Abstract

A polymer waveguide with 4-channel graded-index circular cores is fabricated by the preform method. Very low loss (0.028 dB/cm at a wavelength of 850 nm) and high bandwidth (83 Gbps for 1 m, estimated) properties are experimentally demonstrated by the new waveguide for the first time. By densely aligning the cores during the preform fabrication, a waveguide with a pitch size of 56 μm and a core diameter of 50 μm is obtained, which is expected to be utilized in high-speed and high-density parallel optical interconnections.

© 2007 Optical Society of America

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  1. P. Pepeljugoski, M. J. Hackert, J. S. Abbott, S. E. Swanson, S. E. Golowich, A. J. Ritger, P. Kolesar, Y. C. Chen, and P. Pleunis, “Development of system specification for laser-optimized 50-μm multimode fiber for multigigabit short-wavelength LANs,” J. Lightwave Technol. 21, 1256–1275 (2003).
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    [Crossref]
  3. D. M. Kuchta, Y. H. Kwark, C. Schuster, C. Baks, C. Haymes, J. Schaub, P. Pepeljugoski, L. Shan, John, D. Kucharski, D. Rogers, M. Ritter, J. Jewell, L. A. Graham, K. Schrödinger, A. Schild, and H.-M. Rein, “120-Gb/s VCSEL-based parallel-optical interconnect and custom 120-Gb/s Testing Station,” J. Lightwave Technol. 22, 2200–2212 (2004).
    [Crossref]
  4. L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, L.Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” J. Sel. Top. Quantum Electron. 12, 1032–1044 (2006).
    [Crossref]
  5. K. Suzuki, Y. Wakazono, A. Suzuki, S. Suzuki, T. Yamaguchi, K. Kikuchi, H. Nakagawa, O. Ibaragi, and M. Aoyagi, “40Gb/s parallel optical interconnection module for optical backplane application,” in Proceedings of Electronic Packaging Technology Conference, (Institute of Electrical and Electronics and Engineering Components, Packaging and Manufacturing Technology Society, Singapore, 2005), Vol. 1, pp. 367–370.
  6. J. A. Kash, F. Doany, D. Kuchta, P. Pepeljugoski, L. Schares, J. Schaub, C. Schow, J. Trewhella, C. Baks, Y. Kwark, C. Schuster, L. Shan, C. Patel, C. Tsang, J. Rosner, F. Libsch, R. Budd, P. Chiniwalla, D. Guckenberger, D. Kucharski, R. Dangel, B. Offrein, M. Tan, G. Trott, D. Lin, A. Tandon, and M. Nystrom, “Terabus: a chip-to-chip parallel optical interconnect,” in Proceedings of IEEE-LEOS Annual Meeting (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, Sydney, 2005), pp. 363–364.
  7. F. E. Doany, P. K. Pepeljugoski, A. C. Lehman, J. A. Kash, and R. Dangel, “Measurement of optical dispersion in multimode polymer waveguide,” in Proceedings of IEEE-LEOS Summer Topical Meeting Optical Interconnects & VLSI Photonics, (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, San Diego, 2004), pp. 31–32.
  8. T. Ishigure, E. Nihei, and Y. Koike, “Graded-index polymer optical fiber for high speed data communication,” Appl. Opt. 33, 4261–4266 (1994).
    [Crossref] [PubMed]
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    [Crossref]
  10. J. B. Schlager, M. J. Hackert, P. Pepeljugoski, and J. Gwinn, “Measurements for enhanced bandwidth performance over 62.5-μm multimode fiber in short-wavelength local area networks,” J. Lightwave Technol. 21, 1276–1285 (2003).
    [Crossref]
  11. T. Ishigure, K. Ohdoko, Y. Ishiyama, and Y. Koike, “Mode coupling control and new index profile of GI POF for restricted launch condition in very short-reach networks,” J. Lightwave Technol. 23, 2443–2448 (2005).
    [Crossref]
  12. R. Dangel, U. Bapst, C. Berger, R. Beyeler, L. Dellmann, F. Horst, B. Offrein, and G.-L. Bona, “Development of a low-cost low-loss polymer waveguide technology for parallel optical interconnect applications,” in Proceedings of IEEE-LEOS Summer Topical Meeting Optical Interconnects & VLSI Photonics, (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, San Diego, 2004), pp. 29–30.
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    [Crossref]

2006 (1)

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, L.Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” J. Sel. Top. Quantum Electron. 12, 1032–1044 (2006).
[Crossref]

2005 (2)

A. F. Benner, M. Ignatowski, J. Lash, D. M. Kuchta, and M. Ritter, “Exploitation of optical interconnects in future server architectures,” IBM J. Res. & Dev. 49, 755–776 (2005).
[Crossref]

T. Ishigure, K. Ohdoko, Y. Ishiyama, and Y. Koike, “Mode coupling control and new index profile of GI POF for restricted launch condition in very short-reach networks,” J. Lightwave Technol. 23, 2443–2448 (2005).
[Crossref]

2004 (1)

2003 (2)

2002 (1)

T. Ishigure, S. Tanaka, E. Kobayashi, and Y. Koike, “Accurate refractive index profiling in a graded-Index plastic optical fiber exceeding gigabit transmission rates,” J. Lightw. Technol. 20, 1449–1456 (2002).
[Crossref]

2000 (1)

1994 (1)

Abbott, J. S.

Aoyagi, M.

K. Suzuki, Y. Wakazono, A. Suzuki, S. Suzuki, T. Yamaguchi, K. Kikuchi, H. Nakagawa, O. Ibaragi, and M. Aoyagi, “40Gb/s parallel optical interconnection module for optical backplane application,” in Proceedings of Electronic Packaging Technology Conference, (Institute of Electrical and Electronics and Engineering Components, Packaging and Manufacturing Technology Society, Singapore, 2005), Vol. 1, pp. 367–370.

