Abstract

In this paper, we demonstrated the use of a photodiode (PD) packaging technique that employs a catadioptric system. This optical system consisted of two components: a BK7 ball lens with a diameter of 1.5 mm that was soldered with glass on a hermetic cap and a plastic-molded offset parabolic mirror with a radius of 550 $\mu$m and an offset of 550 $\mu$m. The offset parabolic mirror was mounted above a surface-illuminated InGaAs pin PD with a detective area of diameter 20 $\mu$m. When an incident pencil of rays were passed through the ball lens and then perpendicularly reflected by the mirror and impinged upon the PD, compact planar assembling became possible for numerous electrical parts on a can-type header for minimizing parasitic impedance due to wire bonds. The optical system provided a high coupling efficiency of 98% between a single-mode fiber and the PD.

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  2. Y. Oikawa, H. Kuwatsuka, T. Yamamoto, T. Ihara, H. Hamano, T. Minami, "Packaging technology for a 10-Gb/s photoreceiver module," IEEE J. Lightw. Technol. 12, 343-352 (1994).
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  7. M. W. Beranek, E. Y. Chan, C.-C. Chen, K. W. Davido, H. E. Hager, C.-S. Hong, D. G. Koshinz, M. Rassaian, H. P. Soares, Jr., R. L. St. Pierre, P. J. Anthony, M. A. Cappuzzo, J. V. Gates, L. T. Gomez, G. E. Henein, J. Shmulovich, M. A. Occhionero, K. P. Fennessy, "Passive alignment optical subassemblies for military/aerospace fiber-optic transmitter/receiver modules," IEEE Trans. Adv. Packag. 23, 461-469 (2000).
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  11. R. B. Comizzoli, J. W. Osenbach, G. R. Crane, G. A. Peins, D. J. Siconolfi, O. G. Lorimor, C.-C. Chang, "Failure mechanism of avalanche photodiodes in the presence of water vapor," IEEE J. Lightw. Technol. 19, 252-265 (2001).
  12. S. Madduri, B. G. Sammakia, B. Infantolino, S. Chaparala, "A review of non-hermetic optoelectronic packaging," 11th Intersoc. Conf. Therm. Thermomech. Phenom. 2008 () pp. 913-919.
  13. W. K. Hogan, R. K. Wolf, A. Shukia, P. Deane, "Low-cost optical sub-assemblies for metro access applications," Proc. Electro. Comp. Technol. Conf. 2004 () pp. 203-207.
  14. F. Centurelli, M. Magliocco, A. Pallotta, P. Tommasino, A. Trifiletti, "A compact 3R-receiver module for short-haul SDH STM-16 systems," IEEE J. Lightw. Technol. 19, 1307-1315 (2001).
  15. J. H. Sinsky, A. Adamiecki, L. Buhl, G. Raybon, P. Winzer, O. Wohlgemuth, M. Duelk, C. R. Doerr, A. Umbach, H.-G. Bach, D. Schmidt, "A 107-Gbit/s optoelectronic receiver utilizing hybrid integration of a photodetector and electronic demultiplexer," IEEE J. Lightw. Technol. 26, 114-120 (2008).
  16. L. B. Aronson, G. Giaretta, S. Schiaffino, B. Mason, "Transmitter optical subassembly for XFP application," Proc. Electro. Comp. Technol. Conf. 2005 () pp. 1058-1062.
  17. S. Bernabe, R. Stevens, M. Volpert, R. Hamelin, C. Rossat, F. Berger, L. Lombard, C. Kopp, J. Berggren, P. Sundgren, M. Hammar, "Highly integrated VCSEL-based 10 Gb/s miniature optical sub-assembly," Proc. Electro. Comp. Technol. Conf. 2005 () pp. 1333-1338.
  18. K. Sakai, H. Aruga, S. Takagi, M. Kawano, M. Negishi, Y. Kondoh, S. Kaneko, "1.3-$\mu$m uncooled DFB laser-diode module with a coupled differential feed for 10-Gb/s Ethernet applications," IEEE J. Lightw. Technol. 22, 574-581 (2004).
  19. R. Lewén, U. Westergren, R. Schatz, E. Berglind, "Design of inductive p-i-n diode matching for optical receivers with increased bit-rate operation," IEEE J. Lightw. Technol. 19, 1956-1963 (2001).

2008 (1)

J. H. Sinsky, A. Adamiecki, L. Buhl, G. Raybon, P. Winzer, O. Wohlgemuth, M. Duelk, C. R. Doerr, A. Umbach, H.-G. Bach, D. Schmidt, "A 107-Gbit/s optoelectronic receiver utilizing hybrid integration of a photodetector and electronic demultiplexer," IEEE J. Lightw. Technol. 26, 114-120 (2008).

2005 (1)

T. Kurosaki, Y. Shuto, T. Tadokoro, K. Yokoyama, J. Endo, M. Amano, M. Nakamura, N. Ishikawa, Y. Suzuki, "Low-cost 10-Gb/s optical receiver module using a novel plastic package and a passive alignment technique," IEEE J. Lightw. Technol. 23, 4257-4264 (2005).

