Abstract

We report a fully packaged silicon passive waveguide device designed for a tunable filter based on a ring-resonator. Polarization diversity circuits prevent polarization dependant issues in the silicon ring-resonator. For the device packaging, the YAG laser welding technique has been used for pigtailing both of the input and output fibers. Post welding misalignment was compensated by mechanical fine tuning using the seesaw effect via power monitoring. Packaging loss less than 1.5dB with respect to chip measurement has been achieved using 10 µm-curvature radius lensed fibers. In addition, the packaging process and the module performance are presented.

© 2011 OSA

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    [CrossRef]
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    [CrossRef]
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    [CrossRef]
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    [CrossRef]
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    [CrossRef]
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    [CrossRef]
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    [CrossRef]
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    [CrossRef]
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    [CrossRef] [PubMed]
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    [CrossRef]
  15. J. H. Song, M. Rensing, C. L. L. M. Daunt, P. O'Brien, and F. H. Peters, “Directly modulated laser diode module exceeding 10 Gb/s transmission,” IEEE Trans. Comp. Packg. Manuf. Technol. 1(6), 975–980 (2011).
    [CrossRef]
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2011 (6)

L. Zimmermann, G. B. Preve, T. Tekin, T. Rosin, and K. Landles, “Packaging and assembly for integrated photonics- A review of the ePIXpack photonics packaging platform,” IEEE J. Sel. Top. Quantum Electron. 17(3), 645–651 (2011).
[CrossRef]

T. Tekin, “Review of packaging of optoelectronic photonics, and MEMS components,” IEEE J. Sel. Top. Quantum Electron. 17(3), 704–719 (2011).
[CrossRef]

C. Kopp, S. Bernabe, B. B. Bakir, J.-M. Fedeli, R. Orobtchouk, F. Schrank, H. Porte, L. Zimmermann, and T. Tekin, “Silicon photonic circuits: On-CMOS integration, fiber optical coupling, and packaging,” IEEE J. Sel. Top. Quantum Electron. 17(3), 498–509 (2011).
[CrossRef]

J. H. Song, M. Rensing, C. L. L. M. Daunt, P. O'Brien, and F. H. Peters, “Directly modulated laser diode module exceeding 10 Gb/s transmission,” IEEE Trans. Comp. Packg. Manuf. Technol. 1(6), 975–980 (2011).
[CrossRef]

F. E. Doany, B. G. Lee, S. Assefa, W. M. J. Green, M. Yang, C. L. Schow, C. V. Jahnes, S. Zhang, J. Singer, V. I. Kopp, J. A. Kash, and Y. A. Vlasov, “Multichannel high-bandwidth coupling of ultra-dense silicon photonic waveguide array to standard-pitch fiber array,” J. Lightwave Technol. 29(4), 475–482 (2011).
[CrossRef]

J. Zhang, H. Zhang, S. Chen, M. Yu, G. Q. Lo, and D. L. Kwong, “A tunable polarization diversity silicon photonics filter,” Opt. Express 19(14), 13063–13072 (2011).
[CrossRef] [PubMed]

2010 (2)

B. B. Bakir, A. V. Gyves, R. Orobtchouk, P. Lyan, C. Porzier, A. Roman, and J. M. Fedeli, “Low-loss (<1dB) and polarization-insensitive edge fiber couplers fabricated on 200-mm silicon-on-insulator wafers,” IEEE Photon. Technol. Lett. 22(11), 739–741 (2010).
[CrossRef]

J. H. Song, B. Roycroft, B. Corbett, and F. H. Peters, “Experimental investigation of laser welding assembling sequences for butterfly laser module packages,” Opt. Eng. 49(1), 014301 (2010).
[CrossRef]

2009 (2)

2006 (3)