Baks, C.

D. M. Kuchta, Y. H. Kwark, C. Schuster, C. Baks, C. Haymes, J. Schaub, P. Pepeljugoski, L. Shan, John, D. Kucharski, D. Rogers, M. Ritter, J. Jewell, L. A. Graham, K. Schrödinger, A. Schild, and H.-M. Rein, “120-Gb/s VCSEL-based parallel-optical interconnect and custom 120-Gb/s Testing Station,” J. Lightwave Technol. 22, 2200–2212 (2004).
[Crossref]

J. A. Kash, F. Doany, D. Kuchta, P. Pepeljugoski, L. Schares, J. Schaub, C. Schow, J. Trewhella, C. Baks, Y. Kwark, C. Schuster, L. Shan, C. Patel, C. Tsang, J. Rosner, F. Libsch, R. Budd, P. Chiniwalla, D. Guckenberger, D. Kucharski, R. Dangel, B. Offrein, M. Tan, G. Trott, D. Lin, A. Tandon, and M. Nystrom, “Terabus: a chip-to-chip parallel optical interconnect,” in Proceedings of IEEE-LEOS Annual Meeting (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, Sydney, 2005), pp. 363–364.

Baks, C. W.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, L.Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” J. Sel. Top. Quantum Electron. 12, 1032–1044 (2006).
[Crossref]

Bapst, U.

R. Dangel, U. Bapst, C. Berger, R. Beyeler, L. Dellmann, F. Horst, B. Offrein, and G.-L. Bona, “Development of a low-cost low-loss polymer waveguide technology for parallel optical interconnect applications,” in Proceedings of IEEE-LEOS Summer Topical Meeting Optical Interconnects & VLSI Photonics, (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, San Diego, 2004), pp. 29–30.

Benner, A. F.

A. F. Benner, M. Ignatowski, J. Lash, D. M. Kuchta, and M. Ritter, “Exploitation of optical interconnects in future server architectures,” IBM J. Res. & Dev. 49, 755–776 (2005).
[Crossref]

Berger, C.

R. Dangel, U. Bapst, C. Berger, R. Beyeler, L. Dellmann, F. Horst, B. Offrein, and G.-L. Bona, “Development of a low-cost low-loss polymer waveguide technology for parallel optical interconnect applications,” in Proceedings of IEEE-LEOS Summer Topical Meeting Optical Interconnects & VLSI Photonics, (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, San Diego, 2004), pp. 29–30.

Beyeler, R.

R. Dangel, U. Bapst, C. Berger, R. Beyeler, L. Dellmann, F. Horst, B. Offrein, and G.-L. Bona, “Development of a low-cost low-loss polymer waveguide technology for parallel optical interconnect applications,” in Proceedings of IEEE-LEOS Summer Topical Meeting Optical Interconnects & VLSI Photonics, (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, San Diego, 2004), pp. 29–30.

Bona, G.-L.

R. Dangel, U. Bapst, C. Berger, R. Beyeler, L. Dellmann, F. Horst, B. Offrein, and G.-L. Bona, “Development of a low-cost low-loss polymer waveguide technology for parallel optical interconnect applications,” in Proceedings of IEEE-LEOS Summer Topical Meeting Optical Interconnects & VLSI Photonics, (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, San Diego, 2004), pp. 29–30.

Bour, D. P

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, L.Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” J. Sel. Top. Quantum Electron. 12, 1032–1044 (2006).
[Crossref]

Budd, R.

J. A. Kash, F. Doany, D. Kuchta, P. Pepeljugoski, L. Schares, J. Schaub, C. Schow, J. Trewhella, C. Baks, Y. Kwark, C. Schuster, L. Shan, C. Patel, C. Tsang, J. Rosner, F. Libsch, R. Budd, P. Chiniwalla, D. Guckenberger, D. Kucharski, R. Dangel, B. Offrein, M. Tan, G. Trott, D. Lin, A. Tandon, and M. Nystrom, “Terabus: a chip-to-chip parallel optical interconnect,” in Proceedings of IEEE-LEOS Annual Meeting (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, Sydney, 2005), pp. 363–364.

Budd, R. A.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, L.Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” J. Sel. Top. Quantum Electron. 12, 1032–1044 (2006).
[Crossref]

Chen, Y. C.

Chiniwalla, P.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, L.Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” J. Sel. Top. Quantum Electron. 12, 1032–1044 (2006).
[Crossref]

J. A. Kash, F. Doany, D. Kuchta, P. Pepeljugoski, L. Schares, J. Schaub, C. Schow, J. Trewhella, C. Baks, Y. Kwark, C. Schuster, L. Shan, C. Patel, C. Tsang, J. Rosner, F. Libsch, R. Budd, P. Chiniwalla, D. Guckenberger, D. Kucharski, R. Dangel, B. Offrein, M. Tan, G. Trott, D. Lin, A. Tandon, and M. Nystrom, “Terabus: a chip-to-chip parallel optical interconnect,” in Proceedings of IEEE-LEOS Annual Meeting (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, Sydney, 2005), pp. 363–364.

Dangel, R.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, L.Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” J. Sel. Top. Quantum Electron. 12, 1032–1044 (2006).
[Crossref]

J. A. Kash, F. Doany, D. Kuchta, P. Pepeljugoski, L. Schares, J. Schaub, C. Schow, J. Trewhella, C. Baks, Y. Kwark, C. Schuster, L. Shan, C. Patel, C. Tsang, J. Rosner, F. Libsch, R. Budd, P. Chiniwalla, D. Guckenberger, D. Kucharski, R. Dangel, B. Offrein, M. Tan, G. Trott, D. Lin, A. Tandon, and M. Nystrom, “Terabus: a chip-to-chip parallel optical interconnect,” in Proceedings of IEEE-LEOS Annual Meeting (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, Sydney, 2005), pp. 363–364.

