Abstract

We review recent progress made on the hybrid silicon platform towards realizing an integrated wavelength division multiplexing (WDM) transmitter on silicon. Using ion-implantation-enhanced quantum-well intermixing, four band gaps are integrated onto a single chip and used to demonstrate a DFB laser-EAM array. Our latest results on design changes to improve Mach-Zehnder and EAM performance are also described, and the prospects for fabricating an integrated terabit-per-second transmitter on silicon are presented.

© 2011 IEEE

PDF Article

References

You do not have subscription access to this journal. Citation lists with outbound citation links are available to subscribers only. You may subscribe either as an OSA member, or as an authorized user of your institution.

Contact your librarian or system administrator
or
Login to access OSA Member Subscription

Cited By

You do not have subscription access to this journal. Cited by links are available to subscribers only. You may subscribe either as an OSA member, or as an authorized user of your institution.

Contact your librarian or system administrator
or
Login to access OSA Member Subscription