Abstract

The recent emergence of multicore architectures and chip multiprocessors (CMPs) has accelerated the bandwidth requirements in high-performance processors for both on-chip and off-chip interconnects. For next generation computing clusters, the delivery of scalable power efficient off-chip communications to each compute node has emerged as a key bottleneck to realizing the full computational performance of these systems. The power dissipation is dominated by the off-chip interface and the necessity to drive high-speed signals over long distances. We present a scalable photonic network interface approach that fully exploits the bandwidth capacity offered by optical interconnects while offering significant power savings over traditional E/O and O/E approaches. The power-efficient interface optically aggregates electronic serial data streams into a multiple WDM channel packet structure at time-of-flight latencies. We demonstrate a scalable optical network interface with 70% improvement in power efficiency for a complete end-to-end PCI Express data transfer.

©2009 Optical Society of America

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References

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  1. S. Vangal, J. Howard, G. Ruhl, S. Dighe, H. Wilson, J. Tschanz, D. Finan, P. Iyer, A. Singh, T. Jacob, S. Jain, S. Venkataraman, Y. Hoskot, and N. Borkar, “An 80-Tile 1.28TFLOPS Network-on-Chip in 65nm CMOS,” in Proceedings of IEEE Int. Solid-State Circuit Conference, Dig. Tech. (ISSCC) (Institute of Electrical and Electronics Engineers, 2007), Paper 5.2.
  2. M. Tremblay and S. Chaudhry, “A Third-Generation 65nm 16-Core 32-Thread Plus 32-Scout-Thread CMT SPARC® Processor,” in Proceedings of IEEE Int. Solid-State Circuits Conference, Dig. Tech. (ISSCC) (Institute of Electrical and Electronics Engineers, 2008), pp. 82–83.
  3. M. Kistler, M. Perrone, and F. Petrini, “Cell Multiprocessor Communication Network: Built for Speed,” IEEE Micro. 26, 10–23 (2006).
    [Crossref]
  4. Y. Li, E. Towe, and M. W. Haney, Eds., “Special Issue on Optical Interconnections for Digital Systems,” Proc. IEEE 88, 723–863, (2000).
    [Crossref]
  5. A. F. Benner, M. Ignatowski, J. A. Kash, D. M. Kuchta, and M. B. Ritter, “Exploitation of Optical interconnects in Future Server Architecture,” IBM J. of Res. Dev.,  49, 755–775 (2005).
    [Crossref]
  6. C. L. Schow, F.E. Doany, O. Liboiron-Ladouceur, C. Baks, D. M. Kuchta, L. Schares, R. John, and J. A. Kash, “160-Gb/s, 16-Channel Full-Duplex, Single-Chip CMOS Optical Transceiver,” in Proceedings of Optical Fiber Communication Conference & Exposition and the National Fiber Optic Engineers Conference, Technical Digest (OFC/NFOEC), paper OThG4, 2007.
  7. M. Asghari, “Silicon Photonics: A Low Cost Integration Platform for Datacom and Telecom Applications,” in Proceedings of Optical Fiber Communication Conference & Exposition and the National Fiber Optic Engineers Conference, Technical Digest (OFC/NFOEC), paper NThA4, 2008.
  8. D. M. Kuchta, Y. Taira, C. Baks, G. McVicker, L. Schares, and H. Numata, “Optical Interconnects for Servers,” Jpn. J. Appl. Phys. 47, 6642–6645 (2008).
    [Crossref]
  9. O. Liboiron-Ladouceur, H. Wang, and K. Bergman, “An All-Optical PCI-Express Network Interface for Optical Packet Switched Networks,” in Proceedings of Optical Fiber Communication Conference & Exposition and the National Fiber Optic Engineers Conference, Technical Digest (OFC/NFOEC), paper JWA59, Mar. 25–29, 2007.
  10. O. Liboiron-Ladouceur, H. Wang, and K. Bergman, “Low Power Optical WDM Interface for Off-Chip Interconnects,” in Proceedings of the 20th Annual meeting of the IEEE Lasers and Electro-Optics Society, Technical Digest (LEOS) (Institute of Electrical and Electronics Engineers, 2007), pp. 680–681.
  11. J. A. Kash, “Leveraging Optical Interconnects in Future Supercomputers and Servers,” in Proceedings of the 16th IEEE Symposium on High Performance Interconnects, (Institute of Electrical and Electronics Engineers, 2008), pp. 190–194, Aug. 2008.
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    [Crossref]
  15. E. Dulkeith, F. Xia, L. Schares, W. M. J. Green, and Y. A. Vlasov, “Group Index and Group Velocity Dispersion in Silicon-on-Insulator Photonic Wires,” Opt. Express 14, 3853–3863 (2006).
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  16. C. Gunn, “CMOS Photonics for High-Speed Interconnects,” IEEE Micro,  26, 58–66 (2006).
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  19. S. J. Koester, J. Schaub, G. Dehlinger, and J. O. Chu, “Germanium-on-SOI Infrared Detectors for Integrated Photonic Applications,” IEEE J. Sel. Top. Quantum Electron. 12, 1489–1502 (2006).
    [Crossref]
  20. S. Janz, P. Cheben, D. Dalacu, A. Delge, A. Densmore, B. Lamontagne, M.-J. Picard, E. Post, J. Schmid, H. Waldron, D.-X. X. Yap, and W. N. Ye, “Microphotonic Elements for integration on the Silicon-on-Insulator Waveguide Platform,” IEEE J. Sel..Top. Quantum Electron. 12, 1402–1415 (2006).
    [Crossref]
  21. K.-Y. Kim, J. H. Song, J. Lee, S. Y. Kim, J. Cho, Y. S. Lee, D. Hand, S. Jung, and Y. Oh, “Reduction of Insertion Loss of Thin Film Filters Embedded in PLC Platforms,” IEEE Photon. Technol. Lett. 17, 1041–1135 (2006).
  22. R. B. Sargent, “Recent advances in thin film filters,” in Proceedings of Optical Fiber Communication Conference, Technical Digest (OFC) (Optical Society of America, 2004), paper TuD6.
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  24. N. S. Kim, T. Austin, D. Baauw, T. Mudge, K. Flautner, J. S. Hu, M. J. Irwin, M. Kandemir, and V. Narayanan, “Leakage current: Moore’s law meets static power,” Computer 36, 68–75(2003).
    [Crossref]

2008 (3)

M. Tremblay and S. Chaudhry, “A Third-Generation 65nm 16-Core 32-Thread Plus 32-Scout-Thread CMT SPARC® Processor,” in Proceedings of IEEE Int. Solid-State Circuits Conference, Dig. Tech. (ISSCC) (Institute of Electrical and Electronics Engineers, 2008), pp. 82–83.