F. Taillaert, M. Van Laere, W. Ayre, D. Bogaerts, P. Van Thourhout, Bienstman, and R. Baets, “Grating Couplers for Coupling between Optical Fibers and Nanophotonic Waveguides,” Jpn. J. Appl. Phys. 45(8A), 6071–6077 (2006).
[CrossRef]

G. Roelkens, P. Dumon, W. Bogaerts, D. V. Thourhout, and R. Baets, “Efficient silicon on insulator fiber coupler fabricated using 248-nm deep UV lithography,” IEEE Photon. Technol. Lett. 17(12), 2613–2615 (2006).
[CrossRef]

Y. Lin, W. Liu, and F. G. Shi, “Adhesive joint design for minimizing fiber alignment shift during UV curing,” IEEE Trans. Adv. Packag. 29(3), 520–524 (2006).
[CrossRef]

2005 (1)

2002 (1)

T. Shoji, T. Tsuchizawa, T. Watanabe, K. Yamada, and H. Morita, “Low loss mode size converter from 0.3µm square Si wire waveguides to singlemode fibers,” Electron. Lett. 38(25), 1669–1679 (2002).
[CrossRef]

Assefa, S.

Ayre, W.

F. Taillaert, M. Van Laere, W. Ayre, D. Bogaerts, P. Van Thourhout, Bienstman, and R. Baets, “Grating Couplers for Coupling between Optical Fibers and Nanophotonic Waveguides,” Jpn. J. Appl. Phys. 45(8A), 6071–6077 (2006).
[CrossRef]

Baets, R.

F. Taillaert, M. Van Laere, W. Ayre, D. Bogaerts, P. Van Thourhout, Bienstman, and R. Baets, “Grating Couplers for Coupling between Optical Fibers and Nanophotonic Waveguides,” Jpn. J. Appl. Phys. 45(8A), 6071–6077 (2006).
[CrossRef]

G. Roelkens, P. Dumon, W. Bogaerts, D. V. Thourhout, and R. Baets, “Efficient silicon on insulator fiber coupler fabricated using 248-nm deep UV lithography,” IEEE Photon. Technol. Lett. 17(12), 2613–2615 (2006).
[CrossRef]

Bakir, B. B.

C. Kopp, S. Bernabe, B. B. Bakir, J.-M. Fedeli, R. Orobtchouk, F. Schrank, H. Porte, L. Zimmermann, and T. Tekin, “Silicon photonic circuits: On-CMOS integration, fiber optical coupling, and packaging,” IEEE J. Sel. Top. Quantum Electron. 17(3), 498–509 (2011).
[CrossRef]

B. B. Bakir, A. V. Gyves, R. Orobtchouk, P. Lyan, C. Porzier, A. Roman, and J. M. Fedeli, “Low-loss (<1dB) and polarization-insensitive edge fiber couplers fabricated on 200-mm silicon-on-insulator wafers,” IEEE Photon. Technol. Lett. 22(11), 739–741 (2010).
[CrossRef]

Bernabe, S.

C. Kopp, S. Bernabe, B. B. Bakir, J.-M. Fedeli, R. Orobtchouk, F. Schrank, H. Porte, L. Zimmermann, and T. Tekin, “Silicon photonic circuits: On-CMOS integration, fiber optical coupling, and packaging,” IEEE J. Sel. Top. Quantum Electron. 17(3), 498–509 (2011).
[CrossRef]

Bienstman,

F. Taillaert, M. Van Laere, W. Ayre, D. Bogaerts, P. Van Thourhout, Bienstman, and R. Baets, “Grating Couplers for Coupling between Optical Fibers and Nanophotonic Waveguides,” Jpn. J. Appl. Phys. 45(8A), 6071–6077 (2006).
[CrossRef]

Bogaerts, D.

F. Taillaert, M. Van Laere, W. Ayre, D. Bogaerts, P. Van Thourhout, Bienstman, and R. Baets, “Grating Couplers for Coupling between Optical Fibers and Nanophotonic Waveguides,” Jpn. J. Appl. Phys. 45(8A), 6071–6077 (2006).
[CrossRef]

Bogaerts, W.