F. E. Doany, P. K. Pepeljugoski, A. C. Lehman, J. A. Kash, and R. Dangel, “Measurement of optical dispersion in multimode polymer waveguide,” in Proceedings of IEEE-LEOS Summer Topical Meeting Optical Interconnects & VLSI Photonics, (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, San Diego, 2004), pp. 31–32.

R. Dangel, U. Bapst, C. Berger, R. Beyeler, L. Dellmann, F. Horst, B. Offrein, and G.-L. Bona, “Development of a low-cost low-loss polymer waveguide technology for parallel optical interconnect applications,” in Proceedings of IEEE-LEOS Summer Topical Meeting Optical Interconnects & VLSI Photonics, (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, San Diego, 2004), pp. 29–30.

Dellmann, L.

R. Dangel, U. Bapst, C. Berger, R. Beyeler, L. Dellmann, F. Horst, B. Offrein, and G.-L. Bona, “Development of a low-cost low-loss polymer waveguide technology for parallel optical interconnect applications,” in Proceedings of IEEE-LEOS Summer Topical Meeting Optical Interconnects & VLSI Photonics, (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, San Diego, 2004), pp. 29–30.

Doany, F.

J. A. Kash, F. Doany, D. Kuchta, P. Pepeljugoski, L. Schares, J. Schaub, C. Schow, J. Trewhella, C. Baks, Y. Kwark, C. Schuster, L. Shan, C. Patel, C. Tsang, J. Rosner, F. Libsch, R. Budd, P. Chiniwalla, D. Guckenberger, D. Kucharski, R. Dangel, B. Offrein, M. Tan, G. Trott, D. Lin, A. Tandon, and M. Nystrom, “Terabus: a chip-to-chip parallel optical interconnect,” in Proceedings of IEEE-LEOS Annual Meeting (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, Sydney, 2005), pp. 363–364.

Doany, F. E.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, L.Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” J. Sel. Top. Quantum Electron. 12, 1032–1044 (2006).
[Crossref]

F. E. Doany, P. K. Pepeljugoski, A. C. Lehman, J. A. Kash, and R. Dangel, “Measurement of optical dispersion in multimode polymer waveguide,” in Proceedings of IEEE-LEOS Summer Topical Meeting Optical Interconnects & VLSI Photonics, (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, San Diego, 2004), pp. 31–32.

Dolfi, D. W.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, L.Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” J. Sel. Top. Quantum Electron. 12, 1032–1044 (2006).
[Crossref]

Fleming, J. W.

Golowich, S. E.

Graham, L. A.

Guckenberger, D.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, L.Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” J. Sel. Top. Quantum Electron. 12, 1032–1044 (2006).
[Crossref]

J. A. Kash, F. Doany, D. Kuchta, P. Pepeljugoski, L. Schares, J. Schaub, C. Schow, J. Trewhella, C. Baks, Y. Kwark, C. Schuster, L. Shan, C. Patel, C. Tsang, J. Rosner, F. Libsch, R. Budd, P. Chiniwalla, D. Guckenberger, D. Kucharski, R. Dangel, B. Offrein, M. Tan, G. Trott, D. Lin, A. Tandon, and M. Nystrom, “Terabus: a chip-to-chip parallel optical interconnect,” in Proceedings of IEEE-LEOS Annual Meeting (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, Sydney, 2005), pp. 363–364.

Gwinn, J.

Hackert, M. J.

Haymes, C.

Hegde, S.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, L.Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” J. Sel. Top. Quantum Electron. 12, 1032–1044 (2006).
[Crossref]

Horst, F.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, L.Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” J. Sel. Top. Quantum Electron. 12, 1032–1044 (2006).
[Crossref]

R. Dangel, U. Bapst, C. Berger, R. Beyeler, L. Dellmann, F. Horst, B. Offrein, and G.-L. Bona, “Development of a low-cost low-loss polymer waveguide technology for parallel optical interconnect applications,” in Proceedings of IEEE-LEOS Summer Topical Meeting Optical Interconnects & VLSI Photonics, (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, San Diego, 2004), pp. 29–30.

Ibaragi, O.

K. Suzuki, Y. Wakazono, A. Suzuki, S. Suzuki, T. Yamaguchi, K. Kikuchi, H. Nakagawa, O. Ibaragi, and M. Aoyagi, “40Gb/s parallel optical interconnection module for optical backplane application,” in Proceedings of Electronic Packaging Technology Conference, (Institute of Electrical and Electronics and Engineering Components, Packaging and Manufacturing Technology Society, Singapore, 2005), Vol. 1, pp. 367–370.

Ignatowski, M.

A. F. Benner, M. Ignatowski, J. Lash, D. M. Kuchta, and M. Ritter, “Exploitation of optical interconnects in future server architectures,” IBM J. Res. & Dev. 49, 755–776 (2005).
[Crossref]

Ishigure, T.

Ishiyama, Y.

Jewell, J.

John, R. A.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, L.Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” J. Sel. Top. Quantum Electron. 12, 1032–1044 (2006).
[Crossref]

Kash, J. A.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, L.Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” J. Sel. Top. Quantum Electron. 12, 1032–1044 (2006).
[Crossref]

F. E. Doany, P. K. Pepeljugoski, A. C. Lehman, J. A. Kash, and R. Dangel, “Measurement of optical dispersion in multimode polymer waveguide,” in Proceedings of IEEE-LEOS Summer Topical Meeting Optical Interconnects & VLSI Photonics, (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, San Diego, 2004), pp. 31–32.

