Abstract

This paper discusses the design optimization of LEDs fabricated using chip-on-board technology. Light losses are analyzed, and an attempt is made to create an optical element that maximizes the light-output efficiency from the chips. Experimental measurements of test samples are made, and optimization calculations are carried out using the Zemax software package. As a result of the studies, an optimized shape of the optical element is obtained that makes it possible to reduce the light losses in the device by 10% by comparison with the initial design.

© 2014 Optical Society of America

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  1. O.  Kückmann, “High-power LED arrays special requirements on packaging technology,” Proc. SPIE 6134, 613404 (2006).
    [CrossRef]
  2. P.  Hartmann, F. P.  Wenzl, C.  Sommer, P.  Pachler, H.  Hoschopf, M.  Schweighart, M.  Hartmann, L.  Kuna, G.  Jakopic, G.  Leising, S.  Tasch, “White LEDs and modules in chip-on-board technology for general lighting,” Proc. SPIE 6337, 63370I (2006).
    [CrossRef]
  3. A. I.  Zhmakin, “Enhancement of light extraction from light-emitting diodes,” Phys. Rep. 498, 189 (2011).
    [CrossRef]
  4. Y.-K.  Ee, P.  Kumnorkaew, R. A.  Arif, H.  Tong, H.  Zhao, J. F.  Gilchrist, N.  Tansu, “Optimization of light-extraction efficiency of III-nitride LEDs with self-assembled colloidal-based microlenses,” IEEE J. Sel. Topics Quantum Electron. 15, 1218 (2009).
  5. K.  Bao, B.  Zhang, X. N.  Kang, T.  Dai, C.  Xiong, G. Y.  Zhang, Y.  Chen, “Improvement of light extraction from micro-pattern encapsulated GaN-based LED by imprinting,” Proc. SPIE 6910, 69100N (2008).
    [CrossRef]
  6. S. A.  Joo, J. K.  Park, K. Y.  Ko, Y. J.  Jeong, S. H.  Choi, “Light-emitting diode package,” U.S. patent8 168 997 (2012).
  7. X.  Tao, “Surface-textured encapsulations for use with light-emitting diodes,” U.S. patent application publication 2011/0316006 (2011).
  8. O. E.  Kruglov, V. N.  Kuz’min, K. A.  Tomskiĭ, “Measurement of the light flux of LEDs,” Svetotekhnika No. 3, 34 (2009).
  9. L.  Szirmay-Kalos, Monte-Carlo Methods in Global Illumination (Institute of Computer Graphics, Vienna, 2000).
  10. Zemax User’s Manual, January2012.

2011 (1)

A. I.  Zhmakin, “Enhancement of light extraction from light-emitting diodes,” Phys. Rep. 498, 189 (2011).
[CrossRef]

2009 (2)

Y.-K.  Ee, P.  Kumnorkaew, R. A.  Arif, H.  Tong, H.  Zhao, J. F.  Gilchrist, N.  Tansu, “Optimization of light-extraction efficiency of III-nitride LEDs with self-assembled colloidal-based microlenses,” IEEE J. Sel. Topics Quantum Electron. 15, 1218 (2009).

O. E.  Kruglov, V. N.  Kuz’min, K. A.  Tomskiĭ, “Measurement of the light flux of LEDs,” Svetotekhnika No. 3, 34 (2009).

2008 (1)

K.  Bao, B.  Zhang, X. N.  Kang, T.  Dai, C.  Xiong, G. Y.  Zhang, Y.  Chen, “Improvement of light extraction from micro-pattern encapsulated GaN-based LED by imprinting,” Proc. SPIE 6910, 69100N (2008).
[CrossRef]

2006 (2)

O.  Kückmann, “High-power LED arrays special requirements on packaging technology,” Proc. SPIE 6134, 613404 (2006).
[CrossRef]

P.  Hartmann, F. P.  Wenzl, C.  Sommer, P.  Pachler, H.  Hoschopf, M.  Schweighart, M.  Hartmann, L.  Kuna, G.  Jakopic, G.  Leising, S.  Tasch, “White LEDs and modules in chip-on-board technology for general lighting,” Proc. SPIE 6337, 63370I (2006).
[CrossRef]

Arif, R. A.

Y.-K.  Ee, P.  Kumnorkaew, R. A.  Arif, H.  Tong, H.  Zhao, J. F.  Gilchrist, N.  Tansu, “Optimization of light-extraction efficiency of III-nitride LEDs with self-assembled colloidal-based microlenses,” IEEE J. Sel. Topics Quantum Electron. 15, 1218 (2009).

