–977 (1999).
[CrossRef]

1996 (1)

A. L. Lentine, K. W. Goossen, J. A. Walker, L. M. F. Chirovsky, L. A. D’Asaro, S. P. Hui, B. J. Tseng, R. E. Leibenguth, J. E. Cunningham, W. Y. Jan, J.-M. Kuo, D. W. Dahringer, D. P. Kossives, D. D. Bacon, G. Livescu, R. L. Morrison, R. A. Novotny, and D. B. Buchholz, “High-speed optoelectronic VLSI switching chip with >4000 optical I/O based on flip-chip bonding of MQW modulators and detectors to silicon CMOS,” IEEE J. Sel. Top. Quantum Electron. 2(1iss.1), 77–84 (1996).
[CrossRef]

1993 (1)

K. W. Goossen, J. E. Cunningham, and W. Y. Jan, “GaAs 850nm modulators solder-bonded to silicon,” IEEE Photon. Technol. Lett. 5(7), 776–778 (1993).
[CrossRef]

Almeida, V. R.

Alon, E.

Amberg, P.

Asghari, M.

P. Dong, R. Shafiiha, S. Liao, H. Liang, N.-N. Feng, D. Feng, G. Li, X. Zheng, A. V. Krishnamoorthy, and M. Asghari, “Wavelength-tunable silicon microring modulator,” Opt. Express 18(11), 10941–10946 (2010).
[CrossRef] [PubMed]

P. Dong, S. Liao, H. Liang, W. Qian, X. Wang, R. Shafiiha, D. Feng, G. Li, X. Zheng, A. V. Krishnamoorthy, and M. Asghari, “High-speed and compact silicon modulator based on a racetrack resonator with a 1 V drive voltage,” Opt. Lett. 35(19), 3246–3248 (2010).
[CrossRef] [PubMed]

N. N. Feng, P. Dong, D. Zheng, S. Liao, H. Liang, R. Shafiiha, D. Feng, G. Li, J. E. Cunningham, A. V. Krishnamoorthy, and M. Asghari, “Vertical p-i-n germanium photodetector with high external responsivity integrated with large core Si waveguides,” Opt. Express 18(1), 96–101 (2010).
[CrossRef] [PubMed]

P. Dong, S. Liao, D. Feng, H. Liang, D. Zheng, R. Shafiiha, C. C. Kung, W. Qian, G. Li, X. Zheng, A. V. Krishnamoorthy, and M. Asghari, “Low VPP, ultralow-energy, compact, high-speed silicon electro-optic modulator,” Opt. Express 17(25), 22484–22490 (2009).
[CrossRef]

D. Feng, S. Liao, P. Dong, N. Feng, H. Liang, D. Zheng, C. Kung, J. Fong, R. Shafiiha, J. Cunningham, A. V. Krishnamoorthy, and M. Asghari, “High-speed Ge photodetector monolithically integrated with large cross-section silicon-on-insulator waveguide,” Appl. Phys. Lett. 95(26), 261105 (2009).
[CrossRef]

X. Zheng, J. E. Cunningham, I. Shubin, J. Simons, M. Asghari, D. Feng, H. Lei, D. Zheng, H. Liang, C. C. Kung, J. Luff, T. Sze, D. Cohen, and A. V. Krishnamoorthy, “Optical proximity communication using reflective mirrors,” Opt. Express 16(19), 15052–15058 (2008).
[CrossRef] [PubMed]

J. E. Cunningham, A. V. Krishnamoorthy, R. Ho, I. Shubin, H. Thacker, J. Lexau, D. C. Lee, D. Feng, E. Chow, Y. Luo, X. Zheng, G. Li, J. Yao, T. Pinguet, K. Raj, M. Asghari, and J. G. Mitchell, “Integration and Packaging of a Macrochip with Silicon Nanophotonic Links,” IEEE J. Sel. Top. Quantum Electron. in press.

Bacon, D. D.

A. L. Lentine, K. W. Goossen, J. A. Walker, L. M. F. Chirovsky, L. A. D’Asaro, S. P. Hui, B. J. Tseng, R. E. Leibenguth, J. E. Cunningham, W. Y. Jan, J.-M. Kuo, D. W. Dahringer, D. P. Kossives, D. D. Bacon, G. Livescu, R. L. Morrison, R. A. Novotny, and D. B. Buchholz, “High-speed optoelectronic VLSI switching chip with >4000 optical I/O based on flip-chip bonding of MQW modulators and detectors to silicon CMOS,” IEEE J. Sel. Top. Quantum Electron. 2(1iss.1), 77–84 (1996).
[CrossRef]

Basak, J.

L. Liao, A. Liu, D. Rubin, J. Basak, Y. Chetrit, H. Nguyen, R. Cohen, N. Izhaky, and M. Paniccia, “40 Gbit/s silicon optical modulator for highspeed applications,” Electron. Lett. 43(22), 1196–1197 (2007).
[CrossRef]

Buchholz, D. B.

A. L. Lentine, K. W. Goossen, J. A. Walker, L. M. F. Chirovsky, L. A. D’Asaro, S. P. Hui, B. J. Tseng, R. E. Leibenguth, J. E. Cunningham, W. Y. Jan, J.-M. Kuo, D. W. Dahringer, D. P. Kossives, D. D. Bacon, G. Livescu, R. L. Morrison, R. A. Novotny, and D. B. Buchholz, “High-speed optoelectronic VLSI switching chip with >4000 optical I/O based on flip-chip bonding of MQW modulators and detectors to silicon CMOS,” IEEE J. Sel. Top. Quantum Electron. 2(1iss.1), 77–84 (1996).
[CrossRef]

Chetrit, Y.

L. Liao, A. Liu, D. Rubin, J. Basak, Y. Chetrit, H. Nguyen, R. Cohen, N. Izhaky, and M. Paniccia, “40 Gbit/s silicon optical modulator for highspeed applications,” Electron. Lett. 43(22), 1196–1197 (2007).
[CrossRef]

Chirovsky, L. M. F.

A. V. Krishnamoorthy, L. M. F. Chirovsky, W. S. Hobson, R. E. Leibengath, S. P. Hui, G. J. Zydzik, K. W. Goossen, J. D. Wynn, B. J. Tseng, J. Lopata, J. A. Walker, J. E. Cunningham, and L. A. D’Asaro, “Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits,” IEEE Photon. Technol. Lett. 11(1), 128–130 (1999).
[CrossRef]

A. L. Lentine, K. W. Goossen, J. A. Walker, L. M. F. Chirovsky, L. A. D’Asaro, S. P. Hui, B. J. Tseng, R. E. Leibenguth, J. E. Cunningham, W. Y. Jan, J.-M. Kuo, D. W. Dahringer, D. P. Kossives, D. D. Bacon, G. Livescu, R. L. Morrison, R. A. Novotny, and D. B. Buchholz, “High-speed optoelectronic VLSI switching chip with >4000 optical I/O based on flip-chip bonding of MQW modulators and detectors to silicon CMOS,” IEEE J. Sel. Top. Quantum Electron. 2(1iss.1), 77–84 (1996).
[CrossRef]

Chow, E.

J. E. Cunningham, A. V. Krishnamoorthy, R. Ho, I. Shubin, H. Thacker, J. Lexau, D. C. Lee, D. Feng, E. Chow, Y. Luo, X. Zheng, G. Li, J. Yao, T. Pinguet, K. Raj, M. Asghari, and J. G. Mitchell, “Integration and Packaging of a Macrochip with Silicon Nanophotonic Links,” IEEE J. Sel. Top. Quantum Electron. in press.

Cohen, D.

Cohen, R.

L. Liao, A. Liu, D. Rubin, J. Basak, Y. Chetrit, H. Nguyen, R. Cohen, N. Izhaky, and M. Paniccia, “40 Gbit/s silicon optical modulator for highspeed applications,” Electron. Lett. 43(22), 1196–1197 (2007).
[CrossRef]

Cunningham, J.

D. Feng, S. Liao, P. Dong, N. Feng, H. Liang, D. Zheng, C. Kung, J. Fong, R. Shafiiha, J. Cunningham, A. V. Krishnamoorthy, and M. Asghari, “High-speed Ge photodetector monolithically integrated with large cross-section silicon-on-insulator waveguide,” Appl. Phys. Lett. 95(26), 261105 (2009).
[CrossRef]

Cunningham, J. E.

