Abstract
1.25 Gb/s optoelectronic full-triplex transceiver module with planar-lightwave-circuits
was designed and fabricated for the fiber-to-the-home services according to
G/E-PONs standards. A low electrical crosstalk of the critical characteristics
for the reliable operation of the 1.25 Gb/s full-triplex transceiver module
is intensively investigated because the electrical crosstalk on a resistive
silicon substrate is more serious than that on a dielectric substrate. It
is observed that the performances of the transmitter and receiver satisfy
the transmitter and receiver specifications defined in the standards. From
this proposed module layout, a design convenience as well as a great reduction
of the silicon substrate size by about 50 % was completely achieved. Consequently,
the 1.25 Gb/s full-triplex transceiver module was fabricated with electrical
and mechanical packaging technologies such of a low crosstalk design and a
passive alignment method.
© 2009 IEEE
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