Abstract

A mathematical model of the thermophysical processes that occur on the contact area between a heat-emitting element (a diamond grain) and the heat-dissipating (bonding) material is proposed for the grinding and polishing of optical materials using bonded diamond-abrasive tools. The results obtained illustrate the influence of the diamond grain size used in the bonded tool on the temperature field profile at the tool contact area and the correlation between the acceptable diamond grain size and the thermophysical properties of the binder material.

© 2020 Optical Society of America

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