X. Zheng, F. Liu, D. Patil, H. Thacker, Y. Luo, T. Pinguet, A. Mekis, J. Yao, G. Li, J. Shi, K. Raj, J. Lexau, E. Alon, R. Ho, J. E. Cunningham, and A. V. Krishnamoorthy, “A sub-picojoule-per-bit CMOS photonic receiver for densely integrated systems,” Opt. Express 18(1), 204–211 (2010).
[CrossRef] [PubMed]

X. Zheng, J. Lexau, Y. Luo, H. Thacker, T. Pinguet, A. Mekis, G. Li, J. Shi, P. Amberg, N. Pinckney, K. Raj, R. Ho, J. E. Cunningham, and A. V. Krishnamoorthy, “Ultra-low-energy all-CMOS modulator integrated with driver,” Opt. Express 18(3), 3059–3070 (2010).
[CrossRef] [PubMed]

N. N. Feng, P. Dong, D. Zheng, S. Liao, H. Liang, R. Shafiiha, D. Feng, G. Li, J. E. Cunningham, A. V. Krishnamoorthy, and M. Asghari, “Vertical p-i-n germanium photodetector with high external responsivity integrated with large core Si waveguides,” Opt. Express 18(1), 96–101 (2010).
[CrossRef] [PubMed]

A. V. Krishnamoorthy, R. Ho, X. Zheng, H. Schwetman, J. Lexau, P. Koka, G. Li, I. Shubin, and J. E. Cunningham, “Computer systems based on silicon photonic interconnects,” Proc. IEEE 97(7), 1337–1361 (2009).
[CrossRef]

X. Zheng, J. E. Cunningham, I. Shubin, J. Simons, M. Asghari, D. Feng, H. Lei, D. Zheng, H. Liang, C. C. Kung, J. Luff, T. Sze, D. Cohen, and A. V. Krishnamoorthy, “Optical proximity communication using reflective mirrors,” Opt. Express 16(19), 15052–15058 (2008).
[CrossRef] [PubMed]

A. V. Krishnamoorthy, L. M. F. Chirovsky, W. S. Hobson, R. E. Leibengath, S. P. Hui, G. J. Zydzik, K. W. Goossen, J. D. Wynn, B. J. Tseng, J. Lopata, J. A. Walker, J. E. Cunningham, and L. A. D’Asaro, “Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits,” IEEE Photon. Technol. Lett. 11(1), 128–130 (1999).
[CrossRef]

A. L. Lentine, K. W. Goossen, J. A. Walker, L. M. F. Chirovsky, L. A. D’Asaro, S. P. Hui, B. J. Tseng, R. E. Leibenguth, J. E. Cunningham, W. Y. Jan, J.-M. Kuo, D. W. Dahringer, D. P. Kossives, D. D. Bacon, G. Livescu, R. L. Morrison, R. A. Novotny, and D. B. Buchholz, “High-speed optoelectronic VLSI switching chip with >4000 optical I/O based on flip-chip bonding of MQW modulators and detectors to silicon CMOS,” IEEE J. Sel. Top. Quantum Electron. 2(1iss.1), 77–84 (1996).
[CrossRef]

K. W. Goossen, J. E. Cunningham, and W. Y. Jan, “GaAs 850nm modulators solder-bonded to silicon,” IEEE Photon. Technol. Lett. 5(7), 776–778 (1993).
[CrossRef]

J. E. Cunningham, A. V. Krishnamoorthy, R. Ho, I. Shubin, H. Thacker, J. Lexau, D. C. Lee, D. Feng, E. Chow, Y. Luo, X. Zheng, G. Li, J. Yao, T. Pinguet, K. Raj, M. Asghari, and J. G. Mitchell, “Integration and Packaging of a Macrochip with Silicon Nanophotonic Links,” IEEE J. Sel. Top. Quantum Electron. in press.

Cunningham, J.E.

A. Majumdar, J.E. Cunningham, and A.V. Krishnamoorthy, “Alignment and performance considerations for capacitive, inductive and optical proximity communication,” IEEE Trans. Adv. Packag. 3327690–701 (2010).
[CrossRef]

D’Asaro, L. A.

A. V. Krishnamoorthy, L. M. F. Chirovsky, W. S. Hobson, R. E. Leibengath, S. P. Hui, G. J. Zydzik, K. W. Goossen, J. D. Wynn, B. J. Tseng, J. Lopata, J. A. Walker, J. E. Cunningham, and L. A. D’Asaro, “Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits,” IEEE Photon. Technol. Lett. 11(1), 128–130 (1999).
[CrossRef]

A. L. Lentine, K. W. Goossen, J. A. Walker, L. M. F. Chirovsky, L. A. D’Asaro, S. P. Hui, B. J. Tseng, R. E. Leibenguth, J. E. Cunningham, W. Y. Jan, J.-M. Kuo, D. W. Dahringer, D. P. Kossives, D. D. Bacon, G. Livescu, R. L. Morrison, R. A. Novotny, and D. B. Buchholz, “High-speed optoelectronic VLSI switching chip with >4000 optical I/O based on flip-chip bonding of MQW modulators and detectors to silicon CMOS,” IEEE J. Sel. Top. Quantum Electron. 2(1iss.1), 77–84 (1996).
[CrossRef]

Dahringer, D. W.

A. L. Lentine, K. W. Goossen, J. A. Walker, L. M. F. Chirovsky, L. A. D’Asaro, S. P. Hui, B. J. Tseng, R. E. Leibenguth, J. E. Cunningham, W. Y. Jan, J.-M. Kuo, D. W. Dahringer, D. P. Kossives, D. D. Bacon, G. Livescu, R. L. Morrison, R. A. Novotny, and D. B. Buchholz, “High-speed optoelectronic VLSI switching chip with >4000 optical I/O based on flip-chip bonding of MQW modulators and detectors to silicon CMOS,” IEEE J. Sel. Top. Quantum Electron. 2(1iss.1), 77–84 (1996).
[CrossRef]

Dong, P.

Feng, D.

P. Dong, S. Liao, H. Liang, W. Qian, X. Wang, R. Shafiiha, D. Feng, G. Li, X. Zheng, A. V. Krishnamoorthy, and M. Asghari, “High-speed and compact silicon modulator based on a racetrack resonator with a 1 V drive voltage,” Opt. Lett. 35(19), 3246–3248 (2010).
[CrossRef] [PubMed]

N. N. Feng, P. Dong, D. Zheng, S. Liao, H. Liang, R. Shafiiha, D. Feng, G. Li, J. E. Cunningham, A. V. Krishnamoorthy, and M. Asghari, “Vertical p-i-n germanium photodetector with high external responsivity integrated with large core Si waveguides,” Opt. Express 18(1), 96–101 (2010).
[CrossRef] [PubMed]

P. Dong, R. Shafiiha, S. Liao, H. Liang, N.-N. Feng, D. Feng, G. Li, X. Zheng, A. V. Krishnamoorthy, and M. Asghari, “Wavelength-tunable silicon microring modulator,” Opt. Express 18(11), 10941–10946 (2010).
[CrossRef] [PubMed]

D. Feng, S. Liao, P. Dong, N. Feng, H. Liang, D. Zheng, C. Kung, J. Fong, R. Shafiiha, J. Cunningham, A. V. Krishnamoorthy, and M. Asghari, “High-speed Ge photodetector monolithically integrated with large cross-section silicon-on-insulator waveguide,” Appl. Phys. Lett. 95(26), 261105 (2009).
[CrossRef]

P. Dong, S. Liao, D. Feng, H. Liang, D. Zheng, R. Shafiiha, C. C. Kung, W. Qian, G. Li, X. Zheng, A. V. Krishnamoorthy, and M. Asghari, “Low VPP, ultralow-energy, compact, high-speed silicon electro-optic modulator,” Opt. Express 17(25), 22484–22490 (2009).
[CrossRef]

X. Zheng, J. E. Cunningham, I. Shubin, J. Simons, M. Asghari, D. Feng, H. Lei, D. Zheng, H. Liang, C. C. Kung, J. Luff, T. Sze, D. Cohen, and A. V. Krishnamoorthy, “Optical proximity communication using reflective mirrors,” Opt. Express 16(19), 15052–15058 (2008).
[CrossRef] [PubMed]

J. E. Cunningham, A. V. Krishnamoorthy, R. Ho, I. Shubin, H. Thacker, J. Lexau, D. C. Lee, D. Feng, E. Chow, Y. Luo, X. Zheng, G. Li, J. Yao, T. Pinguet, K. Raj, M. Asghari, and J. G. Mitchell, “Integration and Packaging of a Macrochip with Silicon Nanophotonic Links,” IEEE J. Sel. Top. Quantum Electron. in press.

Feng, N.

D. Feng, S. Liao, P. Dong, N. Feng, H. Liang, D. Zheng, C. Kung, J. Fong, R. Shafiiha, J. Cunningham, A. V. Krishnamoorthy, and M. Asghari, “High-speed Ge photodetector monolithically integrated with large cross-section silicon-on-insulator waveguide,” Appl. Phys. Lett. 95(26), 261105 (2009).
[CrossRef]

Feng, N. N.

Feng, N.-N.

Fong, J.

D. Feng, S. Liao, P. Dong, N. Feng, H. Liang, D. Zheng, C. Kung, J. Fong, R. Shafiiha, J. Cunningham, A. V. Krishnamoorthy, and M. Asghari, “High-speed Ge photodetector monolithically integrated with large cross-section silicon-on-insulator waveguide,” Appl. Phys. Lett. 95(26), 261105 (2009).
[CrossRef]

Franck, T.