D. M. Kuchta, Y. Taira, C. Baks, G. McVicker, L. Schares, and H. Numata, “Optical Interconnects for Servers,” Jpn. J. Appl. Phys. 47, 6642–6645 (2008).
[Crossref]

O. Liboiron-Ladouceur, A. Shacham, B.A. Small, B.G. Lee, H. Wang, C. P. Lai, A. Biberman, and K. Bergman, “The Data Vortex Optical Packet Switched Interconnection Network,” J. Lightwave Technol. 26, 1777–1789 (2008).
[Crossref]

2007 (1)

S. Vangal, J. Howard, G. Ruhl, S. Dighe, H. Wilson, J. Tschanz, D. Finan, P. Iyer, A. Singh, T. Jacob, S. Jain, S. Venkataraman, Y. Hoskot, and N. Borkar, “An 80-Tile 1.28TFLOPS Network-on-Chip in 65nm CMOS,” in Proceedings of IEEE Int. Solid-State Circuit Conference, Dig. Tech. (ISSCC) (Institute of Electrical and Electronics Engineers, 2007), Paper 5.2.

2006 (7)

M. Kistler, M. Perrone, and F. Petrini, “Cell Multiprocessor Communication Network: Built for Speed,” IEEE Micro. 26, 10–23 (2006).
[Crossref]

S. J. Koester, J. Schaub, G. Dehlinger, and J. O. Chu, “Germanium-on-SOI Infrared Detectors for Integrated Photonic Applications,” IEEE J. Sel. Top. Quantum Electron. 12, 1489–1502 (2006).
[Crossref]

S. Janz, P. Cheben, D. Dalacu, A. Delge, A. Densmore, B. Lamontagne, M.-J. Picard, E. Post, J. Schmid, H. Waldron, D.-X. X. Yap, and W. N. Ye, “Microphotonic Elements for integration on the Silicon-on-Insulator Waveguide Platform,” IEEE J. Sel..Top. Quantum Electron. 12, 1402–1415 (2006).
[Crossref]

K.-Y. Kim, J. H. Song, J. Lee, S. Y. Kim, J. Cho, Y. S. Lee, D. Hand, S. Jung, and Y. Oh, “Reduction of Insertion Loss of Thin Film Filters Embedded in PLC Platforms,” IEEE Photon. Technol. Lett. 17, 1041–1135 (2006).

C. Gunn, “CMOS Photonics for High-Speed Interconnects,” IEEE Micro,  26, 58–66 (2006).
[Crossref]

R. Soref, “The Past, Present, and Future of Silicon Photonics,” IEEE J. Sel. Top. Quantum Electron. 12, 1678–1687 (2006).
[Crossref]

E. Dulkeith, F. Xia, L. Schares, W. M. J. Green, and Y. A. Vlasov, “Group Index and Group Velocity Dispersion in Silicon-on-Insulator Photonic Wires,” Opt. Express 14, 3853–3863 (2006).
[Crossref] [PubMed]

2005 (3)

2003 (1)

N. S. Kim, T. Austin, D. Baauw, T. Mudge, K. Flautner, J. S. Hu, M. J. Irwin, M. Kandemir, and V. Narayanan, “Leakage current: Moore’s law meets static power,” Computer 36, 68–75(2003).
[Crossref]

2000 (1)

Y. Li, E. Towe, and M. W. Haney, Eds., “Special Issue on Optical Interconnections for Digital Systems,” Proc. IEEE 88, 723–863, (2000).
[Crossref]

Asghari, M.

M. Asghari, “Silicon Photonics: A Low Cost Integration Platform for Datacom and Telecom Applications,” in Proceedings of Optical Fiber Communication Conference & Exposition and the National Fiber Optic Engineers Conference, Technical Digest (OFC/NFOEC), paper NThA4, 2008.

Austin, T.

N. S. Kim, T. Austin, D. Baauw, T. Mudge, K. Flautner, J. S. Hu, M. J. Irwin, M. Kandemir, and V. Narayanan, “Leakage current: Moore’s law meets static power,” Computer 36, 68–75(2003).
[Crossref]

Baauw, D.

N. S. Kim, T. Austin, D. Baauw, T. Mudge, K. Flautner, J. S. Hu, M. J. Irwin, M. Kandemir, and V. Narayanan, “Leakage current: Moore’s law meets static power,” Computer 36, 68–75(2003).
[Crossref]

Baks, C.

D. M. Kuchta, Y. Taira, C. Baks, G. McVicker, L. Schares, and H. Numata, “Optical Interconnects for Servers,” Jpn. J. Appl. Phys. 47, 6642–6645 (2008).
[Crossref]

C. L. Schow, F.E. Doany, O. Liboiron-Ladouceur, C. Baks, D. M. Kuchta, L. Schares, R. John, and J. A. Kash, “160-Gb/s, 16-Channel Full-Duplex, Single-Chip CMOS Optical Transceiver,” in Proceedings of Optical Fiber Communication Conference & Exposition and the National Fiber Optic Engineers Conference, Technical Digest (OFC/NFOEC), paper OThG4, 2007.

Benner, A. F.

A. F. Benner, M. Ignatowski, J. A. Kash, D. M. Kuchta, and M. B. Ritter, “Exploitation of Optical interconnects in Future Server Architecture,” IBM J. of Res. Dev.,  49, 755–775 (2005).
[Crossref]

Bergman, K.

O. Liboiron-Ladouceur, A. Shacham, B.A. Small, B.G. Lee, H. Wang, C. P. Lai, A. Biberman, and K. Bergman, “The Data Vortex Optical Packet Switched Interconnection Network,” J. Lightwave Technol. 26, 1777–1789 (2008).
[Crossref]

O. Liboiron-Ladouceur, H. Wang, and K. Bergman, “An All-Optical PCI-Express Network Interface for Optical Packet Switched Networks,” in Proceedings of Optical Fiber Communication Conference & Exposition and the National Fiber Optic Engineers Conference, Technical Digest (OFC/NFOEC), paper JWA59, Mar. 25–29, 2007.

