Abstract

A new optical interconnection scheme based on a rigid flexible optical electrical printed circuit board (RFOE-PCB) is suggested. The easily installed RFOE-PCB can be universally applied for both chip- and board-level optical interconnections. This letter describes the detailed fabrication process, optical properties, and heat-resisting property of the RFOE-PCB. The fabricated RFOE-PCB was also successfully demonstrated with a 2.5-Gb/s data transmission through a 45°-ended optical waveguide embedded in the RFOE-PCB.

©2008 Optical Society of America

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References

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  1. N. Savage, “Linking with light,” IEEE Spectrum 39, 32–36 (2002).
    [Crossref]
  2. I.-K. Cho, K. B. Yoon, S. H. Ahn, H.-K. Sung, S. W. Ha, Y. U. Heo, and H.-H. Park, “Experimental demonstration of 10 Gbit/s transmission with an optical backplane system using optical slots,” Opt. Lett. 30, 1635–1637 (2005).
    [Crossref] [PubMed]
  3. F. E. Doany, C. L. Schow, C. Baks, R. Budd, Y.-J. Chang, P. Pepeljugoski, L. Schares, D. Kuchta, R. John, J. A. Kash, and F. Libsch, “160 Gb/s bidirectional parallel optical transceiver module for board-level interconnects using single-chip CMOS IC,” in Proceedings of IEEE Electronic Components and Technology Conference, 1256–1261 (2007).
  4. H. S. Cho, K.-M. Chu, S.-K. Kang, S. H. Hwang, B. S. Rho, W. H. Kim, J.-S. Kim, J.-J. Kim, and H.-H. Park, “Compact packaging of optical and electronic components for on-board optical interconnects,” IEEE Trans. Compon. Packag. Technol. 28, 114–120 (2005).
  5. M. Hikita, R. Yoshimura, M. Usui, S. Tomaru, and S. Imamura, “Polymeric optical waveguides for optical interconnections,” Thin Solid Films 331, 303–308 (1998).
    [Crossref]

2005 (2)

H. S. Cho, K.-M. Chu, S.-K. Kang, S. H. Hwang, B. S. Rho, W. H. Kim, J.-S. Kim, J.-J. Kim, and H.-H. Park, “Compact packaging of optical and electronic components for on-board optical interconnects,” IEEE Trans. Compon. Packag. Technol. 28, 114–120 (2005).

I.-K. Cho, K. B. Yoon, S. H. Ahn, H.-K. Sung, S. W. Ha, Y. U. Heo, and H.-H. Park, “Experimental demonstration of 10 Gbit/s transmission with an optical backplane system using optical slots,” Opt. Lett. 30, 1635–1637 (2005).
[Crossref] [PubMed]

2002 (1)

N. Savage, “Linking with light,” IEEE Spectrum 39, 32–36 (2002).
[Crossref]

1998 (1)

M. Hikita, R. Yoshimura, M. Usui, S. Tomaru, and S. Imamura, “Polymeric optical waveguides for optical interconnections,” Thin Solid Films 331, 303–308 (1998).
[Crossref]

Ahn, S. H.

Baks, C.

F. E. Doany, C. L. Schow, C. Baks, R. Budd, Y.-J. Chang, P. Pepeljugoski, L. Schares, D. Kuchta, R. John, J. A. Kash, and F. Libsch, “160 Gb/s bidirectional parallel optical transceiver module for board-level interconnects using single-chip CMOS IC,” in Proceedings of IEEE Electronic Components and Technology Conference, 1256–1261 (2007).

Budd, R.

F. E. Doany, C. L. Schow, C. Baks, R. Budd, Y.-J. Chang, P. Pepeljugoski, L. Schares, D. Kuchta, R. John, J. A. Kash, and F. Libsch, “160 Gb/s bidirectional parallel optical transceiver module for board-level interconnects using single-chip CMOS IC,” in Proceedings of IEEE Electronic Components and Technology Conference, 1256–1261 (2007).

Chang, Y.-J.

F. E. Doany, C. L. Schow, C. Baks, R. Budd, Y.-J. Chang, P. Pepeljugoski, L. Schares, D. Kuchta, R. John, J. A. Kash, and F. Libsch, “160 Gb/s bidirectional parallel optical transceiver module for board-level interconnects using single-chip CMOS IC,” in Proceedings of IEEE Electronic Components and Technology Conference, 1256–1261 (2007).

Cho, H. S.

H. S. Cho, K.-M. Chu, S.-K. Kang, S. H. Hwang, B. S. Rho, W. H. Kim, J.-S. Kim, J.-J. Kim, and H.-H. Park, “Compact packaging of optical and electronic components for on-board optical interconnects,” IEEE Trans. Compon. Packag. Technol. 28, 114–120 (2005).

Cho, I.-K.

Chu, K.-M.

H. S. Cho, K.-M. Chu, S.-K. Kang, S. H. Hwang, B. S. Rho, W. H. Kim, J.-S. Kim, J.-J. Kim, and H.-H. Park, “Compact packaging of optical and electronic components for on-board optical interconnects,” IEEE Trans. Compon. Packag. Technol. 28, 114–120 (2005).