Goossen, K. W.

A. V. Krishnamoorthy, L. M. F. Chirovsky, W. S. Hobson, R. E. Leibengath, S. P. Hui, G. J. Zydzik, K. W. Goossen, J. D. Wynn, B. J. Tseng, J. Lopata, J. A. Walker, J. E. Cunningham, and L. A. D’Asaro, “Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits,” IEEE Photon. Technol. Lett. 11(1), 128–130 (1999).
[CrossRef]

A. L. Lentine, K. W. Goossen, J. A. Walker, L. M. F. Chirovsky, L. A. D’Asaro, S. P. Hui, B. J. Tseng, R. E. Leibenguth, J. E. Cunningham, W. Y. Jan, J.-M. Kuo, D. W. Dahringer, D. P. Kossives, D. D. Bacon, G. Livescu, R. L. Morrison, R. A. Novotny, and D. B. Buchholz, “High-speed optoelectronic VLSI switching chip with >4000 optical I/O based on flip-chip bonding of MQW modulators and detectors to silicon CMOS,” IEEE J. Sel. Top. Quantum Electron. 2(1iss.1), 77–84 (1996).
[CrossRef]

K. W. Goossen, J. E. Cunningham, and W. Y. Jan, “GaAs 850nm modulators solder-bonded to silicon,” IEEE Photon. Technol. Lett. 5(7), 776–778 (1993).
[CrossRef]

Ho, R.

X. Zheng, J. Lexau, Y. Luo, H. Thacker, T. Pinguet, A. Mekis, G. Li, J. Shi, P. Amberg, N. Pinckney, K. Raj, R. Ho, J. E. Cunningham, and A. V. Krishnamoorthy, “Ultra-low-energy all-CMOS modulator integrated with driver,” Opt. Express 18(3), 3059–3070 (2010).
[CrossRef] [PubMed]

X. Zheng, F. Liu, D. Patil, H. Thacker, Y. Luo, T. Pinguet, A. Mekis, J. Yao, G. Li, J. Shi, K. Raj, J. Lexau, E. Alon, R. Ho, J. E. Cunningham, and A. V. Krishnamoorthy, “A sub-picojoule-per-bit CMOS photonic receiver for densely integrated systems,” Opt. Express 18(1), 204–211 (2010).
[CrossRef] [PubMed]

A. V. Krishnamoorthy, R. Ho, X. Zheng, H. Schwetman, J. Lexau, P. Koka, G. Li, I. Shubin, and J. E. Cunningham, “Computer systems based on silicon photonic interconnects,” Proc. IEEE 97(7), 1337–1361 (2009).
[CrossRef]

J. E. Cunningham, A. V. Krishnamoorthy, R. Ho, I. Shubin, H. Thacker, J. Lexau, D. C. Lee, D. Feng, E. Chow, Y. Luo, X. Zheng, G. Li, J. Yao, T. Pinguet, K. Raj, M. Asghari, and J. G. Mitchell, “Integration and Packaging of a Macrochip with Silicon Nanophotonic Links,” IEEE J. Sel. Top. Quantum Electron. in press.

Hobson, W. S.

A. V. Krishnamoorthy, L. M. F. Chirovsky, W. S. Hobson, R. E. Leibengath, S. P. Hui, G. J. Zydzik, K. W. Goossen, J. D. Wynn, B. J. Tseng, J. Lopata, J. A. Walker, J. E. Cunningham, and L. A. D’Asaro, “Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits,” IEEE Photon. Technol. Lett. 11(1), 128–130 (1999).
[CrossRef]

Hodge, D.

Hui, S. P.

A. V. Krishnamoorthy, L. M. F. Chirovsky, W. S. Hobson, R. E. Leibengath, S. P. Hui, G. J. Zydzik, K. W. Goossen, J. D. Wynn, B. J. Tseng, J. Lopata, J. A. Walker, J. E. Cunningham, and L. A. D’Asaro, “Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits,” IEEE Photon. Technol. Lett. 11(1), 128–130 (1999).
[CrossRef]

A. L. Lentine, K. W. Goossen, J. A. Walker, L. M. F. Chirovsky, L. A. D’Asaro, S. P. Hui, B. J. Tseng, R. E. Leibenguth, J. E. Cunningham, W. Y. Jan, J.-M. Kuo, D. W. Dahringer, D. P. Kossives, D. D. Bacon, G. Livescu, R. L. Morrison, R. A. Novotny, and D. B. Buchholz, “High-speed optoelectronic VLSI switching chip with >4000 optical I/O based on flip-chip bonding of MQW modulators and detectors to silicon CMOS,” IEEE J. Sel. Top. Quantum Electron. 2(1iss.1), 77–84 (1996).
[CrossRef]

Ingels, M.

M. Ingels and M. S. J. Steyaert, “A 1-gb/s, 0.7- um CMOS optical receiver with full rail-to-rail output swing,” IEEE J. Solid-State Circuits 34(7), 971–977 (1999).
[CrossRef]

Izhaky, N.

L. Liao, A. Liu, D. Rubin, J. Basak, Y. Chetrit, H. Nguyen, R. Cohen, N. Izhaky, and M. Paniccia, “40 Gbit/s silicon optical modulator for highspeed applications,” Electron. Lett. 43(22), 1196–1197 (2007).
[CrossRef]

Jan, W. Y.

A. L. Lentine, K. W. Goossen, J. A. Walker, L. M. F. Chirovsky, L. A. D’Asaro, S. P. Hui, B. J. Tseng, R. E. Leibenguth, J. E. Cunningham, W. Y. Jan, J.-M. Kuo, D. W. Dahringer, D. P. Kossives, D. D. Bacon, G. Livescu, R. L. Morrison, R. A. Novotny, and D. B. Buchholz, “High-speed optoelectronic VLSI switching chip with >4000 optical I/O based on flip-chip bonding of MQW modulators and detectors to silicon CMOS,” IEEE J. Sel. Top. Quantum Electron. 2(1iss.1), 77–84 (1996).
[CrossRef]

K. W. Goossen, J. E. Cunningham, and W. Y. Jan, “GaAs 850nm modulators solder-bonded to silicon,” IEEE Photon. Technol. Lett. 5(7), 776–778 (1993).
[CrossRef]

Keil, U.

Koka, P.

A. V. Krishnamoorthy, R. Ho, X. Zheng, H. Schwetman, J. Lexau, P. Koka, G. Li, I. Shubin, and J. E. Cunningham, “Computer systems based on silicon photonic interconnects,” Proc. IEEE 97(7), 1337–1361 (2009).
[CrossRef]

Kossives, D. P.

A. L. Lentine, K. W. Goossen, J. A. Walker, L. M. F. Chirovsky, L. A. D’Asaro, S. P. Hui, B. J. Tseng, R. E. Leibenguth, J. E. Cunningham, W. Y. Jan, J.-M. Kuo, D. W. Dahringer, D. P. Kossives, D. D. Bacon, G. Livescu, R. L. Morrison, R. A. Novotny, and D. B. Buchholz, “High-speed optoelectronic VLSI switching chip with >4000 optical I/O based on flip-chip bonding of MQW modulators and detectors to silicon CMOS,” IEEE J. Sel. Top. Quantum Electron. 2(1iss.1), 77–84 (1996).
[CrossRef]

Krishnamoorthy, A. V.

X. Zheng, F. Liu, D. Patil, H. Thacker, Y. Luo, T. Pinguet, A. Mekis, J. Yao, G. Li, J. Shi, K. Raj, J. Lexau, E. Alon, R. Ho, J. E. Cunningham, and A. V. Krishnamoorthy, “A sub-picojoule-per-bit CMOS photonic receiver for densely integrated systems,” Opt. Express 18(1), 204–211 (2010).
[CrossRef] [PubMed]

P. Dong, S. Liao, H. Liang, W. Qian, X. Wang, R. Shafiiha, D. Feng, G. Li, X. Zheng, A. V. Krishnamoorthy, and M. Asghari, “High-speed and compact silicon modulator based on a racetrack resonator with a 1 V drive voltage,” Opt. Lett. 35(19), 3246–3248 (2010).
[CrossRef] [PubMed]

N. N. Feng, P. Dong, D. Zheng, S. Liao, H. Liang, R. Shafiiha, D. Feng, G. Li, J. E. Cunningham, A. V. Krishnamoorthy, and M. Asghari, “Vertical p-i-n germanium photodetector with high external responsivity integrated with large core Si waveguides,” Opt. Express 18(1), 96–101 (2010).
[CrossRef] [PubMed]

P. Dong, R. Shafiiha, S. Liao, H. Liang, N.-N. Feng, D. Feng, G. Li, X. Zheng, A. V. Krishnamoorthy, and M. Asghari, “Wavelength-tunable silicon microring modulator,” Opt. Express 18(11), 10941–10946 (2010).
[CrossRef] [PubMed]

