Abstract

Advanced transceivers generally require a multi-lane approach, which necessitates the integration of multiple subcomponents. The use of mature, generally available, and low-cost single element components such as electro-absorption modulated lasers, silica planar lightwave circuits, and direct-modulated distributed feedback lasers, integrated in a hybrid fashion and optically aligned with micro-electromechanical systems provides a practical solution. Standard bonding tools with positioning tolerances of approximately ten micrometers are used to populate a silicon microbench that incorporates micro-adjustable elements with various optical components. After diebonding, the positions of coupling microlenses are adjusted to correct for the poor diebond accuracy, and then these movable elements are fixed in place with built-in heaters and solder. The net result is highly uniform, manufacturable, and low loss coupling between the optical elements, with typically 1 to 2 dB of loss. Using this packaging technique, we demonstrate a 40 Gb/s four-channel (4 × 10 Gb/s) DML-based transceiver and a 100 Gb/s ten-channel (10 × 10 Gb/s) EML-based transceiver for 10 and 80 km reach respectively.

© 2014 IEEE

PDF Article

References

  • View by:
  • |
  • |

  1. V. Tolstikhin, "Multi-guide vertical integration in InP: PIC technology for cost-sensitive applications," Proc. Conf. Lasers Electro-Opt. Pacific Rim (2013) pp. 1 -2.
  2. N. Izhaky, M. T. Morse, S. Koehl, O. Cohen, D. Rubin, A. Barkai, G. Sarid, R. Cohen, M. J. Paniccia, "Development of CMOS-compatible integrated silicon photonics devices ," IEEE J. Sel. Topics Quantum Electron. 12, 1688-1698 ( 2006).
  3. R. Nagarajan, C. H. Joyner, R. P. Schneider, J. S. Bostak, T. Butrie, A. G. Dentai, V. G. Dominic, P. W. Evans, M. Kato, M. Kauffman, D. J. H. Lambert, S. K. Mathis, A. Mathur, R. H. Miles, M. L. Mitchell, M. J. Missey, S. Murthy, A. C. Nilsson, F. H. Peters, S. C. Pennypacker, J. L. Pleumeekers, R. A. Salvatore, R. K. Schlenker, R. B. Taylor, H.-S. Tsai, M. F. Van Leeuwen, J. Webjorn, M. Ziari, D. Perkins, J. Singh, S. G. Grubb, M. S. Reffle, D. G. Mehuys, F. A. Kish, D. F. Welch, "Large scale photonic integrated circuits," IEEE J. Sel. Topics Quantum Electron 11 , 50-65 (2005).
  4. B. Pezeshki, E. Vail, J. Kubicky, G. W. Yoffe, S. Zou, J. F. Heanue, P. Epp, S. Rishton, D. Ton, B. Faraji, M. Emanuel, X. Hong, M. Sherback, V. Agrawal, C. Chipman, T. Razazan, "20-mW widely tunable laser module using DFB array and MEMS selection," IEEE Photon. Technol. Lett. 14, 145-1459 (2002).
  5. M. Epitaux, J. M. Verdeil, Y. Petremand, W. Noell, N. F. De Rooij, "Micro-machined XY stage for fiber optic module alignment," Opt. Fiber Commun. Conf. presented at theAnaheimCA USA (2005).
  6. Telcordia. (Sep. 2004). Generic reliability assurance requirements for optoelectronic devices used in telecommunications equipment. GR-468, no. 2. [Sep. 2004 Online]. Available: http://telecom-info.telcordia.com/.

2005 (1)

R. Nagarajan, C. H. Joyner, R. P. Schneider, J. S. Bostak, T. Butrie, A. G. Dentai, V. G. Dominic, P. W. Evans, M. Kato, M. Kauffman, D. J. H. Lambert, S. K. Mathis, A. Mathur, R. H. Miles, M. L. Mitchell, M. J. Missey, S. Murthy, A. C. Nilsson, F. H. Peters, S. C. Pennypacker, J. L. Pleumeekers, R. A. Salvatore, R. K. Schlenker, R. B. Taylor, H.-S. Tsai, M. F. Van Leeuwen, J. Webjorn, M. Ziari, D. Perkins, J. Singh, S. G. Grubb, M. S. Reffle, D. G. Mehuys, F. A. Kish, D. F. Welch, "Large scale photonic integrated circuits," IEEE J. Sel. Topics Quantum Electron 11 , 50-65 (2005).

2002 (1)

B. Pezeshki, E. Vail, J. Kubicky, G. W. Yoffe, S. Zou, J. F. Heanue, P. Epp, S. Rishton, D. Ton, B. Faraji, M. Emanuel, X. Hong, M. Sherback, V. Agrawal, C. Chipman, T. Razazan, "20-mW widely tunable laser module using DFB array and MEMS selection," IEEE Photon. Technol. Lett. 14, 145-1459 (2002).

IEEE Photon. Technol. Lett. (1)

B. Pezeshki, E. Vail, J. Kubicky, G. W. Yoffe, S. Zou, J. F. Heanue, P. Epp, S. Rishton, D. Ton, B. Faraji, M. Emanuel, X. Hong, M. Sherback, V. Agrawal, C. Chipman, T. Razazan, "20-mW widely tunable laser module using DFB array and MEMS selection," IEEE Photon. Technol. Lett. 14, 145-1459 (2002).

IEEE J. Sel. Topics Quantum Electron (1)

R. Nagarajan, C. H. Joyner, R. P. Schneider, J. S. Bostak, T. Butrie, A. G. Dentai, V. G. Dominic, P. W. Evans, M. Kato, M. Kauffman, D. J. H. Lambert, S. K. Mathis, A. Mathur, R. H. Miles, M. L. Mitchell, M. J. Missey, S. Murthy, A. C. Nilsson, F. H. Peters, S. C. Pennypacker, J. L. Pleumeekers, R. A. Salvatore, R. K. Schlenker, R. B. Taylor, H.-S. Tsai, M. F. Van Leeuwen, J. Webjorn, M. Ziari, D. Perkins, J. Singh, S. G. Grubb, M. S. Reffle, D. G. Mehuys, F. A. Kish, D. F. Welch, "Large scale photonic integrated circuits," IEEE J. Sel. Topics Quantum Electron 11 , 50-65 (2005).

IEEE J. Sel. Topics Quantum Electron. (1)

N. Izhaky, M. T. Morse, S. Koehl, O. Cohen, D. Rubin, A. Barkai, G. Sarid, R. Cohen, M. J. Paniccia, "Development of CMOS-compatible integrated silicon photonics devices ," IEEE J. Sel. Topics Quantum Electron. 12, 1688-1698 ( 2006).

Other (3)

V. Tolstikhin, "Multi-guide vertical integration in InP: PIC technology for cost-sensitive applications," Proc. Conf. Lasers Electro-Opt. Pacific Rim (2013) pp. 1 -2.

M. Epitaux, J. M. Verdeil, Y. Petremand, W. Noell, N. F. De Rooij, "Micro-machined XY stage for fiber optic module alignment," Opt. Fiber Commun. Conf. presented at theAnaheimCA USA (2005).

Telcordia. (Sep. 2004). Generic reliability assurance requirements for optoelectronic devices used in telecommunications equipment. GR-468, no. 2. [Sep. 2004 Online]. Available: http://telecom-info.telcordia.com/.

Cited By

OSA participates in CrossRef's Cited-By Linking service. Citing articles from OSA journals and other participating publishers are listed here.

Alert me when this article is cited.