F. E. Doany, C. L. Schow, C. Baks, R. Budd, Y.-J. Chang, P. Pepeljugoski, L. Schares, D. Kuchta, R. John, J. A. Kash, and F. Libsch, “160 Gb/s bidirectional parallel optical transceiver module for board-level interconnects using single-chip CMOS IC,” in Proceedings of IEEE Electronic Components and Technology Conference, 1256–1261 (2007).
F. E. Doany, C. L. Schow, C. Baks, R. Budd, Y.-J. Chang, P. Pepeljugoski, L. Schares, D. Kuchta, R. John, J. A. Kash, and F. Libsch, “160 Gb/s bidirectional parallel optical transceiver module for board-level interconnects using single-chip CMOS IC,” in Proceedings of IEEE Electronic Components and Technology Conference, 1256–1261 (2007).
F. E. Doany, C. L. Schow, C. Baks, R. Budd, Y.-J. Chang, P. Pepeljugoski, L. Schares, D. Kuchta, R. John, J. A. Kash, and F. Libsch, “160 Gb/s bidirectional parallel optical transceiver module for board-level interconnects using single-chip CMOS IC,” in Proceedings of IEEE Electronic Components and Technology Conference, 1256–1261 (2007).
H. S. Cho, K.-M. Chu, S.-K. Kang, S. H. Hwang, B. S. Rho, W. H. Kim, J.-S. Kim, J.-J. Kim, and H.-H. Park, “Compact packaging of optical and electronic components for on-board optical interconnects,” IEEE Trans. Compon. Packag. Technol. 28, 114–120 (2005).
H. S. Cho, K.-M. Chu, S.-K. Kang, S. H. Hwang, B. S. Rho, W. H. Kim, J.-S. Kim, J.-J. Kim, and H.-H. Park, “Compact packaging of optical and electronic components for on-board optical interconnects,” IEEE Trans. Compon. Packag. Technol. 28, 114–120 (2005).
F. E. Doany, C. L. Schow, C. Baks, R. Budd, Y.-J. Chang, P. Pepeljugoski, L. Schares, D. Kuchta, R. John, J. A. Kash, and F. Libsch, “160 Gb/s bidirectional parallel optical transceiver module for board-level interconnects using single-chip CMOS IC,” in Proceedings of IEEE Electronic Components and Technology Conference, 1256–1261 (2007).
M. Hikita, R. Yoshimura, M. Usui, S. Tomaru, and S. Imamura, “Polymeric optical waveguides for optical interconnections,” Thin Solid Films 331, 303–308 (1998).
[Crossref]
H. S. Cho, K.-M. Chu, S.-K. Kang, S. H. Hwang, B. S. Rho, W. H. Kim, J.-S. Kim, J.-J. Kim, and H.-H. Park, “Compact packaging of optical and electronic components for on-board optical interconnects,” IEEE Trans. Compon. Packag. Technol. 28, 114–120 (2005).
M. Hikita, R. Yoshimura, M. Usui, S. Tomaru, and S. Imamura, “Polymeric optical waveguides for optical interconnections,” Thin Solid Films 331, 303–308 (1998).
[Crossref]
F. E. Doany, C. L. Schow, C. Baks, R. Budd, Y.-J. Chang, P. Pepeljugoski, L. Schares, D. Kuchta, R. John, J. A. Kash, and F. Libsch, “160 Gb/s bidirectional parallel optical transceiver module for board-level interconnects using single-chip CMOS IC,” in Proceedings of IEEE Electronic Components and Technology Conference, 1256–1261 (2007).
H. S. Cho, K.-M. Chu, S.-K. Kang, S. H. Hwang, B. S. Rho, W. H. Kim, J.-S. Kim, J.-J. Kim, and H.-H. Park, “Compact packaging of optical and electronic components for on-board optical interconnects,” IEEE Trans. Compon. Packag. Technol. 28, 114–120 (2005).
F. E. Doany, C. L. Schow, C. Baks, R. Budd, Y.-J. Chang, P. Pepeljugoski, L. Schares, D. Kuchta, R. John, J. A. Kash, and F. Libsch, “160 Gb/s bidirectional parallel optical transceiver module for board-level interconnects using single-chip CMOS IC,” in Proceedings of IEEE Electronic Components and Technology Conference, 1256–1261 (2007).
H. S. Cho, K.-M. Chu, S.-K. Kang, S. H. Hwang, B. S. Rho, W. H. Kim, J.-S. Kim, J.-J. Kim, and H.-H. Park, “Compact packaging of optical and electronic components for on-board optical interconnects,” IEEE Trans. Compon. Packag. Technol. 28, 114–120 (2005).
H. S. Cho, K.-M. Chu, S.-K. Kang, S. H. Hwang, B. S. Rho, W. H. Kim, J.-S. Kim, J.-J. Kim, and H.-H. Park, “Compact packaging of optical and electronic components for on-board optical interconnects,” IEEE Trans. Compon. Packag. Technol. 28, 114–120 (2005).
