C. Monat, C. Seassal, X. Letartre, P. Viktorovitch, P. Regreny, M. Gendry, P. Rojo-Romeo, G. Hollinger E. Jalaguier, S. Pocas, and B. Aspar, "InP 2D photonic crystal microlasers on silicon wafer: room temperature
operation at 1.55μm," Electron. Lett. 37, 764-765 (2001).
W. Bogaerts, R. Baets, P. Dumon, V. Wiaux, S. Beckx, D. Taillaert, B. Luyssaert, J. Van Campenhout, P. Bienstman, and D. Vanthourhout. "Nanophotonic waveguides in silicon-on-insulator fabricated with CMOS
technology," IEEE J. Lightwave Technol. 23, 401-412 (2005).
I. Christiaens, G. Roelkens, K. De Mesel, D. Van Thourhout, and R. Baets, "Thin film devices fabricated with BCB wafer bonding," IEEE J. Lightwave Technol. 23, 517-522 (2005).
D. Taillaert, H. Chong, P. Borel, L. Frandsen, R. De La Rue, and R. Baets, "A compact two-dimensional grating coupler used as a polarization splitter," IEEE Photon. Technol. Lett. 15, 1249-1251 (2003).
P. Dumon, W. Bogaerts, V. Wiaux, J. Wouters, S. Beckx, J. Van Campenhout, D. Taillaert, B. Luyssaert, P Bienstman, D. Van Thourhout, and R. Baets, "Low-loss SOI photonic wires and ring resonators fabricated
with deep UV lithography," IEEE Photonics Technol. Lett. 16, 1328-1330 (2004).
O. I. Dusumnu, D. D. Cannon, M. K. Emsley, L. C. Kimerling, and M. S. Ünlü, "High-speed resonant cavity enhanced Ge photodetectors on reflecting Si substrates for 1550nm operation", IEEE Photonics Technol. Lett. 17, 175-177 (2005).
Y. T. Sun, K. Baskar, and S. Lourdudoss, "Thermal strain in Indium Phosphide on Silicon obtained by epitaxial lateral overgrowth," J. Appl. Phys. 94, 2746-2748 (2003).
H. Rong, R. Jones, A. Liu, O. Cohen, D. Hak, A. Fang, and M. Paniccia, "A continuous-wave Raman silicon laser," Nature 433, 725-728 (2005).
Z. Yu, R. Droopad, D. Jordan, J. Curless, Y. Liang, C. Overgaard, H. Li, A. Talin, T. Eschrich, B. Craigo, K. Eisenbeiser, R. Emrick, J. Finder, X. Hu, Y. Wei, J. Edwards, D. Convey, K. Moore, D. Marshall, J. Ramdani, L. Tisinger, W. Ooms, M. O'Steen, F. Towner, and T. Hierl, "GaAs-based heterostructures on silicon," GaAs Manufacturing Technol., paper 13E (2002).
F. Niklaus, P. Enoksson, E. Kalvesten, and G. Stemme, "Void-free full wafer adhesive bonding," 13th annual conference on MEMS, 247-252 (2000)
G. Roelkens, D. Van Thourhout, and R. Baets, "Heterogeneous integration of III-V membrane devices and ultracompact SOI waveguides," LEOS Summer Topicals, 23-24 (2004)
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