Abstract

This paper presents the results of a study of the optical surface quality of items processed using three types of polyurethane at the polishing stage by means of multi-workpiece processing. These are compared with the results of processing the optical surfaces of items by the standard technology (on resin). This type of polishing wheels is shown to be effective for achieving the lowest roughness, the minimum deviation of the shape of the surface profile, and the minimum local error of the surface shape. The use of polyurethanes makes it possible to obtain items processed on a block with small scatter in the PV and RMS parameters and increases the percentage yield of finished items with respect to optical purity.

© 2012 OSA

PDF Article

References

  • View by:
  • |
  • |
  • |

  1. A. A. Tesar and B. A. Fuchs, “Removal rates of fused silica with cerium oxide/pitch polishing,” Proc. SPIE 1531, 80 (1991).
    [CrossRef]
  2. M. J. Cumbo, “Chemo-mechanical interactions in optical polishing,” Ph.D. Dissertation, Univ. of Rochester, Rochester, N.Y., 1993.
  3. J. E. DeGroote, S. D. Jacobs, L. L. Gregg, and A. E. Marino, “Quantitative characterization of optical polishing pitch,” Proc. SPIE 4451, 209 (2001).
    [CrossRef]
  4. R. R. Berggren and R. A. Schmell, “Pad polishing for rapid production of large flats,” Proc. SPIE 3134, 252 (1997).
    [CrossRef]
  5. Y. Li, J. Hou, Q. Xu, J. Wang, W. Yang, and Y. Guo, “The characteristics of optics polished with a polyurethane pad,” Opt. Express 16, No. 14, 10285 (2008).
    [CrossRef] [PubMed]
  6. L. M. Cook, “Chemical process in glass polishing,” J. Non-Cryst. Solids 120, 152 (1990).
    [CrossRef]
  7. H. Lu, B. Fookes, Y. Obeng, S. Machinski, and K. A. Richardson, “Quantitative analysis of physical and chemical changes in CMP polyurethane pad surfaces,” Mater. Charact. 49, 35 (2002).
    [CrossRef]
  8. T. Kamimura, S. Akamatsu, M. Yamamoto, I. Yamato, H. Shiba, S. Motokoshi, T. Sakamoto, T. Okamoto, and K. Yoshida, “Enhancement of surface-damage resistance by removing a subsurface damage in fused silica,” Proc. SPIE 5273, 244 (2004).
    [CrossRef]
  9. L. S. Ramanathan, S. Sivam, and M. K. Mishrara, “Polyurethane,” in Polymer Data Handbook, J. E. Mark, ed. (Oxford Univ. Press, 1999).

2008 (1)

2004 (1)

T. Kamimura, S. Akamatsu, M. Yamamoto, I. Yamato, H. Shiba, S. Motokoshi, T. Sakamoto, T. Okamoto, and K. Yoshida, “Enhancement of surface-damage resistance by removing a subsurface damage in fused silica,” Proc. SPIE 5273, 244 (2004).
[CrossRef]

2002 (1)

H. Lu, B. Fookes, Y. Obeng, S. Machinski, and K. A. Richardson, “Quantitative analysis of physical and chemical changes in CMP polyurethane pad surfaces,” Mater. Charact. 49, 35 (2002).
[CrossRef]

2001 (1)

J. E. DeGroote, S. D. Jacobs, L. L. Gregg, and A. E. Marino, “Quantitative characterization of optical polishing pitch,” Proc. SPIE 4451, 209 (2001).
[CrossRef]

1997 (1)

R. R. Berggren and R. A. Schmell, “Pad polishing for rapid production of large flats,” Proc. SPIE 3134, 252 (1997).
[CrossRef]

1991 (1)

A. A. Tesar and B. A. Fuchs, “Removal rates of fused silica with cerium oxide/pitch polishing,” Proc. SPIE 1531, 80 (1991).
[CrossRef]

1990 (1)

L. M. Cook, “Chemical process in glass polishing,” J. Non-Cryst. Solids 120, 152 (1990).
[CrossRef]

Akamatsu, S.

T. Kamimura, S. Akamatsu, M. Yamamoto, I. Yamato, H. Shiba, S. Motokoshi, T. Sakamoto, T. Okamoto, and K. Yoshida, “Enhancement of surface-damage resistance by removing a subsurface damage in fused silica,” Proc. SPIE 5273, 244 (2004).
[CrossRef]

Berggren, R. R.

R. R. Berggren and R. A. Schmell, “Pad polishing for rapid production of large flats,” Proc. SPIE 3134, 252 (1997).
[CrossRef]

Cook, L. M.

