A line scan interferometer, which comprises a visible supercontinuum source coupled to Fourier domain Michelson interferometer, is used to obtain 3D images of ~300 μm high solder balls on a semiconductor die with 125 nm axial and 15 μm lateral resolution. The ability to measure curved surfaces enables the determination of solder ball shape defects in addition to ball height. We show that the maximum measurable angular tilt from the sample surface normal for a given source power depends on the surface roughness of the sample. As an example, we demonstrate height measurement over +/−20 degrees from the normal on the solder balls and over +/−60 degrees on a rough steel ball bearing sample.
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