O. Liboiron-Ladouceur, H. Wang, and K. Bergman, “Low Power Optical WDM Interface for Off-Chip Interconnects,” in Proceedings of the 20th Annual meeting of the IEEE Lasers and Electro-Optics Society, Technical Digest (LEOS) (Institute of Electrical and Electronics Engineers, 2007), pp. 680–681.

Biberman, A.

Borkar, N.

S. Vangal, J. Howard, G. Ruhl, S. Dighe, H. Wilson, J. Tschanz, D. Finan, P. Iyer, A. Singh, T. Jacob, S. Jain, S. Venkataraman, Y. Hoskot, and N. Borkar, “An 80-Tile 1.28TFLOPS Network-on-Chip in 65nm CMOS,” in Proceedings of IEEE Int. Solid-State Circuit Conference, Dig. Tech. (ISSCC) (Institute of Electrical and Electronics Engineers, 2007), Paper 5.2.

Chang-Hasnain, C. J.

Chaudhry, S.

M. Tremblay and S. Chaudhry, “A Third-Generation 65nm 16-Core 32-Thread Plus 32-Scout-Thread CMT SPARC® Processor,” in Proceedings of IEEE Int. Solid-State Circuits Conference, Dig. Tech. (ISSCC) (Institute of Electrical and Electronics Engineers, 2008), pp. 82–83.

Cheben, P.

S. Janz, P. Cheben, D. Dalacu, A. Delge, A. Densmore, B. Lamontagne, M.-J. Picard, E. Post, J. Schmid, H. Waldron, D.-X. X. Yap, and W. N. Ye, “Microphotonic Elements for integration on the Silicon-on-Insulator Waveguide Platform,” IEEE J. Sel..Top. Quantum Electron. 12, 1402–1415 (2006).
[Crossref]

Cho, J.

K.-Y. Kim, J. H. Song, J. Lee, S. Y. Kim, J. Cho, Y. S. Lee, D. Hand, S. Jung, and Y. Oh, “Reduction of Insertion Loss of Thin Film Filters Embedded in PLC Platforms,” IEEE Photon. Technol. Lett. 17, 1041–1135 (2006).

Chu, J. O.

S. J. Koester, J. Schaub, G. Dehlinger, and J. O. Chu, “Germanium-on-SOI Infrared Detectors for Integrated Photonic Applications,” IEEE J. Sel. Top. Quantum Electron. 12, 1489–1502 (2006).
[Crossref]

Dalacu, D.

S. Janz, P. Cheben, D. Dalacu, A. Delge, A. Densmore, B. Lamontagne, M.-J. Picard, E. Post, J. Schmid, H. Waldron, D.-X. X. Yap, and W. N. Ye, “Microphotonic Elements for integration on the Silicon-on-Insulator Waveguide Platform,” IEEE J. Sel..Top. Quantum Electron. 12, 1402–1415 (2006).
[Crossref]

Dehlinger, G.

S. J. Koester, J. Schaub, G. Dehlinger, and J. O. Chu, “Germanium-on-SOI Infrared Detectors for Integrated Photonic Applications,” IEEE J. Sel. Top. Quantum Electron. 12, 1489–1502 (2006).
[Crossref]

Delge, A.

S. Janz, P. Cheben, D. Dalacu, A. Delge, A. Densmore, B. Lamontagne, M.-J. Picard, E. Post, J. Schmid, H. Waldron, D.-X. X. Yap, and W. N. Ye, “Microphotonic Elements for integration on the Silicon-on-Insulator Waveguide Platform,” IEEE J. Sel..Top. Quantum Electron. 12, 1402–1415 (2006).
[Crossref]

Densmore, A.

S. Janz, P. Cheben, D. Dalacu, A. Delge, A. Densmore, B. Lamontagne, M.-J. Picard, E. Post, J. Schmid, H. Waldron, D.-X. X. Yap, and W. N. Ye, “Microphotonic Elements for integration on the Silicon-on-Insulator Waveguide Platform,” IEEE J. Sel..Top. Quantum Electron. 12, 1402–1415 (2006).
[Crossref]

Dighe, S.

S. Vangal, J. Howard, G. Ruhl, S. Dighe, H. Wilson, J. Tschanz, D. Finan, P. Iyer, A. Singh, T. Jacob, S. Jain, S. Venkataraman, Y. Hoskot, and N. Borkar, “An 80-Tile 1.28TFLOPS Network-on-Chip in 65nm CMOS,” in Proceedings of IEEE Int. Solid-State Circuit Conference, Dig. Tech. (ISSCC) (Institute of Electrical and Electronics Engineers, 2007), Paper 5.2.

Doany, F.E.

C. L. Schow, F.E. Doany, O. Liboiron-Ladouceur, C. Baks, D. M. Kuchta, L. Schares, R. John, and J. A. Kash, “160-Gb/s, 16-Channel Full-Duplex, Single-Chip CMOS Optical Transceiver,” in Proceedings of Optical Fiber Communication Conference & Exposition and the National Fiber Optic Engineers Conference, Technical Digest (OFC/NFOEC), paper OThG4, 2007.

Dulkeith, E.

Finan, D.

S. Vangal, J. Howard, G. Ruhl, S. Dighe, H. Wilson, J. Tschanz, D. Finan, P. Iyer, A. Singh, T. Jacob, S. Jain, S. Venkataraman, Y. Hoskot, and N. Borkar, “An 80-Tile 1.28TFLOPS Network-on-Chip in 65nm CMOS,” in Proceedings of IEEE Int. Solid-State Circuit Conference, Dig. Tech. (ISSCC) (Institute of Electrical and Electronics Engineers, 2007), Paper 5.2.

Flautner, K.

N. S. Kim, T. Austin, D. Baauw, T. Mudge, K. Flautner, J. S. Hu, M. J. Irwin, M. Kandemir, and V. Narayanan, “Leakage current: Moore’s law meets static power,” Computer 36, 68–75(2003).
[Crossref]

Green, W. M. J.

Gunn, C.

C. Gunn, “CMOS Photonics for High-Speed Interconnects,” IEEE Micro,  26, 58–66 (2006).
[Crossref]

Hand, D.

K.-Y. Kim, J. H. Song, J. Lee, S. Y. Kim, J. Cho, Y. S. Lee, D. Hand, S. Jung, and Y. Oh, “Reduction of Insertion Loss of Thin Film Filters Embedded in PLC Platforms,” IEEE Photon. Technol. Lett. 17, 1041–1135 (2006).

Hoskot, Y.