J. A. Kash, F. Doany, D. Kuchta, P. Pepeljugoski, L. Schares, J. Schaub, C. Schow, J. Trewhella, C. Baks, Y. Kwark, C. Schuster, L. Shan, C. Patel, C. Tsang, J. Rosner, F. Libsch, R. Budd, P. Chiniwalla, D. Guckenberger, D. Kucharski, R. Dangel, B. Offrein, M. Tan, G. Trott, D. Lin, A. Tandon, and M. Nystrom, “Terabus: a chip-to-chip parallel optical interconnect,” in Proceedings of IEEE-LEOS Annual Meeting (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, Sydney, 2005), pp. 363–364.

Kikuchi, K.

K. Suzuki, Y. Wakazono, A. Suzuki, S. Suzuki, T. Yamaguchi, K. Kikuchi, H. Nakagawa, O. Ibaragi, and M. Aoyagi, “40Gb/s parallel optical interconnection module for optical backplane application,” in Proceedings of Electronic Packaging Technology Conference, (Institute of Electrical and Electronics and Engineering Components, Packaging and Manufacturing Technology Society, Singapore, 2005), Vol. 1, pp. 367–370.

Kobayashi, E.

T. Ishigure, S. Tanaka, E. Kobayashi, and Y. Koike, “Accurate refractive index profiling in a graded-Index plastic optical fiber exceeding gigabit transmission rates,” J. Lightw. Technol. 20, 1449–1456 (2002).
[Crossref]

Koike, Y.

Kolesar, P.

Kucharski, D.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, L.Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” J. Sel. Top. Quantum Electron. 12, 1032–1044 (2006).
[Crossref]

J. A. Kash, F. Doany, D. Kuchta, P. Pepeljugoski, L. Schares, J. Schaub, C. Schow, J. Trewhella, C. Baks, Y. Kwark, C. Schuster, L. Shan, C. Patel, C. Tsang, J. Rosner, F. Libsch, R. Budd, P. Chiniwalla, D. Guckenberger, D. Kucharski, R. Dangel, B. Offrein, M. Tan, G. Trott, D. Lin, A. Tandon, and M. Nystrom, “Terabus: a chip-to-chip parallel optical interconnect,” in Proceedings of IEEE-LEOS Annual Meeting (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, Sydney, 2005), pp. 363–364.

Kucharski, John, D.

Kuchta, D.

J. A. Kash, F. Doany, D. Kuchta, P. Pepeljugoski, L. Schares, J. Schaub, C. Schow, J. Trewhella, C. Baks, Y. Kwark, C. Schuster, L. Shan, C. Patel, C. Tsang, J. Rosner, F. Libsch, R. Budd, P. Chiniwalla, D. Guckenberger, D. Kucharski, R. Dangel, B. Offrein, M. Tan, G. Trott, D. Lin, A. Tandon, and M. Nystrom, “Terabus: a chip-to-chip parallel optical interconnect,” in Proceedings of IEEE-LEOS Annual Meeting (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, Sydney, 2005), pp. 363–364.

Kuchta, D. M.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, L.Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” J. Sel. Top. Quantum Electron. 12, 1032–1044 (2006).
[Crossref]

A. F. Benner, M. Ignatowski, J. Lash, D. M. Kuchta, and M. Ritter, “Exploitation of optical interconnects in future server architectures,” IBM J. Res. & Dev. 49, 755–776 (2005).
[Crossref]

D. M. Kuchta, Y. H. Kwark, C. Schuster, C. Baks, C. Haymes, J. Schaub, P. Pepeljugoski, L. Shan, John, D. Kucharski, D. Rogers, M. Ritter, J. Jewell, L. A. Graham, K. Schrödinger, A. Schild, and H.-M. Rein, “120-Gb/s VCSEL-based parallel-optical interconnect and custom 120-Gb/s Testing Station,” J. Lightwave Technol. 22, 2200–2212 (2004).
[Crossref]

Kwark, L.Y. H.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, L.Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” J. Sel. Top. Quantum Electron. 12, 1032–1044 (2006).
[Crossref]

Kwark, Y.

J. A. Kash, F. Doany, D. Kuchta, P. Pepeljugoski, L. Schares, J. Schaub, C. Schow, J. Trewhella, C. Baks, Y. Kwark, C. Schuster, L. Shan, C. Patel, C. Tsang, J. Rosner, F. Libsch, R. Budd, P. Chiniwalla, D. Guckenberger, D. Kucharski, R. Dangel, B. Offrein, M. Tan, G. Trott, D. Lin, A. Tandon, and M. Nystrom, “Terabus: a chip-to-chip parallel optical interconnect,” in Proceedings of IEEE-LEOS Annual Meeting (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, Sydney, 2005), pp. 363–364.

Kwark, Y. H.

Lash, J.

A. F. Benner, M. Ignatowski, J. Lash, D. M. Kuchta, and M. Ritter, “Exploitation of optical interconnects in future server architectures,” IBM J. Res. & Dev. 49, 755–776 (2005).
[Crossref]

Lehman, A. C.

F. E. Doany, P. K. Pepeljugoski, A. C. Lehman, J. A. Kash, and R. Dangel, “Measurement of optical dispersion in multimode polymer waveguide,” in Proceedings of IEEE-LEOS Summer Topical Meeting Optical Interconnects & VLSI Photonics, (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, San Diego, 2004), pp. 31–32.

Libsch, F.

J. A. Kash, F. Doany, D. Kuchta, P. Pepeljugoski, L. Schares, J. Schaub, C. Schow, J. Trewhella, C. Baks, Y. Kwark, C. Schuster, L. Shan, C. Patel, C. Tsang, J. Rosner, F. Libsch, R. Budd, P. Chiniwalla, D. Guckenberger, D. Kucharski, R. Dangel, B. Offrein, M. Tan, G. Trott, D. Lin, A. Tandon, and M. Nystrom, “Terabus: a chip-to-chip parallel optical interconnect,” in Proceedings of IEEE-LEOS Annual Meeting (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, Sydney, 2005), pp. 363–364.