X. Zheng, J. Lexau, Y. Luo, H. Thacker, T. Pinguet, A. Mekis, G. Li, J. Shi, P. Amberg, N. Pinckney, K. Raj, R. Ho, J. E. Cunningham, and A. V. Krishnamoorthy, “Ultra-low-energy all-CMOS modulator integrated with driver,” Opt. Express 18(3), 3059–3070 (2010).
[CrossRef] [PubMed]

P. Dong, S. Liao, D. Feng, H. Liang, D. Zheng, R. Shafiiha, C. C. Kung, W. Qian, G. Li, X. Zheng, A. V. Krishnamoorthy, and M. Asghari, “Low VPP, ultralow-energy, compact, high-speed silicon electro-optic modulator,” Opt. Express 17(25), 22484–22490 (2009).
[CrossRef]

D. Feng, S. Liao, P. Dong, N. Feng, H. Liang, D. Zheng, C. Kung, J. Fong, R. Shafiiha, J. Cunningham, A. V. Krishnamoorthy, and M. Asghari, “High-speed Ge photodetector monolithically integrated with large cross-section silicon-on-insulator waveguide,” Appl. Phys. Lett. 95(26), 261105 (2009).
[CrossRef]

A. V. Krishnamoorthy, R. Ho, X. Zheng, H. Schwetman, J. Lexau, P. Koka, G. Li, I. Shubin, and J. E. Cunningham, “Computer systems based on silicon photonic interconnects,” Proc. IEEE 97(7), 1337–1361 (2009).
[CrossRef]

X. Zheng, J. E. Cunningham, I. Shubin, J. Simons, M. Asghari, D. Feng, H. Lei, D. Zheng, H. Liang, C. C. Kung, J. Luff, T. Sze, D. Cohen, and A. V. Krishnamoorthy, “Optical proximity communication using reflective mirrors,” Opt. Express 16(19), 15052–15058 (2008).
[CrossRef] [PubMed]

A. V. Krishnamoorthy, L. M. F. Chirovsky, W. S. Hobson, R. E. Leibengath, S. P. Hui, G. J. Zydzik, K. W. Goossen, J. D. Wynn, B. J. Tseng, J. Lopata, J. A. Walker, J. E. Cunningham, and L. A. D’Asaro, “Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits,” IEEE Photon. Technol. Lett. 11(1), 128–130 (1999).
[CrossRef]

J. E. Cunningham, A. V. Krishnamoorthy, R. Ho, I. Shubin, H. Thacker, J. Lexau, D. C. Lee, D. Feng, E. Chow, Y. Luo, X. Zheng, G. Li, J. Yao, T. Pinguet, K. Raj, M. Asghari, and J. G. Mitchell, “Integration and Packaging of a Macrochip with Silicon Nanophotonic Links,” IEEE J. Sel. Top. Quantum Electron. in press.

Krishnamoorthy, A.V.

A. Majumdar, J.E. Cunningham, and A.V. Krishnamoorthy, “Alignment and performance considerations for capacitive, inductive and optical proximity communication,” IEEE Trans. Adv. Packag. 3327690–701 (2010).
[CrossRef]

Kung, C.

D. Feng, S. Liao, P. Dong, N. Feng, H. Liang, D. Zheng, C. Kung, J. Fong, R. Shafiiha, J. Cunningham, A. V. Krishnamoorthy, and M. Asghari, “High-speed Ge photodetector monolithically integrated with large cross-section silicon-on-insulator waveguide,” Appl. Phys. Lett. 95(26), 261105 (2009).
[CrossRef]

Kung, C. C.

Kuo, J.-M.

A. L. Lentine, K. W. Goossen, J. A. Walker, L. M. F. Chirovsky, L. A. D’Asaro, S. P. Hui, B. J. Tseng, R. E. Leibenguth, J. E. Cunningham, W. Y. Jan, J.-M. Kuo, D. W. Dahringer, D. P. Kossives, D. D. Bacon, G. Livescu, R. L. Morrison, R. A. Novotny, and D. B. Buchholz, “High-speed optoelectronic VLSI switching chip with >4000 optical I/O based on flip-chip bonding of MQW modulators and detectors to silicon CMOS,” IEEE J. Sel. Top. Quantum Electron. 2(1iss.1), 77–84 (1996).
[CrossRef]

Lee, D. C.

J. E. Cunningham, A. V. Krishnamoorthy, R. Ho, I. Shubin, H. Thacker, J. Lexau, D. C. Lee, D. Feng, E. Chow, Y. Luo, X. Zheng, G. Li, J. Yao, T. Pinguet, K. Raj, M. Asghari, and J. G. Mitchell, “Integration and Packaging of a Macrochip with Silicon Nanophotonic Links,” IEEE J. Sel. Top. Quantum Electron. in press.

Lei, H.

Leibengath, R. E.

A. V. Krishnamoorthy, L. M. F. Chirovsky, W. S. Hobson, R. E. Leibengath, S. P. Hui, G. J. Zydzik, K. W. Goossen, J. D. Wynn, B. J. Tseng, J. Lopata, J. A. Walker, J. E. Cunningham, and L. A. D’Asaro, “Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits,” IEEE Photon. Technol. Lett. 11(1), 128–130 (1999).
[CrossRef]

Leibenguth, R. E.

A. L. Lentine, K. W. Goossen, J. A. Walker, L. M. F. Chirovsky, L. A. D’Asaro, S. P. Hui, B. J. Tseng, R. E. Leibenguth, J. E. Cunningham, W. Y. Jan, J.-M. Kuo, D. W. Dahringer, D. P. Kossives, D. D. Bacon, G. Livescu, R. L. Morrison, R. A. Novotny, and D. B. Buchholz, “High-speed optoelectronic VLSI switching chip with >4000 optical I/O based on flip-chip bonding of MQW modulators and detectors to silicon CMOS,” IEEE J. Sel. Top. Quantum Electron. 2(1iss.1), 77–84 (1996).
[CrossRef]

Lentine, A. L.

A. L. Lentine, K. W. Goossen, J. A. Walker, L. M. F. Chirovsky, L. A. D’Asaro, S. P. Hui, B. J. Tseng, R. E. Leibenguth, J. E. Cunningham, W. Y. Jan, J.-M. Kuo, D. W. Dahringer, D. P. Kossives, D. D. Bacon, G. Livescu, R. L. Morrison, R. A. Novotny, and D. B. Buchholz, “High-speed optoelectronic VLSI switching chip with >4000 optical I/O based on flip-chip bonding of MQW modulators and detectors to silicon CMOS,” IEEE J. Sel. Top. Quantum Electron. 2(1iss.1), 77–84 (1996).
[CrossRef]

Lexau, J.

X. Zheng, F. Liu, D. Patil, H. Thacker, Y. Luo, T. Pinguet, A. Mekis, J. Yao, G. Li, J. Shi, K. Raj, J. Lexau, E. Alon, R. Ho, J. E. Cunningham, and A. V. Krishnamoorthy, “A sub-picojoule-per-bit CMOS photonic receiver for densely integrated systems,” Opt. Express 18(1), 204–211 (2010).
[CrossRef] [PubMed]

X. Zheng, J. Lexau, Y. Luo, H. Thacker, T. Pinguet, A. Mekis, G. Li, J. Shi, P. Amberg, N. Pinckney, K. Raj, R. Ho, J. E. Cunningham, and A. V. Krishnamoorthy, “Ultra-low-energy all-CMOS modulator integrated with driver,” Opt. Express 18(3), 3059–3070 (2010).
[CrossRef] [PubMed]

A. V. Krishnamoorthy, R. Ho, X. Zheng, H. Schwetman, J. Lexau, P. Koka, G. Li, I. Shubin, and J. E. Cunningham, “Computer systems based on silicon photonic interconnects,” Proc. IEEE 97(7), 1337–1361 (2009).
[CrossRef]

J. E. Cunningham, A. V. Krishnamoorthy, R. Ho, I. Shubin, H. Thacker, J. Lexau, D. C. Lee, D. Feng, E. Chow, Y. Luo, X. Zheng, G. Li, J. Yao, T. Pinguet, K. Raj, M. Asghari, and J. G. Mitchell, “Integration and Packaging of a Macrochip with Silicon Nanophotonic Links,” IEEE J. Sel. Top. Quantum Electron. in press.

Li, G.