S. Vangal, J. Howard, G. Ruhl, S. Dighe, H. Wilson, J. Tschanz, D. Finan, P. Iyer, A. Singh, T. Jacob, S. Jain, S. Venkataraman, Y. Hoskot, and N. Borkar, “An 80-Tile 1.28TFLOPS Network-on-Chip in 65nm CMOS,” in Proceedings of IEEE Int. Solid-State Circuit Conference, Dig. Tech. (ISSCC) (Institute of Electrical and Electronics Engineers, 2007), Paper 5.2.

Howard, J.

S. Vangal, J. Howard, G. Ruhl, S. Dighe, H. Wilson, J. Tschanz, D. Finan, P. Iyer, A. Singh, T. Jacob, S. Jain, S. Venkataraman, Y. Hoskot, and N. Borkar, “An 80-Tile 1.28TFLOPS Network-on-Chip in 65nm CMOS,” in Proceedings of IEEE Int. Solid-State Circuit Conference, Dig. Tech. (ISSCC) (Institute of Electrical and Electronics Engineers, 2007), Paper 5.2.

Hu, J. S.

N. S. Kim, T. Austin, D. Baauw, T. Mudge, K. Flautner, J. S. Hu, M. J. Irwin, M. Kandemir, and V. Narayanan, “Leakage current: Moore’s law meets static power,” Computer 36, 68–75(2003).
[Crossref]

Ignatowski, M.

A. F. Benner, M. Ignatowski, J. A. Kash, D. M. Kuchta, and M. B. Ritter, “Exploitation of Optical interconnects in Future Server Architecture,” IBM J. of Res. Dev.,  49, 755–775 (2005).
[Crossref]

Irwin, M. J.

N. S. Kim, T. Austin, D. Baauw, T. Mudge, K. Flautner, J. S. Hu, M. J. Irwin, M. Kandemir, and V. Narayanan, “Leakage current: Moore’s law meets static power,” Computer 36, 68–75(2003).
[Crossref]

Iyer, P.

S. Vangal, J. Howard, G. Ruhl, S. Dighe, H. Wilson, J. Tschanz, D. Finan, P. Iyer, A. Singh, T. Jacob, S. Jain, S. Venkataraman, Y. Hoskot, and N. Borkar, “An 80-Tile 1.28TFLOPS Network-on-Chip in 65nm CMOS,” in Proceedings of IEEE Int. Solid-State Circuit Conference, Dig. Tech. (ISSCC) (Institute of Electrical and Electronics Engineers, 2007), Paper 5.2.

Jacob, T.

S. Vangal, J. Howard, G. Ruhl, S. Dighe, H. Wilson, J. Tschanz, D. Finan, P. Iyer, A. Singh, T. Jacob, S. Jain, S. Venkataraman, Y. Hoskot, and N. Borkar, “An 80-Tile 1.28TFLOPS Network-on-Chip in 65nm CMOS,” in Proceedings of IEEE Int. Solid-State Circuit Conference, Dig. Tech. (ISSCC) (Institute of Electrical and Electronics Engineers, 2007), Paper 5.2.

Jain, S.

S. Vangal, J. Howard, G. Ruhl, S. Dighe, H. Wilson, J. Tschanz, D. Finan, P. Iyer, A. Singh, T. Jacob, S. Jain, S. Venkataraman, Y. Hoskot, and N. Borkar, “An 80-Tile 1.28TFLOPS Network-on-Chip in 65nm CMOS,” in Proceedings of IEEE Int. Solid-State Circuit Conference, Dig. Tech. (ISSCC) (Institute of Electrical and Electronics Engineers, 2007), Paper 5.2.

Janz, S.

S. Janz, P. Cheben, D. Dalacu, A. Delge, A. Densmore, B. Lamontagne, M.-J. Picard, E. Post, J. Schmid, H. Waldron, D.-X. X. Yap, and W. N. Ye, “Microphotonic Elements for integration on the Silicon-on-Insulator Waveguide Platform,” IEEE J. Sel..Top. Quantum Electron. 12, 1402–1415 (2006).
[Crossref]

John, R.

C. L. Schow, F.E. Doany, O. Liboiron-Ladouceur, C. Baks, D. M. Kuchta, L. Schares, R. John, and J. A. Kash, “160-Gb/s, 16-Channel Full-Duplex, Single-Chip CMOS Optical Transceiver,” in Proceedings of Optical Fiber Communication Conference & Exposition and the National Fiber Optic Engineers Conference, Technical Digest (OFC/NFOEC), paper OThG4, 2007.

Jung, S.

K.-Y. Kim, J. H. Song, J. Lee, S. Y. Kim, J. Cho, Y. S. Lee, D. Hand, S. Jung, and Y. Oh, “Reduction of Insertion Loss of Thin Film Filters Embedded in PLC Platforms,” IEEE Photon. Technol. Lett. 17, 1041–1135 (2006).

Kandemir, M.

N. S. Kim, T. Austin, D. Baauw, T. Mudge, K. Flautner, J. S. Hu, M. J. Irwin, M. Kandemir, and V. Narayanan, “Leakage current: Moore’s law meets static power,” Computer 36, 68–75(2003).
[Crossref]

Kash, J. A.

A. F. Benner, M. Ignatowski, J. A. Kash, D. M. Kuchta, and M. B. Ritter, “Exploitation of Optical interconnects in Future Server Architecture,” IBM J. of Res. Dev.,  49, 755–775 (2005).
[Crossref]

C. L. Schow, F.E. Doany, O. Liboiron-Ladouceur, C. Baks, D. M. Kuchta, L. Schares, R. John, and J. A. Kash, “160-Gb/s, 16-Channel Full-Duplex, Single-Chip CMOS Optical Transceiver,” in Proceedings of Optical Fiber Communication Conference & Exposition and the National Fiber Optic Engineers Conference, Technical Digest (OFC/NFOEC), paper OThG4, 2007.

J. A. Kash, “Leveraging Optical Interconnects in Future Supercomputers and Servers,” in Proceedings of the 16th IEEE Symposium on High Performance Interconnects, (Institute of Electrical and Electronics Engineers, 2008), pp. 190–194, Aug. 2008.

Kim, K.-Y.

K.-Y. Kim, J. H. Song, J. Lee, S. Y. Kim, J. Cho, Y. S. Lee, D. Hand, S. Jung, and Y. Oh, “Reduction of Insertion Loss of Thin Film Filters Embedded in PLC Platforms,” IEEE Photon. Technol. Lett. 17, 1041–1135 (2006).