G. Roelkens, P. Dumon, W. Bogaerts, D. V. Thourhout, and R. Baets, “Efficient silicon on insulator fiber coupler fabricated using 248-nm deep UV lithography,” IEEE Photon. Technol. Lett. 17(12), 2613–2615 (2006).
[CrossRef]

Chen, S.

Corbett, B.

J. H. Song, B. Roycroft, B. Corbett, and F. H. Peters, “Experimental investigation of laser welding assembling sequences for butterfly laser module packages,” Opt. Eng. 49(1), 014301 (2010).
[CrossRef]

J. H. Song, H. N. J. Fernando, B. Roycroft, B. Corbett, and F. H. Peters, “Practical design of lensed fibers for semiconductor laser packaging using laser welding technique,” J. Lightwave Technol. 27(11), 1533–1539 (2009).
[CrossRef]

Daunt, C. L. L. M.

J. H. Song, M. Rensing, C. L. L. M. Daunt, P. O'Brien, and F. H. Peters, “Directly modulated laser diode module exceeding 10 Gb/s transmission,” IEEE Trans. Comp. Packg. Manuf. Technol. 1(6), 975–980 (2011).
[CrossRef]

Doany, F. E.

Dumon, P.

G. Roelkens, P. Dumon, W. Bogaerts, D. V. Thourhout, and R. Baets, “Efficient silicon on insulator fiber coupler fabricated using 248-nm deep UV lithography,” IEEE Photon. Technol. Lett. 17(12), 2613–2615 (2006).
[CrossRef]

Eichele, C.

Fedeli, J. M.

B. B. Bakir, A. V. Gyves, R. Orobtchouk, P. Lyan, C. Porzier, A. Roman, and J. M. Fedeli, “Low-loss (<1dB) and polarization-insensitive edge fiber couplers fabricated on 200-mm silicon-on-insulator wafers,” IEEE Photon. Technol. Lett. 22(11), 739–741 (2010).
[CrossRef]

Fedeli, J.-M.

C. Kopp, S. Bernabe, B. B. Bakir, J.-M. Fedeli, R. Orobtchouk, F. Schrank, H. Porte, L. Zimmermann, and T. Tekin, “Silicon photonic circuits: On-CMOS integration, fiber optical coupling, and packaging,” IEEE J. Sel. Top. Quantum Electron. 17(3), 498–509 (2011).
[CrossRef]

Fernando, H. N. J.

Green, W. M. J.

Gyves, A. V.

B. B. Bakir, A. V. Gyves, R. Orobtchouk, P. Lyan, C. Porzier, A. Roman, and J. M. Fedeli, “Low-loss (<1dB) and polarization-insensitive edge fiber couplers fabricated on 200-mm silicon-on-insulator wafers,” IEEE Photon. Technol. Lett. 22(11), 739–741 (2010).
[CrossRef]

Jahnes, C. V.

Kash, J. A.

Kopp, C.

C. Kopp, S. Bernabe, B. B. Bakir, J.-M. Fedeli, R. Orobtchouk, F. Schrank, H. Porte, L. Zimmermann, and T. Tekin, “Silicon photonic circuits: On-CMOS integration, fiber optical coupling, and packaging,” IEEE J. Sel. Top. Quantum Electron. 17(3), 498–509 (2011).
[CrossRef]

Kopp, V. I.

Kwong, D. L.

Landles, K.

L. Zimmermann, G. B. Preve, T. Tekin, T. Rosin, and K. Landles, “Packaging and assembly for integrated photonics- A review of the ePIXpack photonics packaging platform,” IEEE J. Sel. Top. Quantum Electron. 17(3), 645–651 (2011).
[CrossRef]

Lee, B. G.

Lin, Y.

Liu, W.