Doany, F. E.

F. E. Doany, C. L. Schow, C. Baks, R. Budd, Y.-J. Chang, P. Pepeljugoski, L. Schares, D. Kuchta, R. John, J. A. Kash, and F. Libsch, “160 Gb/s bidirectional parallel optical transceiver module for board-level interconnects using single-chip CMOS IC,” in Proceedings of IEEE Electronic Components and Technology Conference, 1256–1261 (2007).

Ha, S. W.

Heo, Y. U.

Hikita, M.

M. Hikita, R. Yoshimura, M. Usui, S. Tomaru, and S. Imamura, “Polymeric optical waveguides for optical interconnections,” Thin Solid Films 331, 303–308 (1998).
[Crossref]

Hwang, S. H.

H. S. Cho, K.-M. Chu, S.-K. Kang, S. H. Hwang, B. S. Rho, W. H. Kim, J.-S. Kim, J.-J. Kim, and H.-H. Park, “Compact packaging of optical and electronic components for on-board optical interconnects,” IEEE Trans. Compon. Packag. Technol. 28, 114–120 (2005).

Imamura, S.

M. Hikita, R. Yoshimura, M. Usui, S. Tomaru, and S. Imamura, “Polymeric optical waveguides for optical interconnections,” Thin Solid Films 331, 303–308 (1998).
[Crossref]

John, R.

F. E. Doany, C. L. Schow, C. Baks, R. Budd, Y.-J. Chang, P. Pepeljugoski, L. Schares, D. Kuchta, R. John, J. A. Kash, and F. Libsch, “160 Gb/s bidirectional parallel optical transceiver module for board-level interconnects using single-chip CMOS IC,” in Proceedings of IEEE Electronic Components and Technology Conference, 1256–1261 (2007).

Kang, S.-K.

H. S. Cho, K.-M. Chu, S.-K. Kang, S. H. Hwang, B. S. Rho, W. H. Kim, J.-S. Kim, J.-J. Kim, and H.-H. Park, “Compact packaging of optical and electronic components for on-board optical interconnects,” IEEE Trans. Compon. Packag. Technol. 28, 114–120 (2005).

Kash, J. A.

F. E. Doany, C. L. Schow, C. Baks, R. Budd, Y.-J. Chang, P. Pepeljugoski, L. Schares, D. Kuchta, R. John, J. A. Kash, and F. Libsch, “160 Gb/s bidirectional parallel optical transceiver module for board-level interconnects using single-chip CMOS IC,” in Proceedings of IEEE Electronic Components and Technology Conference, 1256–1261 (2007).

Kim, J.-J.

H. S. Cho, K.-M. Chu, S.-K. Kang, S. H. Hwang, B. S. Rho, W. H. Kim, J.-S. Kim, J.-J. Kim, and H.-H. Park, “Compact packaging of optical and electronic components for on-board optical interconnects,” IEEE Trans. Compon. Packag. Technol. 28, 114–120 (2005).

Kim, J.-S.

H. S. Cho, K.-M. Chu, S.-K. Kang, S. H. Hwang, B. S. Rho, W. H. Kim, J.-S. Kim, J.-J. Kim, and H.-H. Park, “Compact packaging of optical and electronic components for on-board optical interconnects,” IEEE Trans. Compon. Packag. Technol. 28, 114–120 (2005).

Kim, W. H.

H. S. Cho, K.-M. Chu, S.-K. Kang, S. H. Hwang, B. S. Rho, W. H. Kim, J.-S. Kim, J.-J. Kim, and H.-H. Park, “Compact packaging of optical and electronic components for on-board optical interconnects,” IEEE Trans. Compon. Packag. Technol. 28, 114–120 (2005).

Kuchta, D.

F. E. Doany, C. L. Schow, C. Baks, R. Budd, Y.-J. Chang, P. Pepeljugoski, L. Schares, D. Kuchta, R. John, J. A. Kash, and F. Libsch, “160 Gb/s bidirectional parallel optical transceiver module for board-level interconnects using single-chip CMOS IC,” in Proceedings of IEEE Electronic Components and Technology Conference, 1256–1261 (2007).

Libsch, F.

F. E. Doany, C. L. Schow, C. Baks, R. Budd, Y.-J. Chang, P. Pepeljugoski, L. Schares, D. Kuchta, R. John, J. A. Kash, and F. Libsch, “160 Gb/s bidirectional parallel optical transceiver module for board-level interconnects using single-chip CMOS IC,” in Proceedings of IEEE Electronic Components and Technology Conference, 1256–1261 (2007).

Park, H.-H.

H. S. Cho, K.-M. Chu, S.-K. Kang, S. H. Hwang, B. S. Rho, W. H. Kim, J.-S. Kim, J.-J. Kim, and H.-H. Park, “Compact packaging of optical and electronic components for on-board optical interconnects,” IEEE Trans. Compon. Packag. Technol. 28, 114–120 (2005).