L. M. Cook, “Chemical process in glass polishing,” J. Non-Cryst. Solids 120, 152 (1990).
[CrossRef]

Cumbo, M. J.

M. J. Cumbo, “Chemo-mechanical interactions in optical polishing,” Ph.D. Dissertation, Univ. of Rochester, Rochester, N.Y., 1993.

DeGroote, J. E.

J. E. DeGroote, S. D. Jacobs, L. L. Gregg, and A. E. Marino, “Quantitative characterization of optical polishing pitch,” Proc. SPIE 4451, 209 (2001).
[CrossRef]

Fookes, B.

H. Lu, B. Fookes, Y. Obeng, S. Machinski, and K. A. Richardson, “Quantitative analysis of physical and chemical changes in CMP polyurethane pad surfaces,” Mater. Charact. 49, 35 (2002).
[CrossRef]

Fuchs, B. A.

A. A. Tesar and B. A. Fuchs, “Removal rates of fused silica with cerium oxide/pitch polishing,” Proc. SPIE 1531, 80 (1991).
[CrossRef]

Gregg, L. L.

J. E. DeGroote, S. D. Jacobs, L. L. Gregg, and A. E. Marino, “Quantitative characterization of optical polishing pitch,” Proc. SPIE 4451, 209 (2001).
[CrossRef]

Guo, Y.

Hou, J.

Jacobs, S. D.

J. E. DeGroote, S. D. Jacobs, L. L. Gregg, and A. E. Marino, “Quantitative characterization of optical polishing pitch,” Proc. SPIE 4451, 209 (2001).
[CrossRef]

Kamimura, T.

T. Kamimura, S. Akamatsu, M. Yamamoto, I. Yamato, H. Shiba, S. Motokoshi, T. Sakamoto, T. Okamoto, and K. Yoshida, “Enhancement of surface-damage resistance by removing a subsurface damage in fused silica,” Proc. SPIE 5273, 244 (2004).
[CrossRef]

Li, Y.

Lu, H.

H. Lu, B. Fookes, Y. Obeng, S. Machinski, and K. A. Richardson, “Quantitative analysis of physical and chemical changes in CMP polyurethane pad surfaces,” Mater. Charact. 49, 35 (2002).
[CrossRef]

Machinski, S.

H. Lu, B. Fookes, Y. Obeng, S. Machinski, and K. A. Richardson, “Quantitative analysis of physical and chemical changes in CMP polyurethane pad surfaces,” Mater. Charact. 49, 35 (2002).
[CrossRef]

Marino, A. E.

J. E. DeGroote, S. D. Jacobs, L. L. Gregg, and A. E. Marino, “Quantitative characterization of optical polishing pitch,” Proc. SPIE 4451, 209 (2001).
[CrossRef]

Mishrara, M. K.

L. S. Ramanathan, S. Sivam, and M. K. Mishrara, “Polyurethane,” in Polymer Data Handbook, J. E. Mark, ed. (Oxford Univ. Press, 1999).

Motokoshi, S.

T. Kamimura, S. Akamatsu, M. Yamamoto, I. Yamato, H. Shiba, S. Motokoshi, T. Sakamoto, T. Okamoto, and K. Yoshida, “Enhancement of surface-damage resistance by removing a subsurface damage in fused silica,” Proc. SPIE 5273, 244 (2004).
[CrossRef]

Obeng, Y.

H. Lu, B. Fookes, Y. Obeng, S. Machinski, and K. A. Richardson, “Quantitative analysis of physical and chemical changes in CMP polyurethane pad surfaces,” Mater. Charact. 49, 35 (2002).
[CrossRef]

Okamoto, T.

T. Kamimura, S. Akamatsu, M. Yamamoto, I. Yamato, H. Shiba, S. Motokoshi, T. Sakamoto, T. Okamoto, and K. Yoshida, “Enhancement of surface-damage resistance by removing a subsurface damage in fused silica,” Proc. SPIE 5273, 244 (2004).
[CrossRef]

Ramanathan, L. S.

L. S. Ramanathan, S. Sivam, and M. K. Mishrara, “Polyurethane,” in Polymer Data Handbook, J. E. Mark, ed. (Oxford Univ. Press, 1999).

Richardson, K. A.

H. Lu, B. Fookes, Y. Obeng, S. Machinski, and K. A. Richardson, “Quantitative analysis of physical and chemical changes in CMP polyurethane pad surfaces,” Mater. Charact. 49, 35 (2002).
[CrossRef]

Sakamoto, T.