Y. Lin, W. Liu, and F. G. Shi, “Adhesive joint design for minimizing fiber alignment shift during UV curing,” IEEE Trans. Adv. Packag. 29(3), 520–524 (2006).
[CrossRef]

Lo, G. Q.

Lyan, P.

B. B. Bakir, A. V. Gyves, R. Orobtchouk, P. Lyan, C. Porzier, A. Roman, and J. M. Fedeli, “Low-loss (<1dB) and polarization-insensitive edge fiber couplers fabricated on 200-mm silicon-on-insulator wafers,” IEEE Photon. Technol. Lett. 22(11), 739–741 (2010).
[CrossRef]

Morita, H.

T. Shoji, T. Tsuchizawa, T. Watanabe, K. Yamada, and H. Morita, “Low loss mode size converter from 0.3µm square Si wire waveguides to singlemode fibers,” Electron. Lett. 38(25), 1669–1679 (2002).
[CrossRef]

O’Brien, P.

O'Brien, P.

J. H. Song, M. Rensing, C. L. L. M. Daunt, P. O'Brien, and F. H. Peters, “Directly modulated laser diode module exceeding 10 Gb/s transmission,” IEEE Trans. Comp. Packg. Manuf. Technol. 1(6), 975–980 (2011).
[CrossRef]

Orobtchouk, R.

C. Kopp, S. Bernabe, B. B. Bakir, J.-M. Fedeli, R. Orobtchouk, F. Schrank, H. Porte, L. Zimmermann, and T. Tekin, “Silicon photonic circuits: On-CMOS integration, fiber optical coupling, and packaging,” IEEE J. Sel. Top. Quantum Electron. 17(3), 498–509 (2011).
[CrossRef]

B. B. Bakir, A. V. Gyves, R. Orobtchouk, P. Lyan, C. Porzier, A. Roman, and J. M. Fedeli, “Low-loss (<1dB) and polarization-insensitive edge fiber couplers fabricated on 200-mm silicon-on-insulator wafers,” IEEE Photon. Technol. Lett. 22(11), 739–741 (2010).
[CrossRef]

Peters, F. H.

J. H. Song, M. Rensing, C. L. L. M. Daunt, P. O'Brien, and F. H. Peters, “Directly modulated laser diode module exceeding 10 Gb/s transmission,” IEEE Trans. Comp. Packg. Manuf. Technol. 1(6), 975–980 (2011).
[CrossRef]

J. H. Song, B. Roycroft, B. Corbett, and F. H. Peters, “Experimental investigation of laser welding assembling sequences for butterfly laser module packages,” Opt. Eng. 49(1), 014301 (2010).
[CrossRef]

J. H. Song, H. N. J. Fernando, B. Roycroft, B. Corbett, and F. H. Peters, “Practical design of lensed fibers for semiconductor laser packaging using laser welding technique,” J. Lightwave Technol. 27(11), 1533–1539 (2009).
[CrossRef]

J. H. Song, P. O’Brien, and F. H. Peters, “Optimal laser welding assembly sequences for butterfly laser module packages,” Opt. Express 17(19), 16406–16414 (2009).
[CrossRef] [PubMed]

Porte, H.

C. Kopp, S. Bernabe, B. B. Bakir, J.-M. Fedeli, R. Orobtchouk, F. Schrank, H. Porte, L. Zimmermann, and T. Tekin, “Silicon photonic circuits: On-CMOS integration, fiber optical coupling, and packaging,” IEEE J. Sel. Top. Quantum Electron. 17(3), 498–509 (2011).
[CrossRef]

Porzier, C.

B. B. Bakir, A. V. Gyves, R. Orobtchouk, P. Lyan, C. Porzier, A. Roman, and J. M. Fedeli, “Low-loss (<1dB) and polarization-insensitive edge fiber couplers fabricated on 200-mm silicon-on-insulator wafers,” IEEE Photon. Technol. Lett. 22(11), 739–741 (2010).
[CrossRef]

Preve, G. B.