Kim, N. S.

N. S. Kim, T. Austin, D. Baauw, T. Mudge, K. Flautner, J. S. Hu, M. J. Irwin, M. Kandemir, and V. Narayanan, “Leakage current: Moore’s law meets static power,” Computer 36, 68–75(2003).
[Crossref]

Kim, S. Y.

K.-Y. Kim, J. H. Song, J. Lee, S. Y. Kim, J. Cho, Y. S. Lee, D. Hand, S. Jung, and Y. Oh, “Reduction of Insertion Loss of Thin Film Filters Embedded in PLC Platforms,” IEEE Photon. Technol. Lett. 17, 1041–1135 (2006).

Kistler, M.

M. Kistler, M. Perrone, and F. Petrini, “Cell Multiprocessor Communication Network: Built for Speed,” IEEE Micro. 26, 10–23 (2006).
[Crossref]

Koester, S. J.

S. J. Koester, J. Schaub, G. Dehlinger, and J. O. Chu, “Germanium-on-SOI Infrared Detectors for Integrated Photonic Applications,” IEEE J. Sel. Top. Quantum Electron. 12, 1489–1502 (2006).
[Crossref]

Kuchta, D. M.

D. M. Kuchta, Y. Taira, C. Baks, G. McVicker, L. Schares, and H. Numata, “Optical Interconnects for Servers,” Jpn. J. Appl. Phys. 47, 6642–6645 (2008).
[Crossref]

A. F. Benner, M. Ignatowski, J. A. Kash, D. M. Kuchta, and M. B. Ritter, “Exploitation of Optical interconnects in Future Server Architecture,” IBM J. of Res. Dev.,  49, 755–775 (2005).
[Crossref]

C. L. Schow, F.E. Doany, O. Liboiron-Ladouceur, C. Baks, D. M. Kuchta, L. Schares, R. John, and J. A. Kash, “160-Gb/s, 16-Channel Full-Duplex, Single-Chip CMOS Optical Transceiver,” in Proceedings of Optical Fiber Communication Conference & Exposition and the National Fiber Optic Engineers Conference, Technical Digest (OFC/NFOEC), paper OThG4, 2007.

Lai, C. P.

Lamontagne, B.

S. Janz, P. Cheben, D. Dalacu, A. Delge, A. Densmore, B. Lamontagne, M.-J. Picard, E. Post, J. Schmid, H. Waldron, D.-X. X. Yap, and W. N. Ye, “Microphotonic Elements for integration on the Silicon-on-Insulator Waveguide Platform,” IEEE J. Sel..Top. Quantum Electron. 12, 1402–1415 (2006).
[Crossref]

Lee, B.G.

Lee, J.

K.-Y. Kim, J. H. Song, J. Lee, S. Y. Kim, J. Cho, Y. S. Lee, D. Hand, S. Jung, and Y. Oh, “Reduction of Insertion Loss of Thin Film Filters Embedded in PLC Platforms,” IEEE Photon. Technol. Lett. 17, 1041–1135 (2006).

Lee, Y. S.

K.-Y. Kim, J. H. Song, J. Lee, S. Y. Kim, J. Cho, Y. S. Lee, D. Hand, S. Jung, and Y. Oh, “Reduction of Insertion Loss of Thin Film Filters Embedded in PLC Platforms,” IEEE Photon. Technol. Lett. 17, 1041–1135 (2006).

Liboiron-Ladouceur, O.

O. Liboiron-Ladouceur, A. Shacham, B.A. Small, B.G. Lee, H. Wang, C. P. Lai, A. Biberman, and K. Bergman, “The Data Vortex Optical Packet Switched Interconnection Network,” J. Lightwave Technol. 26, 1777–1789 (2008).
[Crossref]

C. L. Schow, F.E. Doany, O. Liboiron-Ladouceur, C. Baks, D. M. Kuchta, L. Schares, R. John, and J. A. Kash, “160-Gb/s, 16-Channel Full-Duplex, Single-Chip CMOS Optical Transceiver,” in Proceedings of Optical Fiber Communication Conference & Exposition and the National Fiber Optic Engineers Conference, Technical Digest (OFC/NFOEC), paper OThG4, 2007.

O. Liboiron-Ladouceur, H. Wang, and K. Bergman, “Low Power Optical WDM Interface for Off-Chip Interconnects,” in Proceedings of the 20th Annual meeting of the IEEE Lasers and Electro-Optics Society, Technical Digest (LEOS) (Institute of Electrical and Electronics Engineers, 2007), pp. 680–681.

O. Liboiron-Ladouceur, H. Wang, and K. Bergman, “An All-Optical PCI-Express Network Interface for Optical Packet Switched Networks,” in Proceedings of Optical Fiber Communication Conference & Exposition and the National Fiber Optic Engineers Conference, Technical Digest (OFC/NFOEC), paper JWA59, Mar. 25–29, 2007.

Lipson, M.

McVicker, G.

D. M. Kuchta, Y. Taira, C. Baks, G. McVicker, L. Schares, and H. Numata, “Optical Interconnects for Servers,” Jpn. J. Appl. Phys. 47, 6642–6645 (2008).
[Crossref]

Mudge, T.

N. S. Kim, T. Austin, D. Baauw, T. Mudge, K. Flautner, J. S. Hu, M. J. Irwin, M. Kandemir, and V. Narayanan, “Leakage current: Moore’s law meets static power,” Computer 36, 68–75(2003).
[Crossref]

Narayanan, V.

N. S. Kim, T. Austin, D. Baauw, T. Mudge, K. Flautner, J. S. Hu, M. J. Irwin, M. Kandemir, and V. Narayanan, “Leakage current: Moore’s law meets static power,” Computer 36, 68–75(2003).
[Crossref]

Numata, H.

D. M. Kuchta, Y. Taira, C. Baks, G. McVicker, L. Schares, and H. Numata, “Optical Interconnects for Servers,” Jpn. J. Appl. Phys. 47, 6642–6645 (2008).
[Crossref]

Oh, Y.

K.-Y. Kim, J. H. Song, J. Lee, S. Y. Kim, J. Cho, Y. S. Lee, D. Hand, S. Jung, and Y. Oh, “Reduction of Insertion Loss of Thin Film Filters Embedded in PLC Platforms,” IEEE Photon. Technol. Lett. 17, 1041–1135 (2006).

Pei-Cheng, K.

Perrone, M.