Libsch, F. R.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, L.Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” J. Sel. Top. Quantum Electron. 12, 1032–1044 (2006).
[Crossref]

Lin, C.-K.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, L.Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” J. Sel. Top. Quantum Electron. 12, 1032–1044 (2006).
[Crossref]

Lin, D.

J. A. Kash, F. Doany, D. Kuchta, P. Pepeljugoski, L. Schares, J. Schaub, C. Schow, J. Trewhella, C. Baks, Y. Kwark, C. Schuster, L. Shan, C. Patel, C. Tsang, J. Rosner, F. Libsch, R. Budd, P. Chiniwalla, D. Guckenberger, D. Kucharski, R. Dangel, B. Offrein, M. Tan, G. Trott, D. Lin, A. Tandon, and M. Nystrom, “Terabus: a chip-to-chip parallel optical interconnect,” in Proceedings of IEEE-LEOS Annual Meeting (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, Sydney, 2005), pp. 363–364.

Nakagawa, H.

K. Suzuki, Y. Wakazono, A. Suzuki, S. Suzuki, T. Yamaguchi, K. Kikuchi, H. Nakagawa, O. Ibaragi, and M. Aoyagi, “40Gb/s parallel optical interconnection module for optical backplane application,” in Proceedings of Electronic Packaging Technology Conference, (Institute of Electrical and Electronics and Engineering Components, Packaging and Manufacturing Technology Society, Singapore, 2005), Vol. 1, pp. 367–370.

Nihei, E.

Nyikal, H.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, L.Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” J. Sel. Top. Quantum Electron. 12, 1032–1044 (2006).
[Crossref]

Nystrom, M.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, L.Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” J. Sel. Top. Quantum Electron. 12, 1032–1044 (2006).
[Crossref]

J. A. Kash, F. Doany, D. Kuchta, P. Pepeljugoski, L. Schares, J. Schaub, C. Schow, J. Trewhella, C. Baks, Y. Kwark, C. Schuster, L. Shan, C. Patel, C. Tsang, J. Rosner, F. Libsch, R. Budd, P. Chiniwalla, D. Guckenberger, D. Kucharski, R. Dangel, B. Offrein, M. Tan, G. Trott, D. Lin, A. Tandon, and M. Nystrom, “Terabus: a chip-to-chip parallel optical interconnect,” in Proceedings of IEEE-LEOS Annual Meeting (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, Sydney, 2005), pp. 363–364.

Offrein, B.

J. A. Kash, F. Doany, D. Kuchta, P. Pepeljugoski, L. Schares, J. Schaub, C. Schow, J. Trewhella, C. Baks, Y. Kwark, C. Schuster, L. Shan, C. Patel, C. Tsang, J. Rosner, F. Libsch, R. Budd, P. Chiniwalla, D. Guckenberger, D. Kucharski, R. Dangel, B. Offrein, M. Tan, G. Trott, D. Lin, A. Tandon, and M. Nystrom, “Terabus: a chip-to-chip parallel optical interconnect,” in Proceedings of IEEE-LEOS Annual Meeting (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, Sydney, 2005), pp. 363–364.

R. Dangel, U. Bapst, C. Berger, R. Beyeler, L. Dellmann, F. Horst, B. Offrein, and G.-L. Bona, “Development of a low-cost low-loss polymer waveguide technology for parallel optical interconnect applications,” in Proceedings of IEEE-LEOS Summer Topical Meeting Optical Interconnects & VLSI Photonics, (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, San Diego, 2004), pp. 29–30.

Offrein, B. J.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, L.Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” J. Sel. Top. Quantum Electron. 12, 1032–1044 (2006).
[Crossref]

Ohdoko, K.

Patel, C.

J. A. Kash, F. Doany, D. Kuchta, P. Pepeljugoski, L. Schares, J. Schaub, C. Schow, J. Trewhella, C. Baks, Y. Kwark, C. Schuster, L. Shan, C. Patel, C. Tsang, J. Rosner, F. Libsch, R. Budd, P. Chiniwalla, D. Guckenberger, D. Kucharski, R. Dangel, B. Offrein, M. Tan, G. Trott, D. Lin, A. Tandon, and M. Nystrom, “Terabus: a chip-to-chip parallel optical interconnect,” in Proceedings of IEEE-LEOS Annual Meeting (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, Sydney, 2005), pp. 363–364.

Patel, C. S.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, L.Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” J. Sel. Top. Quantum Electron. 12, 1032–1044 (2006).
[Crossref]

Pepeljugoski, P.

Pepeljugoski, P. K.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, L.Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” J. Sel. Top. Quantum Electron. 12, 1032–1044 (2006).
[Crossref]

F. E. Doany, P. K. Pepeljugoski, A. C. Lehman, J. A. Kash, and R. Dangel, “Measurement of optical dispersion in multimode polymer waveguide,” in Proceedings of IEEE-LEOS Summer Topical Meeting Optical Interconnects & VLSI Photonics, (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, San Diego, 2004), pp. 31–32.

Pleunis, P.

Rein, H.-M.

Ritger, A. J.

Ritter, M.

Rogers, D.

Rosner, J.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, L.Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” J. Sel. Top. Quantum Electron. 12, 1032–1044 (2006).
[Crossref]

J. A. Kash, F. Doany, D. Kuchta, P. Pepeljugoski, L. Schares, J. Schaub, C. Schow, J. Trewhella, C. Baks, Y. Kwark, C. Schuster, L. Shan, C. Patel, C. Tsang, J. Rosner, F. Libsch, R. Budd, P. Chiniwalla, D. Guckenberger, D. Kucharski, R. Dangel, B. Offrein, M. Tan, G. Trott, D. Lin, A. Tandon, and M. Nystrom, “Terabus: a chip-to-chip parallel optical interconnect,” in Proceedings of IEEE-LEOS Annual Meeting (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, Sydney, 2005), pp. 363–364.