X. Zheng, F. Liu, D. Patil, H. Thacker, Y. Luo, T. Pinguet, A. Mekis, J. Yao, G. Li, J. Shi, K. Raj, J. Lexau, E. Alon, R. Ho, J. E. Cunningham, and A. V. Krishnamoorthy, “A sub-picojoule-per-bit CMOS photonic receiver for densely integrated systems,” Opt. Express 18(1), 204–211 (2010).
[CrossRef] [PubMed]

X. Zheng, J. Lexau, Y. Luo, H. Thacker, T. Pinguet, A. Mekis, G. Li, J. Shi, P. Amberg, N. Pinckney, K. Raj, R. Ho, J. E. Cunningham, and A. V. Krishnamoorthy, “Ultra-low-energy all-CMOS modulator integrated with driver,” Opt. Express 18(3), 3059–3070 (2010).
[CrossRef] [PubMed]

P. Dong, R. Shafiiha, S. Liao, H. Liang, N.-N. Feng, D. Feng, G. Li, X. Zheng, A. V. Krishnamoorthy, and M. Asghari, “Wavelength-tunable silicon microring modulator,” Opt. Express 18(11), 10941–10946 (2010).
[CrossRef] [PubMed]

P. Dong, S. Liao, H. Liang, W. Qian, X. Wang, R. Shafiiha, D. Feng, G. Li, X. Zheng, A. V. Krishnamoorthy, and M. Asghari, “High-speed and compact silicon modulator based on a racetrack resonator with a 1 V drive voltage,” Opt. Lett. 35(19), 3246–3248 (2010).
[CrossRef] [PubMed]

N. N. Feng, P. Dong, D. Zheng, S. Liao, H. Liang, R. Shafiiha, D. Feng, G. Li, J. E. Cunningham, A. V. Krishnamoorthy, and M. Asghari, “Vertical p-i-n germanium photodetector with high external responsivity integrated with large core Si waveguides,” Opt. Express 18(1), 96–101 (2010).
[CrossRef] [PubMed]

P. Dong, S. Liao, D. Feng, H. Liang, D. Zheng, R. Shafiiha, C. C. Kung, W. Qian, G. Li, X. Zheng, A. V. Krishnamoorthy, and M. Asghari, “Low VPP, ultralow-energy, compact, high-speed silicon electro-optic modulator,” Opt. Express 17(25), 22484–22490 (2009).
[CrossRef]

A. V. Krishnamoorthy, R. Ho, X. Zheng, H. Schwetman, J. Lexau, P. Koka, G. Li, I. Shubin, and J. E. Cunningham, “Computer systems based on silicon photonic interconnects,” Proc. IEEE 97(7), 1337–1361 (2009).
[CrossRef]

J. E. Cunningham, A. V. Krishnamoorthy, R. Ho, I. Shubin, H. Thacker, J. Lexau, D. C. Lee, D. Feng, E. Chow, Y. Luo, X. Zheng, G. Li, J. Yao, T. Pinguet, K. Raj, M. Asghari, and J. G. Mitchell, “Integration and Packaging of a Macrochip with Silicon Nanophotonic Links,” IEEE J. Sel. Top. Quantum Electron. in press.

Liang, H.

N. N. Feng, P. Dong, D. Zheng, S. Liao, H. Liang, R. Shafiiha, D. Feng, G. Li, J. E. Cunningham, A. V. Krishnamoorthy, and M. Asghari, “Vertical p-i-n germanium photodetector with high external responsivity integrated with large core Si waveguides,” Opt. Express 18(1), 96–101 (2010).
[CrossRef] [PubMed]

P. Dong, S. Liao, H. Liang, W. Qian, X. Wang, R. Shafiiha, D. Feng, G. Li, X. Zheng, A. V. Krishnamoorthy, and M. Asghari, “High-speed and compact silicon modulator based on a racetrack resonator with a 1 V drive voltage,” Opt. Lett. 35(19), 3246–3248 (2010).
[CrossRef] [PubMed]

P. Dong, R. Shafiiha, S. Liao, H. Liang, N.-N. Feng, D. Feng, G. Li, X. Zheng, A. V. Krishnamoorthy, and M. Asghari, “Wavelength-tunable silicon microring modulator,” Opt. Express 18(11), 10941–10946 (2010).
[CrossRef] [PubMed]

P. Dong, S. Liao, D. Feng, H. Liang, D. Zheng, R. Shafiiha, C. C. Kung, W. Qian, G. Li, X. Zheng, A. V. Krishnamoorthy, and M. Asghari, “Low VPP, ultralow-energy, compact, high-speed silicon electro-optic modulator,” Opt. Express 17(25), 22484–22490 (2009).
[CrossRef]

D. Feng, S. Liao, P. Dong, N. Feng, H. Liang, D. Zheng, C. Kung, J. Fong, R. Shafiiha, J. Cunningham, A. V. Krishnamoorthy, and M. Asghari, “High-speed Ge photodetector monolithically integrated with large cross-section silicon-on-insulator waveguide,” Appl. Phys. Lett. 95(26), 261105 (2009).
[CrossRef]

X. Zheng, J. E. Cunningham, I. Shubin, J. Simons, M. Asghari, D. Feng, H. Lei, D. Zheng, H. Liang, C. C. Kung, J. Luff, T. Sze, D. Cohen, and A. V. Krishnamoorthy, “Optical proximity communication using reflective mirrors,” Opt. Express 16(19), 15052–15058 (2008).
[CrossRef] [PubMed]

Liao, L.

L. Liao, A. Liu, D. Rubin, J. Basak, Y. Chetrit, H. Nguyen, R. Cohen, N. Izhaky, and M. Paniccia, “40 Gbit/s silicon optical modulator for highspeed applications,” Electron. Lett. 43(22), 1196–1197 (2007).
[CrossRef]

L. Liao, D. Samara-Rubio, M. Morse, A. Liu, D. Hodge, D. Rubin, U. Keil, and T. Franck, “High speed silicon Mach-Zehnder modulator,” Opt. Express 13(8), 3129–3135 (2005).
[CrossRef] [PubMed]

Liao, S.

Lipson, M.

Liu, A.

L. Liao, A. Liu, D. Rubin, J. Basak, Y. Chetrit, H. Nguyen, R. Cohen, N. Izhaky, and M. Paniccia, “40 Gbit/s silicon optical modulator for highspeed applications,” Electron. Lett. 43(22), 1196–1197 (2007).
[CrossRef]

L. Liao, D. Samara-Rubio, M. Morse, A. Liu, D. Hodge, D. Rubin, U. Keil, and T. Franck, “High speed silicon Mach-Zehnder modulator,” Opt. Express 13(8), 3129–3135 (2005).
[CrossRef] [PubMed]

Liu, F.

Livescu, G.

A. L. Lentine, K. W. Goossen, J. A. Walker, L. M. F. Chirovsky, L. A. D’Asaro, S. P. Hui, B. J. Tseng, R. E. Leibenguth, J. E. Cunningham, W. Y. Jan, J.-M. Kuo, D. W. Dahringer, D. P. Kossives, D. D. Bacon, G. Livescu, R. L. Morrison, R. A. Novotny, and D. B. Buchholz, “High-speed optoelectronic VLSI switching chip with >4000 optical I/O based on flip-chip bonding of MQW modulators and detectors to silicon CMOS,” IEEE J. Sel. Top. Quantum Electron. 2(1iss.1), 77–84 (1996).
[CrossRef]

Lopata, J.

A. V. Krishnamoorthy, L. M. F. Chirovsky, W. S. Hobson, R. E. Leibengath, S. P. Hui, G. J. Zydzik, K. W. Goossen, J. D. Wynn, B. J. Tseng, J. Lopata, J. A. Walker, J. E. Cunningham, and L. A. D’Asaro, “Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits,” IEEE Photon. Technol. Lett. 11(1), 128–130 (1999).
[CrossRef]

Luff, J.

Luo, Y.

Majumdar, A.

A. Majumdar, J.E. Cunningham, and A.V. Krishnamoorthy, “Alignment and performance considerations for capacitive, inductive and optical proximity communication,” IEEE Trans. Adv. Packag. 3327690–701 (2010).
[CrossRef]

Mekis, A.

Mitchell, J. G.

J. E. Cunningham, A. V. Krishnamoorthy, R. Ho, I. Shubin, H. Thacker, J. Lexau, D. C. Lee, D. Feng, E. Chow, Y. Luo, X. Zheng, G. Li, J. Yao, T. Pinguet, K. Raj, M. Asghari, and J. G. Mitchell, “Integration and Packaging of a Macrochip with Silicon Nanophotonic Links,” IEEE J. Sel. Top. Quantum Electron. in press.

Morrison, R. L.

A. L. Lentine, K. W. Goossen, J. A. Walker, L. M. F. Chirovsky, L. A. D’Asaro, S. P. Hui, B. J. Tseng, R. E. Leibenguth, J. E. Cunningham, W. Y. Jan, J.-M. Kuo, D. W. Dahringer, D. P. Kossives, D. D. Bacon, G. Livescu, R. L. Morrison, R. A. Novotny, and D. B. Buchholz, “High-speed optoelectronic VLSI switching chip with >4000 optical I/O based on flip-chip bonding of MQW modulators and detectors to silicon CMOS,” IEEE J. Sel. Top. Quantum Electron. 2(1iss.1), 77–84 (1996).
[CrossRef]

Morse, M.

