Abstract

We present a very simple and efficient bare-wafer inspection method using a knife-edge test. The wafer front surface and inner structures are inspected simultaneously. The wafer front surface is inspected visually using a knife-edge test while the inner structure is simultaneously inspected by a camera in the infrared region with a single white-light source. This paper presents a laboratory implementation of the test method with some experimental results.

© 2007 Optical Society of Korea

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  1. Paul Sandland, Curt H. Chadwick, Russell M. Singleton, Sunnyvale, and Howard Dwyer, "Method and apparatus for automatic wafer inspection," US Patent, No. 4,618, 938, 1986
  2. Lawrence H. Lin, Victor A. Scheff, and Alameda, "Inspection system with in-lens off-axis illuminator", US patent, No. 5,428,442, 1995
  3. Michael E. Fossey and John C. Stover, "Wafer inspection system for distinguishing pits and particles," US patent, No. 6,292,259, 2001
  4. Jhon R. Jordan, Mehrdad Nikoonahad, and Keith B. Wells,"Surface inspection system," US Patent, No. 5,864,394, 1999
  5. Christopher R Fairley, Yao-Yi Fu, Gershon Perelman, and Bin-Ming Benjamin Tsai, "High throughput brightfield/ darkfield wafer inspection system using advanced optical techniques," US patent, No. 6,288,780, 2001
  6. Yukiko Nakashige and Tadashi Nishioka, "Semiconductor wafer inspection apparatus," US Patent, No. 5,465,145, 1995
  7. Dong-Guk Kim, Seung-Bae Chung, and Ki-kweon Chung, "Method and apparatus of wafer backside inspection," Korea Patent, No. 10-0445457, 2004
  8. Tae-yueol Hu, Kyu-cheol Cho, Kyung-rim Kang, and Soo-yeol Choi, "Wafer surface inspection method," Korea Patent, No. 10-0327340, 2002
  9. Yeon-Han Bae, "Wafer inspection apparatus," Korea Patent, No. 10-0478482, 2005
  10. Da Meisberget, etc, "Electron beam inspection system and method," US patent, No. 5,578,821, 1996
  11. Daniel Malacara, "Optical Shop Testing," Chap. 8, pp. 265-320, 1991
  12. Yasuyuki Ishii, Akira Isoya, Takuji Kojima, and Kazuo Arakawa, "Estimation of keV submicron ion beam width using a knife-edge method," Nuclear instruments and methods in physics research B 211, pp. 415-424, 2003
    [CrossRef]

2005 (1)

Yeon-Han Bae, "Wafer inspection apparatus," Korea Patent, No. 10-0478482, 2005

2004 (1)

Dong-Guk Kim, Seung-Bae Chung, and Ki-kweon Chung, "Method and apparatus of wafer backside inspection," Korea Patent, No. 10-0445457, 2004

2003 (1)

Yasuyuki Ishii, Akira Isoya, Takuji Kojima, and Kazuo Arakawa, "Estimation of keV submicron ion beam width using a knife-edge method," Nuclear instruments and methods in physics research B 211, pp. 415-424, 2003
[CrossRef]

2002 (1)

Tae-yueol Hu, Kyu-cheol Cho, Kyung-rim Kang, and Soo-yeol Choi, "Wafer surface inspection method," Korea Patent, No. 10-0327340, 2002

2001 (2)

Christopher R Fairley, Yao-Yi Fu, Gershon Perelman, and Bin-Ming Benjamin Tsai, "High throughput brightfield/ darkfield wafer inspection system using advanced optical techniques," US patent, No. 6,288,780, 2001

Michael E. Fossey and John C. Stover, "Wafer inspection system for distinguishing pits and particles," US patent, No. 6,292,259, 2001

1999 (1)

Jhon R. Jordan, Mehrdad Nikoonahad, and Keith B. Wells,"Surface inspection system," US Patent, No. 5,864,394, 1999

1996 (1)

Da Meisberget, etc, "Electron beam inspection system and method," US patent, No. 5,578,821, 1996

1995 (2)

Lawrence H. Lin, Victor A. Scheff, and Alameda, "Inspection system with in-lens off-axis illuminator", US patent, No. 5,428,442, 1995

Yukiko Nakashige and Tadashi Nishioka, "Semiconductor wafer inspection apparatus," US Patent, No. 5,465,145, 1995

1991 (1)

Daniel Malacara, "Optical Shop Testing," Chap. 8, pp. 265-320, 1991

1986 (1)

Paul Sandland, Curt H. Chadwick, Russell M. Singleton, Sunnyvale, and Howard Dwyer, "Method and apparatus for automatic wafer inspection," US Patent, No. 4,618, 938, 1986

Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms (1)

Yasuyuki Ishii, Akira Isoya, Takuji Kojima, and Kazuo Arakawa, "Estimation of keV submicron ion beam width using a knife-edge method," Nuclear instruments and methods in physics research B 211, pp. 415-424, 2003
[CrossRef]

Other (11)

Paul Sandland, Curt H. Chadwick, Russell M. Singleton, Sunnyvale, and Howard Dwyer, "Method and apparatus for automatic wafer inspection," US Patent, No. 4,618, 938, 1986

Lawrence H. Lin, Victor A. Scheff, and Alameda, "Inspection system with in-lens off-axis illuminator", US patent, No. 5,428,442, 1995

Michael E. Fossey and John C. Stover, "Wafer inspection system for distinguishing pits and particles," US patent, No. 6,292,259, 2001

Jhon R. Jordan, Mehrdad Nikoonahad, and Keith B. Wells,"Surface inspection system," US Patent, No. 5,864,394, 1999

Christopher R Fairley, Yao-Yi Fu, Gershon Perelman, and Bin-Ming Benjamin Tsai, "High throughput brightfield/ darkfield wafer inspection system using advanced optical techniques," US patent, No. 6,288,780, 2001

Yukiko Nakashige and Tadashi Nishioka, "Semiconductor wafer inspection apparatus," US Patent, No. 5,465,145, 1995

Dong-Guk Kim, Seung-Bae Chung, and Ki-kweon Chung, "Method and apparatus of wafer backside inspection," Korea Patent, No. 10-0445457, 2004

Tae-yueol Hu, Kyu-cheol Cho, Kyung-rim Kang, and Soo-yeol Choi, "Wafer surface inspection method," Korea Patent, No. 10-0327340, 2002

Yeon-Han Bae, "Wafer inspection apparatus," Korea Patent, No. 10-0478482, 2005

Da Meisberget, etc, "Electron beam inspection system and method," US patent, No. 5,578,821, 1996

Daniel Malacara, "Optical Shop Testing," Chap. 8, pp. 265-320, 1991

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