Bao, K.

K.  Bao, B.  Zhang, X. N.  Kang, T.  Dai, C.  Xiong, G. Y.  Zhang, Y.  Chen, “Improvement of light extraction from micro-pattern encapsulated GaN-based LED by imprinting,” Proc. SPIE 6910, 69100N (2008).
[CrossRef]

Chen, Y.

K.  Bao, B.  Zhang, X. N.  Kang, T.  Dai, C.  Xiong, G. Y.  Zhang, Y.  Chen, “Improvement of light extraction from micro-pattern encapsulated GaN-based LED by imprinting,” Proc. SPIE 6910, 69100N (2008).
[CrossRef]

Choi, S. H.

S. A.  Joo, J. K.  Park, K. Y.  Ko, Y. J.  Jeong, S. H.  Choi, “Light-emitting diode package,” U.S. patent8 168 997 (2012).

Dai, T.

K.  Bao, B.  Zhang, X. N.  Kang, T.  Dai, C.  Xiong, G. Y.  Zhang, Y.  Chen, “Improvement of light extraction from micro-pattern encapsulated GaN-based LED by imprinting,” Proc. SPIE 6910, 69100N (2008).
[CrossRef]

Ee, Y.-K.

Y.-K.  Ee, P.  Kumnorkaew, R. A.  Arif, H.  Tong, H.  Zhao, J. F.  Gilchrist, N.  Tansu, “Optimization of light-extraction efficiency of III-nitride LEDs with self-assembled colloidal-based microlenses,” IEEE J. Sel. Topics Quantum Electron. 15, 1218 (2009).

Gilchrist, J. F.

Y.-K.  Ee, P.  Kumnorkaew, R. A.  Arif, H.  Tong, H.  Zhao, J. F.  Gilchrist, N.  Tansu, “Optimization of light-extraction efficiency of III-nitride LEDs with self-assembled colloidal-based microlenses,” IEEE J. Sel. Topics Quantum Electron. 15, 1218 (2009).

Hartmann, M.

P.  Hartmann, F. P.  Wenzl, C.  Sommer, P.  Pachler, H.  Hoschopf, M.  Schweighart, M.  Hartmann, L.  Kuna, G.  Jakopic, G.  Leising, S.  Tasch, “White LEDs and modules in chip-on-board technology for general lighting,” Proc. SPIE 6337, 63370I (2006).
[CrossRef]

Hartmann, P.

P.  Hartmann, F. P.  Wenzl, C.  Sommer, P.  Pachler, H.  Hoschopf, M.  Schweighart, M.  Hartmann, L.  Kuna, G.  Jakopic, G.  Leising, S.  Tasch, “White LEDs and modules in chip-on-board technology for general lighting,” Proc. SPIE 6337, 63370I (2006).
[CrossRef]

Hoschopf, H.

P.  Hartmann, F. P.  Wenzl, C.  Sommer, P.  Pachler, H.  Hoschopf, M.  Schweighart, M.  Hartmann, L.  Kuna, G.  Jakopic, G.  Leising, S.  Tasch, “White LEDs and modules in chip-on-board technology for general lighting,” Proc. SPIE 6337, 63370I (2006).
[CrossRef]

Jakopic, G.

P.  Hartmann, F. P.  Wenzl, C.  Sommer, P.  Pachler, H.  Hoschopf, M.  Schweighart, M.  Hartmann, L.  Kuna, G.  Jakopic, G.  Leising, S.  Tasch, “White LEDs and modules in chip-on-board technology for general lighting,” Proc. SPIE 6337, 63370I (2006).
[CrossRef]

Jeong, Y. J.

S. A.  Joo, J. K.  Park, K. Y.  Ko, Y. J.  Jeong, S. H.  Choi, “Light-emitting diode package,” U.S. patent8 168 997 (2012).

Joo, S. A.

S. A.  Joo, J. K.  Park, K. Y.  Ko, Y. J.  Jeong, S. H.  Choi, “Light-emitting diode package,” U.S. patent8 168 997 (2012).

Kang, X. N.

K.  Bao, B.  Zhang, X. N.  Kang, T.  Dai, C.  Xiong, G. Y.  Zhang, Y.  Chen, “Improvement of light extraction from micro-pattern encapsulated GaN-based LED by imprinting,” Proc. SPIE 6910, 69100N (2008).
[CrossRef]

Ko, K. Y.

S. A.  Joo, J. K.  Park, K. Y.  Ko, Y. J.  Jeong, S. H.  Choi, “Light-emitting diode package,” U.S. patent8 168 997 (2012).