Schares, L.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, L.Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” J. Sel. Top. Quantum Electron. 12, 1032–1044 (2006).
[Crossref]

J. A. Kash, F. Doany, D. Kuchta, P. Pepeljugoski, L. Schares, J. Schaub, C. Schow, J. Trewhella, C. Baks, Y. Kwark, C. Schuster, L. Shan, C. Patel, C. Tsang, J. Rosner, F. Libsch, R. Budd, P. Chiniwalla, D. Guckenberger, D. Kucharski, R. Dangel, B. Offrein, M. Tan, G. Trott, D. Lin, A. Tandon, and M. Nystrom, “Terabus: a chip-to-chip parallel optical interconnect,” in Proceedings of IEEE-LEOS Annual Meeting (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, Sydney, 2005), pp. 363–364.

Schaub, J.

D. M. Kuchta, Y. H. Kwark, C. Schuster, C. Baks, C. Haymes, J. Schaub, P. Pepeljugoski, L. Shan, John, D. Kucharski, D. Rogers, M. Ritter, J. Jewell, L. A. Graham, K. Schrödinger, A. Schild, and H.-M. Rein, “120-Gb/s VCSEL-based parallel-optical interconnect and custom 120-Gb/s Testing Station,” J. Lightwave Technol. 22, 2200–2212 (2004).
[Crossref]

J. A. Kash, F. Doany, D. Kuchta, P. Pepeljugoski, L. Schares, J. Schaub, C. Schow, J. Trewhella, C. Baks, Y. Kwark, C. Schuster, L. Shan, C. Patel, C. Tsang, J. Rosner, F. Libsch, R. Budd, P. Chiniwalla, D. Guckenberger, D. Kucharski, R. Dangel, B. Offrein, M. Tan, G. Trott, D. Lin, A. Tandon, and M. Nystrom, “Terabus: a chip-to-chip parallel optical interconnect,” in Proceedings of IEEE-LEOS Annual Meeting (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, Sydney, 2005), pp. 363–364.

Schaub, J. D.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, L.Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” J. Sel. Top. Quantum Electron. 12, 1032–1044 (2006).
[Crossref]

Schild, A.

Schlager, J. B.

Schow, C.

J. A. Kash, F. Doany, D. Kuchta, P. Pepeljugoski, L. Schares, J. Schaub, C. Schow, J. Trewhella, C. Baks, Y. Kwark, C. Schuster, L. Shan, C. Patel, C. Tsang, J. Rosner, F. Libsch, R. Budd, P. Chiniwalla, D. Guckenberger, D. Kucharski, R. Dangel, B. Offrein, M. Tan, G. Trott, D. Lin, A. Tandon, and M. Nystrom, “Terabus: a chip-to-chip parallel optical interconnect,” in Proceedings of IEEE-LEOS Annual Meeting (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, Sydney, 2005), pp. 363–364.

Schow, C. L.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, L.Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” J. Sel. Top. Quantum Electron. 12, 1032–1044 (2006).
[Crossref]

Schrödinger, K.

Schuster, C.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, L.Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” J. Sel. Top. Quantum Electron. 12, 1032–1044 (2006).
[Crossref]

D. M. Kuchta, Y. H. Kwark, C. Schuster, C. Baks, C. Haymes, J. Schaub, P. Pepeljugoski, L. Shan, John, D. Kucharski, D. Rogers, M. Ritter, J. Jewell, L. A. Graham, K. Schrödinger, A. Schild, and H.-M. Rein, “120-Gb/s VCSEL-based parallel-optical interconnect and custom 120-Gb/s Testing Station,” J. Lightwave Technol. 22, 2200–2212 (2004).
[Crossref]

J. A. Kash, F. Doany, D. Kuchta, P. Pepeljugoski, L. Schares, J. Schaub, C. Schow, J. Trewhella, C. Baks, Y. Kwark, C. Schuster, L. Shan, C. Patel, C. Tsang, J. Rosner, F. Libsch, R. Budd, P. Chiniwalla, D. Guckenberger, D. Kucharski, R. Dangel, B. Offrein, M. Tan, G. Trott, D. Lin, A. Tandon, and M. Nystrom, “Terabus: a chip-to-chip parallel optical interconnect,” in Proceedings of IEEE-LEOS Annual Meeting (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, Sydney, 2005), pp. 363–364.

Shan, L.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, L.Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” J. Sel. Top. Quantum Electron. 12, 1032–1044 (2006).
[Crossref]

D. M. Kuchta, Y. H. Kwark, C. Schuster, C. Baks, C. Haymes, J. Schaub, P. Pepeljugoski, L. Shan, John, D. Kucharski, D. Rogers, M. Ritter, J. Jewell, L. A. Graham, K. Schrödinger, A. Schild, and H.-M. Rein, “120-Gb/s VCSEL-based parallel-optical interconnect and custom 120-Gb/s Testing Station,” J. Lightwave Technol. 22, 2200–2212 (2004).
[Crossref]

J. A. Kash, F. Doany, D. Kuchta, P. Pepeljugoski, L. Schares, J. Schaub, C. Schow, J. Trewhella, C. Baks, Y. Kwark, C. Schuster, L. Shan, C. Patel, C. Tsang, J. Rosner, F. Libsch, R. Budd, P. Chiniwalla, D. Guckenberger, D. Kucharski, R. Dangel, B. Offrein, M. Tan, G. Trott, D. Lin, A. Tandon, and M. Nystrom, “Terabus: a chip-to-chip parallel optical interconnect,” in Proceedings of IEEE-LEOS Annual Meeting (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, Sydney, 2005), pp. 363–364.

Suzuki, A.