L. Zimmermann, G. B. Preve, T. Tekin, T. Rosin, and K. Landles, “Packaging and assembly for integrated photonics- A review of the ePIXpack photonics packaging platform,” IEEE J. Sel. Top. Quantum Electron. 17(3), 645–651 (2011).
[CrossRef]

Rensing, M.

J. H. Song, M. Rensing, C. L. L. M. Daunt, P. O'Brien, and F. H. Peters, “Directly modulated laser diode module exceeding 10 Gb/s transmission,” IEEE Trans. Comp. Packg. Manuf. Technol. 1(6), 975–980 (2011).
[CrossRef]

Roelkens, G.

G. Roelkens, P. Dumon, W. Bogaerts, D. V. Thourhout, and R. Baets, “Efficient silicon on insulator fiber coupler fabricated using 248-nm deep UV lithography,” IEEE Photon. Technol. Lett. 17(12), 2613–2615 (2006).
[CrossRef]

Roman, A.

B. B. Bakir, A. V. Gyves, R. Orobtchouk, P. Lyan, C. Porzier, A. Roman, and J. M. Fedeli, “Low-loss (<1dB) and polarization-insensitive edge fiber couplers fabricated on 200-mm silicon-on-insulator wafers,” IEEE Photon. Technol. Lett. 22(11), 739–741 (2010).
[CrossRef]

Rosin, T.

L. Zimmermann, G. B. Preve, T. Tekin, T. Rosin, and K. Landles, “Packaging and assembly for integrated photonics- A review of the ePIXpack photonics packaging platform,” IEEE J. Sel. Top. Quantum Electron. 17(3), 645–651 (2011).
[CrossRef]

Roycroft, B.

J. H. Song, B. Roycroft, B. Corbett, and F. H. Peters, “Experimental investigation of laser welding assembling sequences for butterfly laser module packages,” Opt. Eng. 49(1), 014301 (2010).
[CrossRef]

J. H. Song, H. N. J. Fernando, B. Roycroft, B. Corbett, and F. H. Peters, “Practical design of lensed fibers for semiconductor laser packaging using laser welding technique,” J. Lightwave Technol. 27(11), 1533–1539 (2009).
[CrossRef]

Schow, C. L.

Schrank, F.

C. Kopp, S. Bernabe, B. B. Bakir, J.-M. Fedeli, R. Orobtchouk, F. Schrank, H. Porte, L. Zimmermann, and T. Tekin, “Silicon photonic circuits: On-CMOS integration, fiber optical coupling, and packaging,” IEEE J. Sel. Top. Quantum Electron. 17(3), 498–509 (2011).
[CrossRef]

Shi, F. G.

Shoji, T.

T. Shoji, T. Tsuchizawa, T. Watanabe, K. Yamada, and H. Morita, “Low loss mode size converter from 0.3µm square Si wire waveguides to singlemode fibers,” Electron. Lett. 38(25), 1669–1679 (2002).
[CrossRef]

Singer, J.

Song, J. H.

J. H. Song, M. Rensing, C. L. L. M. Daunt, P. O'Brien, and F. H. Peters, “Directly modulated laser diode module exceeding 10 Gb/s transmission,” IEEE Trans. Comp. Packg. Manuf. Technol. 1(6), 975–980 (2011).
[CrossRef]

J. H. Song, B. Roycroft, B. Corbett, and F. H. Peters, “Experimental investigation of laser welding assembling sequences for butterfly laser module packages,” Opt. Eng. 49(1), 014301 (2010).
[CrossRef]

J. H. Song, H. N. J. Fernando, B. Roycroft, B. Corbett, and F. H. Peters, “Practical design of lensed fibers for semiconductor laser packaging using laser welding technique,” J. Lightwave Technol. 27(11), 1533–1539 (2009).
[CrossRef]

J. H. Song, P. O’Brien, and F. H. Peters, “Optimal laser welding assembly sequences for butterfly laser module packages,” Opt. Express 17(19), 16406–16414 (2009).
[CrossRef] [PubMed]

Taillaert, F.

