Abstract

We introduce a surface-tension driven heterogeneous integration of thin film photonic devices using a surface wetting modification. In this process, the combination of a micro-contact printing method and plasma surface modification is used to selectively form a binding liquid on an integration host substrate. With predefined integration areas using the binding liquid, thin film GaAs photodetectors (PDs) are successfully integrated. We have demonstrated the implementation of this integration method by presenting a multi-material photonic integrated structure with integrated GaAs based thin film PDs and a polymer waveguide on a silicon substrate. The measured average misalignment of the integrated PDs was 2.8 $\mu$m from the predefined integration locations. Stable electrical contact between the PDs and the host substrate has been confirmed with dark and photocurrent measurements. The proposed process has the potential towards a low-cost, parallel heterogeneous integration of III-V photonic devices on a silicon platform.

© 2011 IEEE

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  1. B. Jalali, S. Fathpour, "Silicon photonics," J. Lightw. Technol. 24, 4600-4615 (2006).
  2. N. M. Jokerst, M. A. Brooke, C. Sang-Yeon, S. Wilkinson, M. Vrazel, S. Fike, J. Tabler, J. Y. Joon, S. Sang-Woo, D. S. Wills, A. Brown, "The heterogeneous integration of optical interconnections into integrated microsystems," IEEE J. Sel. Topics Quantum Electron. 9, 350-360 (2003).
  3. S. Sang-Woo, C. Sang-Yeon, H. Sa, S. J. Jung, N. M. Jokerst, A. S. Brown, M. A. Brooke, "High-speed large-area inverted InGaAs thin-film metal-semiconductor-metal photodetectors," IEEE J. Sel. Topics Quantum Electron. 10, 686-693 (2004).
  4. L. Lin, R. D. Evans, N. M. Jokerst, R. B. Fair, "Integrated optical sensor in a digital microfluidic platform," IEEE Sens. J. 8, 628-635 (2008).
  5. C. Sang-Yeon, N. M. Jokerst, "Integrated thin film photodetectors with vertically coupled microring resonators for chip scale spectral analysis," Appl. Phys. Lett. 90, 101105-101101 (2007).
  6. S. Dhar, A. Degiron, D. R. Smith, N. M. Jokerst, "Planar integrated optical detection of a hybrid long-range surface plasmon using an InGaAs inverted-MSM detector bonded to silicon," IEEE Photon. Technol. Lett. 22, 841-843 (2010).
  7. S. Sang-Woo, C. Sang-Yeon, N. M. Jokerst, "Integrated thin film InGaAsP laser and 14 polymer multimode interference splitter on silicon," Opt. Lett. 32, 548-550 (2007).
  8. C. Sang-Yeon, S. Sang-Woo, N. M. Jokerst, M. A. Brooke, "Board-level optical interconnection and signal distribution using embedded thin-film optoelectronic devices," J. Lightw. Technol. 22, 2111-2118 (2004).
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  11. C. D. James, R. C. Davis, L. Kam, H. G. Craighead, M. Isaacson, J. N. Turner, W. Shain, "Patterned protein layers on solid substrates by thin stamp microcontact printing," Langmuir 14, 741-744 (1998).
  12. C. Sang-Yeon, S. Sang-Woo, M. A. Brooke, N. M. Jokerst, "Integrated detectors for embedded optical interconnections on electrical boards, modules, and integrated circuits," IEEE J. Sel. Topics Quantum Electron. 8, 1427-1434 (2002).
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  14. E. N. Glytsis, N. M. Jokerst, R. A. Villalaz, S. Y. Cho, S. D. Wu, Z. Huang, M. A. Brooke, T. K. Gaylord, "Substrate-embedded and flip-chip-bonded photodetector polymer-based optical interconnects: Analysis, design, and performance," J. Lightw. Technol. 21, 2382-2394 (2003).

2010 (2)

S. Dhar, A. Degiron, D. R. Smith, N. M. Jokerst, "Planar integrated optical detection of a hybrid long-range surface plasmon using an InGaAs inverted-MSM detector bonded to silicon," IEEE Photon. Technol. Lett. 22, 841-843 (2010).

X. Jing, S. Fuchuan, S. Sang-Woo, "Fluidic assisted heterogeneous integration of photonic thin-film devices," IEEE Photon. Technol. Lett. 22, 1622-1624 (2010).

2008 (1)

L. Lin, R. D. Evans, N. M. Jokerst, R. B. Fair, "Integrated optical sensor in a digital microfluidic platform," IEEE Sens. J. 8, 628-635 (2008).

2007 (2)

C. Sang-Yeon, N. M. Jokerst, "Integrated thin film photodetectors with vertically coupled microring resonators for chip scale spectral analysis," Appl. Phys. Lett. 90, 101105-101101 (2007).

S. Sang-Woo, C. Sang-Yeon, N. M. Jokerst, "Integrated thin film InGaAsP laser and 14 polymer multimode interference splitter on silicon," Opt. Lett. 32, 548-550 (2007).

2006 (1)

B. Jalali, S. Fathpour, "Silicon photonics," J. Lightw. Technol. 24, 4600-4615 (2006).

2004 (2)

C. Sang-Yeon, S. Sang-Woo, N. M. Jokerst, M. A. Brooke, "Board-level optical interconnection and signal distribution using embedded thin-film optoelectronic devices," J. Lightw. Technol. 22, 2111-2118 (2004).