2004 (1)

K. Sakai, H. Aruga, S. Takagi, M. Kawano, M. Negishi, Y. Kondoh, S. Kaneko, "1.3-$\mu$m uncooled DFB laser-diode module with a coupled differential feed for 10-Gb/s Ethernet applications," IEEE J. Lightw. Technol. 22, 574-581 (2004).

2001 (3)

R. Lewén, U. Westergren, R. Schatz, E. Berglind, "Design of inductive p-i-n diode matching for optical receivers with increased bit-rate operation," IEEE J. Lightw. Technol. 19, 1956-1963 (2001).

R. B. Comizzoli, J. W. Osenbach, G. R. Crane, G. A. Peins, D. J. Siconolfi, O. G. Lorimor, C.-C. Chang, "Failure mechanism of avalanche photodiodes in the presence of water vapor," IEEE J. Lightw. Technol. 19, 252-265 (2001).

F. Centurelli, M. Magliocco, A. Pallotta, P. Tommasino, A. Trifiletti, "A compact 3R-receiver module for short-haul SDH STM-16 systems," IEEE J. Lightw. Technol. 19, 1307-1315 (2001).

2000 (2)

M. W. Beranek, E. Y. Chan, C.-C. Chen, K. W. Davido, H. E. Hager, C.-S. Hong, D. G. Koshinz, M. Rassaian, H. P. Soares, Jr., R. L. St. Pierre, P. J. Anthony, M. A. Cappuzzo, J. V. Gates, L. T. Gomez, G. E. Henein, J. Shmulovich, M. A. Occhionero, K. P. Fennessy, "Passive alignment optical subassemblies for military/aerospace fiber-optic transmitter/receiver modules," IEEE Trans. Adv. Packag. 23, 461-469 (2000).

A. Ebberg, R. Bauknecht, M. Bittner, M. Grumm, M. Bitter, "High performance optical receiver module for 10 Gbit/s applications with low cost potential," Electron. Lett. 36, 741-742 (2000).

1999 (3)

K. Tatsuno, K. Yoshida, T. Kato, T. Hirataka, T. Miura, K. Fukuda, T. Ishikawa, M. Shimaoka, T. Ishii, "High-performance and low-cost plastic optical modules for access network system applications," IEEE J. Lightw. Technol. 17, 1211-1216 (1999).

M. Kato, R. Furukawa, T. Terashima, H. Takano, "Large coupling tolerance side-illuminated mirror photodiode for low-cost surface hybrid integration," IEEE Photon. Technol. Lett. 11, 709-711 (1999).

M. Fukuda, F. Ichikawa, Y. Shuto, H. Sato, Y. Yamada, K. Kato, S. Tohno, H. Toba, T. Sugie, J. Yoshida, K. Suzuki, O. Suzuki, S. Kondo, "Plastic module of laser diode and photodiode mounted on planar lightwave circuit for access network," IEEE J. Lightw. Technol. 17, 1585-1592 (1999).

1996 (1)

J. W. Osenbach, T. L. Evanosky, "Temperature-humidity-bias-behavior and acceleration model for InP planar pin photodiode," IEEE J. Lightw. Technol. 14, 1865-1881 (1996).

1994 (1)

Y. Oikawa, H. Kuwatsuka, T. Yamamoto, T. Ihara, H. Hamano, T. Minami, "Packaging technology for a 10-Gb/s photoreceiver module," IEEE J. Lightw. Technol. 12, 343-352 (1994).

1991 (1)

K. Kitamura, K. Ito, H. Matsuda, T. Kaneko, M. Haneda, "Broadband receiver module for 10 Gbit/s optical transmission," Electron. Lett. 27, 1435-1436 (1991).

Electron. Lett. (1)

A. Ebberg, R. Bauknecht, M. Bittner, M. Grumm, M. Bitter, "High performance optical receiver module for 10 Gbit/s applications with low cost potential," Electron. Lett. 36, 741-742 (2000).

Electron. Lett. (1)

K. Kitamura, K. Ito, H. Matsuda, T. Kaneko, M. Haneda, "Broadband receiver module for 10 Gbit/s optical transmission," Electron. Lett. 27, 1435-1436 (1991).

IEEE J. Lightw. Technol. (4)

J. W. Osenbach, T. L. Evanosky, "Temperature-humidity-bias-behavior and acceleration model for InP planar pin photodiode," IEEE J. Lightw. Technol. 14, 1865-1881 (1996).

M. Fukuda, F. Ichikawa, Y. Shuto, H. Sato, Y. Yamada, K. Kato, S. Tohno, H. Toba, T. Sugie, J. Yoshida, K. Suzuki, O. Suzuki, S. Kondo, "Plastic module of laser diode and photodiode mounted on planar lightwave circuit for access network," IEEE J. Lightw. Technol. 17, 1585-1592 (1999).