Kruglov, O. E.

O. E.  Kruglov, V. N.  Kuz’min, K. A.  Tomskiĭ, “Measurement of the light flux of LEDs,” Svetotekhnika No. 3, 34 (2009).

Kückmann, O.

O.  Kückmann, “High-power LED arrays special requirements on packaging technology,” Proc. SPIE 6134, 613404 (2006).
[CrossRef]

Kumnorkaew, P.

Y.-K.  Ee, P.  Kumnorkaew, R. A.  Arif, H.  Tong, H.  Zhao, J. F.  Gilchrist, N.  Tansu, “Optimization of light-extraction efficiency of III-nitride LEDs with self-assembled colloidal-based microlenses,” IEEE J. Sel. Topics Quantum Electron. 15, 1218 (2009).

Kuna, L.

P.  Hartmann, F. P.  Wenzl, C.  Sommer, P.  Pachler, H.  Hoschopf, M.  Schweighart, M.  Hartmann, L.  Kuna, G.  Jakopic, G.  Leising, S.  Tasch, “White LEDs and modules in chip-on-board technology for general lighting,” Proc. SPIE 6337, 63370I (2006).
[CrossRef]

Kuz’min, V. N.

O. E.  Kruglov, V. N.  Kuz’min, K. A.  Tomskiĭ, “Measurement of the light flux of LEDs,” Svetotekhnika No. 3, 34 (2009).

Leising, G.

P.  Hartmann, F. P.  Wenzl, C.  Sommer, P.  Pachler, H.  Hoschopf, M.  Schweighart, M.  Hartmann, L.  Kuna, G.  Jakopic, G.  Leising, S.  Tasch, “White LEDs and modules in chip-on-board technology for general lighting,” Proc. SPIE 6337, 63370I (2006).
[CrossRef]

Pachler, P.

P.  Hartmann, F. P.  Wenzl, C.  Sommer, P.  Pachler, H.  Hoschopf, M.  Schweighart, M.  Hartmann, L.  Kuna, G.  Jakopic, G.  Leising, S.  Tasch, “White LEDs and modules in chip-on-board technology for general lighting,” Proc. SPIE 6337, 63370I (2006).
[CrossRef]

Park, J. K.

S. A.  Joo, J. K.  Park, K. Y.  Ko, Y. J.  Jeong, S. H.  Choi, “Light-emitting diode package,” U.S. patent8 168 997 (2012).

Schweighart, M.

P.  Hartmann, F. P.  Wenzl, C.  Sommer, P.  Pachler, H.  Hoschopf, M.  Schweighart, M.  Hartmann, L.  Kuna, G.  Jakopic, G.  Leising, S.  Tasch, “White LEDs and modules in chip-on-board technology for general lighting,” Proc. SPIE 6337, 63370I (2006).
[CrossRef]

Sommer, C.

P.  Hartmann, F. P.  Wenzl, C.  Sommer, P.  Pachler, H.  Hoschopf, M.  Schweighart, M.  Hartmann, L.  Kuna, G.  Jakopic, G.  Leising, S.  Tasch, “White LEDs and modules in chip-on-board technology for general lighting,” Proc. SPIE 6337, 63370I (2006).
[CrossRef]

Szirmay-Kalos, L.

L.  Szirmay-Kalos, Monte-Carlo Methods in Global Illumination (Institute of Computer Graphics, Vienna, 2000).

Tansu, N.

Y.-K.  Ee, P.  Kumnorkaew, R. A.  Arif, H.  Tong, H.  Zhao, J. F.  Gilchrist, N.  Tansu, “Optimization of light-extraction efficiency of III-nitride LEDs with self-assembled colloidal-based microlenses,” IEEE J. Sel. Topics Quantum Electron. 15, 1218 (2009).

Tao, X.

X.  Tao, “Surface-textured encapsulations for use with light-emitting diodes,” U.S. patent application publication 2011/0316006 (2011).

Tasch, S.

P.  Hartmann, F. P.  Wenzl, C.  Sommer, P.  Pachler, H.  Hoschopf, M.  Schweighart, M.  Hartmann, L.  Kuna, G.  Jakopic, G.  Leising, S.  Tasch, “White LEDs and modules in chip-on-board technology for general lighting,” Proc. SPIE 6337, 63370I (2006).
[CrossRef]

Tomskii, K. A.

O. E.  Kruglov, V. N.  Kuz’min, K. A.  Tomskiĭ, “Measurement of the light flux of LEDs,” Svetotekhnika No. 3, 34 (2009).

Tong, H.

