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Low loss silicon on insulator photonic crystal waveguides made by 193nm optical lithography

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Abstract

We show the successful fabrication and operation of photonic crystal waveguides on SOI, with lower silicon dioxide cladding remaining, using 193 nm DUV lithography. We demonstrate that 193 nm lithography gives more process latitude, allowing a wider range of periods and hole diameters to be printed, as well as reducing the optical proximity effect to a minimum. The smallest period /hole size variation printed successfully was 280 nm and 150 nm, which is very promising for ambitious future designs. Lowest losses obtained were 14.2 ± 2.0 dB/cm for a W1 waveguide in a 400 nm lattice with an r/a of 0.25 at a frequency of 0.257 a/λ, which approaches the best losses reported for air-bridge type W1s.

©2006 Optical Society of America

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Figures (5)

Fig. 1.
Fig. 1. Cross section of PhC crystal holes, period 280nm and diameter 152nm.
Fig. 2.
Fig. 2. Top view of a photonic crystal lattice printed without proximity correction using 193 nm lithography. The top line of holes constitutes a row of border holes; where as the rest of the holes can be considered as bulk lattice. Image analysis conducted by fitting a best circle to each hole yielded a size of 194.3 ± 2.3 nm for the border holes, and 195.3 ± 2.0 nm for the bulk lattice holes. The optical proximity effect is therefore smaller than the hole size variation and thus negligible.
Fig. 3.
Fig. 3. Propagation loss for W1 PhC waveguide determined by the cut-back method.
Fig. 4.
Fig. 4. Bandstructure and corresponding transmission window of the asymmetric oxide-clad W1 waveguide. The spectrum corresponds to the loss determined by the cut-back method across seven lengths.
Fig. 5.
Fig. 5. TE transmission (in dB/cm) and corresponding TM conversion (in arb. units). Both traces were obtained for TE excitation.
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