M. Kistler, M. Perrone, and F. Petrini, “Cell Multiprocessor Communication Network: Built for Speed,” IEEE Micro. 26, 10–23 (2006).
[Crossref]

Petrini, F.

M. Kistler, M. Perrone, and F. Petrini, “Cell Multiprocessor Communication Network: Built for Speed,” IEEE Micro. 26, 10–23 (2006).
[Crossref]

Picard, M.-J.

S. Janz, P. Cheben, D. Dalacu, A. Delge, A. Densmore, B. Lamontagne, M.-J. Picard, E. Post, J. Schmid, H. Waldron, D.-X. X. Yap, and W. N. Ye, “Microphotonic Elements for integration on the Silicon-on-Insulator Waveguide Platform,” IEEE J. Sel..Top. Quantum Electron. 12, 1402–1415 (2006).
[Crossref]

Post, E.

S. Janz, P. Cheben, D. Dalacu, A. Delge, A. Densmore, B. Lamontagne, M.-J. Picard, E. Post, J. Schmid, H. Waldron, D.-X. X. Yap, and W. N. Ye, “Microphotonic Elements for integration on the Silicon-on-Insulator Waveguide Platform,” IEEE J. Sel..Top. Quantum Electron. 12, 1402–1415 (2006).
[Crossref]

Ritter, M. B.

A. F. Benner, M. Ignatowski, J. A. Kash, D. M. Kuchta, and M. B. Ritter, “Exploitation of Optical interconnects in Future Server Architecture,” IBM J. of Res. Dev.,  49, 755–775 (2005).
[Crossref]

Ruhl, G.

S. Vangal, J. Howard, G. Ruhl, S. Dighe, H. Wilson, J. Tschanz, D. Finan, P. Iyer, A. Singh, T. Jacob, S. Jain, S. Venkataraman, Y. Hoskot, and N. Borkar, “An 80-Tile 1.28TFLOPS Network-on-Chip in 65nm CMOS,” in Proceedings of IEEE Int. Solid-State Circuit Conference, Dig. Tech. (ISSCC) (Institute of Electrical and Electronics Engineers, 2007), Paper 5.2.

Sargent, R. B.

R. B. Sargent, “Recent advances in thin film filters,” in Proceedings of Optical Fiber Communication Conference, Technical Digest (OFC) (Optical Society of America, 2004), paper TuD6.

Schares, L.

D. M. Kuchta, Y. Taira, C. Baks, G. McVicker, L. Schares, and H. Numata, “Optical Interconnects for Servers,” Jpn. J. Appl. Phys. 47, 6642–6645 (2008).
[Crossref]

E. Dulkeith, F. Xia, L. Schares, W. M. J. Green, and Y. A. Vlasov, “Group Index and Group Velocity Dispersion in Silicon-on-Insulator Photonic Wires,” Opt. Express 14, 3853–3863 (2006).
[Crossref] [PubMed]

C. L. Schow, F.E. Doany, O. Liboiron-Ladouceur, C. Baks, D. M. Kuchta, L. Schares, R. John, and J. A. Kash, “160-Gb/s, 16-Channel Full-Duplex, Single-Chip CMOS Optical Transceiver,” in Proceedings of Optical Fiber Communication Conference & Exposition and the National Fiber Optic Engineers Conference, Technical Digest (OFC/NFOEC), paper OThG4, 2007.

Schaub, J.

S. J. Koester, J. Schaub, G. Dehlinger, and J. O. Chu, “Germanium-on-SOI Infrared Detectors for Integrated Photonic Applications,” IEEE J. Sel. Top. Quantum Electron. 12, 1489–1502 (2006).
[Crossref]

Schmid, J.

S. Janz, P. Cheben, D. Dalacu, A. Delge, A. Densmore, B. Lamontagne, M.-J. Picard, E. Post, J. Schmid, H. Waldron, D.-X. X. Yap, and W. N. Ye, “Microphotonic Elements for integration on the Silicon-on-Insulator Waveguide Platform,” IEEE J. Sel..Top. Quantum Electron. 12, 1402–1415 (2006).
[Crossref]

Schow, C. L.

C. L. Schow, F.E. Doany, O. Liboiron-Ladouceur, C. Baks, D. M. Kuchta, L. Schares, R. John, and J. A. Kash, “160-Gb/s, 16-Channel Full-Duplex, Single-Chip CMOS Optical Transceiver,” in Proceedings of Optical Fiber Communication Conference & Exposition and the National Fiber Optic Engineers Conference, Technical Digest (OFC/NFOEC), paper OThG4, 2007.

Shacham, A.

Singh, A.

S. Vangal, J. Howard, G. Ruhl, S. Dighe, H. Wilson, J. Tschanz, D. Finan, P. Iyer, A. Singh, T. Jacob, S. Jain, S. Venkataraman, Y. Hoskot, and N. Borkar, “An 80-Tile 1.28TFLOPS Network-on-Chip in 65nm CMOS,” in Proceedings of IEEE Int. Solid-State Circuit Conference, Dig. Tech. (ISSCC) (Institute of Electrical and Electronics Engineers, 2007), Paper 5.2.

Small, B.A.

Song, J. H.

K.-Y. Kim, J. H. Song, J. Lee, S. Y. Kim, J. Cho, Y. S. Lee, D. Hand, S. Jung, and Y. Oh, “Reduction of Insertion Loss of Thin Film Filters Embedded in PLC Platforms,” IEEE Photon. Technol. Lett. 17, 1041–1135 (2006).

Soref, R.

R. Soref, “The Past, Present, and Future of Silicon Photonics,” IEEE J. Sel. Top. Quantum Electron. 12, 1678–1687 (2006).
[Crossref]

Taira, Y.

D. M. Kuchta, Y. Taira, C. Baks, G. McVicker, L. Schares, and H. Numata, “Optical Interconnects for Servers,” Jpn. J. Appl. Phys. 47, 6642–6645 (2008).
[Crossref]

Tremblay, M.

M. Tremblay and S. Chaudhry, “A Third-Generation 65nm 16-Core 32-Thread Plus 32-Scout-Thread CMT SPARC® Processor,” in Proceedings of IEEE Int. Solid-State Circuits Conference, Dig. Tech. (ISSCC) (Institute of Electrical and Electronics Engineers, 2008), pp. 82–83.

Tschanz, J.