K. Suzuki, Y. Wakazono, A. Suzuki, S. Suzuki, T. Yamaguchi, K. Kikuchi, H. Nakagawa, O. Ibaragi, and M. Aoyagi, “40Gb/s parallel optical interconnection module for optical backplane application,” in Proceedings of Electronic Packaging Technology Conference, (Institute of Electrical and Electronics and Engineering Components, Packaging and Manufacturing Technology Society, Singapore, 2005), Vol. 1, pp. 367–370.

Suzuki, K.

K. Suzuki, Y. Wakazono, A. Suzuki, S. Suzuki, T. Yamaguchi, K. Kikuchi, H. Nakagawa, O. Ibaragi, and M. Aoyagi, “40Gb/s parallel optical interconnection module for optical backplane application,” in Proceedings of Electronic Packaging Technology Conference, (Institute of Electrical and Electronics and Engineering Components, Packaging and Manufacturing Technology Society, Singapore, 2005), Vol. 1, pp. 367–370.

Suzuki, S.

K. Suzuki, Y. Wakazono, A. Suzuki, S. Suzuki, T. Yamaguchi, K. Kikuchi, H. Nakagawa, O. Ibaragi, and M. Aoyagi, “40Gb/s parallel optical interconnection module for optical backplane application,” in Proceedings of Electronic Packaging Technology Conference, (Institute of Electrical and Electronics and Engineering Components, Packaging and Manufacturing Technology Society, Singapore, 2005), Vol. 1, pp. 367–370.

Swanson, S. E.

Tan, M.

J. A. Kash, F. Doany, D. Kuchta, P. Pepeljugoski, L. Schares, J. Schaub, C. Schow, J. Trewhella, C. Baks, Y. Kwark, C. Schuster, L. Shan, C. Patel, C. Tsang, J. Rosner, F. Libsch, R. Budd, P. Chiniwalla, D. Guckenberger, D. Kucharski, R. Dangel, B. Offrein, M. Tan, G. Trott, D. Lin, A. Tandon, and M. Nystrom, “Terabus: a chip-to-chip parallel optical interconnect,” in Proceedings of IEEE-LEOS Annual Meeting (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, Sydney, 2005), pp. 363–364.

Tan, M. R. T.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, L.Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” J. Sel. Top. Quantum Electron. 12, 1032–1044 (2006).
[Crossref]

Tanaka, S.

T. Ishigure, S. Tanaka, E. Kobayashi, and Y. Koike, “Accurate refractive index profiling in a graded-Index plastic optical fiber exceeding gigabit transmission rates,” J. Lightw. Technol. 20, 1449–1456 (2002).
[Crossref]

Tandon, A.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, L.Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” J. Sel. Top. Quantum Electron. 12, 1032–1044 (2006).
[Crossref]

J. A. Kash, F. Doany, D. Kuchta, P. Pepeljugoski, L. Schares, J. Schaub, C. Schow, J. Trewhella, C. Baks, Y. Kwark, C. Schuster, L. Shan, C. Patel, C. Tsang, J. Rosner, F. Libsch, R. Budd, P. Chiniwalla, D. Guckenberger, D. Kucharski, R. Dangel, B. Offrein, M. Tan, G. Trott, D. Lin, A. Tandon, and M. Nystrom, “Terabus: a chip-to-chip parallel optical interconnect,” in Proceedings of IEEE-LEOS Annual Meeting (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, Sydney, 2005), pp. 363–364.

Trewhella, J.

J. A. Kash, F. Doany, D. Kuchta, P. Pepeljugoski, L. Schares, J. Schaub, C. Schow, J. Trewhella, C. Baks, Y. Kwark, C. Schuster, L. Shan, C. Patel, C. Tsang, J. Rosner, F. Libsch, R. Budd, P. Chiniwalla, D. Guckenberger, D. Kucharski, R. Dangel, B. Offrein, M. Tan, G. Trott, D. Lin, A. Tandon, and M. Nystrom, “Terabus: a chip-to-chip parallel optical interconnect,” in Proceedings of IEEE-LEOS Annual Meeting (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, Sydney, 2005), pp. 363–364.

Trewhella, J. M.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, L.Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” J. Sel. Top. Quantum Electron. 12, 1032–1044 (2006).
[Crossref]

Trott, G.

J. A. Kash, F. Doany, D. Kuchta, P. Pepeljugoski, L. Schares, J. Schaub, C. Schow, J. Trewhella, C. Baks, Y. Kwark, C. Schuster, L. Shan, C. Patel, C. Tsang, J. Rosner, F. Libsch, R. Budd, P. Chiniwalla, D. Guckenberger, D. Kucharski, R. Dangel, B. Offrein, M. Tan, G. Trott, D. Lin, A. Tandon, and M. Nystrom, “Terabus: a chip-to-chip parallel optical interconnect,” in Proceedings of IEEE-LEOS Annual Meeting (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, Sydney, 2005), pp. 363–364.

Trott, G. R.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, L.Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” J. Sel. Top. Quantum Electron. 12, 1032–1044 (2006).
[Crossref]

Tsang, C.

J. A. Kash, F. Doany, D. Kuchta, P. Pepeljugoski, L. Schares, J. Schaub, C. Schow, J. Trewhella, C. Baks, Y. Kwark, C. Schuster, L. Shan, C. Patel, C. Tsang, J. Rosner, F. Libsch, R. Budd, P. Chiniwalla, D. Guckenberger, D. Kucharski, R. Dangel, B. Offrein, M. Tan, G. Trott, D. Lin, A. Tandon, and M. Nystrom, “Terabus: a chip-to-chip parallel optical interconnect,” in Proceedings of IEEE-LEOS Annual Meeting (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, Sydney, 2005), pp. 363–364.

Tsang, C. K.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, L.Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” J. Sel. Top. Quantum Electron. 12, 1032–1044 (2006).
[Crossref]

Wakazono, Y.