T. Kamimura, S. Akamatsu, M. Yamamoto, I. Yamato, H. Shiba, S. Motokoshi, T. Sakamoto, T. Okamoto, and K. Yoshida, “Enhancement of surface-damage resistance by removing a subsurface damage in fused silica,” Proc. SPIE 5273, 244 (2004).
[CrossRef]

Schmell, R. A.

R. R. Berggren and R. A. Schmell, “Pad polishing for rapid production of large flats,” Proc. SPIE 3134, 252 (1997).
[CrossRef]

Shiba, H.

T. Kamimura, S. Akamatsu, M. Yamamoto, I. Yamato, H. Shiba, S. Motokoshi, T. Sakamoto, T. Okamoto, and K. Yoshida, “Enhancement of surface-damage resistance by removing a subsurface damage in fused silica,” Proc. SPIE 5273, 244 (2004).
[CrossRef]

Sivam, S.

L. S. Ramanathan, S. Sivam, and M. K. Mishrara, “Polyurethane,” in Polymer Data Handbook, J. E. Mark, ed. (Oxford Univ. Press, 1999).

Tesar, A. A.

A. A. Tesar and B. A. Fuchs, “Removal rates of fused silica with cerium oxide/pitch polishing,” Proc. SPIE 1531, 80 (1991).
[CrossRef]

Wang, J.

Xu, Q.

Yamamoto, M.

T. Kamimura, S. Akamatsu, M. Yamamoto, I. Yamato, H. Shiba, S. Motokoshi, T. Sakamoto, T. Okamoto, and K. Yoshida, “Enhancement of surface-damage resistance by removing a subsurface damage in fused silica,” Proc. SPIE 5273, 244 (2004).
[CrossRef]

Yamato, I.

T. Kamimura, S. Akamatsu, M. Yamamoto, I. Yamato, H. Shiba, S. Motokoshi, T. Sakamoto, T. Okamoto, and K. Yoshida, “Enhancement of surface-damage resistance by removing a subsurface damage in fused silica,” Proc. SPIE 5273, 244 (2004).
[CrossRef]

Yang, W.

Yoshida, K.

T. Kamimura, S. Akamatsu, M. Yamamoto, I. Yamato, H. Shiba, S. Motokoshi, T. Sakamoto, T. Okamoto, and K. Yoshida, “Enhancement of surface-damage resistance by removing a subsurface damage in fused silica,” Proc. SPIE 5273, 244 (2004).
[CrossRef]

J. Non-Cryst. Solids (1)

L. M. Cook, “Chemical process in glass polishing,” J. Non-Cryst. Solids 120, 152 (1990).
[CrossRef]

Mater. Charact. (1)

H. Lu, B. Fookes, Y. Obeng, S. Machinski, and K. A. Richardson, “Quantitative analysis of physical and chemical changes in CMP polyurethane pad surfaces,” Mater. Charact. 49, 35 (2002).
[CrossRef]

Opt. Express (1)

Proc. SPIE (4)

T. Kamimura, S. Akamatsu, M. Yamamoto, I. Yamato, H. Shiba, S. Motokoshi, T. Sakamoto, T. Okamoto, and K. Yoshida, “Enhancement of surface-damage resistance by removing a subsurface damage in fused silica,” Proc. SPIE 5273, 244 (2004).
[CrossRef]

A. A. Tesar and B. A. Fuchs, “Removal rates of fused silica with cerium oxide/pitch polishing,” Proc. SPIE 1531, 80 (1991).
[CrossRef]

J. E. DeGroote, S. D. Jacobs, L. L. Gregg, and A. E. Marino, “Quantitative characterization of optical polishing pitch,” Proc. SPIE 4451, 209 (2001).
[CrossRef]

R. R. Berggren and R. A. Schmell, “Pad polishing for rapid production of large flats,” Proc. SPIE 3134, 252 (1997).
[CrossRef]

Other (2)

M. J. Cumbo, “Chemo-mechanical interactions in optical polishing,” Ph.D. Dissertation, Univ. of Rochester, Rochester, N.Y., 1993.

L. S. Ramanathan, S. Sivam, and M. K. Mishrara, “Polyurethane,” in Polymer Data Handbook, J. E. Mark, ed. (Oxford Univ. Press, 1999).

Cited By

OSA participates in CrossRef's Cited-By Linking service. Citing articles from OSA journals and other participating publishers are listed here.

Alert me when this article is cited.