Nguyen, H.

L. Liao, A. Liu, D. Rubin, J. Basak, Y. Chetrit, H. Nguyen, R. Cohen, N. Izhaky, and M. Paniccia, “40 Gbit/s silicon optical modulator for highspeed applications,” Electron. Lett. 43(22), 1196–1197 (2007).
[CrossRef]

Novotny, R. A.

A. L. Lentine, K. W. Goossen, J. A. Walker, L. M. F. Chirovsky, L. A. D’Asaro, S. P. Hui, B. J. Tseng, R. E. Leibenguth, J. E. Cunningham, W. Y. Jan, J.-M. Kuo, D. W. Dahringer, D. P. Kossives, D. D. Bacon, G. Livescu, R. L. Morrison, R. A. Novotny, and D. B. Buchholz, “High-speed optoelectronic VLSI switching chip with >4000 optical I/O based on flip-chip bonding of MQW modulators and detectors to silicon CMOS,” IEEE J. Sel. Top. Quantum Electron. 2(1iss.1), 77–84 (1996).
[CrossRef]

Panepucci, R. R.

Paniccia, M.

L. Liao, A. Liu, D. Rubin, J. Basak, Y. Chetrit, H. Nguyen, R. Cohen, N. Izhaky, and M. Paniccia, “40 Gbit/s silicon optical modulator for highspeed applications,” Electron. Lett. 43(22), 1196–1197 (2007).
[CrossRef]

Patil, D.

Pinckney, N.

Pinguet, T.

Qian, W.

Raj, K.

Rubin, D.

L. Liao, A. Liu, D. Rubin, J. Basak, Y. Chetrit, H. Nguyen, R. Cohen, N. Izhaky, and M. Paniccia, “40 Gbit/s silicon optical modulator for highspeed applications,” Electron. Lett. 43(22), 1196–1197 (2007).
[CrossRef]

L. Liao, D. Samara-Rubio, M. Morse, A. Liu, D. Hodge, D. Rubin, U. Keil, and T. Franck, “High speed silicon Mach-Zehnder modulator,” Opt. Express 13(8), 3129–3135 (2005).
[CrossRef] [PubMed]

Samara-Rubio, D.

Schwetman, H.

A. V. Krishnamoorthy, R. Ho, X. Zheng, H. Schwetman, J. Lexau, P. Koka, G. Li, I. Shubin, and J. E. Cunningham, “Computer systems based on silicon photonic interconnects,” Proc. IEEE 97(7), 1337–1361 (2009).
[CrossRef]

Shafiiha, R.

Shi, J.

Shubin, I.

A. V. Krishnamoorthy, R. Ho, X. Zheng, H. Schwetman, J. Lexau, P. Koka, G. Li, I. Shubin, and J. E. Cunningham, “Computer systems based on silicon photonic interconnects,” Proc. IEEE 97(7), 1337–1361 (2009).
[CrossRef]

X. Zheng, J. E. Cunningham, I. Shubin, J. Simons, M. Asghari, D. Feng, H. Lei, D. Zheng, H. Liang, C. C. Kung, J. Luff, T. Sze, D. Cohen, and A. V. Krishnamoorthy, “Optical proximity communication using reflective mirrors,” Opt. Express 16(19), 15052–15058 (2008).
[CrossRef] [PubMed]

J. E. Cunningham, A. V. Krishnamoorthy, R. Ho, I. Shubin, H. Thacker, J. Lexau, D. C. Lee, D. Feng, E. Chow, Y. Luo, X. Zheng, G. Li, J. Yao, T. Pinguet, K. Raj, M. Asghari, and J. G. Mitchell, “Integration and Packaging of a Macrochip with Silicon Nanophotonic Links,” IEEE J. Sel. Top. Quantum Electron. in press.

Simons, J.

Steyaert, M. S. J.

M. Ingels and M. S. J. Steyaert, “A 1-gb/s, 0.7- um CMOS optical receiver with full rail-to-rail output swing,” IEEE J. Solid-State Circuits 34(7), 971–977 (1999).
[CrossRef]

Sze, T.

Thacker, H.

Tseng, B. J.

A. V. Krishnamoorthy, L. M. F. Chirovsky, W. S. Hobson, R. E. Leibengath, S. P. Hui, G. J. Zydzik, K. W. Goossen, J. D. Wynn, B. J. Tseng, J. Lopata, J. A. Walker, J. E. Cunningham, and L. A. D’Asaro, “Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits,” IEEE Photon. Technol. Lett. 11(1), 128–130 (1999).
[CrossRef]

A. L. Lentine, K. W. Goossen, J. A. Walker, L. M. F. Chirovsky, L. A. D’Asaro, S. P. Hui, B. J. Tseng, R. E. Leibenguth, J. E. Cunningham, W. Y. Jan, J.-M. Kuo, D. W. Dahringer, D. P. Kossives, D. D. Bacon, G. Livescu, R. L. Morrison, R. A. Novotny, and D. B. Buchholz, “High-speed optoelectronic VLSI switching chip with >4000 optical I/O based on flip-chip bonding of MQW modulators and detectors to silicon CMOS,” IEEE J. Sel. Top. Quantum Electron. 2(1iss.1), 77–84 (1996).
[CrossRef]

Walker, J. A.

A. V. Krishnamoorthy, L. M. F. Chirovsky, W. S. Hobson, R. E. Leibengath, S. P. Hui, G. J. Zydzik, K. W. Goossen, J. D. Wynn, B. J. Tseng, J. Lopata, J. A. Walker, J. E. Cunningham, and L. A. D’Asaro, “Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits,” IEEE Photon. Technol. Lett. 11(1), 128–130 (1999).
[CrossRef]

A. L. Lentine, K. W. Goossen, J. A. Walker, L. M. F. Chirovsky, L. A. D’Asaro, S. P. Hui, B. J. Tseng, R. E. Leibenguth, J. E. Cunningham, W. Y. Jan, J.-M. Kuo, D. W. Dahringer, D. P. Kossives, D. D. Bacon, G. Livescu, R. L. Morrison, R. A. Novotny, and D. B. Buchholz, “High-speed optoelectronic VLSI switching chip with >4000 optical I/O based on flip-chip bonding of MQW modulators and detectors to silicon CMOS,” IEEE J. Sel. Top. Quantum Electron. 2(1iss.1), 77–84 (1996).
[CrossRef]

Wang, X.

Wynn, J. D.

A. V. Krishnamoorthy, L. M. F. Chirovsky, W. S. Hobson, R. E. Leibengath, S. P. Hui, G. J. Zydzik, K. W. Goossen, J. D. Wynn, B. J. Tseng, J. Lopata, J. A. Walker, J. E. Cunningham, and L. A. D’Asaro, “Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits,” IEEE Photon. Technol. Lett. 11(1), 128–130 (1999).
[CrossRef]

Yao, J.

X. Zheng, F. Liu, D. Patil, H. Thacker, Y. Luo, T. Pinguet, A. Mekis, J. Yao, G. Li, J. Shi, K. Raj, J. Lexau, E. Alon, R. Ho, J. E. Cunningham, and A. V. Krishnamoorthy, “A sub-picojoule-per-bit CMOS photonic receiver for densely integrated systems,” Opt. Express 18(1), 204–211 (2010).
[CrossRef] [PubMed]

J. E. Cunningham, A. V. Krishnamoorthy, R. Ho, I. Shubin, H. Thacker, J. Lexau, D. C. Lee, D. Feng, E. Chow, Y. Luo, X. Zheng, G. Li, J. Yao, T. Pinguet, K. Raj, M. Asghari, and J. G. Mitchell, “Integration and Packaging of a Macrochip with Silicon Nanophotonic Links,” IEEE J. Sel. Top. Quantum Electron. in press.

Zheng, D.

Zheng, X.