K. Suzuki, Y. Wakazono, A. Suzuki, S. Suzuki, T. Yamaguchi, K. Kikuchi, H. Nakagawa, O. Ibaragi, and M. Aoyagi, “40Gb/s parallel optical interconnection module for optical backplane application,” in Proceedings of Electronic Packaging Technology Conference, (Institute of Electrical and Electronics and Engineering Components, Packaging and Manufacturing Technology Society, Singapore, 2005), Vol. 1, pp. 367–370.

Yamaguchi, T.

K. Suzuki, Y. Wakazono, A. Suzuki, S. Suzuki, T. Yamaguchi, K. Kikuchi, H. Nakagawa, O. Ibaragi, and M. Aoyagi, “40Gb/s parallel optical interconnection module for optical backplane application,” in Proceedings of Electronic Packaging Technology Conference, (Institute of Electrical and Electronics and Engineering Components, Packaging and Manufacturing Technology Society, Singapore, 2005), Vol. 1, pp. 367–370.

Appl. Opt. (1)

IBM J. Res. & Dev. (1)

A. F. Benner, M. Ignatowski, J. Lash, D. M. Kuchta, and M. Ritter, “Exploitation of optical interconnects in future server architectures,” IBM J. Res. & Dev. 49, 755–776 (2005).
[Crossref]

J. Lightw. Technol. (1)

T. Ishigure, S. Tanaka, E. Kobayashi, and Y. Koike, “Accurate refractive index profiling in a graded-Index plastic optical fiber exceeding gigabit transmission rates,” J. Lightw. Technol. 20, 1449–1456 (2002).
[Crossref]

J. Lightwave Technol. (5)

J. Sel. Top. Quantum Electron. (1)

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, L.Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” J. Sel. Top. Quantum Electron. 12, 1032–1044 (2006).
[Crossref]

Other (4)

K. Suzuki, Y. Wakazono, A. Suzuki, S. Suzuki, T. Yamaguchi, K. Kikuchi, H. Nakagawa, O. Ibaragi, and M. Aoyagi, “40Gb/s parallel optical interconnection module for optical backplane application,” in Proceedings of Electronic Packaging Technology Conference, (Institute of Electrical and Electronics and Engineering Components, Packaging and Manufacturing Technology Society, Singapore, 2005), Vol. 1, pp. 367–370.

J. A. Kash, F. Doany, D. Kuchta, P. Pepeljugoski, L. Schares, J. Schaub, C. Schow, J. Trewhella, C. Baks, Y. Kwark, C. Schuster, L. Shan, C. Patel, C. Tsang, J. Rosner, F. Libsch, R. Budd, P. Chiniwalla, D. Guckenberger, D. Kucharski, R. Dangel, B. Offrein, M. Tan, G. Trott, D. Lin, A. Tandon, and M. Nystrom, “Terabus: a chip-to-chip parallel optical interconnect,” in Proceedings of IEEE-LEOS Annual Meeting (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, Sydney, 2005), pp. 363–364.

F. E. Doany, P. K. Pepeljugoski, A. C. Lehman, J. A. Kash, and R. Dangel, “Measurement of optical dispersion in multimode polymer waveguide,” in Proceedings of IEEE-LEOS Summer Topical Meeting Optical Interconnects & VLSI Photonics, (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, San Diego, 2004), pp. 31–32.

R. Dangel, U. Bapst, C. Berger, R. Beyeler, L. Dellmann, F. Horst, B. Offrein, and G.-L. Bona, “Development of a low-cost low-loss polymer waveguide technology for parallel optical interconnect applications,” in Proceedings of IEEE-LEOS Summer Topical Meeting Optical Interconnects & VLSI Photonics, (Institute of Electrical and Electronics and Engineering - Lasers and Electro-Optics Society, San Diego, 2004), pp. 29–30.

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Figures (9)

Fig. 1.
Fig. 1.

Schematic representation of waveguide fabrication process by the preform method.

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Fig. 2.
Fig. 2.

Photographs of cross-section of waveguides (a)Waveguide A: 100 μm-diameter cores with 116-μm pitch (light beam from a 650-nm LD is coupled to the far-right core) (b)Waveguide B: 50 μm-diameter cores with 58-μm pitch

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Fig. 3.
Fig. 3.

Interference fringe pattern on the cross-section of polymer waveguide (Waveguide B).

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Fig. 4.
Fig. 4.

Refractive index profile obtained from the fringe pattern shown in Fig. 3.

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Fig. 5.
Fig. 5.

Results of the loss measurement by the cut-back process for Waveguide C.

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Fig. 6.
Fig. 6.

Observed NFP image (Bottom) and intensity profile on radial direction (Top) from a channel of 100-μm core waveguide (Waveguide A). (a) launched via 100-μm core MMF probe (b) launched via 50-μm core MMF probe (c) launched via 9-μm core SMF probe

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Fig. 7.
Fig. 7.

Output pulse and reference pulse waveforms of (a) 5-m long waveguide with graded-index core (Waveguide B) and (b) 1-m long SI POF for 850 nm.

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Fig. 8.
Fig. 8.

Eye diagrams at 12.5 Gbps (a) back-to-back and (b) after propagation through 3-m waveguide (130-μm core).

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Fig. 9.
Fig. 9.

Eye diagrams at 10 Gbps for 850 nm (a): after propagation through 1-m waveguide (130-μm core) when optical output power is −12.5 dBm, and (b): after propagation through 1-m SI POF when optical output power is −12.42 dBm.

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Tables (2)

Tables Icon

Table 1. Propagation Loss of Each Channel in Polymer Waveguide with Circular Graded-Index Cores.

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Table 2. Output Pulse Broadening and -3dB Bandwidth of a channel in Polymer Waveguide with Circular Graded-Index Cores.

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