S. Vangal, J. Howard, G. Ruhl, S. Dighe, H. Wilson, J. Tschanz, D. Finan, P. Iyer, A. Singh, T. Jacob, S. Jain, S. Venkataraman, Y. Hoskot, and N. Borkar, “An 80-Tile 1.28TFLOPS Network-on-Chip in 65nm CMOS,” in Proceedings of IEEE Int. Solid-State Circuit Conference, Dig. Tech. (ISSCC) (Institute of Electrical and Electronics Engineers, 2007), Paper 5.2.

Tucker, R. S.

Vangal, S.

S. Vangal, J. Howard, G. Ruhl, S. Dighe, H. Wilson, J. Tschanz, D. Finan, P. Iyer, A. Singh, T. Jacob, S. Jain, S. Venkataraman, Y. Hoskot, and N. Borkar, “An 80-Tile 1.28TFLOPS Network-on-Chip in 65nm CMOS,” in Proceedings of IEEE Int. Solid-State Circuit Conference, Dig. Tech. (ISSCC) (Institute of Electrical and Electronics Engineers, 2007), Paper 5.2.

Venkataraman, S.

S. Vangal, J. Howard, G. Ruhl, S. Dighe, H. Wilson, J. Tschanz, D. Finan, P. Iyer, A. Singh, T. Jacob, S. Jain, S. Venkataraman, Y. Hoskot, and N. Borkar, “An 80-Tile 1.28TFLOPS Network-on-Chip in 65nm CMOS,” in Proceedings of IEEE Int. Solid-State Circuit Conference, Dig. Tech. (ISSCC) (Institute of Electrical and Electronics Engineers, 2007), Paper 5.2.

Vlasov, Y. A.

Waldron, H.

S. Janz, P. Cheben, D. Dalacu, A. Delge, A. Densmore, B. Lamontagne, M.-J. Picard, E. Post, J. Schmid, H. Waldron, D.-X. X. Yap, and W. N. Ye, “Microphotonic Elements for integration on the Silicon-on-Insulator Waveguide Platform,” IEEE J. Sel..Top. Quantum Electron. 12, 1402–1415 (2006).
[Crossref]

Wang, H.

O. Liboiron-Ladouceur, A. Shacham, B.A. Small, B.G. Lee, H. Wang, C. P. Lai, A. Biberman, and K. Bergman, “The Data Vortex Optical Packet Switched Interconnection Network,” J. Lightwave Technol. 26, 1777–1789 (2008).
[Crossref]

O. Liboiron-Ladouceur, H. Wang, and K. Bergman, “An All-Optical PCI-Express Network Interface for Optical Packet Switched Networks,” in Proceedings of Optical Fiber Communication Conference & Exposition and the National Fiber Optic Engineers Conference, Technical Digest (OFC/NFOEC), paper JWA59, Mar. 25–29, 2007.

O. Liboiron-Ladouceur, H. Wang, and K. Bergman, “Low Power Optical WDM Interface for Off-Chip Interconnects,” in Proceedings of the 20th Annual meeting of the IEEE Lasers and Electro-Optics Society, Technical Digest (LEOS) (Institute of Electrical and Electronics Engineers, 2007), pp. 680–681.

Wilson, H.

S. Vangal, J. Howard, G. Ruhl, S. Dighe, H. Wilson, J. Tschanz, D. Finan, P. Iyer, A. Singh, T. Jacob, S. Jain, S. Venkataraman, Y. Hoskot, and N. Borkar, “An 80-Tile 1.28TFLOPS Network-on-Chip in 65nm CMOS,” in Proceedings of IEEE Int. Solid-State Circuit Conference, Dig. Tech. (ISSCC) (Institute of Electrical and Electronics Engineers, 2007), Paper 5.2.

Xia, F.

Yap, D.-X. X.

S. Janz, P. Cheben, D. Dalacu, A. Delge, A. Densmore, B. Lamontagne, M.-J. Picard, E. Post, J. Schmid, H. Waldron, D.-X. X. Yap, and W. N. Ye, “Microphotonic Elements for integration on the Silicon-on-Insulator Waveguide Platform,” IEEE J. Sel..Top. Quantum Electron. 12, 1402–1415 (2006).
[Crossref]

Ye, W. N.

S. Janz, P. Cheben, D. Dalacu, A. Delge, A. Densmore, B. Lamontagne, M.-J. Picard, E. Post, J. Schmid, H. Waldron, D.-X. X. Yap, and W. N. Ye, “Microphotonic Elements for integration on the Silicon-on-Insulator Waveguide Platform,” IEEE J. Sel..Top. Quantum Electron. 12, 1402–1415 (2006).
[Crossref]

Computer (1)

N. S. Kim, T. Austin, D. Baauw, T. Mudge, K. Flautner, J. S. Hu, M. J. Irwin, M. Kandemir, and V. Narayanan, “Leakage current: Moore’s law meets static power,” Computer 36, 68–75(2003).
[Crossref]

Dig. Tech. (2)

S. Vangal, J. Howard, G. Ruhl, S. Dighe, H. Wilson, J. Tschanz, D. Finan, P. Iyer, A. Singh, T. Jacob, S. Jain, S. Venkataraman, Y. Hoskot, and N. Borkar, “An 80-Tile 1.28TFLOPS Network-on-Chip in 65nm CMOS,” in Proceedings of IEEE Int. Solid-State Circuit Conference, Dig. Tech. (ISSCC) (Institute of Electrical and Electronics Engineers, 2007), Paper 5.2.

M. Tremblay and S. Chaudhry, “A Third-Generation 65nm 16-Core 32-Thread Plus 32-Scout-Thread CMT SPARC® Processor,” in Proceedings of IEEE Int. Solid-State Circuits Conference, Dig. Tech. (ISSCC) (Institute of Electrical and Electronics Engineers, 2008), pp. 82–83.