S. Sang-Woo, C. Sang-Yeon, H. Sa, S. J. Jung, N. M. Jokerst, A. S. Brown, M. A. Brooke, "High-speed large-area inverted InGaAs thin-film metal-semiconductor-metal photodetectors," IEEE J. Sel. Topics Quantum Electron. 10, 686-693 (2004).

2003 (2)

E. N. Glytsis, N. M. Jokerst, R. A. Villalaz, S. Y. Cho, S. D. Wu, Z. Huang, M. A. Brooke, T. K. Gaylord, "Substrate-embedded and flip-chip-bonded photodetector polymer-based optical interconnects: Analysis, design, and performance," J. Lightw. Technol. 21, 2382-2394 (2003).

N. M. Jokerst, M. A. Brooke, C. Sang-Yeon, S. Wilkinson, M. Vrazel, S. Fike, J. Tabler, J. Y. Joon, S. Sang-Woo, D. S. Wills, A. Brown, "The heterogeneous integration of optical interconnections into integrated microsystems," IEEE J. Sel. Topics Quantum Electron. 9, 350-360 (2003).

2002 (1)

C. Sang-Yeon, S. Sang-Woo, M. A. Brooke, N. M. Jokerst, "Integrated detectors for embedded optical interconnections on electrical boards, modules, and integrated circuits," IEEE J. Sel. Topics Quantum Electron. 8, 1427-1434 (2002).

1998 (1)

C. D. James, R. C. Davis, L. Kam, H. G. Craighead, M. Isaacson, J. N. Turner, W. Shain, "Patterned protein layers on solid substrates by thin stamp microcontact printing," Langmuir 14, 741-744 (1998).

1994 (1)

A. Kumar, H. A. Biebuyck, G. M. Whitesides, "Patterning self-assembled monolayers: Applications in materials science," Langmuir 10, 1498-1511 (1994).

Appl. Phys. Lett. (1)

C. Sang-Yeon, N. M. Jokerst, "Integrated thin film photodetectors with vertically coupled microring resonators for chip scale spectral analysis," Appl. Phys. Lett. 90, 101105-101101 (2007).

IEEE J. Sel. Topics Quantum Electron. (1)

S. Sang-Woo, C. Sang-Yeon, H. Sa, S. J. Jung, N. M. Jokerst, A. S. Brown, M. A. Brooke, "High-speed large-area inverted InGaAs thin-film metal-semiconductor-metal photodetectors," IEEE J. Sel. Topics Quantum Electron. 10, 686-693 (2004).

IEEE Photon. Technol. Lett. (1)

X. Jing, S. Fuchuan, S. Sang-Woo, "Fluidic assisted heterogeneous integration of photonic thin-film devices," IEEE Photon. Technol. Lett. 22, 1622-1624 (2010).

IEEE J. Sel. Topics Quantum Electron. (1)

N. M. Jokerst, M. A. Brooke, C. Sang-Yeon, S. Wilkinson, M. Vrazel, S. Fike, J. Tabler, J. Y. Joon, S. Sang-Woo, D. S. Wills, A. Brown, "The heterogeneous integration of optical interconnections into integrated microsystems," IEEE J. Sel. Topics Quantum Electron. 9, 350-360 (2003).

IEEE J. Sel. Topics Quantum Electron. (1)

C. Sang-Yeon, S. Sang-Woo, M. A. Brooke, N. M. Jokerst, "Integrated detectors for embedded optical interconnections on electrical boards, modules, and integrated circuits," IEEE J. Sel. Topics Quantum Electron. 8, 1427-1434 (2002).

IEEE Photon. Technol. Lett. (1)

S. Dhar, A. Degiron, D. R. Smith, N. M. Jokerst, "Planar integrated optical detection of a hybrid long-range surface plasmon using an InGaAs inverted-MSM detector bonded to silicon," IEEE Photon. Technol. Lett. 22, 841-843 (2010).

IEEE Sens. J. (1)

L. Lin, R. D. Evans, N. M. Jokerst, R. B. Fair, "Integrated optical sensor in a digital microfluidic platform," IEEE Sens. J. 8, 628-635 (2008).

J. Lightw. Technol. (3)

B. Jalali, S. Fathpour, "Silicon photonics," J. Lightw. Technol. 24, 4600-4615 (2006).

C. Sang-Yeon, S. Sang-Woo, N. M. Jokerst, M. A. Brooke, "Board-level optical interconnection and signal distribution using embedded thin-film optoelectronic devices," J. Lightw. Technol. 22, 2111-2118 (2004).

E. N. Glytsis, N. M. Jokerst, R. A. Villalaz, S. Y. Cho, S. D. Wu, Z. Huang, M. A. Brooke, T. K. Gaylord, "Substrate-embedded and flip-chip-bonded photodetector polymer-based optical interconnects: Analysis, design, and performance," J. Lightw. Technol. 21, 2382-2394 (2003).

Langmuir (2)

A. Kumar, H. A. Biebuyck, G. M. Whitesides, "Patterning self-assembled monolayers: Applications in materials science," Langmuir 10, 1498-1511 (1994).

C. D. James, R. C. Davis, L. Kam, H. G. Craighead, M. Isaacson, J. N. Turner, W. Shain, "Patterned protein layers on solid substrates by thin stamp microcontact printing," Langmuir 14, 741-744 (1998).

Opt. Lett. (1)

Other (1)

R. G. Hunsperger, Integrated Optics: Theory and Technology (Springer Verlag, 2009).

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