X. Zheng, F. Liu, D. Patil, H. Thacker, Y. Luo, T. Pinguet, A. Mekis, J. Yao, G. Li, J. Shi, K. Raj, J. Lexau, E. Alon, R. Ho, J. E. Cunningham, and A. V. Krishnamoorthy, “A sub-picojoule-per-bit CMOS photonic receiver for densely integrated systems,” Opt. Express 18(1), 204–211 (2010).
[CrossRef] [PubMed]

P. Dong, S. Liao, H. Liang, W. Qian, X. Wang, R. Shafiiha, D. Feng, G. Li, X. Zheng, A. V. Krishnamoorthy, and M. Asghari, “High-speed and compact silicon modulator based on a racetrack resonator with a 1 V drive voltage,” Opt. Lett. 35(19), 3246–3248 (2010).
[CrossRef] [PubMed]

X. Zheng, J. Lexau, Y. Luo, H. Thacker, T. Pinguet, A. Mekis, G. Li, J. Shi, P. Amberg, N. Pinckney, K. Raj, R. Ho, J. E. Cunningham, and A. V. Krishnamoorthy, “Ultra-low-energy all-CMOS modulator integrated with driver,” Opt. Express 18(3), 3059–3070 (2010).
[CrossRef] [PubMed]

P. Dong, R. Shafiiha, S. Liao, H. Liang, N.-N. Feng, D. Feng, G. Li, X. Zheng, A. V. Krishnamoorthy, and M. Asghari, “Wavelength-tunable silicon microring modulator,” Opt. Express 18(11), 10941–10946 (2010).
[CrossRef] [PubMed]

P. Dong, S. Liao, D. Feng, H. Liang, D. Zheng, R. Shafiiha, C. C. Kung, W. Qian, G. Li, X. Zheng, A. V. Krishnamoorthy, and M. Asghari, “Low VPP, ultralow-energy, compact, high-speed silicon electro-optic modulator,” Opt. Express 17(25), 22484–22490 (2009).
[CrossRef]

A. V. Krishnamoorthy, R. Ho, X. Zheng, H. Schwetman, J. Lexau, P. Koka, G. Li, I. Shubin, and J. E. Cunningham, “Computer systems based on silicon photonic interconnects,” Proc. IEEE 97(7), 1337–1361 (2009).
[CrossRef]

X. Zheng, J. E. Cunningham, I. Shubin, J. Simons, M. Asghari, D. Feng, H. Lei, D. Zheng, H. Liang, C. C. Kung, J. Luff, T. Sze, D. Cohen, and A. V. Krishnamoorthy, “Optical proximity communication using reflective mirrors,” Opt. Express 16(19), 15052–15058 (2008).
[CrossRef] [PubMed]

J. E. Cunningham, A. V. Krishnamoorthy, R. Ho, I. Shubin, H. Thacker, J. Lexau, D. C. Lee, D. Feng, E. Chow, Y. Luo, X. Zheng, G. Li, J. Yao, T. Pinguet, K. Raj, M. Asghari, and J. G. Mitchell, “Integration and Packaging of a Macrochip with Silicon Nanophotonic Links,” IEEE J. Sel. Top. Quantum Electron. in press.

Zydzik, G. J.

A. V. Krishnamoorthy, L. M. F. Chirovsky, W. S. Hobson, R. E. Leibengath, S. P. Hui, G. J. Zydzik, K. W. Goossen, J. D. Wynn, B. J. Tseng, J. Lopata, J. A. Walker, J. E. Cunningham, and L. A. D’Asaro, “Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits,” IEEE Photon. Technol. Lett. 11(1), 128–130 (1999).
[CrossRef]

Appl. Phys. Lett. (1)

D. Feng, S. Liao, P. Dong, N. Feng, H. Liang, D. Zheng, C. Kung, J. Fong, R. Shafiiha, J. Cunningham, A. V. Krishnamoorthy, and M. Asghari, “High-speed Ge photodetector monolithically integrated with large cross-section silicon-on-insulator waveguide,” Appl. Phys. Lett. 95(26), 261105 (2009).
[CrossRef]

Electron. Lett. (1)

L. Liao, A. Liu, D. Rubin, J. Basak, Y. Chetrit, H. Nguyen, R. Cohen, N. Izhaky, and M. Paniccia, “40 Gbit/s silicon optical modulator for highspeed applications,” Electron. Lett. 43(22), 1196–1197 (2007).
[CrossRef]

IEEE J. Sel. Top. Quantum Electron. (2)

A. L. Lentine, K. W. Goossen, J. A. Walker, L. M. F. Chirovsky, L. A. D’Asaro, S. P. Hui, B. J. Tseng, R. E. Leibenguth, J. E. Cunningham, W. Y. Jan, J.-M. Kuo, D. W. Dahringer, D. P. Kossives, D. D. Bacon, G. Livescu, R. L. Morrison, R. A. Novotny, and D. B. Buchholz, “High-speed optoelectronic VLSI switching chip with >4000 optical I/O based on flip-chip bonding of MQW modulators and detectors to silicon CMOS,” IEEE J. Sel. Top. Quantum Electron. 2(1iss.1), 77–84 (1996).
[CrossRef]

J. E. Cunningham, A. V. Krishnamoorthy, R. Ho, I. Shubin, H. Thacker, J. Lexau, D. C. Lee, D. Feng, E. Chow, Y. Luo, X. Zheng, G. Li, J. Yao, T. Pinguet, K. Raj, M. Asghari, and J. G. Mitchell, “Integration and Packaging of a Macrochip with Silicon Nanophotonic Links,” IEEE J. Sel. Top. Quantum Electron. in press.

IEEE J. Solid-State Circuits (1)

M. Ingels and M. S. J. Steyaert, “A 1-gb/s, 0.7- um CMOS optical receiver with full rail-to-rail output swing,” IEEE J. Solid-State Circuits 34(7), 971–977 (1999).
[CrossRef]

IEEE Photon. Technol. Lett. (2)

K. W. Goossen, J. E. Cunningham, and W. Y. Jan, “GaAs 850nm modulators solder-bonded to silicon,” IEEE Photon. Technol. Lett. 5(7), 776–778 (1993).
[CrossRef]

A. V. Krishnamoorthy, L. M. F. Chirovsky, W. S. Hobson, R. E. Leibengath, S. P. Hui, G. J. Zydzik, K. W. Goossen, J. D. Wynn, B. J. Tseng, J. Lopata, J. A. Walker, J. E. Cunningham, and L. A. D’Asaro, “Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits,” IEEE Photon. Technol. Lett. 11(1), 128–130 (1999).
[CrossRef]

IEEE Trans. Adv. Packag. (1)

A. Majumdar, J.E. Cunningham, and A.V. Krishnamoorthy, “Alignment and performance considerations for capacitive, inductive and optical proximity communication,” IEEE Trans. Adv. Packag. 3327690–701 (2010).
[CrossRef]

Opt. Express (7)

X. Zheng, J. E. Cunningham, I. Shubin, J. Simons, M. Asghari, D. Feng, H. Lei, D. Zheng, H. Liang, C. C. Kung, J. Luff, T. Sze, D. Cohen, and A. V. Krishnamoorthy, “Optical proximity communication using reflective mirrors,” Opt. Express 16(19), 15052–15058 (2008).
[CrossRef] [PubMed]

L. Liao, D. Samara-Rubio, M. Morse, A. Liu, D. Hodge, D. Rubin, U. Keil, and T. Franck, “High speed silicon Mach-Zehnder modulator,” Opt. Express 13(8), 3129–3135 (2005).
[CrossRef] [PubMed]

N. N. Feng, P. Dong, D. Zheng, S. Liao, H. Liang, R. Shafiiha, D. Feng, G. Li, J. E. Cunningham, A. V. Krishnamoorthy, and M. Asghari, “Vertical p-i-n germanium photodetector with high external responsivity integrated with large core Si waveguides,” Opt. Express 18(1), 96–101 (2010).
[CrossRef] [PubMed]

X. Zheng, J. Lexau, Y. Luo, H. Thacker, T. Pinguet, A. Mekis, G. Li, J. Shi, P. Amberg, N. Pinckney, K. Raj, R. Ho, J. E. Cunningham, and A. V. Krishnamoorthy, “Ultra-low-energy all-CMOS modulator integrated with driver,” Opt. Express 18(3), 3059–3070 (2010).
[CrossRef] [PubMed]

X. Zheng, F. Liu, D. Patil, H. Thacker, Y. Luo, T. Pinguet, A. Mekis, J. Yao, G. Li, J. Shi, K. Raj, J. Lexau, E. Alon, R. Ho, J. E. Cunningham, and A. V. Krishnamoorthy, “A sub-picojoule-per-bit CMOS photonic receiver for densely integrated systems,” Opt. Express 18(1), 204–211 (2010).
[CrossRef] [PubMed]

P. Dong, S. Liao, D. Feng, H. Liang, D. Zheng, R. Shafiiha, C. C. Kung, W. Qian, G. Li, X. Zheng, A. V. Krishnamoorthy, and M. Asghari, “Low VPP, ultralow-energy, compact, high-speed silicon electro-optic modulator,” Opt. Express 17(25), 22484–22490 (2009).
[CrossRef]

P. Dong, R. Shafiiha, S. Liao, H. Liang, N.-N. Feng, D. Feng, G. Li, X. Zheng, A. V. Krishnamoorthy, and M. Asghari, “Wavelength-tunable silicon microring modulator,” Opt. Express 18(11), 10941–10946 (2010).
[CrossRef] [PubMed]

Opt. Lett. (2)

Proc. IEEE (1)

A. V. Krishnamoorthy, R. Ho, X. Zheng, H. Schwetman, J. Lexau, P. Koka, G. Li, I. Shubin, and J. E. Cunningham, “Computer systems based on silicon photonic interconnects,” Proc. IEEE 97(7), 1337–1361 (2009).
[CrossRef]

Other (17)

A. Narasimha, B. Analui, Y. Liang, T. J. Sleboda, and C. Gunn, “A fully integrated 4x10Gb/s DWDM optoelectronic transceiver in a standard 0.13um CMOS SOI,” ISSCC 2007 Dig. Tech. Papers, Feb. 2007.