IBM J. of Res. Dev. (1)

A. F. Benner, M. Ignatowski, J. A. Kash, D. M. Kuchta, and M. B. Ritter, “Exploitation of Optical interconnects in Future Server Architecture,” IBM J. of Res. Dev.,  49, 755–775 (2005).
[Crossref]

IEEE J. Sel. Top. Quantum Electron. (2)

R. Soref, “The Past, Present, and Future of Silicon Photonics,” IEEE J. Sel. Top. Quantum Electron. 12, 1678–1687 (2006).
[Crossref]

S. J. Koester, J. Schaub, G. Dehlinger, and J. O. Chu, “Germanium-on-SOI Infrared Detectors for Integrated Photonic Applications,” IEEE J. Sel. Top. Quantum Electron. 12, 1489–1502 (2006).
[Crossref]

IEEE J. Sel..Top. Quantum Electron. (1)

S. Janz, P. Cheben, D. Dalacu, A. Delge, A. Densmore, B. Lamontagne, M.-J. Picard, E. Post, J. Schmid, H. Waldron, D.-X. X. Yap, and W. N. Ye, “Microphotonic Elements for integration on the Silicon-on-Insulator Waveguide Platform,” IEEE J. Sel..Top. Quantum Electron. 12, 1402–1415 (2006).
[Crossref]

IEEE Micro (1)

C. Gunn, “CMOS Photonics for High-Speed Interconnects,” IEEE Micro,  26, 58–66 (2006).
[Crossref]

IEEE Micro. (1)

M. Kistler, M. Perrone, and F. Petrini, “Cell Multiprocessor Communication Network: Built for Speed,” IEEE Micro. 26, 10–23 (2006).
[Crossref]

IEEE Photon. Technol. Lett. (1)

K.-Y. Kim, J. H. Song, J. Lee, S. Y. Kim, J. Cho, Y. S. Lee, D. Hand, S. Jung, and Y. Oh, “Reduction of Insertion Loss of Thin Film Filters Embedded in PLC Platforms,” IEEE Photon. Technol. Lett. 17, 1041–1135 (2006).

J. Lightwave Technol. (3)

Jpn. J. Appl. Phys. (1)

D. M. Kuchta, Y. Taira, C. Baks, G. McVicker, L. Schares, and H. Numata, “Optical Interconnects for Servers,” Jpn. J. Appl. Phys. 47, 6642–6645 (2008).
[Crossref]

Opt. Express (1)

Proc. IEEE (1)

Y. Li, E. Towe, and M. W. Haney, Eds., “Special Issue on Optical Interconnections for Digital Systems,” Proc. IEEE 88, 723–863, (2000).
[Crossref]

Other (8)

O. Liboiron-Ladouceur, H. Wang, and K. Bergman, “An All-Optical PCI-Express Network Interface for Optical Packet Switched Networks,” in Proceedings of Optical Fiber Communication Conference & Exposition and the National Fiber Optic Engineers Conference, Technical Digest (OFC/NFOEC), paper JWA59, Mar. 25–29, 2007.

O. Liboiron-Ladouceur, H. Wang, and K. Bergman, “Low Power Optical WDM Interface for Off-Chip Interconnects,” in Proceedings of the 20th Annual meeting of the IEEE Lasers and Electro-Optics Society, Technical Digest (LEOS) (Institute of Electrical and Electronics Engineers, 2007), pp. 680–681.

J. A. Kash, “Leveraging Optical Interconnects in Future Supercomputers and Servers,” in Proceedings of the 16th IEEE Symposium on High Performance Interconnects, (Institute of Electrical and Electronics Engineers, 2008), pp. 190–194, Aug. 2008.

International Technology Roadmap for Semiconductors (ITRS), 2005.

Standard Development Group, http//:www.pcisig.com.

R. B. Sargent, “Recent advances in thin film filters,” in Proceedings of Optical Fiber Communication Conference, Technical Digest (OFC) (Optical Society of America, 2004), paper TuD6.

C. L. Schow, F.E. Doany, O. Liboiron-Ladouceur, C. Baks, D. M. Kuchta, L. Schares, R. John, and J. A. Kash, “160-Gb/s, 16-Channel Full-Duplex, Single-Chip CMOS Optical Transceiver,” in Proceedings of Optical Fiber Communication Conference & Exposition and the National Fiber Optic Engineers Conference, Technical Digest (OFC/NFOEC), paper OThG4, 2007.

M. Asghari, “Silicon Photonics: A Low Cost Integration Platform for Datacom and Telecom Applications,” in Proceedings of Optical Fiber Communication Conference & Exposition and the National Fiber Optic Engineers Conference, Technical Digest (OFC/NFOEC), paper NThA4, 2008.

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Figures (10)

Fig. 1.
Fig. 1. Transparent optical photonic network interface for high throughput communications infrastructure.

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Fig. 2.
Fig. 2. Serial electronic packets mapped onto 8 WDM channels (W0 to W7) and TDM interleaved by up to 8 lanes to maximize link utilization.

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Fig. 3.
Fig. 3. Detailed schematic of the all-optical PCIe photonic network interface experimental demonstration. The PCIe packet is partitioned onto eight payload channels (W0 to W7) using bandpass filters and optical fiber delay lines in the PCIe-to-WDM block of the interface. The PCIe packet is reconstructed in the WDM-to-PCIe block before being converted to an electrical signal using a broadband receiver (RX). The power and wavelength of each payload channel is monitored and adjusted using an optical wavelength-monitoring (OWM) scheme employing an optical spectrum analyzer (OSA) and controls the cooled DFBs (W0 to W7).

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Fig. 4.
Fig. 4. (a) Output packet in the time-domain with each wavelength (W0 to W7) carrying a segment of the PCIe packet. (b) The reconstructed packet at the destination node: (top) optical signal with each packet segment encoded on a different wavelength (W0 to W7); (bottom) electrical PCIe data stream with each PCIe segment annotated.

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Fig. 5.
Fig. 5. Measured power penalty of the photonic interface.

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Fig. 8.
Fig. 8. (a) Optical eye diagram of PCIe training sequence at 1544.53 nm at the output of the egress node and (b) electrical eye diagram at destination.

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Fig. 7.
Fig. 7. Schematic representation of host and endpoint system organization as experimentally implemented. The optical interface is inserted inline with the upstream link.

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Fig. 8.
Fig. 8. (a) Receiver output signal showing the timing alignment between PCIe[2] and PCIe[3] data for the three possible cases. (b) Corresponding digitized output signal of the analyzer for all three cases, exhibiting an error in the case of excessive timing skew.

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Fig. 9.
Fig. 9. Maximum interconnection length versus the number of wavelength channels based on chromatic dispersion for 0.8 nm (solid black line), 0.4 nm (dashed line) channel spacing and for a Silicon Photonic (SiP) waveguide (light gray).

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Fig. 10.
Fig. 10. Number of WDM channels required to map a x16 PCIe packet using space division (4 parallel waveguides).

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Equations (2)

Equations on this page are rendered with MathJax. Learn more.

P tot , elec = N ( P static + C V D D 2 A f S )
P tot , WDW P tot , elec = P static + N · C V D D 2 f s N · P static + N · C V D D 2 f s

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