Abstract
An architecture of a passively assembled optical platform is suggested
for a chip-to-chip optical interconnection system. The platform is constructed
using all-fiber media for the optical paths: a fiber-embedded optical printed-circuit
board (OPCB) and 90$^{\circ}$-bent
fiber connector. The passive assembling was achieved by employing the guide
pins/holes of commercialized ferrules in the optical link between the OPCB,
90$^{\circ}$-bent fiber
connector, and the transmitter/receiver (Tx/Rx) module. From this interconnection
scheme, a low total optical loss of ${-
}{\hbox {5.3 dB}}$ was obtained. From an assembled platform
with 10 Gb/s/ch $\times$ 4
ch Tx/Rx modules, a 7-Gb/s/ch data transmission was demonstrated with a bit
error rate below $10 ^{-12}$,
involving the optical and electrical crosstalk arisen in the whole channel
operation.
© 2008 IEEE
PDF Article
More Like This
Cited By
You do not have subscription access to this journal. Cited by links are available to subscribers only. You may subscribe either as an Optica member, or as an authorized user of your institution.
Contact your librarian or system administrator
or
Login to access Optica Member Subscription