H. S. Cho, K.-M. Chu, S.-K. Kang, S. H. Hwang, B. S. Rho, W. H. Kim, J.-S. Kim, J.-J. Kim, and H.-H. Park, “Compact packaging of optical and electronic components for on-board optical interconnects,” IEEE Trans. Compon. Packag. Technol. 28, 114–120 (2005).
F. E. Doany, C. L. Schow, C. Baks, R. Budd, Y.-J. Chang, P. Pepeljugoski, L. Schares, D. Kuchta, R. John, J. A. Kash, and F. Libsch, “160 Gb/s bidirectional parallel optical transceiver module for board-level interconnects using single-chip CMOS IC,” in Proceedings of IEEE Electronic Components and Technology Conference, 1256–1261 (2007).
F. E. Doany, C. L. Schow, C. Baks, R. Budd, Y.-J. Chang, P. Pepeljugoski, L. Schares, D. Kuchta, R. John, J. A. Kash, and F. Libsch, “160 Gb/s bidirectional parallel optical transceiver module for board-level interconnects using single-chip CMOS IC,” in Proceedings of IEEE Electronic Components and Technology Conference, 1256–1261 (2007).
H. S. Cho, K.-M. Chu, S.-K. Kang, S. H. Hwang, B. S. Rho, W. H. Kim, J.-S. Kim, J.-J. Kim, and H.-H. Park, “Compact packaging of optical and electronic components for on-board optical interconnects,” IEEE Trans. Compon. Packag. Technol. 28, 114–120 (2005).
I.-K. Cho, K. B. Yoon, S. H. Ahn, H.-K. Sung, S. W. Ha, Y. U. Heo, and H.-H. Park, “Experimental demonstration of 10 Gbit/s transmission with an optical backplane system using optical slots,” Opt. Lett. 30, 1635–1637 (2005).
[Crossref]
[PubMed]
F. E. Doany, C. L. Schow, C. Baks, R. Budd, Y.-J. Chang, P. Pepeljugoski, L. Schares, D. Kuchta, R. John, J. A. Kash, and F. Libsch, “160 Gb/s bidirectional parallel optical transceiver module for board-level interconnects using single-chip CMOS IC,” in Proceedings of IEEE Electronic Components and Technology Conference, 1256–1261 (2007).
H. S. Cho, K.-M. Chu, S.-K. Kang, S. H. Hwang, B. S. Rho, W. H. Kim, J.-S. Kim, J.-J. Kim, and H.-H. Park, “Compact packaging of optical and electronic components for on-board optical interconnects,” IEEE Trans. Compon. Packag. Technol. 28, 114–120 (2005).
N. Savage, “Linking with light,” IEEE Spectrum 39, 32–36 (2002).
[Crossref]
F. E. Doany, C. L. Schow, C. Baks, R. Budd, Y.-J. Chang, P. Pepeljugoski, L. Schares, D. Kuchta, R. John, J. A. Kash, and F. Libsch, “160 Gb/s bidirectional parallel optical transceiver module for board-level interconnects using single-chip CMOS IC,” in Proceedings of IEEE Electronic Components and Technology Conference, 1256–1261 (2007).
F. E. Doany, C. L. Schow, C. Baks, R. Budd, Y.-J. Chang, P. Pepeljugoski, L. Schares, D. Kuchta, R. John, J. A. Kash, and F. Libsch, “160 Gb/s bidirectional parallel optical transceiver module for board-level interconnects using single-chip CMOS IC,” in Proceedings of IEEE Electronic Components and Technology Conference, 1256–1261 (2007).
M. Hikita, R. Yoshimura, M. Usui, S. Tomaru, and S. Imamura, “Polymeric optical waveguides for optical interconnections,” Thin Solid Films 331, 303–308 (1998).
[Crossref]
M. Hikita, R. Yoshimura, M. Usui, S. Tomaru, and S. Imamura, “Polymeric optical waveguides for optical interconnections,” Thin Solid Films 331, 303–308 (1998).
[Crossref]
M. Hikita, R. Yoshimura, M. Usui, S. Tomaru, and S. Imamura, “Polymeric optical waveguides for optical interconnections,” Thin Solid Films 331, 303–308 (1998).
[Crossref]
N. Savage, “Linking with light,” IEEE Spectrum 39, 32–36 (2002).
[Crossref]
H. S. Cho, K.-M. Chu, S.-K. Kang, S. H. Hwang, B. S. Rho, W. H. Kim, J.-S. Kim, J.-J. Kim, and H.-H. Park, “Compact packaging of optical and electronic components for on-board optical interconnects,” IEEE Trans. Compon. Packag. Technol. 28, 114–120 (2005).
M. Hikita, R. Yoshimura, M. Usui, S. Tomaru, and S. Imamura, “Polymeric optical waveguides for optical interconnections,” Thin Solid Films 331, 303–308 (1998).
[Crossref]
F. E. Doany, C. L. Schow, C. Baks, R. Budd, Y.-J. Chang, P. Pepeljugoski, L. Schares, D. Kuchta, R. John, J. A. Kash, and F. Libsch, “160 Gb/s bidirectional parallel optical transceiver module for board-level interconnects using single-chip CMOS IC,” in Proceedings of IEEE Electronic Components and Technology Conference, 1256–1261 (2007).