Y.-K.  Ee, P.  Kumnorkaew, R. A.  Arif, H.  Tong, H.  Zhao, J. F.  Gilchrist, N.  Tansu, “Optimization of light-extraction efficiency of III-nitride LEDs with self-assembled colloidal-based microlenses,” IEEE J. Sel. Topics Quantum Electron. 15, 1218 (2009).

Wenzl, F. P.

P.  Hartmann, F. P.  Wenzl, C.  Sommer, P.  Pachler, H.  Hoschopf, M.  Schweighart, M.  Hartmann, L.  Kuna, G.  Jakopic, G.  Leising, S.  Tasch, “White LEDs and modules in chip-on-board technology for general lighting,” Proc. SPIE 6337, 63370I (2006).
[CrossRef]

Xiong, C.

K.  Bao, B.  Zhang, X. N.  Kang, T.  Dai, C.  Xiong, G. Y.  Zhang, Y.  Chen, “Improvement of light extraction from micro-pattern encapsulated GaN-based LED by imprinting,” Proc. SPIE 6910, 69100N (2008).
[CrossRef]

Zhang, B.

K.  Bao, B.  Zhang, X. N.  Kang, T.  Dai, C.  Xiong, G. Y.  Zhang, Y.  Chen, “Improvement of light extraction from micro-pattern encapsulated GaN-based LED by imprinting,” Proc. SPIE 6910, 69100N (2008).
[CrossRef]

Zhang, G. Y.

K.  Bao, B.  Zhang, X. N.  Kang, T.  Dai, C.  Xiong, G. Y.  Zhang, Y.  Chen, “Improvement of light extraction from micro-pattern encapsulated GaN-based LED by imprinting,” Proc. SPIE 6910, 69100N (2008).
[CrossRef]

Zhao, H.

Y.-K.  Ee, P.  Kumnorkaew, R. A.  Arif, H.  Tong, H.  Zhao, J. F.  Gilchrist, N.  Tansu, “Optimization of light-extraction efficiency of III-nitride LEDs with self-assembled colloidal-based microlenses,” IEEE J. Sel. Topics Quantum Electron. 15, 1218 (2009).

Zhmakin, A. I.

A. I.  Zhmakin, “Enhancement of light extraction from light-emitting diodes,” Phys. Rep. 498, 189 (2011).
[CrossRef]

IEEE J. Sel. Topics Quantum Electron. (1)

Y.-K.  Ee, P.  Kumnorkaew, R. A.  Arif, H.  Tong, H.  Zhao, J. F.  Gilchrist, N.  Tansu, “Optimization of light-extraction efficiency of III-nitride LEDs with self-assembled colloidal-based microlenses,” IEEE J. Sel. Topics Quantum Electron. 15, 1218 (2009).

Phys. Rep. (1)

A. I.  Zhmakin, “Enhancement of light extraction from light-emitting diodes,” Phys. Rep. 498, 189 (2011).
[CrossRef]

Proc. SPIE (3)

K.  Bao, B.  Zhang, X. N.  Kang, T.  Dai, C.  Xiong, G. Y.  Zhang, Y.  Chen, “Improvement of light extraction from micro-pattern encapsulated GaN-based LED by imprinting,” Proc. SPIE 6910, 69100N (2008).
[CrossRef]

O.  Kückmann, “High-power LED arrays special requirements on packaging technology,” Proc. SPIE 6134, 613404 (2006).
[CrossRef]

P.  Hartmann, F. P.  Wenzl, C.  Sommer, P.  Pachler, H.  Hoschopf, M.  Schweighart, M.  Hartmann, L.  Kuna, G.  Jakopic, G.  Leising, S.  Tasch, “White LEDs and modules in chip-on-board technology for general lighting,” Proc. SPIE 6337, 63370I (2006).
[CrossRef]

Svetotekhnika (1)

O. E.  Kruglov, V. N.  Kuz’min, K. A.  Tomskiĭ, “Measurement of the light flux of LEDs,” Svetotekhnika No. 3, 34 (2009).

Other (4)

L.  Szirmay-Kalos, Monte-Carlo Methods in Global Illumination (Institute of Computer Graphics, Vienna, 2000).

Zemax User’s Manual, January2012.

S. A.  Joo, J. K.  Park, K. Y.  Ko, Y. J.  Jeong, S. H.  Choi, “Light-emitting diode package,” U.S. patent8 168 997 (2012).

X.  Tao, “Surface-textured encapsulations for use with light-emitting diodes,” U.S. patent application publication 2011/0316006 (2011).

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