Abstract

To measure the depth and diameter of through silicon vias simultaneously, a novel method based on spectral-domain interferometer and confocal microscope is proposed and realized. Most parts of the measurement system are constructed with optical fiber components for flexible configuration and easy alignment. According to the measurement results and performance evaluation, the mean values of the diameter and depth were 6.07m and 48.255m with the expanded uncertainties of 0.20m ( $k\,= \,{\text{2}}$ ) and 37nm ( $k\,= \,{\text{2}}$ ), respectively.

© 2016 IEEE

PDF Article

References

You do not have subscription access to this journal. Citation lists with outbound citation links are available to subscribers only. You may subscribe either as an OSA member, or as an authorized user of your institution.

Contact your librarian or system administrator
or
Login to access OSA Member Subscription

Cited By

You do not have subscription access to this journal. Cited by links are available to subscribers only. You may subscribe either as an OSA member, or as an authorized user of your institution.

Contact your librarian or system administrator
or
Login to access OSA Member Subscription