A. Alduino, L. Liao, R. Jones, M. Morse, B. Kim, W. Lo, J. Basak, B. Koch, H. Liu, H. Rong, M. Sysak, C. Krause, R. Saba, D. Lazar, L. Horwitz, R. Bar, S. Litski, A. Liu, K. Sullivan, O. Dosunmu, N. Na, T. Yin, F. Haubensack, I. Hsieh, J. Heck, R. Beatty, H. Park, J. Bovington, S. Lee, H. Nguyen, H. Au, K. Nguyen, P. Merani, M. Hakami, and M. Paniccia, “Demonstration of a high speed 4-channel integrated silicon photonics WDM link with hybrid silicon lasers,” in Integrated Photonics Research, Silicon and Nanophotonics, OSA Technical Digest (CD), paper PDIWI5, 2010.

M. R. Watts, D. C. Trotter, R. W. Young, and A. L. Lentine, “Ultralow power silicon microdisk modulators and switches,” in Proceedings of the 5th IEEE International Conference on Group IV Photonics, pp. 4–6, 2009.

X. Zheng P. Koka, H. Schwetman, J. Lexau, R. Ho, J.E. Cunningham, A.V. Krishnamoorthy, “Silicon photonic WDM point-to-point network for multi-chip processor interconnects,” Group IV Photonics, 2008 5th IEEE International Conference on, pp. 380–382, 2008.

D. Vantrease, R. Schreiber, M. Monchiero, M. McLaren, N. Jouppi, M. Fiorentino, A. Davis, N. Binkert, R. Beausoleil, and J. H. Ahn, “Corona: system implications of emerging nanophotonic technology,” Proceedings of the 35th Annual International Symposium on Computer Architecture (ISCA), pp. 153–164, June 2008.

A. Shacham, K. Bergman, and L. Carloni, “On the design of a photonic network-on-chip,” Proceedings of the First International Symposium on Networks-on-Chip (NOCS), pp. 53–64, May 2007.

C. Batten, A. Joshi, J. Orcutt, A. Khilo, B. Moss, C. Holzwarth, M. Popovic, H. Li, H. Smith, J. Hoyt, F. Kartner, R. Ram, V. Stojanović, and K. Asanović, “Building manycore processor-to-DRAM networks with monolithic silicon photonics,” Proceedings of the 16th IEEE Symposium on High Performance Interconnects (HOT-I), pp. 21–30, August 2008.

G. Masini, S. Sahni, G. Capellini, J. Witzens, and C. Gunn, “High-speed near infrared optical receivers based on Ge waveguide photodetectors integrated in a CMOS process,” Advances in Optical Technologies, Hindawi Publishing Corporation, Volume 2008, Article ID 196572.

G. Li, X. Zheng, J. Lexau, Y. Luo, H. Thacker, P. Dong, S. Liao, M. Asghari, J. Yao, J. Shi, P. Amberg, N. Pinckney, K. Raj, R. Ho, J. Cunningham, and A. V. Krishnamoorthy, “Ultralow-power high-performance Si photonic transmitter,” OFC/NFOEC 2010, OMI2, pp.1–3 2010.

S. Palermo, and M. Horowitz, “High-speed transmitters in 90nm CMOS for high-density optical interconnects,” Proceedings of the 32nd European Solid-State Circuits Conference (ESSCIRC), pp. 508–511, September 2006.

D. Dobberpuhl, “The design of a high performance low power microprocessor,” Proceedings of the IEEE International Symposium on Low-Power Electronics and Design (ISLPED), pp. 11–16, 1996.

L. Vivien, et al., “A high efficiency silicon nitride grating coupler,” Group IV Photonics, 4th IEEE International Conference, 19–21 Sept. 2007, 162–164 2007.

J. Yao, X. Zheng, G. Li, Y. Luo, H. Thacker, A. Mekis, T. Pinguet, K. Raj, J. E. Cunningham, and A. V. Krishnamoorthy, “Grating coupler based optical proximity coupling for scalable computing systems,” SPIE Photonics West 2011, Optoelectronic Interconnects and Component Integration XI (OE112), 2011.

J. E. Cunninghmam, A. V. Krishnamoorthy, I. Shubin, J. G. Mitchell, and X. Zheng, “Aligning chips face to face for dense capacitive communication,” Coupled Data Techniques, Springer, R. Ho and R. Drost Ed., 2010.

H. D. Thacker, Y. Luo, J. Shi, I. Shubin, J. Lexau, X. Zheng, G. Li, J. Yao, J. Costa, T. Pinguet, A. Mekis, P. Dong, S. Liao, D. Feng, M. Asghari, R. Ho, K. Raj, J. G. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Flip-chip integrated silicon photonic bridge chips for sub-picojoule per bit optical links,” IEEE Electronic Components and Technology Conference, pp. 240–246, 2010.

H. D. Thacker, I. Shubin, Y. Luo, J. Costa, J. Lexau, X. Zheng, G. Li, J. Yao, J. Li, D. Patil, F. Liu, R. Ho, M. Asghari, T. Pinguet, K. Raj, J. Mitchell, A. V. Krishnamoorthy, and J. E. Cunningham, “Hybrid integration of silicon nanophotonics with 40nm-CMOS VLSI drivers and receivers,” IEEE Electronic Components and Technology Conference, 2011, in press.

Barkai,A. Liu, D. Kim, R. Cohen, N. Elek, H. Chang, B. H. Malik, R. Gabay, R. Jones, M. Paniccia, and N. Izhaky, “Efficient mode converter for coupling between fiber and micrometer size silicon waveguides,” Group IV Photonics, 4th IEEE International Conference, 19–21 Sept. 2007, 49–51 2007.

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Figures (15)

Fig. 1
Fig. 1

Top view SEM picture of the racetrack ring modulator.

Fig. 2
Fig. 2

Small signal high speed characteristics of the racetrack ring modulator. (a) Circuit model extracted by measured S11 data; (b) Measured frequency response for the 12 μm racetrack ring modulator.

Fig. 3
Fig. 3

The measured electrical bandwidth of the CMOS Ge waveguide PIN photodetector for different bias voltages.

Fig. 4
Fig. 4

The measured responsivity of the CMOS Ge waveguide PIN photodetector.

Fig. 5
Fig. 5

Cascoded modulator driver circuit.

Fig. 6
Fig. 6

VLSI chip floorplan showing multiple modulator drivers and receiver circuits integrated on the same chip.

Fig. 7
Fig. 7

Probed modulator driver data “eye,” prior to hybrid integration, showing 2 V modulation at 10 Gbps.

Fig. 8
Fig. 8

Block diagram of the receiver, showing an adjustable shunt current, an adjustable offset voltage (one of two shown here), and an adjustable clock strobe. Not depicted are the finite state machines that control these adjustments.

Fig. 9
Fig. 9

Illustration of flip-chip hybrid-bonding technique using microsolder bumps.

Fig. 10
Fig. 10

SEM picture of an array of microsolder bumps on the 40 nm node VLSI driver chip. Circuitry and metal routing below the passivation layer is not visible. The flat pad just above the featureless grey background (passivation layer) is the top level Al pad that has been ELESS plated with UBM and above that is the “cup like” microsolder bump.

Fig. 11
Fig. 11

Photonic devices hybrid integrated with VLSI chip. (a) Hybrid integrated transmitter chip assembly with the silicon photonic modulator chip facing up; (b) Hybrid integrated receiver chip assembly with the Ge waveguide PIN detector array chip facing up.

Fig. 12
Fig. 12

Test setup for hybrid silicon photonic transmitter characterization with the inset blow-up picture showing the modulator/VLSI driver hybrid chip assembly die attached and wire bonded on a test PCB.

Fig. 13
Fig. 13

Performance of the hybrid integrated silicon photonic transmitter at 10 Gbps. (a) Measured optical “eye” diagram at 10 Gbps with >7 dB extinction ratio; (b) Received power penalty measurement showing ~1 dB power penalty at a BER of 10−12 compared with an off-the-shelf LiNOb3 lightwave transmitter with 12 dB extinction ratio.

Fig. 14
Fig. 14

Test setup for hybrid silicon photonic receiver characterization with the inset blow-up pictures showing the PD/VLSI circuits hybrid chip assembly die attached and wire bonded on a test PCB, and a lensed fiber aligned with grating coupler for optical input.

Fig. 15
Fig. 15

Performance of the hybrid integrated silicon photonic receiver at 10 Gbps showing the measured BER “eye” at average input photo current of 24 μA (left plot) and 16 μA (right plot). Under 16 μA average photo current, the receiver was error-free for 25 minutes for PRBS 231-1 data.

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