F. Taillaert, M. Van Laere, W. Ayre, D. Bogaerts, P. Van Thourhout, Bienstman, and R. Baets, “Grating Couplers for Coupling between Optical Fibers and Nanophotonic Waveguides,” Jpn. J. Appl. Phys. 45(8A), 6071–6077 (2006).
[CrossRef]

Tekin, T.

C. Kopp, S. Bernabe, B. B. Bakir, J.-M. Fedeli, R. Orobtchouk, F. Schrank, H. Porte, L. Zimmermann, and T. Tekin, “Silicon photonic circuits: On-CMOS integration, fiber optical coupling, and packaging,” IEEE J. Sel. Top. Quantum Electron. 17(3), 498–509 (2011).
[CrossRef]

L. Zimmermann, G. B. Preve, T. Tekin, T. Rosin, and K. Landles, “Packaging and assembly for integrated photonics- A review of the ePIXpack photonics packaging platform,” IEEE J. Sel. Top. Quantum Electron. 17(3), 645–651 (2011).
[CrossRef]

T. Tekin, “Review of packaging of optoelectronic photonics, and MEMS components,” IEEE J. Sel. Top. Quantum Electron. 17(3), 704–719 (2011).
[CrossRef]

Thourhout, D. V.

G. Roelkens, P. Dumon, W. Bogaerts, D. V. Thourhout, and R. Baets, “Efficient silicon on insulator fiber coupler fabricated using 248-nm deep UV lithography,” IEEE Photon. Technol. Lett. 17(12), 2613–2615 (2006).
[CrossRef]

Tsuchizawa, T.

T. Shoji, T. Tsuchizawa, T. Watanabe, K. Yamada, and H. Morita, “Low loss mode size converter from 0.3µm square Si wire waveguides to singlemode fibers,” Electron. Lett. 38(25), 1669–1679 (2002).
[CrossRef]

Van Laere, M.

F. Taillaert, M. Van Laere, W. Ayre, D. Bogaerts, P. Van Thourhout, Bienstman, and R. Baets, “Grating Couplers for Coupling between Optical Fibers and Nanophotonic Waveguides,” Jpn. J. Appl. Phys. 45(8A), 6071–6077 (2006).
[CrossRef]

Van Thourhout, P.

F. Taillaert, M. Van Laere, W. Ayre, D. Bogaerts, P. Van Thourhout, Bienstman, and R. Baets, “Grating Couplers for Coupling between Optical Fibers and Nanophotonic Waveguides,” Jpn. J. Appl. Phys. 45(8A), 6071–6077 (2006).
[CrossRef]

Vlasov, Y. A.

Watanabe, T.

T. Shoji, T. Tsuchizawa, T. Watanabe, K. Yamada, and H. Morita, “Low loss mode size converter from 0.3µm square Si wire waveguides to singlemode fibers,” Electron. Lett. 38(25), 1669–1679 (2002).
[CrossRef]

Yamada, K.

T. Shoji, T. Tsuchizawa, T. Watanabe, K. Yamada, and H. Morita, “Low loss mode size converter from 0.3µm square Si wire waveguides to singlemode fibers,” Electron. Lett. 38(25), 1669–1679 (2002).
[CrossRef]

Yang, M.

Yu, M.

Zhang, H.

Zhang, J.

Zhang, S.

Zimmermann, L.

