Abstract
It is shown that it is promising to use the RGB data of bright-field optical microscopy to efficiently monitor the surface cleanliness of the active elements of semiconductor wafers in the planar production cycle. It is demonstrated that the film thickness on a substrate surface can be determined from RGB data obtained by means of a photosensor based on a Bayer array with known spectral response. An example shows how to use it on a GaAs semiconductor wafer with metallized active gold elements. Software has been developed for channel-by-channel comparison of a discriminated region of two pictures. An algorithm is presented for obtaining micrographs that can subsequently be analyzed and compared.
© 2020 Optical Society of America
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