R. B. Comizzoli, J. W. Osenbach, G. R. Crane, G. A. Peins, D. J. Siconolfi, O. G. Lorimor, C.-C. Chang, "Failure mechanism of avalanche photodiodes in the presence of water vapor," IEEE J. Lightw. Technol. 19, 252-265 (2001).

J. H. Sinsky, A. Adamiecki, L. Buhl, G. Raybon, P. Winzer, O. Wohlgemuth, M. Duelk, C. R. Doerr, A. Umbach, H.-G. Bach, D. Schmidt, "A 107-Gbit/s optoelectronic receiver utilizing hybrid integration of a photodetector and electronic demultiplexer," IEEE J. Lightw. Technol. 26, 114-120 (2008).

IEEE J. Lightw. Technol. (3)

K. Sakai, H. Aruga, S. Takagi, M. Kawano, M. Negishi, Y. Kondoh, S. Kaneko, "1.3-$\mu$m uncooled DFB laser-diode module with a coupled differential feed for 10-Gb/s Ethernet applications," IEEE J. Lightw. Technol. 22, 574-581 (2004).

K. Tatsuno, K. Yoshida, T. Kato, T. Hirataka, T. Miura, K. Fukuda, T. Ishikawa, M. Shimaoka, T. Ishii, "High-performance and low-cost plastic optical modules for access network system applications," IEEE J. Lightw. Technol. 17, 1211-1216 (1999).

F. Centurelli, M. Magliocco, A. Pallotta, P. Tommasino, A. Trifiletti, "A compact 3R-receiver module for short-haul SDH STM-16 systems," IEEE J. Lightw. Technol. 19, 1307-1315 (2001).

IEEE J. Lightw. Technol. (3)

T. Kurosaki, Y. Shuto, T. Tadokoro, K. Yokoyama, J. Endo, M. Amano, M. Nakamura, N. Ishikawa, Y. Suzuki, "Low-cost 10-Gb/s optical receiver module using a novel plastic package and a passive alignment technique," IEEE J. Lightw. Technol. 23, 4257-4264 (2005).

R. Lewén, U. Westergren, R. Schatz, E. Berglind, "Design of inductive p-i-n diode matching for optical receivers with increased bit-rate operation," IEEE J. Lightw. Technol. 19, 1956-1963 (2001).

Y. Oikawa, H. Kuwatsuka, T. Yamamoto, T. Ihara, H. Hamano, T. Minami, "Packaging technology for a 10-Gb/s photoreceiver module," IEEE J. Lightw. Technol. 12, 343-352 (1994).

IEEE Photon. Technol. Lett. (1)

M. Kato, R. Furukawa, T. Terashima, H. Takano, "Large coupling tolerance side-illuminated mirror photodiode for low-cost surface hybrid integration," IEEE Photon. Technol. Lett. 11, 709-711 (1999).

IEEE Trans. Adv. Packag. (1)

M. W. Beranek, E. Y. Chan, C.-C. Chen, K. W. Davido, H. E. Hager, C.-S. Hong, D. G. Koshinz, M. Rassaian, H. P. Soares, Jr., R. L. St. Pierre, P. J. Anthony, M. A. Cappuzzo, J. V. Gates, L. T. Gomez, G. E. Henein, J. Shmulovich, M. A. Occhionero, K. P. Fennessy, "Passive alignment optical subassemblies for military/aerospace fiber-optic transmitter/receiver modules," IEEE Trans. Adv. Packag. 23, 461-469 (2000).

Other (5)

L. B. Aronson, G. Giaretta, S. Schiaffino, B. Mason, "Transmitter optical subassembly for XFP application," Proc. Electro. Comp. Technol. Conf. 2005 () pp. 1058-1062.

S. Bernabe, R. Stevens, M. Volpert, R. Hamelin, C. Rossat, F. Berger, L. Lombard, C. Kopp, J. Berggren, P. Sundgren, M. Hammar, "Highly integrated VCSEL-based 10 Gb/s miniature optical sub-assembly," Proc. Electro. Comp. Technol. Conf. 2005 () pp. 1333-1338.

J. W. Lim, S. H. Hwang, S. H. Kim, B.-G. Kim, B. S. Rho, "Low-cost hybrid WDM module integrated on planar lightwave circuit (PLC) with a coated WDM filter using passive alignment technique," Proc. Electro. Comp. Technol. Conf. 2007 () pp. 1959-1963.

S. Madduri, B. G. Sammakia, B. Infantolino, S. Chaparala, "A review of non-hermetic optoelectronic packaging," 11th Intersoc. Conf. Therm. Thermomech. Phenom. 2008 () pp. 913-919.

W. K. Hogan, R. K. Wolf, A. Shukia, P. Deane, "Low-cost optical sub-assemblies for metro access applications," Proc. Electro. Comp. Technol. Conf. 2004 () pp. 203-207.

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