L. Zimmermann, G. B. Preve, T. Tekin, T. Rosin, and K. Landles, “Packaging and assembly for integrated photonics- A review of the ePIXpack photonics packaging platform,” IEEE J. Sel. Top. Quantum Electron. 17(3), 645–651 (2011).
[CrossRef]

C. Kopp, S. Bernabe, B. B. Bakir, J.-M. Fedeli, R. Orobtchouk, F. Schrank, H. Porte, L. Zimmermann, and T. Tekin, “Silicon photonic circuits: On-CMOS integration, fiber optical coupling, and packaging,” IEEE J. Sel. Top. Quantum Electron. 17(3), 498–509 (2011).
[CrossRef]

Electron. Lett. (1)

T. Shoji, T. Tsuchizawa, T. Watanabe, K. Yamada, and H. Morita, “Low loss mode size converter from 0.3µm square Si wire waveguides to singlemode fibers,” Electron. Lett. 38(25), 1669–1679 (2002).
[CrossRef]

IEEE J. Sel. Top. Quantum Electron. (3)

L. Zimmermann, G. B. Preve, T. Tekin, T. Rosin, and K. Landles, “Packaging and assembly for integrated photonics- A review of the ePIXpack photonics packaging platform,” IEEE J. Sel. Top. Quantum Electron. 17(3), 645–651 (2011).
[CrossRef]

T. Tekin, “Review of packaging of optoelectronic photonics, and MEMS components,” IEEE J. Sel. Top. Quantum Electron. 17(3), 704–719 (2011).
[CrossRef]

C. Kopp, S. Bernabe, B. B. Bakir, J.-M. Fedeli, R. Orobtchouk, F. Schrank, H. Porte, L. Zimmermann, and T. Tekin, “Silicon photonic circuits: On-CMOS integration, fiber optical coupling, and packaging,” IEEE J. Sel. Top. Quantum Electron. 17(3), 498–509 (2011).
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IEEE Photon. Technol. Lett. (2)

G. Roelkens, P. Dumon, W. Bogaerts, D. V. Thourhout, and R. Baets, “Efficient silicon on insulator fiber coupler fabricated using 248-nm deep UV lithography,” IEEE Photon. Technol. Lett. 17(12), 2613–2615 (2006).
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B. B. Bakir, A. V. Gyves, R. Orobtchouk, P. Lyan, C. Porzier, A. Roman, and J. M. Fedeli, “Low-loss (<1dB) and polarization-insensitive edge fiber couplers fabricated on 200-mm silicon-on-insulator wafers,” IEEE Photon. Technol. Lett. 22(11), 739–741 (2010).
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IEEE Trans. Comp. Packg. Manuf. Technol. (1)

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Figures (12)

Fig. 1
Fig. 1

(a) Polarization diversity circuit for the silicon ring resonator and (b) simulation results of converted polarization in the circuit.

Fig. 2
Fig. 2

Fabricated silicon ring resonator with micro heater.

Fig. 3
Fig. 3

Passive Si-device packaging structure using YAG laser welding technique.

Fig. 4
Fig. 4

3D-FDTD simulation for 200 µm-long tapered Si-waveguide as a mode size converter.

Fig. 5
Fig. 5

(a) Lensed fiber coupling efficiency as a function of later offset for the spot diameter of 1.8 µm when R = 5, 10, 15, 20 µm and infinite at the optimum working distance of Z = 10, 19, 24, 26.5 µm, respectively. (b) Theoretical and experimental tolerance analysis when R = 10 µm.

Fig. 6
Fig. 6

Laser welding station and sub-assembly loaded on the station.

Fig. 7
Fig. 7

Characterization of YAG laser welding spots for 150µm-thick nickel plate.

Fig. 8
Fig. 8

Mechanical tuning using seesaw effect and guided mode on IR camera monitor by aligned lensed fiber after tuning.

Fig. 9
Fig. 9

Fully packaged Si-ring resonator.

Fig. 10
Fig. 10

Packaging process flow chart. (‘YES’ means max-coupling and dotted lines and boxes are optional process.)

Fig. 11
Fig. 11

Loss comparison between chip and module.

Fig. 12
Fig. 12

(a) Loss measurement of the module and (b) its wavelength tuning characteristics at 1543.94nm.

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