I.-K. Cho, K. B. Yoon, S. H. Ahn, H.-K. Sung, S. W. Ha, Y. U. Heo, and H.-H. Park, “Experimental demonstration of 10 Gbit/s transmission with an optical backplane system using optical slots,” Opt. Lett. 30, 1635–1637 (2005).
[Crossref] [PubMed]

Pepeljugoski, P.

F. E. Doany, C. L. Schow, C. Baks, R. Budd, Y.-J. Chang, P. Pepeljugoski, L. Schares, D. Kuchta, R. John, J. A. Kash, and F. Libsch, “160 Gb/s bidirectional parallel optical transceiver module for board-level interconnects using single-chip CMOS IC,” in Proceedings of IEEE Electronic Components and Technology Conference, 1256–1261 (2007).

Rho, B. S.

H. S. Cho, K.-M. Chu, S.-K. Kang, S. H. Hwang, B. S. Rho, W. H. Kim, J.-S. Kim, J.-J. Kim, and H.-H. Park, “Compact packaging of optical and electronic components for on-board optical interconnects,” IEEE Trans. Compon. Packag. Technol. 28, 114–120 (2005).

Savage, N.

N. Savage, “Linking with light,” IEEE Spectrum 39, 32–36 (2002).
[Crossref]

Schares, L.

F. E. Doany, C. L. Schow, C. Baks, R. Budd, Y.-J. Chang, P. Pepeljugoski, L. Schares, D. Kuchta, R. John, J. A. Kash, and F. Libsch, “160 Gb/s bidirectional parallel optical transceiver module for board-level interconnects using single-chip CMOS IC,” in Proceedings of IEEE Electronic Components and Technology Conference, 1256–1261 (2007).

Schow, C. L.

F. E. Doany, C. L. Schow, C. Baks, R. Budd, Y.-J. Chang, P. Pepeljugoski, L. Schares, D. Kuchta, R. John, J. A. Kash, and F. Libsch, “160 Gb/s bidirectional parallel optical transceiver module for board-level interconnects using single-chip CMOS IC,” in Proceedings of IEEE Electronic Components and Technology Conference, 1256–1261 (2007).

Sung, H.-K.

Tomaru, S.

M. Hikita, R. Yoshimura, M. Usui, S. Tomaru, and S. Imamura, “Polymeric optical waveguides for optical interconnections,” Thin Solid Films 331, 303–308 (1998).
[Crossref]

Usui, M.

M. Hikita, R. Yoshimura, M. Usui, S. Tomaru, and S. Imamura, “Polymeric optical waveguides for optical interconnections,” Thin Solid Films 331, 303–308 (1998).
[Crossref]

Yoon, K. B.

Yoshimura, R.

M. Hikita, R. Yoshimura, M. Usui, S. Tomaru, and S. Imamura, “Polymeric optical waveguides for optical interconnections,” Thin Solid Films 331, 303–308 (1998).
[Crossref]

IEEE Spectrum (1)

N. Savage, “Linking with light,” IEEE Spectrum 39, 32–36 (2002).
[Crossref]

IEEE Trans. Compon. Packag. Technol. (1)

H. S. Cho, K.-M. Chu, S.-K. Kang, S. H. Hwang, B. S. Rho, W. H. Kim, J.-S. Kim, J.-J. Kim, and H.-H. Park, “Compact packaging of optical and electronic components for on-board optical interconnects,” IEEE Trans. Compon. Packag. Technol. 28, 114–120 (2005).

Opt. Lett. (1)

Thin Solid Films (1)

M. Hikita, R. Yoshimura, M. Usui, S. Tomaru, and S. Imamura, “Polymeric optical waveguides for optical interconnections,” Thin Solid Films 331, 303–308 (1998).
[Crossref]

Other (1)

F. E. Doany, C. L. Schow, C. Baks, R. Budd, Y.-J. Chang, P. Pepeljugoski, L. Schares, D. Kuchta, R. John, J. A. Kash, and F. Libsch, “160 Gb/s bidirectional parallel optical transceiver module for board-level interconnects using single-chip CMOS IC,” in Proceedings of IEEE Electronic Components and Technology Conference, 1256–1261 (2007).

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Figures (6)

Fig. 1.
Fig. 1. Conceptual drawings of (a) the proposed optical interconnected system and (b) the multi chip module platform based on the RFOE-PCB.

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Fig. 2.
Fig. 2. Fabrication process of the RFOE-PCB.

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Fig. 3.
Fig. 3. Photographs of the completed RFOE-PCB, the used flexible optical waveguide, and an emitted beam at the output port.

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Fig. 4.
Fig. 4. Comparison of the bending losses between the measured data and the simulated data.

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Fig. 5.
Fig. 5. Results after the reflow test. (a) Condition of the reflow test. Photographs of cross-sectional facet of the flexible OE-PCB (b) before and (c) after the reflow test. (d) Variation in insertion losses before and after the reflow test.

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Fig. 6.
Fig. 6. Measured 2.5-Gb/s eye diagram with 20% eye margin through the fabricated RFOE-PCB.

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